NEC 2SK3749

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
2SK3749
N-CHANNEL MOS FET FOR HIGH-SPEED SWITCHIG
PACKAGE DRAWING (Unit: mm)
DESCRIPTION
The 2SK3749 is an N-channel vertical MOS FET. Because
2.1 ± 0.1
1.25 ± 0.1
it can be driven by a voltage as low as 2.5 V and it is not
0.9 ± 0.1
• Gate can be driven by 2.5 V
• Because of its high input impedance, there’s no need to
0.3 +0.1
–0
Marking
+0.1
0 to 0.1
consider drive current
3
1
+0.1
FEATURES
2
0.15–0.05
stereos and video cameras.
0.3–0
0.65 0.65
actuator for low-current portable systems such as headphone
0.3
2.0 ± 0.2
necessary to consider a drive current, this FET is ideal as an
ORDERING INFORMATION
PART NUMBER
PACKAGE
2SK3749
SC-70 (SSP)
1 : Source
2 : Gate
3 : Drain
Marking: G27
EQUIVALENT CIRCUIT
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Drain to Source Voltage (VGS = 0 V)
VDSS
50
V
Gate to Source Voltage (VDS = 0 V)
VGSS
±7.0
V
ID(DC)
±100
mA
ID(pulse)
±200
mA
Drain Current (DC)
Drain Current (pulse)
Note
Total Power Dissipation
PT
150
mW
Channel Temperature
Tch
150
°C
Storage Temperature
Tstg
−55 to +150
°C
Note PW ≤ 10 ms, Duty Cycle ≤ 50%
Drain
Body
Diode
Gate
Gate
Protection
Diode
Source
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.
When this device actually used, an additional protection circuit is externally required if a voltage exceeding
the rated voltage may be applied to this device.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. D17136EJ1V0DS00 (1st edition)
Date Published April 2004 NS CP(K)
Printed in Japan
2004
2SK3749
ELECTRICAL CHARACTERISTICS (TA = 25°C)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Zero Gate Voltage Drain Current
IDSS
VDS = 50 V, VGS = 0 V
1.0
µA
Gate Leakage Current
IGSS
VGS = ±7.0 V, VDS = 0 V
±5.0
µA
VGS(off)
VDS = 3.0 V, ID = 1.0 µA
0.9
1.5
V
| yfs |
VDS = 3.0 V, ID = 10 mA
20
RDS(on)1
VGS = 2.5 V, ID = 10 mA
20
40
Ω
RDS(on)2
VGS = 4.0 V, ID = 10 mA
15
20
Ω
Gate Cut-off Voltage
Forward Transfer Admittance
Note
Drain to Source On-state Resistance
Note
1.2
mS
Input Capacitance
Ciss
VDS = 3.0 V
6.0
pF
Output Capacitance
Coss
VGS = 0 V
8.0
pF
Reverse Transfer Capacitance
Crss
f = 1 MHz
1.2
pF
Turn-on Delay Time
td(on)
VDD = 3.0 V, ID = 20 mA
9.0
ns
tr
VGS = 3.0 V
50
ns
td(off)
RG = 10 Ω
20
ns
40
ns
Rise Time
Turn-off Delay Time
Fall Time
tf
Note Pulsed: PW ≤ 350 µs, Duty Cycle ≤ 2%
TEST CIRCUIT SWITCHING TIME
D.U.T.
RL
RG
PG.
VGS
VGS
Wave Form
0
90%
VDD
90%
ID
90%
ID
VGS
0
ID
0 10%
10%
Wave Form
τ
τ = 1 µs
Duty Cycle ≤ 1%
2
VGS
10%
td(on)
tr
ton
td(off)
tf
toff
Data Sheet D17136EJ1V0DS
2SK3749
TYPICAL CHARACTERISTICS (TA = 25°C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPRATURE
100
150
80
ID - Drain Current - mA
PT- Total Power Dissipation - mW
180
120
90
60
3.5 V
60
2.5 V
40
20
30
0
0
30
90
120
150
60
TA - Ambient Temperature - ˚C
0
180
VGS = 2.0 V
0
100
100
|yfs| - Forward Transfer Admittance - mS
VDS = 3.0 V
ID - Drain Current - mA
10
TA = 75˚C
25˚C
1
2
3
4
1
VDS - Drain to Source Voltage - V
5
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
TRANSFER CHARACTERISTICS
–25˚C
0.1
0.01
0.001
VDS = 3.0 V
TA = –25˚C
50
25˚C
125˚C
20
10
1
1
2
3
VGS - Gate to Source Voltage - V
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. DRAIN CURRENT
100
VGS = 2.5 V
50
TA = 75˚C
25˚C
20
–25˚C
10
5
2
1
1
2
5
10
20
ID - Drain Current - mA
50
100
RDS(on) - Drain to Source On-State Resistance - Ω
0
RDS(on) - Drain to Source On-State Resistance - Ω
3.0 V
4.0 V
2
5
10
20
ID - Drain Current - A
50
100
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. DRAIN CURRENT
100
VGS = 4.0 V
50
TA = 75˚C
25˚C
20
–25˚C
10
Data Sheet D17136EJ1V0DS
5
2
1
1
2
5
10
20
ID - Drain Current - mA
50
100
3
CAPACITANCE vs. DRAIN TO
SOURCE VOLTAGE
DRAIN TO SOURCE ON-STATE RESISTANCE
vs. GATE TO SOURCE VOLTAGE
10
30
Pulsed
Ciss, Coss, Crss - Capacitance - pF
RDS(on) - Drain to Source On-State Resistance - Ω
2SK3749
ID = 1 mA
10 mA
50 mA
20
10
Ciss
5
Coss
2
1
0.5
Crss
0.2
VGS = 0 V
f = 1 MHz
0.1
1
2
3
4
5
6
VGS - Gate to Source Voltage - V
1
7
100
tr
IF - Diode Forward Current - mA
td(on), tr, td(off), tf - Switching Time - ns
100
4
100
SOURCE TO DRAIN DIODE
FORWARD VOLTAGE
SWITCHING CHARACTERISTICS
50
tf
20
td(off)
10
td(on)
5
VDD = 3.0 V
VGS = 3.0 V
RG = 10 Ω
2
1
10
2
5
10
20
50
VDS - Drain to Source Voltage - V
20
50
100 200
ID - Drain Current - mA
500
10
1
1000
0
0.2
0.4
0.6
0.8
VF(S-D) - Source to Drain Voltage - V
Data Sheet D17136EJ1V0DS
1.0
2SK3749
• The information in this document is current as of April, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
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M8E 02. 11-1