TI TPS22907YZTT

TPS22907
www.ti.com
SLVSA44 – NOVEMBER 2009
ULTRA SMALL, LOW-INPUT VOLTAGE, LOW rON LOAD SWITCH
Check for Samples: TPS22907
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
1
Low Input Voltage: 1.1 V to 3.6 V
Ultra-Low ON-State Resistance
– rON = 44 mΩ at VIN = 3.6 V
– rON = 50 mΩ at VIN = 2.5 V
– rON = 58 mΩ at VIN = 1.8 V
– rON = 83 mΩ at VIN = 1.2 V
1-A Maximum Continuous Switch Current
Quiescent Current < 1 µA
Shutdown Current < 1 µA
Low Control Input Thresholds Enable Use of
Low-Voltage Logic
Controlled Slew Rate to Avoid Inrush Currents
ESD Performance Tested Per JESD 22
– 3000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
Ultra Small Four-Terminal Wafer Chip Scale
Package (WCSP)
– 0.9 mm × 0.9 mm,
0.5-mm Pitch, 0.5-mm Height
•
•
•
•
•
•
•
Battery Powered Equipment
Portable Industrial Equipment
Portable Medical Equipment
Portable Media Players
Point Of Sales Terminal
GPS Devices
Digital Cameras
Portable Instrumentation
Smartphones
YZT PACKAGE
B
B
A
A
2 1
Laser Marking View
1 2
Bump View
Table 1. TERMINAL ASSIGNMENTS
B
ON
GND
A
VIN
VOUT
2
1
DESCRIPTION
The TPS22907 is an ultra small, low RON load switch with controlled turn on. The device contains a P-channel
MOSFET that operates over an input voltage range of 1.1 V to 3.6 V. The switch is controlled by an on/off input
(ON), which is capable of interfacing directly with low-voltage control signals.
The TPS22907 is available in a space-saving 4-terminal WCSP with 0.5-mm pitch (YZT). The device is
characterized for operation over the free-air temperature range of –40°C to 85°C.
DEVICE
rON
(TYP at 1.8 V)
SLEW RATE
(TYP at 1.8 V)
MAXIMUM OUTPUT
CURRENT
ENABLE
TPS22907
58 mΩ
36 μs
1000 mA
Active high
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
(2)
(3)
PACKAGE (1)
WCSP – YZT (0.5-mm pitch)
(2)
ORDERABLE PART NUMBER
Tape and reel
TPS22907YZTR
TOP-SIDE MARKING
_ _ _ 5K_ (3)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to
designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TPS22907
SLVSA44 – NOVEMBER 2009
www.ti.com
FUNCTIONAL BLOCK DIAGRAM
A2
VIN
Turn-On Slew Rate
Controlled Driver
ON
Control
Logic
B2
A1
VOUT
ESD Protection
B1
GND
FUNCTION TABLE
ON (Control Input)
VIN to VOUT
L
OFF
H
ON
TERMINAL FUNCTIONS
TERMINAL
2
BALL NO.
NAME
A1
VOUT
A2
VIN
B1
GND
B2
ON
DESCRIPTION
Switch output
Switch input. Bypass this input with a ceramic capacitor to ground.
Ground
Switch control input. Active high, do not leave floating
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ABSOLUTE MAXIMUM RATINGS (1)
VIN
Input voltage range
VOUT
Output voltage range
VON
Input voltage range
IMAX
Maximum continuous switch current, TA = -40°C to 85°C
IPLS
Maximum pulsed current (100-µs pulse, 2% duty cycle), TA = -40°C to 85°C
TA
Operating free-air temperature range
Tstg
Storage temperature range
ESD
(1)
MIN
MAX
–0.3
4
V
VIN + 0.3
V
4
V
1
A
–0.3
2.7
A
85
°C
150
°C
–40
–65
Electrostatic discharge protection
UNIT
Human-Body Model (HBM)
3000
Charged-Device Model (CDM)
1000
V
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATINGS
BOARD
High-K
(1)
(1)
PACKAGE
RθJC
RθJA
DERATING FACTOR
ABOVE TA = 25°C
TA < 25°C
TA = 70°C
TA = 85°C
YZT
28.6°C/W
116.32°C/W
-8.5969 mW/°C
859.69 mW
472.83 mW
343.87 mW
The JEDEC high-K (2s2p) board used to derive this data was a 3- × 3-inch, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
RECOMMENDED OPERATING CONDITIONS
MIN
VIN
Input voltage range
VOUT
Output voltage range
VIH
High-level input voltage, ON
VIL
Low-level input voltage, ON
CIN
Input capacitor
(1)
1.1
0.85
MAX
UNIT
3.6
V
VIN
V
3.6
V
0.4
1 (1)
V
μF
See Application Information.
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TPS22907
SLVSA44 – NOVEMBER 2009
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ELECTRICAL CHARACTERISTICS
VIN = 1.1 V to 3.6 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
(1)
MIN
TYP (2)
MAX
UNIT
IIN
Quiescent current
IOUT = 0, VIN = VON
0.07
1
µA
IIN(OFF)
Off supply current
VON = GND, OUT = Open
0.05
1
µA
IIN(LEAKAGE)
Leakage current
VON = GND, VOUT = 0
0.05
1
µA
44
60
VIN = 3.6 V, IOUT = -200 mA
VIN = 2.5 V, IOUT = -200 mA
rON
ON-state resistance
VIN = 1.8 V, IOUT = -200 mA
VIN = 1.2 V, IOUT = -200 mA
VIN = 1.1 V, IOUT = -200 mA
ION
(1)
(2)
ON input leakage current
VON = 1.1 V to 3.6 V or GND
25°C
Full range
67
25°C
50
63
Full range
70
25°C
58
72
Full range
80
25°C
83
Full range
mΩ
106
117
25°C
97
Full range
125
140
Full range
0.005
1
µA
Full range TA = –40°C to 85°C
Typical values are at the specified VIN and TA = 25°C.
SWITCHING CHARACTERISTICS
VIN = 3.6 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω
CL = 0.1 μF
28
μs
tOFF
Turn-OFF time
RL = 500 Ω
CL = 0.1 μF
40
μs
tr
VOUT rise time
RL = 500 Ω
CL = 0.1 μF
25
μs
tf
VOUT fall time
RL = 500 Ω
CL = 0.1 μF
116
μs
SWITCHING CHARACTERISTICS
VIN = 1.8 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω
CL = 0.1 μF
48
μs
tOFF
Turn-OFF time
RL = 500 Ω
CL = 0.1 μF
40
μs
tr
VOUT rise time
RL = 500 Ω
CL = 0.1 μF
36
μs
tf
VOUT fall time
RL = 500 Ω
CL = 0.1 μF
113
μs
SWITCHING CHARACTERISTICS
VIN = 1.1 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
tON
Turn-ON time
RL = 500 Ω
CL = 0.1 μF
81
μs
tOFF
Turn-OFF time
RL = 500 Ω
CL = 0.1 μF
42
μs
tr
VOUT rise time
RL = 500 Ω
CL = 0.1 μF
57
μs
tf
VOUT fall time
RL = 500 Ω
CL = 0.1 μF
113
μs
4
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Product Folder Link(s): TPS22907
TPS22907
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SLVSA44 – NOVEMBER 2009
TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON-STATE RESISTANCE
vs
TEMPERATURE
0.06
0.14
V IN = 3.6 V
IOUT = 200 m A
IOUT = -200 m A
0.05
r ON - ON-State Resistance - W
ð
W
r ON - ON-State Resistance - W
0.12
0.1
0.08
TA = 85°C
0.06
0.04
TA = 25°C
TA = -40°C
0.04
0.03
0.02
0.01
0.02
0
1
1.5
2
2.5
3
3.5
0
-40
4
-15
35
Figure 1.
Figure 2.
QUIESCENT CURRENT
vs
INPUT VOLTAGE
QUIESCENT CURRENT
vs
TEMPERATURE
60
85
60
85
0.30
0.25
V ON = V IN
IOUT = 0
0.25
IIN - Quiescent Current - µA
0.20
IIN - Quiescent Current - µA
10
TA - Tem perature - °C
V IN - Input Voltage - V
0.15
0.10
0.20
0.15
0.10
0.05
0.05
0.00
0.00
-40
1
1.5
2
2.5
3
3.5
4
V IN = 3.6 V
IOUT = 0
V IN = V ON
-15
10
35
TA - Tem perature - °C
V IN - Input Voltage - V
Figure 3.
Figure 4.
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SLVSA44 – NOVEMBER 2009
www.ti.com
TYPICAL CHARACTERISTICS (continued)
OFF SUPPLY CURRENT
vs
INPUT VOLTAGE
OFF SUPPLY CURRENT
vs
TEMPERATURE
0.14
0.12
V IN = 3.6 V
V ON = 0 V
0.12
IIN(OFF) - Off Supply Current - µA
IIN(off) - Off Supply Current - µA
0.10
0.08
0.06
0.04
0.02
0.10
0.08
0.06
0.04
0.02
0.00
-40
0.00
1
1.5
2
2.5
3
3.5
4
-15
10
V IN - Input Voltage - V
Figure 5.
Figure 6.
LEAKAGE CURRENT
vs
INPUT VOLTAGE
LEAKAGE CURRENT
vs
TEMPERATURE
0.18
0.45
85
60
85
V IN = 3.6 V
IOUT = 0
V ON = 0
0.40
0.14
IIN(leakage) - Leakage Current - µA
IIN(leakage) - Leakage Current - µA
60
0.50
IOUT = 0
V ON = 0
0.16
0.12
0.10
0.08
0.06
0.04
0.02
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
1
1.5
2
2.5
3
3.5
4
0.00
-40
V IN - Input Voltage - V
-15
10
35
TA - Tem perature - °C
Figure 7.
6
35
TA - Tem perature - °C
Figure 8.
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TPS22907
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SLVSA44 – NOVEMBER 2009
TYPICAL CHARACTERISTICS (continued)
ON INPUT THRESHOLD
4.0
3.5
V OUT - Output Voltage - V
3.0
TA = 85°C
2.5
TA = 25°C
2.0
TA = -40C
1.5
1.0
V IN = 3.6 V
IOUT = 500 m A
0.5
0.0
0
0.5
1
1.5
2
V ON - ON Voltage - V
Figure 9.
ON TIME
vs
TEMPERATURE
OFF TIME
vs
TEMPERATURE
41.0
40
V IN = 3.6 V
CL = 0.1 µF
RL = 500 W
35
40.0
t OFF - Off Time - µs
t ON - On Time - µs
30
25
20
15
10
39.5
39.0
38.5
38.0
37.5
5
0
-40
V IN = 3.6 V
CL = 0.1 µF
RL = 500 W
40.5
37.0
-15
10
35
60
85
36.5
-40
-15
10
35
60
85
TA - Tem perature - °C
TA - Tem perature - °C
Figure 10.
Figure 11.
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www.ti.com
TYPICAL CHARACTERISTICS (continued)
RISE TIME
vs
TEMPERATURE
FALL TIME
vs
TEMPERATURE
30.5
122
V IN = 3.6 V
CL = 0.1 µF
RL = 500 W
30.0
120
118
t f - Fall Time - µs
29.5
t r - Rise Time - µs
V IN = 3.6 V
CL = 0.1 µF
RL = 500 W
29.0
28.5
28.0
116
114
112
27.5
110
27.0
108
26.5
-40
-15
10
35
60
85
106
-40
TA - Tem perature - °C
-15
10
35
60
85
TA - Tem perature - °C
Figure 12.
Figure 13.
VIN = 3.6 V
CIN = 1 µF
CL = 0.1 µF
RL = 36 W
TA = 25°C
IOUT
VON
VON
IOUT
VIN = 3.6 V
CIN = 1 µF
CL = 0.1 µF
RL = 36 W
TA = 25°C
Figure 14. tON RESPONSE
8
Figure 15. tOFF RESPONSE
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SLVSA44 – NOVEMBER 2009
TYPICAL CHARACTERISTICS (continued)
VIN = 1.1 V
CIN = 1 µF
CL = 0.1 µF
RL = 11 W
TA = 25°C
IOUT
VON
VON
IOUT
VIN = 1.1 V
CIN = 1 µF
CL = 0.1 µF
RL = 11 W
TA = 25°C
Figure 16. tON RESPONSE
Figure 17. tOFF RESPONSE
VIN = 3.6 V
CIN = 1 µF
CL = 10 µF
RL = 36 W
TA = 25°C
IOUT
VON
VON
IOUT
VIN = 3.6 V
CIN = 1 µF
CL = 10 µF
RL = 36 W
TA = 25°C
Figure 18. tON RESPONSE
Figure 19. tOFF RESPONSE
VIN = 1.1 V
CIN = 1 µF
CL = 10 µF
RL = 11 W
TA = 25°C
IOUT
VON
VON
IOUT
VIN = 1.1 V
CIN = 1 µF
CL = 10 µF
RL = 11 W
TA = 25°C
Figure 20. tON RESPONSE
Figure 21. tOFF RESPONSE
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PARAMETER MEASUREMENT INFORMATION
VIN
VOUT
ON
(A)
RL
CL
+
–
OFF
DUT
CIN = 1 µF
GND
GND
TEST CIRCUIT
GND
1.8 V
VON
VON
VON/2
VON/2
tr
0V
tf
0V
tOFF
tON
90%
VOUT
VOH
VOUT
VOUT/2
10%
90%
10%
VOUT/2
VOL
tON/tOFF WAVEFORMS
A.
trise and tfall of the control signal is 100 ns.
Figure 22. Test Circuit and tON/tOFF Waveforms
10
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SLVSA44 – NOVEMBER 2009
APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long
as there is no fault. ON is active high and has a low threshold, making it capable of interfacing with low-voltage
signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller
with 1.2-V, 1.8-V, 2.5-V, or 3.3-V GPIOs.
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns on into a
discharged load capacitor or short-circuit, a capacitor needs to be placed between VIN and GND. A 1-μF ceramic
capacitor, CIN, place close to the pins is usually sufficient. Higher values of CIN can be use to further reduce the
voltage drop during high-current application. When switching heavy loads, it is recommended to have an input
capacitor approximately ten times higher than the output capacitor to avoid excessive voltage drop.
Output Capacitor
Due to the integral body diode in the PMOS switch, a CIN greater than CL is highly recommended. A CL greater
than CIN can cause VOUT to exceed VIN when the system supply is removed. This could result in current flow
through the body diode from VOUT to VIN.
Board Layout
For best performance, all traces should be as short as possible. To be most effective, the input and output
capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have
on normal and short-circuit operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic
electrical effects along with minimizing the case to ambient thermal impedance.
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PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS22907YZTR
ACTIVE
DSBGA
YZT
4
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
TPS22907YZTT
ACTIVE
DSBGA
YZT
4
250
SNAGCU
Level-1-260C-UNLIM
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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