MCNIX MX27L2000TI-25

MX27L2000
2M-BIT [256Kx8] CMOS EPROM
FEATURES
•
•
•
•
•
•
•
256Kx 8 organization
Wide power supply range, 2.7V DC to 3.6V DC
+12.5V programming voltage
Fast access time: 120/150/200/250 ns
Totally static operation
Completely TTL compatible
Operating current:20mA @ 3.6V, 5MHz
• Standby current: 20uA
• Package type:
-
32 pin plastic DIP
32 pin SOP
32 pin PLCC
8x20mm 32-lead TSOP(I)
8x14mm 32-lead TSOP(I)
8x13.4mm 32-lead TSOP(I)
GENERAL DESCRIPTION
The MX27L2000 is a 3V only, 2M-bit, One Time
Programmable Read Only Memory. It is organized as
256K words by 8 bits per word, operates from a single +
3 volt supply, has a static standby mode, and features
fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27L2000 supports
a intelligent fast programming algorithm which can result
in programming time of less than one minute.
PIN CONFIGURATIONS
BLOCK DIAGRAM
A7
32
CE
PGM
A17
1
NC
VCC
A16
4
VPP
5
A15
30
29
A13
A8
A3
25
MX27L2000
A0~A17
ADDRESS
A11
A2
OE
A1
A10
INPUTS
21
20
Q5
Q4
Q3
17
Q7
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
P/N: PM0372
MX27L2000
Y-SELECT
.
.
.
.
.
.
.
X-DECODER
.
.
.
.
2M BIT
CELL
MAXTRIX
.
VCC
VSS
32 TSOP(I) (8x20mm,8x14mm,8x13.4mm)
A11
A9
A8
A13
A14
A17
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
Q0~Q7
Q6
13
14
Y-DECODER
.
.
CE
A0
Q0
.
.
A9
9
OUTPUT
BUFFERS
A14
A5
A4
CONTROL
LOGIC
OE
A6
GND
VCC
PGM
A17
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
A12
32 PLCC
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
Q2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MX27L2000
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
Q1
32 PDIP/SOP
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead SOP and 32 lead PLCC
and 32 lead TSOP(I) packages.
PIN DESCRIPTION
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
1
SYMBOL
PIN NAME
A0~A17
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
PGM
Programmable Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
REV. 2.9, JAN. 22, 2002
MX27L2000
FUNCTIONAL DESCRIPTION
AUTO IDENTIFY MODE
THE PROGRAMMING OF THE MX27L2000
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of
automatically matching the device to be programmed
with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
temperature range that is required when programming
the MX27L2000.
When the MX27L2000 is delivered, or it is erased, the
chip has all 2M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27L2000 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 0.1uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
To activate this mode, the programming equipment
must force 12.0 ± 0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
FAST PROGRAMMING
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For the
MX27L2000, these two identifier bytes are given in the
Mode Select Table. All identifiers for manufacturer and
device codes will possess odd parity, with the MSB (Q7)
defined as the parity bit.
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIH (Algorithm is shown in
Figure 1). The programming is achieved by applying a
single TTL low level 100us pulse to the PGM input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of
25 pulses. This process is repeated while sequencing
through each address of the device. When the
programming mode is completed, the data in all address
is verified at VCC = VPP = 5V ± 10%.
READ MODE
The MX27L2000 has two control functions, both of
which must be logically satisfied in order to obtain data
at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tQE.
PROGRAM INHIBIT MODE
Programming of multiple MX27L2000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27L2000 may be common. A
TTL low-level program pulse applied to an MX27L2000
CE input with VPP = 12.5 ± 0.5 V and PGM LOW will
program that MX27L2000. A high-level CE input inhibits
the other MX27L2000s from being programmed.
STANDBY MODE
The MX27L2000 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27L2000 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
PROGRAM VERIFY MODE
Verification should be performed on the programmed
bits to determine that they were correctly programmed.
The verification should be performed with OE and CE, at
VIL, PGM at VIH, and VPP at its programming voltage.
REV. 2.9, JAN. 22, 2002
P/N: PM0372
2
MX27L2000
TWO-LINE OUTPUT CONTROL FUNCTION
SYSTEM CONSIDERATIONS
To accommodate multiple memory connections, a twoline control function is provided to allow for:
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
Vcc and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as the
primary device-selecting function, while OE be made a
common connection to all devices in the array and
connected to the READ line from the system control bus.
This assures that all deselected memory devices are in
their low-power standby mode and that the output pins
are only active when data is desired from a particular
memory device.
MODE SELECT TABLE
PINS
MODE
CE
OE
PGM
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
X
VCC
High Z
Standby (CMOS)
VCC±0.3V
X
X
X
X
VCC
High Z
Program
VIL
VIH
VIL
X
X
VPP
DIN
Program Verify
VIL
VIL
VIH
X
X
VPP
DOUT
Program Inhibit
VIH
X
X
X
X
VPP
High Z
Manufacturer Code(3) VIL
VIL
X
VIL
VH
VCC
C2H
Device Code(3)
VIL
X
VIH
VH
VCC
20H
VIL
NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A17 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
REV. 2.9, JAN. 22, 2002
P/N: PM0372
3
MX27L2000
FIGURE 1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X=0
PROGRAM ONE 100us PULSE
INCREMENT X
INTERACTIVE
SECTION
YES
X = 25?
NO
FAIL
VERIFY BYTE
?
PASS
NO
LAST ADDRESS
INCREMENT ADDRESS
FAIL
YES
VCC = VPP = 5.25V
VERIFY SECTION
VERIFY ALL BYTES
?
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
REV. 2.9, JAN. 22, 2002
P/N: PM0372
4
MX27L2000
SWITCHING TEST CIRCUITS
DEVICE
UNDER
TEST
1.8K ohm
+5V
DIODES = IN3064
OR EQUIVALENT
CL
6.2K ohm
CL = 100 pF including jig capacitance (30pF for MX27L2000-120, 150ns)
SWITCHING TEST WAVEFORMS
2.0V
2.0V
TEST POINTS
AC driving levels
0.8V
0.8V
OUTPUT
INPUT
AC TESTING: AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
1.5V
AC driving levels
1.5V
TEST POINTS
OUTPUT
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27L2000-12/15.
REV. 2.9, JAN. 22, 2002
P/N: PM0372
5
MX27L2000
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature -40oC to 85oC
Storage Temperature
-65oC to 125oC
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC+0.5V
VCC to Ground Potential
-0.5V to 7.0V
V9 & VPP
-0.5V to 13.5V
NOTICE:
Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27L2000
Operating Temperature
Commercial
-12-
15
-20
-25
0°C to 70°C
0°C to 70°C
0°C to 70°C
0°C to 70°C
-
-
2.7V to 3.6V
2.7V to 3.6V
Industrial
Vcc Power Supply
-40°C to 85°C -40°C to 85°C
2.7V to 3.6V
2.7V to 3.6V
DC CHARACTERISTICS
SYMBOL
PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
2.4
CONDITIONS
V
IOH = -0.4mA, VCC=3.0V
0.4
V
IOL = 2.1mA, VCC=3.0V
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
2.7V < VCC < 3.6V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 3.6V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
20
uA
CE = VCC ± 0.3V
ICC2
VCC Standby Current
0.25
mA
CE = VIH
ICC1
VCC Active Current
20
mA
CE = VIL, f=5MHz, Iout = 0mA,
VCC=3.6V
IPP
VPP Supply Current Read
10
uA
CE = OE = VIL, VPP = VCC
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
TYP.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
CVPP
VPP Capacitance
18
25
pF
VPP = 0V
REV. 2.9, JAN. 22, 2002
P/N: PM0372
6
MX27L2000
AC CHARACTERISTICS
SYMBOL PARAMETER
27L2000-12
27L2000-15 27L2000-20
MIN
MIN. MAX. MIN.
MAX.
27L2000-25
MAX. MIN. MAX. UNIT CONDITIONS
tACC
Address to Output Delay
120
150
200
250
ns
CE = OE =VIL
tCE
Chip Enable to Output Delay
120
150
200
250
ns
OE = VIL
120
ns
CE = VIL
70
ns
tOE
Output Enable to Output Delay
tDF
OE High to Output Float,
50
0
65
35
0
50
100
0
60
0
or CE High to Output Floa
tOH
Output Hold from Address,
0
0
0
0
ns
CE or OE which ever occurred first
DC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
VOH
Output High Voltage
VOL
Output Low Voltage
VIH
Input High Voltage
VIL
MIN.
MAX.
UNIT
CONDITIONS
V
IOH = -0.40mA
0.4
V
IOL = 2.1mA
2.0
VCC + 0.5
V
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program & Verify)
50
mA
IPP2
VPP Supply Current(Program)
30
mA
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
2.4
VIN = 0 to 3.6V
CE=PGM=VIL,OE=VIH
AC PROGRAMMING CHARACTERISTICS TA = 25oC ± 5°C
SYMBOL
PARAMETER
MIN.
MAX.
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Output Enable to Output Float Delay
0
tVPS
VPP Setup Time
2.0
tPW
PGM Program Pulse Width
95
tVCS
VCC Setup Time
2.0
us
tCES
CE Setup Time
2
us
tOE
Data valid from OE
130
UNIT
ns
us
105
150
us
ns
REV. 2.9, JAN. 22, 2002
P/N: PM0372
7
MX27L2000
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA ADDRESS
tACC
CE
tCE
OE
tDF
DATA
OUT
VALID DATA
tOE
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM
PROGRAM VERIFY
VIH
Addresses
VIL
DATA
tAH
Hi-z
tAS
DATA OUT VALID
DATA IN STABLE
tDS
tDFP
tDH
VPP1
VPP
VCC
tVPS
VCC1
VCC
tVCS
VCC
VIH
CE
VIL
tCES
VIH
PGM
VIL
tOES
tPW
tOE
Max
VIH
OE
VIL
REV. 2.9, JAN. 22, 2002
P/N: PM0372
8
MX27L2000
ORDERING INFORMATION
PLASTIC PACKAGE
OPERATING
PART NO.
ACCESS TIME
STANDBY
OPERATING
CURRENT MAX. CURRENT MAX. TEMPERATURE
PACKAGE
(ns)
(mA)
(uA)
MX27L2000PC-12
120
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-12
120
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-12
120
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-15
150
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-15
150
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-15
150
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-20
200
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-20
200
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-20
200
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PC-25
250
20
20
0°C to 70°C
32 Pin DIP
MX27L2000MC-25
250
20
20
0°C to 70°C
32 Pin SOP
MX27L2000TC-25
250
20
20
0°C to 70°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-12
120
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-12
120
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-12
120
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-15
150
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-15
150
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-15
150
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-20
200
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-20
200
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-20
200
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000PI-25
250
20
20
-40°C to 85°C
32 Pin DIP
MX27L2000MI-25
250
20
20
-40°C to 85°C
32 Pin SOP
MX27L2000TI-25
250
20
20
-40°C to 85°C
8x20mm 32 Pin TSOP(I)
MX27L2000T2C-12
120
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-15
150
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-20
200
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2C-25
250
20
20
0°C to 70°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-12
120
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-15
150
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-20
200
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T2I-25
250
20
20
-40°C to 85°C
8x14mm 32 Pin TSOP(I)
MX27L2000T3C-12
120
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-15
150
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-20
200
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3C-25
250
20
20
0°C to 70°C
8x13.4mm 32 Pin TSOP(I)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
9
MX27L2000
OPERATING
PART NO.
ACCESS TIME
STANDBY
OPERATING
CURRENT MAX. CURRENT MAX. TEMPERATURE
PACKAGE
(ns)
(mA)
(uA)
MX27L2000T3I-12
120
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-15
150
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-20
200
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000T3I-25
250
20
20
-40°C to 85°C
8x13.4mm 32 Pin TSOP(I)
MX27L2000QC-12
120
20
20
0°C to 70°C
32 PLCC
MX27L2000QC-15
150
20
20
0°C to 70°C
32 PLCC
MX27L2000QC-20
200
20
20
0°C to 70°C
32 PLCC
MX27L2000QC-25
250
20
20
0°C to 70°C
32 PLCC
MX27L2000QI-12
120
20
20
-40°C to 85°C
32 PLCC
MX27L2000QI-15
150
20
20
-40°C to 85°C
32 PLCC
MX27L2000QI-20
200
20
20
-40°C to 85°C
32 PLCC
MX27L2000QI-25
250
20
20
-40°C to 85°C
32 PLCC
REV. 2.9, JAN. 22, 2002
P/N: PM0372
10
MX27L2000
PACKAGE INFORMATION
32-PIN PLASTIC DIP(600 mil)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
11
MX27L2000
32-PIN PLASTIC SOP (450 mil)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
12
MX27L2000
32-PIN TSOP (8 x 20mm)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
13
MX27L2000
32-PIN TSOP (8 x 14mm)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
14
MX27L2000
32-PIN TSOP (8 x 13.4mm)
REV. 2.9, JAN. 22, 2002
P/N: PM0372
15
MX27L2000
32-PIN PLCC
REV. 2.9, JAN. 22, 2002
P/N: PM0372
16
MX27L2000
REVISION HISTORY
Revision No. Description
Page
2.0
Eliminate Interactive Programming Mode.
AC driving levels changed from 2.4V/0.4V to 3V/0V.
2.1
IPP 100uA --> 10uA
2.2
Add 120/150ns speed grades.
2.3
Corrected errors in the DC/AC Operating Conditions for Read Operation
2.4
Add 8x14mm and 8x13.4mm 32-TSOP(I) Packages
2.5
Change TSOP Orientation
2.6
Cancel Ceramic DIP package type
P1,2,9,11
2.7
To modify Package Information
P10~14
2.8
Cancel "Ultraviolet Erasable" wording in General Description
P1
2.9
To added 32-pin PLCC information
P1,10,16
Date
5/29/1997
8/07/1997
12/24/1997
2/5/1998
2/24/1998
4/09/1998
MAR/01/2000
JUL/19/2001
AUG/20/2001
JAN/22/2002
REV. 2.9, JAN. 22, 2002
P/N: PM0372
17
MX27L2000
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-6688
FAX:+886-3-563-2888
EUROPE OFFICE:
TEL:+32-2-456-8020
FAX:+32-2-456-8021
JAPAN OFFICE:
TEL:+81-44-246-9100
FAX:+81-44-246-9105
SINGAPORE OFFICE:
TEL:+65-348-8385
FAX:+65-348-8096
TAIPEI OFFICE:
TEL:+886-2-2509-3300
FAX:+886-2-2509-2200
MACRONIX AMERICA, INC.
TEL:+1-408-453-8088
FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900
FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.