SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 FEATURES • • Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) xxxxx OE 1D 2D 3D 4D 5D 6D 7D 8D GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q LE 1D 2D 3D 4D 5D 6D 7D 8D VCC RGY PACKAGE (TOP VIEW) DB, DGV, DW, NS, OR PW PACKAGE (TOP VIEW) 1 20 4 19 1Q 18 2Q 17 3Q 5 6 16 4Q 15 5Q 7 8 14 6Q 13 7Q 9 12 8Q 2 3 10 11 LE • • OE • Inputs Are TTL-Voltage Compatible 4.5-V to 5.5-V VCC Operation Typical tpd = 5.1 ns at 5 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 5 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2.3 V at VCC = 5 V, TA = 25°C Supports Mixed-Mode Voltage Operation on All Ports GND • • • • DESCRIPTION/ORDERING INFORMATION The SN74LV573AT is an octal transparent D-type latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is low, the Q outputs are latched at the logic levels of the D inputs. ORDERING INFORMATION PACKAGE (1) TA QFN – RGY SN74LV573ATRGYR Tube SN74LV573ATDW Tape and reel SN74LV573ATDWR SOP – NS Tape and reel SN74LV573ATNSR 74LV573AT SSOP – DB Tape and reel SN74LV573ATDBR LV573AT Tube SN74LV573ATPW Tape and reel SN74LV573ATPWR Tape and reel SN74LV573ATDGVR TSSOP – PW TVSOP – DGV (1) TOP-SIDE MARKING Tape and reel SOIC – DW –40°C to 85°C ORDERABLE PART NUMBER VV573 LV573AT LV573AT LV573AT Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2004–2005, Texas Instruments Incorporated SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 DESCRIPTION/ORDERING INFORMATION (CONTINUED) A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. To ensure the high-impedance state during power up or power down, OE shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. FUNCTION TABLE (EACH LATCH) INPUTS OE LE D OUTPUTS Q L H H H L H L L L L X Q0 H X X Z LOGIC DIAGRAM (POSTIVE LOGIC) OE LE 1 11 C1 1D 2 1D To Seven Other Channels 2 19 1Q SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V –0.5 7 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Output voltage range applied in the high or low state (2) (3) IIK Input clamp current VI < 0 –20 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current VO = 0 to VCC ±35 mA ±70 mA Continuous current through VCC or GND DB θJA Package thermal impedance package (4) 70 DGV package (4) 92 DW package (4) 58 NS package (4) 60 PW package (4) 83 RGYpackage (5) Tstg (1) (2) (3) (4) (5) Storage temperature range V °C/W 37 –65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 5.5 V maximum. The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VCC = 4.5 V to 5.5 V VIL Low-level input voltage VCC = 4.5 V to 5.5 V VI Input voltage MIN MAX 4.5 5.5 UNIT V 2 V 0.8 V 0 5.5 V High or low state 0 VCC 3-state 0 5.5 VO Output voltage IOH High-level output current VCC = 4.5 V to 5.5 V –16 IOL Low-level output current VCC = 4.5 V to 5.5 V 16 mA ∆t/∆v Input transition rise or fall rate VCC = 4.5 V to 5.5 V 20 ns/V TA Operating free-air temperature 85 °C (1) –40 V mA All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VOH VOL TA = –40°C to 85°C TA = 25°C VCC MIN TYP 4.5 IOH = –50 µA 4.5 V 4.4 IOH = –16 mA 4.5 V 3.8 IOL = 50 µA 4.5 V IOL = 16 mA 4.5 V MAX MIN UNIT MAX 4.4 V 3.8 0 0.1 0.1 0.55 0.55 V II VI = 5.5 V or GND 0 to 5.5 V ±0.1 ±1 µA IOZ VO = VCC or GND 5.5 V ±0.25 ±2.5 µA ICC VI = VCC or GND, IO = 0 5.5 V 2 20 µA One input at 3.4 V, Other inputs at VCC or GND 5.5 V 1.35 1.5 mA 0 0.5 5 µA ∆ICC (1) TEST CONDITIONS (1) Ioff VI or VO = 0 to 5.5 V Ci VI = VCC or GND 4.5 pF This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC. Timing Requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) TA = –40°C to 85°C TA = 25°C MIN MAX MIN UNIT MAX tw Pulse duration, LE high 6.5 8.5 ns tsu Setup time, data before LE↓ 1.5 1.5 ns th Hold time, data after LE↓ 3.5 3.5 ns Switching Characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tsk(o) 4 FROM (INPUT) TO (OUTPUT) LOAD CAPACITANCE D Q CL = 15 pF LE Q CL = 15 pF OE Q CL = 15 pF OE Q CL = 15 pF D Q CL = 50 pF LE Q CL = 50 pF OE Q CL = 50 pF OE Q CL = 50 pF CL = 50 pF TA = –40°C to 85°C TA = 25°C MIN TYP MAX MIN MAX 2.6 5.1 8.5 1 9.5 3 5.1 8.5 1 9.5 3 7.7 12.3 1 14.5 3.5 7.7 12.3 1 14.5 3 6.3 10.9 1 12.5 3.3 6.3 10.9 1 12.5 2.8 5.5 8 1 11 1.6 5.4 8 1 9.5 3.7 5.9 9.5 1 10.5 5.5 5.9 9.5 1 10.5 4.3 8.5 13.3 1 14.5 5.9 8.5 13.3 1 14.5 4.5 7.1 11.9 1 13.5 5.4 7.1 11.9 1 13.5 3.3 8.8 11.2 1 12 2.6 8.8 11.2 1 12 1.5 1.5 UNIT ns ns ns ns ns ns ns ns ns SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 Noise Characteristics (1) VCC = 5 V, CL = 50 pF TA = 25°C MIN TYP MAX UNIT VOL(P) Quiet output, maximum dynamic VOL 1.1 1.5 V VOL(V) Quiet output, minimum dynamic VOL –1.1 –1.5 V VOH(V) Quiet output, maximum dynamic VOH VIH(D) High-level dynamic input voltage VIL(D) Low-level dynamic input voltage (1) 4 V 2 V 0.8 V TYP UNIT Characteristics are for surface-mount packages only. Operating Characteristics VCC = 5 V, TA = 25°C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS Outputs enabled CL = 50 pF, f = 10 MHz 8 pF 5 SN74LV573AT OCTAL TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCES574C – JUNE 2004 – REVISED AUGUST 2005 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test Test Point RL = 1 kΩ From Output Under Test CL (see Note A) S1 Open TEST GND CL (see Note A) LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS 3V 1.5 V Timing Input 0V tw 3V 1.5 V Input 1.5 V th tsu 3V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 3V 1.5 V Input 1.5 V 0V tPLH tPHL VOH In-Phase Output 50% VCC tPHL Out-of-Phase Output 50% VCC VOL Output Waveform 1 S1 at VCC (see Note B) VOH 50% VCC VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 3V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 50% VCC VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time, with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPHL and tPLH are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuits and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74LV573ATDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATNSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATNSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATNSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LV573ATRGYR ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN74LV573ATRGYRG4 ACTIVE QFN RGY 20 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 4-Jun-2007 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.2 7.5 2.5 12.0 16.0 Q1 SN74LV573ATDBR SSOP DB 20 2000 330.0 16.4 SN74LV573ATDGVR TVSOP DGV 20 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 SN74LV573ATDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1 SN74LV573ATPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1 SN74LV573ATRGYR QFN RGY 20 1000 180.0 12.4 3.8 4.8 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74LV573ATDBR SSOP DB 20 2000 346.0 346.0 33.0 SN74LV573ATDGVR TVSOP DGV 20 2000 346.0 346.0 29.0 SN74LV573ATDWR SOIC DW 20 2000 346.0 346.0 41.0 SN74LV573ATPWR TSSOP PW 20 2000 346.0 346.0 33.0 SN74LV573ATRGYR QFN RGY 20 1000 190.5 212.7 31.8 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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