NEC 3SK134B

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
3SK134B
RF AMP. FOR UHF TV TUNER
N-CHANNEL SILICON DUAL GATE MOS FIELD-EFFECT TRANSISTOR
4 PINS MINI MOLD
FEATURES
V
Gate1 to Source Voltage
VG1S
±8
Gate2 to Source Voltage
VG2S
±8 (±10)*1
V
Gate1 to Drain Voltage
VG1D
18
V
Gate2 to Drain Voltage
VG2D
18
V
Drain Current
ID
25
mA
Total Power Dissipation
PD
200
mW
Channel Temperature
Tch
125
°C
Storage Temperature
Tstg
–55 to +125
°C
*1 : RL ≥ 10 kΩ
3
0.95
(1.9)
V
(±10)*1
4
18
1
VDSX
0.6 +0.1
– 0.05
Drain to Source Voltage
(1.8)
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
0.85
4 Pins Mini Mold (EIAJ: SC-61)
1.5 +0.2
– 0.1
5o
5o
0.8
• Surface Mount Package :
2.9±0.2
Embossed Type Taping
1.1 +0.2
– 0.1
• Automatically Mounting :
2
• Suitable for use as RF amplifier in UHF TV tuner.
0.4 +0.1
– 0.05
2.8 +0.2
– 0.3
5o
0.4 +0.1
– 0.05
NF = 2.4 dB TYP. (@ = 900 MHz)
0.16 +0.1
– 0.05
• Low Noise Figure :
PACKAGE DIMENSIONS
(Unit : mm)
0 to 0.1
Gps = 23.0 dB TYP. (@ = 900 MHz)
0.4 +0.1
– 0.05
• High Power Gain :
5o
PIN CONNECTIONS
1. Source
2. Drain
3. Gate2
4. Gate1
PRECAUTION:
Avoid high static voltages or electric fields so that this device would not suffer from any damage due to those voltage
fields.
Document No. P10566EJ2V0DS00 (2nd edition)
(Previous No. TD-2398)
Date Published August 1995 P
Printed in Japan
©
1993
3SK134B
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
CHARACTERISTIC
SYMBOL
MIN.
Drain to Source Breakdown Voltage
BVDSX
18
Drain Current
IDSX
0.4
Gate1 to Source Cutoff Voltage
MAX.
UNIT
V
TEST CONDITIONS
VG1S = VG2S = –2 V, ID = 10 µA
8.0
mA
VG1S(off)
–2.0
V
VDS = 10 V, VG2S = 4 V, ID = 10 µA
Gate2 to Source Cutoff Voltage
VG2SS(off)
–0.7
V
VDS = 10 V, VG1S = 4 V, ID = 10 µA
Gate1 Reverse Current
IG1SS
±20
nA
VDS = VG2S = 0, VG1S = ±8 V
Gate2 Reverse Current
IG2SS
±20
nA
VDS = VG1S = 0, VG2S = ±8 V
Forward Transfer Admittance
|yfs|
25.0
29.0
35.0
mS
VDS = 10 V, VG2S = 4 V, ID = 10 mA
f = 1 kHz
Input Capacitance
Ciss
1.5
2.5
3.5
pF
Output Capacitance
Coss
0.6
1.1
1.6
pF
Reverse Transfer Capacitance
Crss
0.02
0.03
pF
Power Gain
Gps
Noise Figure
NF
IDSX Classification
Rank
2
TYP.
U55/UEE
U56/UEF
Marking
U55
U56
IDSX (mA)
0.4 to 5.0
3.0 to 8.0
20.0
23.0
2.4
3.5
VDS = 10 V, VG2S = 4 V, VG1S = 0.5 V
VDS = 10 V, VG2S = 4 V, ID = 10 mA
f = 1 MHz
dB
VDS = 10 V, VG2S = 4 V, ID = 10 mA
dB
f = 900 MHz
3SK134B
TYPICAL CHARACTERISTICS (TA = 25 ˚C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
25
Free air
ID – Drain Current – mA
300
200
100
0
20
ID – Drain Current – mA
VG2S = 4 V
25
50
100
75
1.1 V
15
0.9 V
10
0.8 V
5
5
15
10
20
VDS – Drain to Source Voltage – V
DRAIN CURRENT vs
GATE1 TO SOURCE VOLTAGE
FORWARD TRANSFER ADMITTANCE vs.
GATE1 TO SOURCE VOLTAGE
VDS = 10 V
VG2S = 5 V
3V
2V
10
0
1V
2.0
1.0
40
VDS = 10 V
f = 1 kHz
VG2S = 5 V
30
3V
4V
20
2V
10
1V
0
VG1S – Gate1 to Source Voltage – V
2.0
1.0
VG1S – Gate1 to Source Voltage – V
INPUT CAPACITANCE vs.
GATE2 TO SOURCE VOLTAGE
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
5.0
40
VDS = 10 V
f = 1 kHz
VG2S = 4 V
Ciss – Input Capacitance – pF
|yfs| – Forward Transfer Admittance – mS
1.0 V
TA – Ambient Temperature – °C
4V
30
20
10
0
VG1S = 1.2 V
20
0
125
|yfs| – Forward Transfer Admittance – mS
PD – Total Power Dissipation – mW
400
4
8
12
ID – Drain Current – mA
16
20
ID = 10 mA
(at VDS = 10 V
VG2S = 4 V)
4.0 f = 1 MHz
3.0
2.0
1.0
0
–1.0
0
1.0
2.0
3.0
4.0
5.0
VG2S – Gate2 to Source Voltage – V
3
3SK134B
POWER GAIN AND NOISE FIGURE vs.
GATE2 TO SOURCE VOLTAGE
OUTPUT CAPACITANCE vs.
GATE2 TO SOURCE VOLTAGE
20
Gps
1.0
0.5
Gps – Power Gain – dB
1.5
10
ID = 10 mA
(at VDS = 10 V
VG2S = 4 V)
f = 1 MHz
NF – Noise Figure – dB
Coss – Output Capacitance – pF
2.0
5
10
0
NF
–10
–20
0
–1.0
0
1.0
2.0
3.0
0
4.0
–2.0
VG2S – Gate2 to Source Voltage – V
0
2.0
ID = 10 mA
(at VDS = 10 V
VG2S = 4 V)
f = 900 MHz
4.0
6.0
8.0
VG2S – Gate2 to Source Voltage – V
900 MHz Gps AND NF TEST CIRCUIT
VG2S (3 V)
1 000 pF
47 kΩ
1 000 pF
to 10 pF
to 10 pF
to 10 pF
INPUT
50 Ω
OUTPUT
50 Ω
to 10 pF
L2
L1
47 kΩ
1 000 pF
RFC
1 000 pF
L1, L2; 35 × 5 × 0.2 mm
VG1S
4
VDD (6 V)
3SK134B
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document.
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property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact NEC Sales Representative in advance.
Anti-radioactive design is not implemented in this product.
M4 94.11
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