NEC 3SK254

DATA SHEET
MOS FIELD EFFECT TRANSISTOR
3SK254
RF AMPLIFIER FOR CATV TUNER
N-CHANNEL Si DUAL GATE MOS FIELD-EFFECT TRANSISTOR
4 PINS SUPER MINI MOLD
FEATURES
PACKAGE DIMENSIONS
(VDS = 3.5 V)
(Unit: mm)
• Driving Battery
2.1±0.2
NF1 = 2.0 dB TYP. (f = 470 MHz)
0.3 +0.1
–0.05
• Low Noise Figure :
NF2 = 0.8 dB TYP. (f = 55 MHz)
GPS = 19.0 dB TYP. (f = 470 MHz)
1.25±0.1
2
• High Power Gain :
0.3 +0.1
–0.05
:
3
• Low VDD Use
±8*1
V
Gate1 to Drain Voltage
VG1D
18
V
Gate2 to Drain Voltage
VG2D
18
V
Drain Current
ID
25
mA
Total Power Dissipation
PD
130*2
mW
Channel Temperature
Tch
125
°C
Storage Temperature
Tstg
–55 to +125
°C
*1: RL ≥ 10 kΩ
*2: Free air
(1.3)
0.3 +0.1
–0.05
VG2S
0.15 +0.1
–0.05
Gate2 to Source Voltage
4
V
0 to 0.1
V
±8*1
0.4 +0.1
–0.05
18
VG1S
0.3
VDSX
Gate1 to Source Voltage
0.9±0.1
Drain to Source Voltage
1
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
0.65
4 Pins Super Mini Mold
:
1.25
Embossed Type Taping
• Small Package
0.60
• Automatically Mounting :
2.0±0.2
• Suitable for use as RF amplifier in CATV tuner.
PIN CONNECTIONS
1.
2.
3.
4.
Source
Drain
Gate2
Gate1
PRECAUTION:
Avoid high static voltages or electric fields so that this device would not suffer from any damage due to those voltage
or fields.
Document No. P10585EJ2V0DS00 (2nd edition)
(Previous No. TD-2307)
Date Published August 1995 P
Printed in Japan
©
1993
3SK254
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
CHARACTERISTIC
SYMBOL
MIN.
Drain to Source Breakdown Voltage
BVDSX
18
Drain Current
IDSX
0.1
Gate1 to Source Cutoff Voltage
VG1S(off)
–1.0
Gate2 to Source Cutoff Voltage
VG2S(off)
0
Gate1 Reverse Current
MAX.
UNIT
V
TEST CONDITIONS
VG1S = VG2S = –2 V, ID = 10 µA
5.0
mA
0
+1.0
V
VDS = 3.5 V, VG2S = 3 V, ID = 10 µA
0.5
1.0
V
VDS = 3.5 V, VG1S = 3 V, ID = 10 µA
IG1SS
±20
nA
VDS = 0, VG2S = 0, VG1S = ±6 V
Gate2 Reverse Current
IG2SS
±20
nA
VDS = 0, VG1S = 0, VG2S = ±6 V
Forward Transfer Admittance
|yfs|
14
18
23
mS
VDS = 3.5 V, VG2S = 3 V, ID = 7 mA
f = 1 kHz
Input Capacitance
Ciss
2.4
2.9
3.4
pF
Output Capacitance
Coss
0.9
1.2
1.5
pF
Reverse Transfer Capacitance
Crss
0.01
0.03
pF
Power Gain
Gps
19
22
dB
VDS = 3.5 V, VG2S = 3 V, ID = 7 mA
Noise Figure 1
NF1
2.0
3.0
dB
f = 470 MHz
Noise Figure 2
NF2
0.8
2.3
dB
VDS = 3.5 V, VG2S = 3 V, ID = 7 mA
f = 55 MHz
IDSX Classification
2
TYP.
Rank
U1E
Marking
U1E
IDSX (mA)
0.1 to 0.5
16
VDS = 3.5 V, VG2S = 3 V, VG1S = 0.5 V
VDS = 3.5 V, VG2S = 3 V, ID = 7 mA
f = 1 MHz
3SK254
TYPICAL CHARACTERISTICS (TA = 25 ˚C)
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
TOTAL POWER DISSIPATION vs.
AMBIENT TEMPERATURE
100
20
1.4 V
15
1.2 V
1.0 V
10
0.8 V
5
0.6 V
25
50
75
100
10
DRAIN CURRENT vs.
GATE1 TO SOURCE VOLTAGE
FORWARD TRANSFER ADMITTANCE vs.
GATE1 TO SOURCE VOLTAGE
VDS = 3.5 V
3.0 V
VG2S = 3.5 V
2.5 V
2.0 V
15
10
1.5 V
5
1.0 V
0.5
1.0
1.5
2.0
2.5
40
VDS = 3.5 V
f = 1 kHz
32
VG2S = 3.5 V
24
3.0 V
16
2.0 V
2.5 V
8
1.0 V
0
0.5
1.5 V
1.0
1.5
2.0
VG1S – Gate1 to Source Voltage – V
VG1S – Gate1 to Source Voltage – V
FORWARD TRANSFER ADMITTANCE vs.
DRAIN CURRENT
INPUT CAPACITANCE vs.
GATE2 TO SOURCE VOLTAGE
40
2.5
5.0
VDS = 3.5 V
f = 1 kHz
32
VG2S = 3.5 V
24
3.0 V
16
2.5 V
8
2.0 V
1.5 V
1.0 V
0
5
VDS – Drain to Source Voltage – V
20
0
0
125
Ta – Ambient Temperature – °C
|yfs| – Forward Transfer Admittance – mS
25
ID – Drain Current – mA
ID – Drain Current – mA
130 mW
0
|yfs| – Forward Transfer Admittance – mS
VG2S = 3 V
VG1S = 1.6 V
200
Ciss – Input Capacitance – pF
PD – Total Power Dissipation – mW
25
4
8
12
ID – Drain Current – mA
16
20
4.0
ID = 7 mA
(at VDS = 3.5 V,
VG2S = 3 V)
f = 1 MHz
3.0
2.0
1.0
0
–1.0
0
1.0
2.0
3.0
4.0
VG2S – Gate2 to Source Voltage – V
3
3SK254
OUTPUT CAPACITANCE vs.
GATE2 TO SOURCE VOLTAGE
POWER GAIN AND NOISE FIGURE vs.
GATE2 TO SOURCE VOLTAGE
10
2.0
1.5
1.0
0.5
5
ID = 7 mA
(at VDS = 3.5 V,
VG2S = 3.0 V)
f = 470 MHz
GPS
10
0
–10
NF
–20
0
–1.0
0
1.0
2.0
3.0
VG2S – Gate2 to Source Voltage – V
4
20
GPS – Power Gain – dB
ID = 7 mA
(at VDS = 3.5 V,
VG2S = 3.0 V)
f = 1 MHz
NF – Noise Figure – dB
Coss – Output Capacitance – pF
2.5
4.0
0
–1.0
0
1.0
2.0
3.0
VG2S – Gate2 to Source Voltage – V
4.0
3SK254
GPS AND NF TEST CIRCUIT AT f = 470 MHz
VG2S
1 000 pF
22 kΩ
1 000 pF
Ferrite Beads
INPUT 40 pF
40 pF OUTPUT
L2
L1
50 Ω
15 pF
1 000 pF
1 000 pF
15 pF
50 Ω
22 kΩ
L3
1 000 pF
1 000 pF
VDS
VG1S
L1: φ 1.2 mm U.E.W φ 5 mm 1T
L2: φ 1.2 mm U.E.W φ 5 mm 1T
L3: REC 2.2 µ H
NF TEST CIRCUIT AT f = 55 MHz
VG2S
VDS
RFC
2.2 kΩ
Ferrite Beads
1 500 pF
1 500 pF
1 000 pF
INPUT
50 Ω
3.3
kΩ
27 pF
47
kΩ
47 kΩ
27 pF
OUTPUT
3.3 kΩ
50 Ω
1 000 pF
VG1S
5
3SK254
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document.
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property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
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property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety
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“Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on
a customer designated “quality assurance program“ for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
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Anti-radioactive design is not implemented in this product.
M4 94.11
2