PRELIMINARY PRODUCT INFORMATION GaAs MULTI-CHIP MODULE MC-7893 1 GHz CATV 23 dB POWER DOUBLER AMPLIFIER DESCRIPTION The MC-7893 is a GaAs Multi-chip Module designed for use in CATV applications up to 1 GHz. This unit has low distortion, low noise figure and return loss across the entire frequency band. Reliability and performance uniformity are assured by our stringent quality and control procedures. FEATURES • Low distortion • High linear gain GL = 22.5 dB MIN. @ f = 1 GHz • Low return loss ORDERING INFORMATION Part Number MC-7893-AZ Package Supplying Form 7-pin special with heatsink 50 pcs MAX./Tray Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: MC-7893 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Ratings Unit VDD 30 V Vi 70.0 dBmV Operating Case Temperature TC −30 to +100 °C Storage Temperature Tstg −40 to +100 °C Supply Voltage Input Voltage Note Note In case of single tone Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. *************** (1st edition) Date Published March 2005 CP(K) Printed in Japan © NEC Compound Semiconductor Devices 2005 MC-7893 RECOMMENDED OPERATING CONDITIONS (ZS = ZL = 75 Ω, unless otherwise specified) Parameter Supply Voltage Input Voltage Symbol Test Conditions VDD Vi 77 channel, MIN. TYP. MAX. Unit 23.5 24.0 24.5 V − 30.0 36.0 dBmV −30 +25 +85 °C 7 dB tilted across the band Operating Case Temperature TC ELECTRICAL CHARACTERISTICS (TC = 30±5°C, VDD = 24 V, ZS = ZL = 75 Ω, unless otherwise specified) Parameter Symbol Test Conditions MIN. TYP. MAX. Unit Linear Gain 1 GL1 f = 40 MHz 21.0 − 22.0 dB Linear Gain 2 GL2 f = 1 GHz 22.5 − 24.0 dB f = 40 MHz to 1 GHz 0.8 − 2.2 dB f = 40 MHz to 1 GHz, Peak to valley − − 0.6 dB Gain Slope GSlope Gain Flatness GFlatness Noise Figure 1 NF1 f = 50 MHz − − 6.5 dB Noise Figure 2 NF2 f = 1 GHz − − 7.0 dB Operating Current IDD RF OFF − − 385 mA Composite Triple Beat CTB 77 channel, − − −63 dBc Cross Modulation XM VO = 52 dBmV at 547.25 MHz, − − −60 dBc Composite 2nd Order Beat CSO 7 dB tilted across the band − − −65 dBc Input Return Loss 1 RLi1 f = 40 MHz 20 − − dB Input Return Loss 2 RLi2 f = 1 GHz 14 − − dB Output Return Loss 1 RLo1 f = 40 MHz 23 − − dB Output Return Loss 2 RLo2 f = 1 GHz 17 − − dB 2 Preliminary Product Information MC-7893 PACKAGE DIMENSIONS 7-PIN SPECIAL WITH HEATSINK (UNIT: mm) 8.1 MAX. 38.1±0.25 +0.25 φ 4.25–0.35 27.5 MAX. 4.0±0.25 14.85 MAX. 3.2 MAX. 45.08 MAX. 19.05±0.38 25.4±0.25 6-32UNC2B 0.51±0.05 10.75±0.25 7 8 9 2.62±0.35 5 12.9 MAX. 1 2 3 21.5 MAX. 4.19±0.13 2.54±0.25 A 2.54±0.38 6.3 0.51±0.05 2.5 0.38.. A ±0.05 PIN CONNECTION VDD 5 1 9 IN OUT 2 3 7 8 GND Preliminary Product Information 3 MC-7893 NOTES ON CORRECT USE (1) The space between PC board and root of the lead should be kept more than 1 mm to prevent undesired stress to the lead and also should be kept less than 4 mm to prevent undesired parasitic inductance. Recommended that space is 2.0 to 3.0 mm typical. (2) Recommended torque strength of the screw is 59 to 78 Ncm. (3) Form the ground pattern as wide as possible to minimize ground impedance. (to prevent undesired oscillation) All the ground pins must be connected together with wide ground pattern to decrease impedance difference. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Partial Heating Soldering Conditions Peak temperature (pin temperature) : 350°C or below Soldering time (per pin of device) Recommended Condition Symbol Note : 3 seconds or less Note The point of pin part heating must be kept more than 1.2 mm distance from the root of lead. 4 Preliminary Product Information − MC-7893 • The information in this document is current as of June, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 Preliminary Product Information 5 MC-7893 Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices, Ltd. http://www.ncsd.necel.com/ E-mail: [email protected] (sales and general) [email protected] (technical) Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579 NEC Compound Semiconductor Devices Hong Kong Limited E-mail: [email protected] (sales, technical and general) FAX: +852-3107-7309 TEL: +852-3107-7303 Hong Kong Head Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Taipei Branch Office FAX: +82-2-558-5209 TEL: +82-2-558-2120 Korea Branch Office NEC Electronics (Europe) GmbH http://www.ee.nec.de/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 0406