MAXIM MAX105

19-2006; Rev 0; 5/01
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
In addition, the MAX105 provides LVDS digital outputs
with an internal 6:12 demultiplexer that reduces the output data rate to one-half the sample clock rate. Data is
output in two’s complement format. The MAX105 operates from a +5V analog supply and the LVDS output
ports operate at +3.3V. The data converter’s typical
power dissipation is 2.6W. The device is packaged in
an 80-pin, TQFP package with exposed paddle, and is
specified for the extended (-40°C to +85°C) temperature range. For a lower-speed, 400Msps version of the
MAX105, please refer to the MAX107 data sheet.
Features
♦ Two Matched 6-Bit, 800Msps ADCs
♦ Excellent Dynamic Performance
36.4dB SINAD at fIN ≈ 200MHz and
fCLK ≈ 800MHz
♦ Typical INL and DNL: ±0.25LSB
♦ Channel-to-Channel Phase Matching: ±0.2°
♦ Channel-to-Channel Gain Matching: ±0.04dB
♦ 6:12 Demultiplexer reduces the Data Rates to
400MHz
♦ Low Error Rate: 1016 Metastable States at
800Msps
♦ LVDS Digital Outputs in Two’s Complement
Format
Ordering Information
PART
MAX105ECS
TEMP. RANGE
PIN-PACKAGE
-40°C to +85°C
80-Pin TQFP-EP
Block Diagram
Applications
I
PRIMARY
PORT
VSAT Receivers
I ADC
WLANs
I
AUXILIARY
PORT
Test Instrumentation
Communications Systems
MAX107
REF
Q
PRIMARY
PORT
Q ADC
Pin Configuration appears at end of data sheet.
Q
AUXILIARY
PORT
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
1
MAX105
General Description
The MAX105 is a dual, 6-bit, analog-to-digital converter
(ADC) designed to allow fast and precise digitizing of
in-phase (I) and quadrature (Q) baseband signals. The
MAX105 converts the analog signals of both I and Q
components to digital outputs at 800Msps while achieving a signal-to-noise ratio (SNR) of typically 37dB with
an input frequency of 200MHz, and an integral nonlinearity (INL) and differential nonlinearity (DNL) of ±0.25
LSB. The MAX105 analog input preamplifiers feature a
400MHz, -0.5dB, and a 1.5GHz, -3dB analog input
bandwidth. Matching channel-to-channel performance
is typically 0.04dB gain, 0.1LSB offset, and 0.2 degrees
phase. Dynamic performance is 36.4dB signal-to-noise
plus distortion (SINAD) with a 200MHz analog input signal and a sampling speed of 800MHz. A fully differential comparator design and encoding circuits reduce
out-of-sequence errors, and ensure excellent
metastable performance of only one error per 1016 clock
cycles.
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
ABSOLUTE MAXIMUM RATINGS
AVCC, AVCCI, AVCCQ and AVCCR to AGND............-0.3V to +6V
OVCCI and OVCCQ to OGND ...................................-0.3V to +4V
AGND to OGND ................................................... -0.3V to +0.3V
P0I± to P5I± and A0I± to A5I±
DREADY+, DREADY- to OGNDI .............-0.3V to OVCCI+0.3V
P0Q± to P5Q±, A0Q± to A5Q±
DOR+ and DOR- to OGNDQ ................-0.3V to OVCCQ+0.3V
REF to AGNDR...........................................-0.3V to AVCCR+0.3V
Differential Voltage Between INI+ and INI- ....................-2V, +2V
Differential Voltage Between INQ+ and INQ-.................-2V, +2V
Differential Voltage Between CLK+ and CLK- ...............-2V, +2V
Maximum Current Into Any Pin ...........................................50mA
Continuous Power Dissipation (TA = +70°C)
80-Pin TQFP (derate 44mW/°C above +70°C)..................3.5W
Operating Temperature Range
MAX105ECS .....................................................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead temperature (soldering, 10s) ..................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ
= 0, fCLK = 802.816MHz, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25°C)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY
Resolution
RES
6
Integral Nonlinearity (Note 1)
INL
-1
±0.2
1
LSB
Differential Nonlinearity
(Note 1)
DNL
-1
±0.25
1
LSB
Offset Voltage
VOS
(Note 2)
-1
±0.25
1
LSB
Offset Matching Between ADCs
OM
(Note 2)
-0.5
±0.1
0.5
LSB
2.4
2.5
2.6
V
±7.5
mV
3.05
V
0.84
Vp-p
No missing codes guaranteed
Bits
ANALOG INPUTS (INI+, INI-, INQ+, INQ-)
Input Open-Circuit Voltage
VAOC
Input Open-Circuit Voltage
Matching
(VINI+ - VIN-) - (VINQ+ - VINQ-)
Common Mode Input Voltage
Range (Note 3)
VCM
Full-Scale Analog Input
Voltage Range (Note 4)
VFSR
0.76
Input Resistance
RIN
1.7
2
kΩ
Input Capacitance
CIN
1.5
pF
TCRIN
150
ppm/°C
FPBW-0.5dB
400
MHz
Input Resistance Temperature
Coefficient
Full-Power Analog Input BW
Signal + Offset w.r.t. AGND
1.85
0.8
REFERENCE OUTPUT
2
Reference Output Resistance
RREF
Referenced to AGNDR
Reference Output Voltage
√REF
ISOURCE = 500µA
Ω
5
2.45
2.50
_______________________________________________________________________________________
2.55
V
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ
= 0, fCLK = 802.816MHz, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25°C)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
CLOCK INPUTS (CLK+, CLK-)
Clock Input Resistance
RCLK
Clock Input Resistance
Temperature Coefficient
TCRCLK
CLK+ and CLK- to AGND
Minimum Clock Input
Amplitude
5
kΩ
150
ppm/°C
500
mVp-p
LVDS OUTPUTS (P0I± TO P5I±, P0Q± TO P5Q±, A0I± TO A5I±, A0Q± TO A5Q±, DREADY+, DREADY-, DOR+, DOR-)
Differential Output Voltage
VOD 
Change in Magnitude of VOD 
Between “0” and “1” States
∆VOD 
Steady-State Common Mode
Output Voltage
VOC(SS)
Change in Magnitude of VOC
Between “0” and “1” States
∆VOC 
247
1.125
Differential Output Resistance
80
Output Current
Short output together
2.5
Short to OGNDI = OGNDQ
25
400
mV
±25
mV
1.375
V
±25
mV
160
Ω
mA
DYNAMIC SPECIFICATION
Effective Number of Bits
(Note 8)
Signal-to-Noise Ratio
(Notes 10, 11)
Total Harmonic Distortion
(Note 11)
fIN = 200.018MHz at
-0.5dB FS (Note 9)
ENOB
fIN = 400.134MHz at
-0.5dB FS
fIN = 200.018MHz at
-0.5dB FS (Note 9)
SNR
fIN = 400.134MHz at
-0.5dB FS
fIN = 200.018MHz at
-0.5dB FS (Note 9)
THD
fIN = 400.134MHz at
-0.5dB FS
fIN = 200.018MHz at
-0.5dB FS (Note 9)
Spurious-Free Dynamic Range
SFDR
fIN = 400.134MHz at
-0.5dB FS
Differential
5.4
5.8
Single-ended
5.75
Differential
5.65
Differential
35
37
Single-ended
36.7
Differential
36.5
Differential
-44.5
Single-ended
-44.5
Differential
Differential
Single-ended
Differential
Bits
dB
-41
dBc
-41
41
45
45
dB
41.5
_______________________________________________________________________________________
3
MAX105
ELECTRICAL CHARACTERISTICS (continued)
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
ELECTRICAL CHARACTERISTICS (continued)
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ
= 0, fCLK = 802.816MHz, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25°C)
PARAMETER
Signal-to-Noise Plus Distortion
Ratio
SYMBOL
CONDITIONS
fIN = 200.018MHz at
-0.5dB FS (Note 9)
SINAD
fIN = 400.134MHz at
-0.5dB FS
Differential
MIN
TYP
34
36.4
Single-ended
36.1
Differential
35.2
MAX
UNITS
dB
Two-Tone Intermodulation
TTIMD
fIN1 = 124.1660MHz, fIN2 = 126.1260MHz
at -7dBFS
-52
dBc
Crosstalk Between ADCs
XTLK
fINI = 200.0180MHz, fINQ = 210.0140MHz
at -0.5dB FS
-70
dB
Gain Match Between ADCs
GM
(Note 12)
-0.3
±0.04
+0.3
dB
Phase Match Between ADCs
PM
(Note 12)
-2
±0.2
+2
deg
Metastable Error Rate
Less than 1 in 1016
Clock
Cycles
5 ±5%
V
POWER REQUIREMENTS
Analog Supply Voltage
AVCC_
AVCC = AVCCI = AVCCQ = AVCCR
Digital Supply Voltage
OVCC_
OVCC I = OVCC Q
Analog Supply Current
ICC
3.3 ±10%
V
ICC = AICCR + AICCI + AICCQ + AICC
250
320
mA
OICC = OICC I + OICC Q
400
510
mA
Output Supply Current
OICC
Analog Power Dissipation
PDISS
Common-Mode Rejection Ratio
CMRR
VIN_+ = VIN_- = ±0.1V (Note 6)
Power-Supply Rejection Ratio
PSRR
AVCC = AVCC I = AVCC Q = AVCC R =
+4.75V to +5.25V (Note 7)
2.6
W
40
60
dB
40
57
dB
TIMING CHARACTERISTICS
4
Maximum Sample Rate
fMAX
800
Msps
Clock Pulse Width Low
tPWL
0.56
ns
Clock Pulse Width High
tPWH
0.56
ns
Aperture Delay
tAD
100
ps
Aperture Jitter
tAJ
1.5
psRMS
1.5
ns
CLK-to-DREADY Propagation
Delay
tPD1
(Note 13)
DREADY-to-DATA
Propagation Delay
tPD2
(Notes 5, 13)
0
120
_______________________________________________________________________________________
300
ps
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ
= 0, fCLK = 802.816MHz, CL= 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA = TMIN to TMAX, unless
otherwise noted. Typical values are at TA = +25°C)
PARAMETER
SYMBOL
DREADY Duty Cycle
MAX
UNITS
(Notes 5, 13)
CONDITIONS
MIN
47
TYP
53
%
ps
LVDS Output Rise-Time
tRDATA
20% to 80% (Notes 5, 13)
200
500
LVDS Output Fall-Time
tFDATA
20% to 80% (Notes 5, 13)
200
500
LVDS Differential Skew
tSKEW1
Any differential pair
<65
Any two LVDS output signals except DREADY
ps
ps
<100
ps
DREADY Rise-Time
tRDREADY
20% to 80% (Notes 5, 13)
200
500
ps
DREADY Fall-Time
tFDREADY
20% to 80% (Notes 5, 13)
200
500
ps
Primary Port Pipeline Delay
tPDP
5
Clock
Cycles
Auxiliary Port Pipeline Delay
tPDA
6
Clock
Cycles
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10:
Note 11:
Note 12:
Note 13:
NL and DNL is measured using a sine-histogram method.
Input offset is the voltage required to cause a transition between codes 0 and -1.
Numbers provided are for DC-coupled case. The user has the choice of AC-coupling, in which case, the DC input
voltage level does not matter.
The peak-to-peak input voltage required, causing a full-scale digitized output when using a trigonometric curve-fitting
algorithm (e.g. FFT).
Guaranteed by design and characterization.
Common-mode rejection ratio is defined as the ratio of the change in the offset voltage to the change in the commonmode voltage expressed in dB.
Measured with analog power supplies tied to the same potential.
Effective number of bits (ENOB) is computed from a curve-fit referenced to the theoretical full-scale range.
The clock and input frequencies are chosen so that there are 2041 cycles in an 8,192-long record.
Signal-to-noise-ratio (SNR) is measured both with the other channel idling and converting an out-of-phase signal.
The worst case number is presented. Harmonic distortion components two through five are excluded from the noise.
Harmonic distortion components two through five are included in the total harmonic distortion specification.
Both I and Q inputs are effectively tied together (e.g. driven by power splitter). Signal amplitude is -0.5dB FS at an input
frequency of fIN = 200.0180 MHz.
Measured with a differential probe, 1pF capacitance.
_______________________________________________________________________________________
5
MAX105
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ = 0,
fCLK = 802.816MHz, differential input at -0.5dB FS, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA =
TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C)
-50
-60
-70
-20
-50
-60
-70
-30
-40
-50
-60
-70
-80
-80
-80
-90
-90
-90
-100
-100
-100
0
20
40
60
80
100
120
140
0
40
80
120
160
0
200
70
140
210
280
350
420
ANALOG INPUT FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (MHz)
TWO-TONE IMD (8192-POINT RECORD),
DIFFERENTIAL INPUT
SNR vs. ANALOG INPUT FREQUENCY,
DIFFERENTIAL INPUT
SINAD vs. ANALOG INPUT FREQUENCY,
DIFFERENTIAL INPUT
fIN1
-40
fIN2
-50
-60
MAX105 toc05
35
-70
-80
-90
-100
30
-6dB FS
25
-12dB FS
40
80
160
240
320
20
15
25
-12dB FS
20
15
10
10
5
5
400
-6dB FS
30
0
0
0
-1dB FS
35
AMPLITUDE (dB)
-30
-1dB FS
AMPLITUDE (dB)
-20
40
MAX105 toc04
fN1 = 124.166MHz
fIN2 = 126.126MHz
AIN = -7dB FS
-10
10M
1G
100M
10M
10G
100M
1G
ANALOG INPUT FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (Hz)
ANALOG INPUT FREQUENCY (Hz)
THD vs. ANALOG INPUT FREQUENCY,
DIFFERENTIAL INPUT
SFDR vs. ANALOG INPUT FREQUENCY,
DIFFERENTIAL INPUT
FULL-POWER INPUT BANDWIDTH
SINGLE-ENDED INPUT
AMPLITUDE (dB)
-12dB FS
-40
-45
-1dB FS
0
-6dB FS
45
40
-12dB FS
35
30
-1
-2
25
-50
20
-6dB FS
-55
1
10G
MAX105 toc09
50
-30
-35
-1dB FS
GAIN (dB)
-25
55
MAX105 toc08
60
MAX105 toc07
-20
MAX105 toc06
ANALOG INPUT FREQUENCY (MHz)
0
-3
15
-60
10
10M
100M
1G
ANALOG INPUT FREQUENCY (Hz)
6
-40
fIN = 400.124MHz
AIN = -0.5dB FS
-10
AMPLITUDE (dB FS)
-40
-30
MAX105 toc03
-20
AMPLITUDE (dB FS)
AMPLITUDE (dB FS)
-30
fIN = 124.999MHz
AIN = -0.5dB FS
-10
0
MAX105 toc02
fIN = 125.146MHz
AIN = -0.5dB FS
-20
AMPLITUDE (dB FS)
0
MAX105 toc01
0
-10
8192-POINT FFT,
DIFFERENTIAL INPUT
8192-POINT FFT,
DIFFERENTIAL INPUT
8192-POINT FFT,
DIFFERENTIAL INPUT
AMPLITUDE (dB)
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
10G
-4
10M
100M
1G
ANALOG INPUT FREQUENCY (Hz)
10G
10M
100M
1G
ANALOG INPUT FREQUENCY (Hz)
_______________________________________________________________________________________
10G
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
40
fIN = 199.8535MHz
36
-34
MAX105 toc11
fIN = 199.8535MHz
fIN = 199.8535MHz
-38
32
28
THD (dB)
SINAD (dB)
36
32
-46
28
24
-8
-7
-6
-5
-4
-3
-2
-1
-50
24
0
-10 -9
ANALOG INPUT POWER (dB FS)
-8
-7
-6
-5
-4
-3
-2
-1
-10 -9
0
SFDR vs. ANALOG INPUT POWER,
DIFFERENTIAL INPUT
SNR vs. TEMPERATURE
45
MAX105 toc13
50
fIN = 199.8535MHz
48
fIN = 199.8535MHz
41
-8
-7
-6
-5
-4
-3
-2
-1
0
ANALOG INPUT POWER (dB FS)
ANALOG INPUT POWER (dB FS)
SINAD vs. TEMPERATURE
42
MAX105 toc14
-10 -9
-42
MAX105 toc15
MAX105 toc10
40
SNR (dB)
THD vs. ANALOG INPUT POWER,
DIFFERENTIAL INPUT
SINAD vs. ANALOG INPUT POWER,
DIFFERENTIAL INPUT
MAX105 toc12
SNR vs. ANALOG INPUT POWER,
DIFFERENTIAL INPUT
fIN = 199.8535MHz
40
44
SINAD (dB)
SNR (dB)
SFDR (dB)
46
37
33
38
36
42
29
40
38
25
-8
-7
-6
-5
-4
-3
-2
-1
0
32
-40
-15
10
35
60
85
-15
10
35
60
TEMPERATURE (°C)
TEMPERATURE (°C)
THD vs. TEMPERATURE
SFDR vs. TEMPERATURE
SNR vs. CLOCK FREQUENCY,
DIFFERENTIAL INPUT (-1dB FS)
fIN = 199.8535MHz
fIN = 199.8535MHz
SFDR (dB)
-46
-50
47
43
10
35
TEMPERATURE (°C)
60
85
36
34
30
35
-15
38
32
39
-54
fIN = 202.346MHz
AMPLITUDE (dB)
51
-42
40
85
MAX105 toc18
55
MAX toc16
-38
-40
-40
ANALOG INPUT POWER (dB FS)
MAX105 toc17
-10 -9
THD (dB)
34
-40
-15
10
35
TEMPERATURE (°C)
60
85
400
500
600
700
800
900
CLOCK FREQUENCY (MHz)
_______________________________________________________________________________________
7
MAX105
Typical Operating Characteristics (continued)
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ = 0,
fCLK = 802.816MHz, differential input at -0.5dB FS, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA =
TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C)
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
Typical Operating Characteristics (continued)
(AVCC = AVCCI = AVCCQ = AVCCR = +5V, OVCCI = OVCCQ = +3.3V, AGND = AGNDI = AGNDQ = AGNDR = 0, OGNDI = OGNDQ = 0,
fCLK = 802.816MHz, differential input at -0.5dB FS, CL = 1µF to AGND at REF, RL = 100Ω ±1% applied to digital LVDS outputs, TA =
TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C)
-43
AMPLITUDE (dB)
38
fIN = 202.346MHz
36
34
32
6.0
fIN = 202.0761MHz
5.9
ENOB (Bits)
fIN = 202.346MHz
MAX105 toc20
-40
MAX105 toc19
40
-46
-49
5.5
-55
400
500
600
700
800
900
5.7
5.6
-52
30
5.8
400
500
CLOCK FREQUENCY (MHz)
600
700
800
4.5
900
4.7
SFDR vs. ANALOG SUPPLY VOLTAGE,
DIFFERENTIAL INPUT (-1dB FS)
INL vs. DIGITAL OUTPUT CODE
fIN = 202.0761MHz
49
5.1
5.3
5.5
DNL vs. DIGITAL OUTPUT CODE
0.40
MAX105 toc23
0.30
MAX105 toc22
50
4.9
ANALOG SUPPLY VOLTAGE (V)
CLOCK FREQUENCY (MHz)
0.20
MAX105 toc24
AMPLITUDE (dB)
ENOB vs. ANALOG SUPPLY VOLTAGE,
DIFFERENTIAL INPUT (-1dB FS)
THD vs. CLOCK FREQUENCY,
DIFFERENTIAL INPUT (-1dB FS)
MAX105 toc21
SINAD vs. CLOCK FREQUENCY,
DIFFERENTIAL INPUT (-1dB FS)
0.20
INL (LSB)
48
47
DNL (LSB)
SFDR (dB)
0.10
0
0
-0.10
-0.20
46
-0.20
-0.30
4.7
4.9
5.1
5.3
5.5
-0.40
0
8
16
ANALOG SUPPLY VOLTAGE (V)
REFERENCE VOLTAGE vs. ANALOG
SUPPLY VOLTAGE
2.502
2.498
2.494
2.490
48
56
64
4.7
4.9
5.1
5.3
ANALOG SUPPLY VOLTAGE (V)
5.5
0
8
16
24
32
40
48
56
DIGITAL OUTPUT CODE
DIGITAL OUTPUT CODE
ANALOG SUPPLY CURRENT vs.
ANALOG SUPPLY VOLTAGE
ANALOG SUPPLY CURRENT vs.
TEMPERATURE
280
260
240
220
300
64
280
260
240
220
200
200
4.5
8
40
MAX105 toc26
MAX toc25
2.506
32
300
ANALOG SUPPLY CURRENT (mA)
REFERENCE VOLTAGE (V)
2.510
24
MAX105 toc27
4.5
ANALOG SUPPLY CURRENT (mA)
45
4.5
4.7
4.9
5.1
5.3
ANALOG SUPPLY VOLTAGE (V)
5.5
-40
-15
10
35
TEMPERATURE (°C)
_______________________________________________________________________________________
60
85
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
PIN
NAME
FUNCTION
1, 20
T.P.
Test Point. Do not connect.
2
REF
Reference Output
3
AVCCR
Analog Reference Supply. Supply voltage for the internal bandgap reference. Bypass to AGNDR
with 0.01µF in parallel with 47pF for proper operation.
4
AGNDR
Reference, Analog Ground. Connect to AGND for proper operation.
5, 8
AGNDI
I-Channel, Analog Ground. Connect to AGND for proper operation.
6
INI-
I-Channel, Differential Input. Negative terminal.
7
INI+
I Channel, Differential Input. Positive terminal.
9
AVCCI
I-Channel, Analog Supply. Supplies I-channel common-mode buffer, pre-amplifier and quantizer.
Bypass to AGNDI with 0.01µF in parallel with 47pF for proper operation.
10
CLK+
Sampling Clock Input
11
CLK-
Complementary Sampling Clock Input
12
AVCCQ
Q-Channel, Analog Supply. Supplies Q-channel common-mode buffer, pre-amplifier and quantizer.
Bypass to AGNDQ with 0.01µF in parallel with 47pF for proper operation.
13, 16
AGNDQ
Q-Channel, Analog Ground. Connect to AGND for proper operation.
14
INQ+
Q-Channel, Differential Input. Positive terminal.
15
INQ-
Q-Channel, Differential Input. Negative terminal.
17, 18
AGND
Analog Ground
19
AVCC
Analog Supply. Bypass to AGND with 0.01µF in parallel with 47pF for proper operation.
21
A5Q+
Auxiliary Output Data Bit 5 (MSB), Q-Channel
22
A5Q-
Complementary Auxiliary Output Data Bit 5 (MSB), Q-Channel
23
P5Q+
Primary Output Data Bit 5 (MSB), Q-Channel
24
P5Q-
Complementary Primary Output Data Bit 5 (MSB), Q-Channel
25
A4Q+
Auxiliary Output Data Bit 4, Q-Channel
26
A4Q-
Complementary Auxiliary Output Data Bit 4, Q-Channel
27
P4Q+
Primary Output Data Bit 4, Q-Channel
28
P4Q-
Complementary Primary Output Data Bit 4, Q-Channel
29, 35
OVCCQ
Q-Channel Outputs, Digital Supply. Supplies Q-channel output drivers and DOR logic. Bypass to
OGND with 0.01µF in parallel with 47pF for proper operation.
30, 36
OGNDQ
Q-Channel Outputs, Digital Ground. Connect to designated digital ground (OGND) on PC board
for proper operation.
_______________________________________________________________________________________
9
MAX105
Pin Description
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
MAX105
Pin Description (continued)
10
PIN
NAME
FUNCTION
31
A3Q+
Auxiliary Output Data Bit 3, Q-Channel
32
A3Q-
Complementary Auxiliary Output Data Bit 3, Q-Channel
33
P3Q+
Primary Output Data Bit 3, Q-Channel
34
P3Q-
Complementary Primary Output Data Bit 3, Q-Channel
37
A2Q+
Auxiliary Output Data Bit 2, Q-Channel
38
A2Q-
Complementary Auxiliary Output Data Bit 2, Q-Channel
39
P2Q+
Primary Output Data Bit 2, Q-Channel
40
P2Q-
Complementary Primary Output Data Bit 2, Q-Channel
41
A1Q+
Auxiliary Output Data Bit 1, Q-Channel
42
A1Q-
Complementary Auxiliary Output Data Bit 1, Q-Channel
43
P1Q+
Primary Output Data Bit 1, Q-Channel
44
P1Q-
Complementary Primary Output Data Bit 1, Q-Channel
45
A0Q+
Auxiliary Output Data Bit 0 (LSB), Q-Channel
46
A0Q-
Complementary Auxiliary Output Data Bit 0 (LSB), Q-Channel
47
P0Q+
Primary Output Data Bit 0 (LSB), Q-Channel
48
P0Q-
Complementary Primary Output Data Bit 0 (LSB), Q-Channel
49
DOR+
Complementary LVDS Out-Of-Range Bit
50
DOR-
LVDS Out-of-Range Bit
51
DREADY-
Complementary Data-Ready Clock
52
DREADY+
Data Ready Clock
53
P0I-
Complementary Primary Output Data Bit 0 (LSB), I-Channel
54
P0I+
Primary Output Data Bit 0 (LSB), I-Channel
55
A0I-
Complementary Auxiliary Output Data Bit 0 (LSB), I-Channel
56
A0I+
Auxiliary Output Data Bit 0 (LSB), I-Channel
57
P1I-
Complementary Primary Output Data Bit 1, I-Channel
58
P1I+
Primary Output Data Bit 1, I-Channel
59
A1I-
Complementary Auxiliary Output Data Bit 1, I-Channel
60
A1I+
Auxiliary Output Data Bit 1, I-Channel
61
P2I-
Complementary Primary Output Data Bit 2, I-Channel
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
PIN
NAME
FUNCTION
62
P2I+
Primary Output Data Bit 2, I-Channel
63
A2I-
Complementary Auxiliary Output Data Bit 2, I-Channel
64
A2I+
Auxiliary Output Data Bit 2, I-Channel
65, 72
OVCCI
I-Channel Outputs, Digital Supply. Supplies I-channel output drivers and DREADY circuit. Bypass to
OGND with 0.01µF in parallel with 47pF for proper operation.
66, 71
OGNDI
I-Channel Outputs, Digital Ground. Connect to designated digital ground (OGND) on PC board
for proper operation.
67
P3I-
Complementary Primary Output Data Bit 3, I-Channel
68
P3I+
Primary Output Data Bit 3, I-Channel
69
A3I-
Complementary Auxiliary Output Data Bit 3, I-Channel
70
A3I+
Auxiliary Output Data Bit 3, I-Channel
73
P4I-
Complementary Primary Output Data Bit 4, I-Channel
74
P4I+
Primary Output Data Bit 4, I-Channel
75
A4I-
Complementary Auxiliary Output Data Bit 4, I-Channel
76
A4I+
Auxiliary Output Data Bit 4, I-Channel
77
P5I-
Complementary Primary Output Data Bit 5, I-Channel
78
P5I+
Primary Output Data Bit 5, I-Channel
79
A5I-
Complementary Auxiliary Output Data Bit 5, I-Channel
80
A5I+
Auxiliary Output Data Bit 5, I-Channel
Detailed Description
The MAX105 is a dual, +5V, 6-bit, 800Msps flash analog-to-digital converter (ADC), designed for highspeed, high-bandwidth I&Q digitizing. Each ADC
(Figure 1) employs a fully differential, wide bandwidth
input stage, 6-bit quantizers and a unique encoding
scheme to limit metastable states to typically one error
per 1016 clock cycles, with no error exceeding a maximum of 1LSB. An integrated 6:12 output demultiplexer
simplifies interfacing to the part by reducing the output
data rate to one-half the sampling clock rate. The
MAX105 outputs data in LVDS two’s complement format.
When clocked at 800Msps, the MAX105 provides a typical signal-to-noise plus distortion (SINAD) of 36.4dB
with a 200MHz input tone. The analog input of the
MAX105 is designed for differential or single-ended use
with a ±400mV full-scale input range. In addition, the
MAX105 features an on-board +2.5V precision
bandgap reference, which is scaled to meet the analog
input full-scale range.
Principle of Operation
The MAX105 employs a flash or parallel architecture.
The key to this high-speed flash architecture is the use
of an innovative, high-performance comparator design.
Each quantizer and downstream logic translates the
comparator outputs into 6-bit, parallel codes in two’s
complement format and passes them on to the internal
6:12 demultiplexer. The demultiplexer enables the
ADCs to provide their output data at half the sampling
speed on primary and auxiliary ports. LVDS data is
available at speeds of up to 400MHz per output port.
Input Amplifier Circuits
As with all ADCs, if the input waveform is changing
rapidly during conversion, effective number of bits
(ENOB), signal-to-noise plus distortion (SINAD), and
______________________________________________________________________________________
11
MAX105
Pin Description (continued)
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
DREADY+/DREADY-
MAX105
INI+
I ADC
PRE-AMP
INI-
REF
2kΩ
PRIMARY
DATA PORT
P0I-P5I
P0I+/P0I-
AUXILIARY
DATA PORT
A0I-A5I
A0I+/A0I-
P5I+/P5I-
A5I+/A5IAVCC
CM BUFFER
10kΩ
1:2
CLK+
REFERENCE
CLK10kΩ
DOR
2kΩ
CM BUFFER
REF
Q ADC
INQ+
PRE-AMP
PRIMARY
DATA PORT
P0Q-P5Q
P0Q+/P0Q-
AUXILIARY
DATA PORT
A0Q-A5Q
A0Q+/A0Q-
P5Q+/P5Q-
INQ-
REF
A5Q+/A5Q-
DOR+/DOR-
Figure 1. MAX105 Flash Converter Architecture
signal-to-noise ratio (SNR) specifications will degrade.
The MAX105’s on-board, wide-bandwidth input amplifiers (I&Q) reduce this effect significantly, allowing precise digitizing of fast analog data at high conversion
rates. The input amplifiers buffer the input signal and
allow a full-scale signal input range of ±400mV
(800mVp-p).
OVCCI
OVCCI
Internal Reference
The MAX105 features an integrated, buffered +2.5V
precision bandgap reference. This reference is internally scaled to match the analog input range specification
of ±400mV. The data converter’s reference output
(REF) can source up to 500µA. REF should be buffered,
if used to supply external devices.
P0I+ - P5I+
A0I+ - A5I+
55Ω
55Ω
OVCCI
P0I- - P5IA0I- - A5I-
LVDS Digital Outputs
The MAX105 provides data in two’s complement format
to differential LVDS outputs. A simplified circuit
schematic of the LVDS output cells is shown in Figure
2. All LVDS outputs are powered from separate I-channel OVCCI and Q-channel OVCCQ (Q-channel) power
supplies, which may be operated at +3.3V ±10%. The
12
MAX105
Figure 2. Simplified LVDS Output Model
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
IN-PHASE INPUTS
(INI+, INQ+)
INVERTED INPUTS
(INI-, INQ-)
OUT-OF-RANGE BIT
(DOR+, DOR-)
OUTPUT CODE
> +400mV + VREF
AC – Coupled to AGND_
1
011111
+400mV - 0.5LSB + VREF
AC – Coupled to AGND_
0
011111
0V + VREF
AC – Coupled to AGND_
0
000000/111111
-400mV + 0.5LSB + VREF
AC – Coupled to AGND_
0
100000
< -400mV + VREF
AC – Coupled to AGND_
1
100000
MAX105
Table 1. Digital Output Codes Corresponding to a DC-Coupled Single-Ended Analog
Input
Table 2. Digital Output Codes Corresponding to a DC-Coupled Differential Analog Input
IN-PHASE INPUTS
(INI+, INQ+)
INVERTED INPUTS
(INI-, INQ-)
OUT-OF-RANGE BIT
(DOR+, DOR-)
OUTPUT CODE
>+200mV + VREF
<-200mV + VREF
1
011111
+200mV - 0.25LSB + VREF
-200mV + 0.25LSB + VREF
0
011111
0V + VREF
0V + VREF
0
000000/111111
-200mV + 0.25LSB + VREF
+200mV - 0.25LSB + VREF
0
100000
<-200mV + VREF
>+200mV + VREF
1
100000
MAX105 LVDS-outputs provide a typical ±270mV voltage swing around a common mode voltage of roughly
+1.2V, and must be differentially terminated at the far
end of each transmission line pair (true and complementary) with 100Ω.
Out-Of-Range Operation
A single output pair (DOR+, DOR-) is provided to flag
an out-of-range condition, if either the I or Q channel is
out-of-range, where out-of-range is above +FS or below
-FS. It features the same latency as the ADCs output
data and is demultiplexed in a similar fashion. With a
800MHz system clock, DOR+ and DOR- are clocked at
up to 400MHz.
Applications Information
Single-Ended Analog Inputs
The MAX105 is designed to work at full-speed for both
single-ended and differential analog inputs without significant degradation in its dynamic performance. Both
input channels I (INI+, INI-) and Q (INQ+, INQ-) have
2kΩ impedance and allow for AC- and DC-coupled
input signals. In a typical DC-coupled single-ended
configuration (Table 1), the analog input signals enter
the analog input amplifier stages at the in-phase-input
pins INI+/INQ+, while the inverted phase input INI/INQ- pins are AC-coupled to AGNDI/AGNDQ. Single-
ended operation allows for an input amplitude of
800mVp-p, centered around VREF.
Differential Analog Inputs
To obtain +FS digital outputs with differential input drive
(Table 2), 400mV must be applied between INI+ (INQ+)
and INI- (INQ-). Midscale digital output codes occur
when there is no voltage difference between INI+
(INQ+) and INI- (INQ-). For a -FS digital output code
both in-phase (INI+, INQ+) and inverted input (INI-,
INQ-) must see -400mV.
Single-Ended to Differential
Conversion Using a Balun
An RF balun (Figure 3) provides an excellent solution to
convert a single-ended signal to a fully differential signal, required by the MAX105 for optimum performance.
At higher frequencies, the MAX105 provides better
SFDR and THD with fully differential input signals over
single-ended input signals. In differential input mode,
even-order harmonics are suppressed and each input
requires only half the signal-swing compared to singleended mode.
Clock Input
The MAX105 features clock inputs designed for either
single-ended or differential operation with very flexible
input drive requirements. The clock inputs (AC- or DCcoupled) provide a 5kΩ input impedance to AVCC/2
______________________________________________________________________________________
13
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
AGND
50Ω
100pF
CLK+,
INI+,
INQ+
D
0°
Differential Clock (Sine-Wave Drive)
The advantages of differential clock drive (Figure 5)
can be obtained by using an appropriate balun or
transformer to convert single-ended sine-wave sources
into differential drives. Refer to Single-Ended Clock
Inputs (Sine-Wave Drive) for proper input amplitude
requirements.
0°
SIGNAL SOURCE A
50Ω
B
50Ω*
0°
180°
tude) to +10dBm (2VP-P clock signal amplitude). The
MAX105 dynamic performance specifications are
determined by a single-ended clock drive of -2dBm
(500mVp-p clock signal amplitude). To avoid saturation
of the input amplifier stage, limit the clock power level
to a maximum of +10dBm.
AGND
C
100pF
CLK-,
INI-,
INQ-
50Ω TRANSMISSION LINES
AGND
50Ω
50Ω
TO 50Ω-TERMINATED
SIGNAL SOURCE
OR BALUM
AGND
100pF
CLK+,
INI+,
INQ+
100pF
CLK-,
INI-,
INQ-
*TERMINATION OF THE UNUSED INPUT/OUTPUT (WITH 50Ω TO AGND) ON A
BALUN IS RECOMMENDED IN ORDER TO AVOID UNWANTED REFLECTIONS.
50Ω
Figure 3. Single-Ended to Differential Conversion Using a Balun
and are internally buffered with a preamplifier to ensure
proper operation of the converter even with smallamplitude sine-wave sources. The MAX105 was
designed for single-ended, low-phase noise sine wave
clock signals with as little as 500mV P-P amplitude
(-2dBm).
Single-Ended Clock (Sine-Wave Drive)
Excellent performance is obtained by AC- or DC-coupling a low-phase noise sine-wave source into a single
clock input (Figure 4). Essentially, the dynamic performance of the converter is unaffected by clock-drive
power levels from -2dBm (500mVp-p clock signal ampli-
AGND
Figure 5. Differential AC-Coupled Input Drive (CLK, INI, INQ)
LVDS, ECL and PECL Clock
The innovative input architecture of the MAX105 clock
also allows these inputs to be driven by LVDS-, ECL-, or
PECL-compatible input levels, ranging from 500mVp-p
to 2Vp-p (Figure 6).
50Ω TRANSMISSION LINES
100pF
SIGNAL
SOURCE
INPUT
100Ω
100pF
AGND
50Ω
100pF
FROM SIGNAL SOURCE
100pF
CLK+,
INI+,
INQ+
CLK-,
INI-,
INQ-
AGND
Figure 4. Single-Ended Clock Input With AC-Coupled Input
Drive (CLK, INI, INQ)
14
CLK-,
INI-,
INQCLK+,
INI+,
INQ+
LVDS LINE DRIVER
Figure 6. LVDS Input Drive (CLK, INI, INQ)
Timing Requirements
The MAX105 features a 6:12 demultiplexer, which
reduces the output data rate (including DREADY and
DOR signals) to one-half of the sample clock rate. The
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
MAX105
ADC SAMPLE
MAX105 ADCs SAMPLE ON THE RISING EDGE OF CLK+
CLK-
N
N+1
N+2
N+3
N+4
N+5
N+6
N+7
N+8
N+9
N+10 N+11
N+12
N+13 N+14
N+15
N+16 N+17
N+18
N+19
CLK
CLK+
DREADYDREADY
DREADY+
AUXILIARY
DATA PORT
N
N+2
N+4
N+6
N+8
N+10
PRIMARY
DATA PORT
N+1
N+3
N+5
N+7
N+9
N+11
NOTE: THE LATENCY TO THE PRIMARY PORT IS FIVE CLOCK CYCLES, THE LATENCY TO THE AUXILIARY PORT IS SIX CLOCK
CYCLES. BOTH PRIMARY AND AUXILIARY DATA PORTS ARE UPDATED ON THE RISING EDGE OF THE DREADY+ CLOCK.
tPWH
tPWL
CLK+
CLKtPD1
DREADY +
DREADY tPD2
AUXILIARY PORT DATA
PRIMARY PORT DATA
MAX105
Figure 7. Output Timing Relationship Between CLK and DREADY Signals and Primary/Auxiliary Output Ports
demultiplexed outputs are presented in dual 6-bit two’s
complement format with two consecutive samples in
the primary and auxiliary output ports on the rising
edge of the data ready clock. The auxiliary data port
always contains the older sample. The primary output
always contains the most recent data sample, regardless of the DREADY clock phase. Figure 7 shows the
timing and data alignment of the auxiliary and primary
output ports in relationship with the CLK and DREADY
signals. Data in the primary port is delayed by five
clock cycles while data in the auxiliary port is delayed
by six clock cycles.
Typical I/Q Application
Quadrature amplitude modulation (QAM) is frequently
used in digital communication systems to increase
channel capacity. A QAM signal is modulated in both
amplitude and phase. With a demodulator, this QAM
signal gets downconverted and separated in its inphase (I) and quadrature (Q) components. Both I&Q
channels are digitized by an ADC at the baseband
level in order to recover the transmitted information.
Figure 8 shows a typical application circuit to directly
tune L-band signals to baseband, incorporating a
direct conversion tuner (MAX2108) and the MAX105 to
digitize I&Q channels with excellent phase- and gainmatching. A front-end L-C filter is required for anti-aliasing purposes.
______________________________________________________________________________________
15
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
DREADY+/DREADYFROM PREVIOUS STAGE
MAX2108
PRIMARY
DATA PORT
P0I-P5I
QUADRATURE
DEMODULATOR
NYQUIST
FILTER
I ADC
PRE-AMP
AUXILIARY
DATA PORT
A0I-A5I
REF
2kΩ
AVCC
CM BUFFER
10kΩ
1:2
LO
D
S
P
REFERENCE
90°
10kΩ
DOR
2kΩ
NYQUIST
FILTER
CM BUFFER
PRE-AMP
PRIMARY
DATA PORT
P0Q-P5Q
REF
Q ADC
AUXILIARY
DATA PORT
A0Q-A5Q
DOR+/DOR-
Figure 8. Typical I/Q Application
Grounding, Bypassing,
and Board Layout
Grounding and power supply decoupling strongly influence the MAX105’s performance. At 800MHz clock frequency and 6-bit resolution, unwanted digital crosstalk
may couple through the input, reference, power supply,
ground connections, and adversely influence the
dynamic performance of the ADC. In addition, the I&Q
inputs may crosstalk through poorly designed decoupling circuits. Therefore, closely follow the grounding
and power-supply decoupling guidelines in Figure 9.
Maxim strongly recommends using a multilayer printed
circuit board (PC board) with separate ground and
power supply planes. Since the MAX105 has separate
analog and digital ground connections (AGND, AGNDI,
AGNDQ, AGNDR, OGNDI, and OGNDQ, respectively).
The PC board should feature separate sections designated to analog (AGND) and digital (OGND), connected at only one point. Digital signals should run above
the digital ground plane and analog signals should run
above the analog ground plane. Keep digital signals far
away from the sensitive analog inputs, reference inputs,
16
and clock inputs. High-speed signals, including clocks,
analog inputs, and digital outputs, should be routed on
50Ω microstrip lines, such as those employed on the
MAX105EV kit.
The MAX105 has separate analog and digital powersupply inputs:
• AV CC = +5V ±5%: Power supply for the analog
input section of the clock circuit.
•
AVCCI = +5V ±5%: Power supply for the I-channel
common-mode buffer, pre-amp and quantizer.
•
AVCCQ = +5V ±5%: Power supply for the Q-channel common-mode buffer, pre-amp and quantizer.
•
AVCCR = +5V ±5%: Power supply for the on-chip
bandgap reference.
•
OVCCI = +3.3V ±10%: Power supply for the I-channel output drivers and DREADY circuitry.
•
OV CC Q = +3.3V ±10%: Power supply for the
Q-channel output drivers and DOR circuitry.
All supplies should be decoupled with large tantalum or
electrolytic capacitors at the point they enter the PC
board. For best performance, bypass all power sup-
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
MAX105
PC BOARD AVCC
10µF
10nF
PC BOARD AGND
FERRITE-BEAD
SUPPRESSORS
PC BOARD OVCC
OVCCI, OVCCQ
10µF
10nF
10nF
47pF
4 x 10nF
PC BOARD OGND
AVCCR
OVCCI
AVCCR
OVCCI
47pF
AGNDR
10nF
OGNDI
AGNDR
OGNDI
AVCCI
AVCCI
10nF
MAX105
OVCCI
OVCCI
47pF
47pF
AGNDI
10nF
OGNDI
OGNDI
AGNDI
AVCCQ
AVCCQ
10nF
OVCCQ
47pF
OVCCQ
47pF
AGNDQ
OGNDQ
AVCC
OVCCQ
10nF
AGNDQ
OGNDQ
AVCC
10nF
47pF
OVCCQ
47pF
AGND
AGND
10nF
OGNDQ
OGNDQ
NOTE:
LOCATE ALL 47pF AND 10nF CAPACITORS, WHICH DECOUPLE AVCCI, AVCCQ, AVCCR, OVCCI, AND OVCCQ AS CLOSE
AS POSSIBLE TO THE CHIP. IT IS ALSO RECOMMENDED TO CONNECT ALL ANALOG GROUND CONNECTIONS TO A COMMON ANALOG
GROUND PLANE AND ALL DIGITAL GROUND CONNECTIONS TO ONE COMMON DIGITAL GROUND PLANE ON THE PC BOARD. A SIMILAR
TECHNIQUE CAN BE USED FOR ALL ANALOG AND DIGITAL POWER SUPPLIES.
AVCC = AVCCI = AVCCQ = AVCCR = +5V±5%
OVCCI = OVCCQ = +3.3V±10%
Figure 9. MAX105 Decoupling, Bypassing and Grounding
plies to the appropriate ground with a 10µF tantalum
capacitor, to filter power supply noise, in parallel with a
0.1µF capacitor. A combination of 0.01µF in parallel
with high quality 47pF ceramic chip capacitor located
very close to the MAX105 device filters high frequency
noise. A properly designed PC board (see MAX105EV
Kit data sheet) allows the user to connect all analog
supplies and all digital supplies together thereby
requiring only two separate power sources. Decoupling
AV CC, AV CCI, AV CCQ and AV CCR with ferrite-bead
suppressors prevents further crosstalk between the
individual analog supply pins
Thermal Management
The MAX105 is designed for a thermally enhanced 80pin TQFP package, providing greater design flexibility,
increased thermal efficiency and a low thermal junction-case (θjc) resistance of ≈1.26°C/W. In this pack-
______________________________________________________________________________________
17
MAX105
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
DIE
80-PIN TQFP PACKAGE
WITH EXPOSED PAD
BONDING WIRE
EXPOXY
THERMAL LAND
COPPER PLANE, 1oz.
EXPOSED PAD
COPPER
TRACE, 1oz.
PC BOARD
COPPER TRACE, 1oz.
TOP LAYER
GROUND PLANE
AGND, DGND
POWER PLANE
GROUND PLANE (AGND)
6 x 6 ARRAY OF THERMAL VIAS
THERMAL LAND
COPPER PLANE, 1oz.
MAX105
Figure 10. MAX105 Exposed Pad Package Cross-Section
age, the data converter die is attached to an exposed
pad (EP) leadframe using a thermally conductive
epoxy. The package is molded in a way, that this leadframe is exposed at the surface, facing the printed circuit board (PC board) side of the package (Figure 10).
This allows the package to be attached to the PC board
with standard infrared (IR) flow soldering techniques. A
specially created land pattern on the PC board, matching the size of the EP (7.5mm x 7.5mm) does not only
guarantee proper attachment of the chip, but can also
be used for heat-sinking purposes. Designing thermal
vias* into the land area and implementing large ground
planes in the PC board design, further enhance the
thermal conductivity between board and package. To
remove heat from an 80-pin TQFP package efficiently,
an array of 6 x 6 vias (≤ 0.3mm diameter per via hole
and 1.2mm pitch between via holes) is required.
Note: Efficient thermal management for the MAX105 is
strongly depending on PC board and circuit design,
component placement, and installation. Therefore,
exact performance figures cannot be provided.
However, the MAX105EV kit exhibits a typical θja of
18°C/W. For more information on proper design techniques and recommendations to enhance the thermal
performance of parts such as the MAX105, please refer
to Amkor Technology’s website at www.amkor.com.
*Connects the land pattern to internal or external copper planes.
18
Static Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. This straight
line is drawn between the endpoints of the transfer
function, once offset and gain errors have been nullified. The static linearity parameters for the MAX105 are
measured using the sine-histogram method.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step-width and the ideal value of 1LSB. A DNL
error specification of greater than -1LSB guarantees no
missing codes and a monotonic transfer function.
Dynamic Parameter Definitions
Aperture Jitter and Delay
Aperture uncertainties affect the dynamic performance
of high-speed converters. Aperture jitter, in particular,
directly influences SNR and limits the maximum slew
rate (dV/dt) that can be digitized without significant
error. Aperture jitter limits the SNR performance of the
ADC, according to the following relationship:
SNRdB = 20 x log10 [1 / (2 x π x fIN x tAJ[RMS])],
where fIN represents the analog input frequency and
tAJ is the RMS aperture jitter. The MAX105’s innovative
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
CLK+
tAW
MAX105
ANALOG
INPUT
THD = 20 x log (V22 + V32 + V4 2 + V52 ) / V12 )
tAD
tAJ
SAMPLING
INSTANT
tAW: APERTURE WIDTH
tAJ: APERTURE JITTER
tAD: APERTURE DELAY
Figure 11. Aperture Timing
clock design limits aperture jitter to typically 1.5psRMS.
Figure 11 depicts the aperture jitter (tAJ), which is the
sample-to-sample variation in the aperture delay.
Aperture delay (tAD) is the time defined between the
rising edge of the sampling clock and the instant when
an actual sample is taken (Figure 11).
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog input (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
minimum analog-to-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N-Bits):
where V1 is the fundamental amplitude, and V2 through
V5 are the amplitudes of the 2nd- through 5th-order harmonics.
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio expressed in decibels of the RMS
amplitude of the fundamental to the RMS value of the
next largest spurious component, excluding DC offset.
Two-Tone Intermodulation
Distortion (IMD)
The two-tone IMD is the ratio expressed in decibels of
either input tone to the worst 3rd-order (or higher) intermodulation products. The individual input tone levels
are at -7dB full-scale and their envelope peaks at -1dB
full-scale.
Chip Information
TRANSISTOR COUNT: 12,286
SNRMAX[dB] = 6.02dB x N + 1.76dB
In reality, there are other noise sources besides quantization noise: thermal noise, reference noise, clock jitter
(see Aperture Uncertainties). SNR is computed by taking the ratio of the RMS signal to the RMS noise, which
includes all spectral components minus the fundamental, the first four harmonics, and the DC offset.
Signal-to-Noise Plus Distortion (SINAD)
SINAD is computed by taking the ratio of the RMS signal to all spectral components minus the fundamental
and the DC offset.
Effective Number of Bits (ENOB)
ENOB specifies the dynamic performance of an ADC at
a specific input frequency, amplitude, and sampling
rate relative to an ideal ADC’s quantization noise. For a
full-scale input ENOB is computed from:
ENOB = (SINAD - 1.76dB) / 6.02dB
______________________________________________________________________________________
19
MAX105
Total Harmonic Distortion (THD)
THD is typically the ratio of the RMS sum of the first four
harmonics of the input signal to the fundamental itself.
This is expressed as:
CLK-
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
20
61 P2I-
62 P2I+
63 A2I-
64 A2I+
65 OVCCI
66 OGNDI
67 P3I-
68 P3I+
69 A3I-
70 A3I+
71 OGNDI
72 OVCCI
73 P4I-
74 P4I+
75 A4I-
76 A4I+
77 P5I-
78 P5I+
79 A5I-
80 A5I+
MAX105
Pin Configuration
T.P.
1
60
A1I+
REF
2
59
A1I-
AVCCR
3
58
P1I+
AGNDR
4
57
P1I-
AGNDI
5
56
A0I+
INI-
6
55
A0I-
INI+
7
54
P01+
AGNDI
8
53
P01-
AVCCI
9
52
DREADY+
CLK+
10
51
DREADY-
CLK-
11
50
DOR-
AVCCQ
12
49
DOR+
AGNDQ
13
48
P0Q-
INQ+
14
47
P0Q+
INQ-
15
46
A0Q-
AGNDQ
16
45
A0Q+
AGND
17
44
P1Q-
AGND
18
43
P1Q+
AVCC
19
42
A1Q-
T.P.
20
41
A1Q+
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
A5Q+
A5Q-
P5Q+
P5Q-
A4Q+
A4Q-
P4Q+
P4Q-
OVCCQ
OGNDQ
A3Q+
A3Q-
P3Q+
P3Q-
OVCCQ
OGNDQ
A2Q+
A2Q-
P2Q+
P2Q-
MAX105
______________________________________________________________________________________
Dual, 6-Bit, 800Msps ADC with On-Chip,
Wideband Input Amplifier
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 21
© 2001 Maxim Integrated Products
Printed USA
is a registered trademark of Maxim Integrated Products.
MAX105
Package Information