MX27C4100/27C4096 4M-BIT [512K x 8/256K x 16] CMOS EPROM FEATURES • 256K x 16 organization(MX27C4096, JEDEC pin • • • • • • • • out) 512K x 8 or 256K x 16 organization(MX27C4100, ROM pin out compatible) +12.5V programming voltage Fast access time: 100/120/150 ns Totally static operation Completely TTL compatible Operating current: 60mA Standby current: 100uA Package type: - 40 pin plastic DIP - 44 pin PLCC - 40 pin SOP GENERAL DESCRIPTION The MX27C4100/4096 is a 5V only, 4M-bit, One Time Programmable Read Only Memory. It is organized as 256K words by 16 bits per word(MX27C4096), 512K x 8 or 256K x 16(MX27C4100), operates from a single + 5 volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C4100/4096 supports a intelligent fast programming algorithm which can result in programming time of less than two minutes. PIN CONFIGURATIONS BLOCK DIAGRAM (MX27C4100) This EPROM is packaged in industry standard 40 pin dual-in-line packages, 40 lead SOP, and 44 lead PLCC packages. A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE Q0 Q8 Q1 Q9 Q2 Q10 Q3 Q11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MX27C4100 SOP/PDIP(MX27C4100) 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 CE OE BYTE/VPP A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND Q15/A-1 Q7 Q14 Q6 Q13 Q5 Q12 Q4 VCC CONTROL LOGIC . Y-DECODER A0~A17 . . . . . . Q0~Q14 Q15/A-1 Y-SELECT . . . . ADDRESS INPUTS OUTPUT BUFFERS X-DECODER . . . . . 4M BIT CELL MAXTRIX VCC GND P/N: PM0197 1 REV. 3.4, AUG. 22, 2001 MX27C4100/27C4096 7 1 44 A14 A15 A16 A17 VCC NC VPP 6 40 39 A13 Q11 A12 Q10 A11 Q9 A10 Q8 GND A9 MX27C4096 12 34 GND NC NC Q7 A8 Q6 A7 A6 Q5 29 28 A3 A2 A1 A0 NC OE Q0 Q1 Q2 23 A5 A4 17 18 Q3 Q4 VPP CE Q15 Q14 Q13 Q12 Q11 Q10 Q9 Q8 GND Q7 Q6 Q5 Q4 Q3 Q2 Q1 Q0 OE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 MX27C4096 Q12 CE PDIP(MX27C4096) Q15 PLCC(MX27C4096) Q14 PIN CONFIGURATIONS Q13 PIN CONFIGURATIONS 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VCC A17 A16 A15 A14 A13 A12 A11 A10 A9 GND A8 A7 A6 A5 A4 A3 A2 A1 A0 BLOCK DIAGRAM (MX27C4096) CE CONTROL LOGIC OE . . A0~A17 ADDRESS INPUTS . . . . Y-DECODER X-DECODER . . VCC GND OUTPUT BUFFERS . . . . . . . . Q0~Q15 Y-SELECT 4M BIT CELL MAXTRIX VPP P/N: PM0197 REV. 3.4, AUG. 22, 2001 2 MX27C4100/27C4096 PIN DESCRIPTION(MX27C4096) PIN DESCRIPTION(MX27C4100) SYMBOL PIN NAME SYMBOL PIN NAME A0~A17 Address Input A0~A17 Address Input Q0~Q14 Data Input/Output Q0~Q15 Data Input/Output CE Chip Enable Input CE Chip Enable Input OE Output Enable Input OE Output Enable Input BYTE/VPP Word/Byte Selection/Program Supply Voltage VPP Program Supply Voltage Q15/A-1 Q15(Word mode)/LSB addr. (Byte mode) VCC Power Supply Pin (+5V) VCC Power Supply Pin (+5V) GND Ground Pin GND Ground Pin TRUTH TABLE OF BYTE FUNCTION(MX27C4100) BYTE MODE(BYTE = GND) CE OE Q15/A-1 MODE Q0-Q7 SUPPLY CURRENT H X X Non selected High Z Standby(ICC2) L H X Non selected High Z Operating(ICC1) L L A-1 input Selected DOUT Operating(ICC1) WORD MODE(BYTE = VCC) CE OE Q15/A-1 MODE Q0-Q14 SUPPLY CURRENT H X High Z Non selected High Z Standby(ICC2) L H High Z Non selected High Z Operating(ICC1) L L DOUT Selected DOUT Operating(ICC1) NOTE : X = H or L P/N: PM0197 REV. 3.4, AUG. 22, 2001 3 MX27C4100/27C4096 The verification should be performed with OE and CE at VIL(for MX27C4096), OE at VIL and CE at VIH(for MX27C4100) and VPP at its programming voltage. FUNCTIONAL DESCRIPTION THE PROGRAMMING OF THE MX27C4100/4096 AUTO IDENTIFY MODE When the MX27C4100/4096 is delivered, or it is erased, the chip has all 4M bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C4100/4096 through the procedure of programming. The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25°C± 5°C ambient temperature range that is required when programming the MX27C4100/4096. For programming, the data to be programmed is applied with 16 bits in parallel to the data pins. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. When programming an MXIC EPROM, a 0.1uF capacitor is required across VPP and ground to suppress spurious voltage transients which may damage the device. To activate this mode, the programming equipment must force 12.0 ± 0.5 V on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage VPP = 12.75V is applied, with VCC = 6.25 V and OE = VIH (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = VPP = 5V ± 10%. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C4100/4096, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q15) defined as the parity bit. READ MODE The MX27C4100/4096 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE's, assuming that CE has been LOW and addresses have been stable for at least tACC - t OE. PROGRAM INHIBIT MODE Programming of multiple MX27C4100/4096's in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C4100/4096 may be common. A TTL low-level program pulse applied to an MX27C4100/4096 CE input with VPP = 12.5 ± 0.5 V will program the MX27C4100/4096. A high-level CE input inhibits the other MX27C4100/4096s from being programmed. WORD-WIDE MODE PROGRAM VERIFY MODE With BYTE/VPP at VCC ± 0.2V outputs Q0-7 present data Q0-7 and outputs Q8-15 present data Q8-15, after CE and OE are appropriately enabled. Verification should be performed on the programmed bits to determine that they were correctly programmed. P/N: PM0197 REV. 3.4, AUG. 22, 2001 4 MX27C4100/27C4096 BYTE-WIDE MODE used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array. With BYTE/VPP at GND ± 0.2V, outputs Q8-15 are tristated. If Q15/A-1 = VIH, outputs Q0-7 present data bits Q8-15. If Q15/A-1 = VIL, outputs Q0-7 present data bits Q0-7. STANDBY MODE The MX27C4100/4096 has a CMOS standby mode which reduces the maximum VCC current to 100 uA. It is placed in CMOS standby when CE is at VCC ± 0.3 V. The MX27C4100/4096 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTL-standby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between Vcc and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be P/N: PM0197 REV. 3.4, AUG. 22, 2001 5 MX27C4100/27C4096 MODE SELECT TABLE (MX27C4096) PINS MODE CE OE A0 A9 VPP OUTPUTS Read VIL VIL X X VCC DOUT Output Disable VIL VIH X X VCC High Z Standby (TTL) VIH X X X VCC High Z Standby (CMOS) VCC±0.3V X X X VCC High Z Program VIL VIH X X VPP DIN Program Verify VIH VIL X X VPP DOUT Program Inhibit VIH VIH X X VPP High Z Manufacturer Code(3) VIL VIL VIL VH VCC 00C2H Device Code(3) VIL VIL VIH VH VCC 0151H 3. A1 - A8 = A10 - A17 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming. NOTES: 1. VH = 12.0 V ± 0.5 V 2. X = Either VIH or VIL MODE SELECT TABLE (MX27C4100) BYTE/ MODE CE OE A9 A0 Q15/A-1 VPP(5) Q8-14 Q0-7 Read (Word) VIL VIL X X Q15 Out VCC Q8-14 Out Q0-7 Out Read (Upper Byte) VIL VIL X X VIH GND High Z Q8-15 Out Read (Lower Byte) VIL VIL X X VIL GND High Z Q0-7 Out Output Disable VIL VIH X X High Z X High Z High Z Standby VIH X X X High Z X High Z High Z Program VIL VIH X X Q15 In VPP Q8-14 In Q0-7 In Program Verify VIH VIL X X Q15 Out VPP Q8-14 Out Q0-7 Out Program Inhibit VIH VIH X X High Z VPP High Z High Z Manufacturer Code(3) VIL VIL VH VIL 0B VCC 00H C2H Device Code(3) VIL VIL VH VIH 1B VCC 38H 00H NOTES: 1. VH = 12.0V ± 0.5V 2. X = Either VIH or VIL 3. A1 - A8, A10 - A17 = VIL(for auto select) 4. See DC Programming Characteristics for VPP voltages. 5. BYTE/VPP is intended for operation under DC Voltage conditions only. 6. Manufacture code = 00C2H Device code = B800H P/N: PM0197 REV. 3.4, AUG. 22, 2001 6 MX27C4100/27C4096 FIGURE 1. FAST PROGRAMMING FLOW CHART START ADDRESS = FIRST LOCATION VCC = 6.25V VPP = 12.75V X=0 PROGRAM ONE 100us PULSE INCREMENT X INTERACTIVE SECTION YES X = 25? NO FAIL VERIFY BYTE ? PASS NO LAST ADDRESS INCREMENT ADDRESS FAIL YES VCC = VPP = 5.25V VERIFY SECTION VERIFY ALL BYTES ? FAIL DEVICE FAILED PASS DEVICE PASSED P/N: PM0197 REV. 3.4, AUG. 22, 2001 7 MX27C4100/27C4096 SWITCHING TEST CIRCUITS 1.8K ohm DEVICE UNDER +5V TEST DIODES = IN3064 OR EQUIVALENT CL 6.2K ohm CL = 100 pF including jig capacitance(30pF for 100 ns parts) SWITCHING TEST WAVEFORMS 2.0V 2.0V TEST POINTS AC driving levels 0.8V 0.8V OUTPUT INPUT AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade , 3.0V/0V for industrial grade. Input pulse rise and fall times are <10ns. 1.5V TEST POINTS 1.5V AC driving levels OUTPUT INPUT AC TESTING: (1)AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2)For MX27C4100/4096-10 P/N: PM0197 REV. 3.4, AUG. 22, 2001 8 MX27C4100/27C4096 ABSOLUTE MAXIMUM RATINGS NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. RATING VALUE Ambient Operating Temperature -40oC to 85oC Storage Temperature -65oC to 125oC Applied Input Voltage -0.5V to 7.0V Applied Output Voltage -0.5V to VCC + 0.5V VCC to Ground Potential -0.5V to 7.0V A9 & VPP -0.5V to 13.5V NOTICE: Specifications contained within the following tables are subject to change. DC/AC Operating Conditions for Read Operation MX27C4100/4096 Operating Temperature Commercial Industrial Vcc Power Supply -10 -12 -15 0°C to 70°C 0°C to 70°C 0°C to 70°C -40°C to 85°C -40°C to 85°C -40°C to 85°C 5V ± 5% 5V ± 10% 5V ± 10% DC CHARACTERISTICS SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 VOL Output Low Voltage VIH Input High Voltage VIL MAX. UNIT CONDITIONS V IOH = -0.4mA 0.4 V IOL = 2.1mA 2.0 VCC + 0.5 V Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V ICC2 VCC Standby Current 1.5 mA CE = VIH ICC1 VCC Active Current 60 mA CE = VIL, f=5MHz, Iout = 0mA IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only) SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS CIN Input Capacitance 8 12 pF VIN = 0V COUT Output Capacitance 8 12 pF VOUT = 0V CVPP VPP Capacitance 18 25 pF VPP = 0V P/N: PM0197 REV. 3.4, AUG. 22, 2001 9 MX27C4100/27C4096 AC CHARACTERISTICS 27C4100/4096-10 27C4100/4096-12 27C4100/4096-15 MIN. MIN. MIN. SYMBOL PARAMETER tACC Address to Output Delay tCE Chip Enable to Output Delay 100 120 150 ns OE = VIL tOE Output Enable to Output Delay 45 50 65 ns CE = VIL 50 ns tDF OE High to Output Float, MAX. 100 0 MAX. 120 30 0 35 0 MAX. UNIT CONDITIONS 150 ns CE = OE = VIL or CE High to Output Float tOH Output Hold from Address, 0 0 0 ns CE or OE which ever occurred first AC CHARACTERISTICS(Continued) SYMBOL PARAMETER 27C4100-10 27C4100-12 27C4100-15 MIN. MIN. MIN. MAX. MAX. MAX. UNIT CONDITIONS tBHA BYTE Access Time tOHB BYTE Output Hold Time tBHZ BYTE Output Delay Time tBLZ BYTE Output Set Time 100 120 0 0 70 150 0 70 10 10 ns ns 70 10 ns ns DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. VOH Output High Voltage 2.4 MAX. UNIT CONDITIONS V IOH = -0.40mA 0.4 V IOL = 2.1mA VCC + 0.5 V VOL Output Low Voltage VIH Input High Voltage VIL Input Low Voltage -0.3 0.8 V ILI Input Leakage Current -10 10 uA VH A9 Auto Select Voltage 11.5 12.5 V ICC3 VCC Supply Current (Program & Verify) 50 mA IPP2 VPP Supply Current(Program) 30 mA VCC1 Fast Programming Supply Voltage 6.00 6.50 V VPP1 Fast Programming Voltage 12.5 13.0 V MAX. UNIT 2.0 VIN = 0 to 5.5V CE = VIL, OE = VIH AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C SYMBOL PARAMETER MIN. tAS Address Setup Time 2.0 us tOES OE Setup Time 2.0 us tDS Data Setup Time 2.0 us tAH Address Hold Time 0 us tDH Data Hold Time 2.0 us tDFP Output Enable to Output Float Delay 0 tVPS VPP Setup Time 2.0 tPW PGM Program Pulse Width 95 tVCS VCC Setup Time 2.0 tOE Data valid from OE P/N: PM0197 130 ns 105 us 150 ns CONDITIONS us us REV. 3.4, AUG. 22, 2001 10 MX27C4100/27C4096 WEFORMS(MX27C4096) READ CYCLE(WORD MODE) ADDRESS INPUTS DATA ADDRESS tACC CE tCE OE tDF DATA OUT VALID DATA tOE tOH FAST PROGRAMMING ALGORITHM WAVEFORMS PROGRAM PROGRAM VERIFY VIH Addresses VIL DATA tAH Hi-z tAS DATA OUT VALID DATA IN STABLE tDS tDFP tDH VPP1 VPP VCC tVPS VCC1 VCC tVCS VCC VIH CE VIL tPW tOES OE tOE Max VIH VIL P/N: PM0197 REV. 3.4, AUG. 22, 2001 11 MX27C4100/27C4096 WAVEFORMS(MX27C4100) READ CYCLE (BYTE MODE) HIGH-Z A-1 HIGH-Z tACC tOH BYTE/VPP Q0-Q7 VALID DATA VALID DATA tBHA tOHB VALID DATA Q15-Q8 tBHZ tBLZ FAST PROGRAMMING ALGORITHM WAVEFORMS VERIFY PROGRAM VIH Addresses VALID ADDRESS VIL tAH tAS DATA OUT VALID DATA SET DATA tDS tDFP tDH VPP1 BYTE/VPP VCC tVPS VCC1 VCC VCC tVCS VIH CE VIL tPW tOES tOE VIH OE VIL P/N: PM0197 REV. 3.4, AUG. 22, 2001 12 MX27C4100/27C4096 ORDERING INFORMATION PLASTIC PACKAGE PART NO. ACCESS TIME OPERATING (ns) STANDBY OPERATING PACKAGE CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE MX27C4100PC-10 100 60 100 0°C to 70°C 40 Pin DIP(ROM pin out) MX27C4100PC-12 120 60 100 0°C to 70°C 40 Pin DIP(ROM pin out) MX27C4100PC-15 150 60 100 0°C to 70°C 40 Pin DIP(ROM pin out) MX27C4100MC-10 100 60 100 0°C to 70°C 40 Pin SOP(ROM pin out) MX27C4100MC-12 120 60 100 0°C to 70°C 40 Pin SOP(ROM pin out) MX27C4100MC-15 150 60 100 0°C to 70°C 40 Pin SOP(ROM pin out) MX27C4096PC-10 100 60 100 0°C to 70°C 40 Pin DIP(JEDEC pin out) MX27C4096PC-12 120 60 100 0°C to 70°C 40 Pin DIP(JEDEC pin out) MX27C4096PC-15 150 60 100 0°C to 70°C 40 Pin DIP(JEDEC pin out) MX27C4096QC-10 100 60 100 0°C to 70°C 44 Pin PLCC MX27C4096QC-12 120 60 100 0°C to 70°C 44 Pin PLCC MX27C4096QC-15 150 60 100 0°C to 70°C 44 Pin PLCC MX27C4100PI-10 100 60 100 -40°C to 85°C 40 Pin DIP(ROM pin out) MX27C4100PI-12 120 60 100 -40°C to 85°C 40 Pin DIP(ROM pin out) MX27C4100PI-15 150 60 100 -40°C to 85°C 40 Pin DIP(ROM pin out) MX27C4100MI-10 100 60 100 -40°C to 85°C 40 Pin SOP(ROM pin out) MX27C4100MI-12 120 60 100 -40°C to 85°C 40 Pin SOP(ROM pin out) MX27C4100MI-15 150 60 100 -40°C to 85°C 40 Pin SOP(ROM pin out) MX27C4096PI-10 100 60 100 --40°C to 85°C 40 Pin DIP(JEDEC pin out) MX27C4096PI-12 120 60 100 -40°C to 85°C 40 Pin DIP(JEDEC pin out) MX27C4096PI-15 150 60 100 -40°C to 85°C 40 Pin DIP(JEDEC pin out) MX27C4096QI-10 100 60 100 -40°C to 85°C 44 Pin PLCC MX27C4096QI-12 120 60 100 -40°C to 85°C 44 Pin PLCC MX27C4096QI-15 150 60 100 -40°C to 85°C 44 Pin PLCC P/N: PM0197 REV. 3.4, AUG. 22, 2001 13 MX27C4100/27C4096 PACKAGE INFORMATION 40-PIN PLASTIC DIP(600 mil) P/N: PM0197 REV. 3.4, AUG. 22, 2001 14 MX27C4100/27C4096 40-PIN PLASTIC SOP(450 mil) P/N: PM0197 REV. 3.4, AUG. 22, 2001 15 MX27C4100/27C4096 44-PIN PLASTIC LEADED CHIP CARRIER(PLCC) P/N: PM0197 REV. 3.4, AUG. 22, 2001 16 MX27C4100/27C4096 Revision History Revision No. Description 3.0 1) Eliminate Interactive Programming Mode 2) 40-CDIP package quartz lens, change to square shape. 3.1 IPP1 100uA to 10uA 3.2 Cancel 32pin ceramic DIP Package 3.3 Modify Commercial range 0~55°C-->0~70°C 3.4 Cancel "Ultraviolet Erasable" wording in General Description To modify Package Information P/N: PM0197 Pgae Date 6/13/1997 P1,2,4,13,14 P9 P1 P14~16 7/17/1997 FEB/25/2000 MAY/03/2000 AUG/22/2001 REV. 3.4, AUG. 22, 2001 17 MX27C4100/27C4096 MACRONIX INTERNATIONAL CO., LTD. HEADQUARTERS: TEL:+886-3-578-6688 FAX:+886-3-563-2888 EUROPE OFFICE: TEL:+32-2-456-8020 FAX:+32-2-456-8021 JAPAN OFFICE: TEL:+81-44-246-9100 FAX:+81-44-246-9105 SINGAPORE OFFICE: TEL:+65-348-8385 FAX:+65-348-8096 TAIPEI OFFICE: TEL:+886-2-2509-3300 FAX:+886-2-2509-2200 MACRONIX AMERICA, INC. TEL:+1-408-453-8088 FAX:+1-408-453-8488 CHICAGO OFFICE: TEL:+1-847-963-1900 FAX:+1-847-963-1909 http : //www.macronix.com MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice. 18