DATA SHEET LASER DIODE NDL7701P Series 1 550 nm OPTICAL FIBER COMMUNICATIONS InGaAsP STRAINED MQW DFB DC-PBH LASER DIODE MODULE DESCRIPTION The NDL7701P Series is a 1 550 nm phase-shifted DFB (Distributed Feed-Back) laser diode with single mode fiber. The strained Multiple Quantum Well (st-MQW) structure is adopted to achieve stable dynamic single longitudinal mode operation over wide temperature range of –20 to +85 °C. It is designed for all STM-1 and STM-4 applications. FEATURES λp = 1 550 nm • Peak emission wavelength • Low threshold current Ith = 15 mA @ TC = 25 °C • Wide operating temperature range T C = −20 to +85 °C • InGaAs monitor PIN-PD • Based on Bellcore TA-NWT-000983 PACKAGE DIMENSIONS in millimeters NDL7701P1 0.9 3.2±0.25 NDL7701P2 0.9 3.2±0.25 7±0.2 PIN CONNECTIONS 15 27.7±1.0 PIN CONNECTIONS 4 3 1 2 12 Case LD 1.0±0.1 3.7±0.3 7.2±0.3 φ 7±0.2 12 0.3 P.C.D. = 2 2– 2.5 16 PD 3 P.C.D. = 2 4– 0.45 ±0.05 PIN CONNECTIONS PD 4 2.5±1.0 19.5±1.0 0.5±0.2 4.0±0.2 20±1.0 0.45±0.05 6±1.0 12.7±0.2 17.0±0.2 6±0.1 4 3 5 27.4±1.0 15 5 2– 2.2 2.0±0.2 5 15 27.4±1.0 20±1.0 0.45±0.05 0.9 3.2±0.25 7±0.2 7±0.2 P.C.D. = 2 Optical Fiber SM-9/125 Length: 1 m 0.3 Optical Fiber SM-9/125 Length: 1 m 4 3 1 2 LD Case 2 1 3 4 12±0.15 7±0.2 NDL7701P Optical Fiber SM-9/125 Length: 1 m PD 2 1 3 4 LD Case 16.0 The information in this document is subject to change without notice. Document No. P10715EJ4V0DS00 (4th edition) Date Published November 1998 NS CP(K) Printed in Japan The mark • shows major revised points. © 1995 NDL7701P Series ORDERING INFORMATION Part Number Available Connector NDL7701P Without Connector NDL7701PC With FC-PC Connector NDL7701PD With SC-PC Connector NDL7701P1 Without Connector NDL7701P1C With FC-PC Connector NDL7701P1D With SC-PC Connector NDL7701P2 Without Connector NDL7701P2C With FC-PC Connector NDL7701P2D With SC-PC Connector Flange Type No Flange Flat Mount Flange Vertical Flange ABSOLUTE MAXIMUM RATINGS (TC = −20 to +85 °C, unless otherwise specified) Parameter Symbol Ratings Unit Optical Output Power from Fiber Pf 5.0 mW Forward Current of LD IF 150 mA Reverse Voltage of LD VR 2.0 V Forward Current of PD IF 10 mA Reverse Voltage of PD VR 20 V Operating Case Temperature TC −20 to +85 °C Storage Temperature Tstg −40 to +85 °C Lead Soldering Temperature (10 s) Tsld 260 °C 2 NDL7701P Series ELECTRO-OPTICAL CHARACTERISTICS (TC = −20 to +85 °C, unless otherwise specified) Parameter Symbol Conditions MIN. TYP. Forward Voltage VF Pf = 2.0 mW, TC = 25 °C Threshold Current Ith TC = 25 °C 15 Differential Efficiency from Fiber ηd Pf = 2.0 mW, TC = 25 °C 0.1 Peak Emission Wavelength λp Pf = 1.0 mW, PN 1/2, Ib = Ith, Side Mode Suppression Ratio SMSR ∆ηd Temperature Dependence of Differential Efficiency from Fiber 1 530 622 Mb/s-NRZ ∆ηd = 10 log 1 550 MAX. Unit 1.3 V 25 mA W/A 1 570 30 ηd (TC = 85 °C) ηd (TC = 25 °C) −3.0 nm dB −2.5 dB Rise Time tr 10-90%, TC = 25 °C 0.5 ns Fall Time tf 90-10%, TC = 25 °C 0.5 ns Monitor Current Im VR = 5 V, Pf = 2.0 mW Monitor Dark Current ID VR = 5 V, TC = 25 °C γ Tracking Error *1 γ = 10 log Pf 2.0 mW Pf (mW) 2.0 *1 µA 100 0.1 Im = const. (@ Pf = 2 mW, TC = 25 °C) 5 nA 1.0 dB TC = 25 ˚C TC = –20 to +85 ˚C Pf 0 Im (@ Pf (25 ˚C) = 2.0 mW) Im 3 NDL7701P Series DFB-LD FAMILY FOR TELECOM Absolute Maximum Ratings Part Number TC (°C) Tstg (°C) Typical Characteristics Ith (mA) Pf (mW) λp (nm) TYP. MIN. TYP. SDH Application Package NDL7603P Series −40 to +85 −40 to +85 15 2 1 310 ≤ STM-4 : 622 Mb/s Coaxial NDL7620P Series 0 to +70 −40 to +85 45 (MAX.) 2 1 310 ≤ STM-16: 2.5 Gb/s Coaxial NDL7701P Series −20 to +85 −40 to +85 15 2 1 550 ≤ STM-4 : 622 Mb/s Coaxial NDL7705P Series −40 to +85 −40 to +85 15 2 1 550 ≤ STM-4 : 622 Mb/s Coaxial *1 CW Light Source for external modulator BFY *2 CW Light Source for external modulator BFY *1 ≤ STM-16: 2.5 Gb/s EA modulator integrated DFB-LD NX8562LB −20 to +65 −40 to +85 20 20 1 550 NX8563LB Series −20 to +65 −40 to +85 20 10 ITU-T NDL7910P −20 to +70 −40 to +85 7 0.5 1 550 *1 Wavelength selectable for ITU-T standards upon request. *2 Wavelength selectable for ITU-T standards. 4 BFY NDL7701P Series REFERENCE Document Name Document No. NEC semiconductor device reliability/quality control system C11159E Quality grades on NEC semiconductor devices C11531E Semiconductor device mounting technology manual C10535E Semiconductor selection guide X10679E 5 NDL7701P Series [MEMO] 6 NDL7701P Series [MEMO] 7 NDL7701P Series CAUTION Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal. NEC Corporation DANGER INVISIBLE LASER RADIATION AVOID DIRECT EXPOSURE TO BEAM OUTPUT POWER mW MAX WAVELENGTH nm CLASS lllb LASER PRODUCT SEMICONDUCTOR LASER AVOID EXPOSURE-Invisible Laser Radiation is emitted from this aperture NEC Building, 7-1, Shiba 5-chome, Minato-ku, Tokyo 108-01, Japan Type number: Manufactured: Serial Number: This product conforms to FDA regulations as applicable to standards 21 CFR Chapter 1. Subchapter J. The export of this product from Japan is prohibited without governmental license. To export or re-export this product from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales representative. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5