TI SN74ABT620DWR

SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
D
D
D
D
SN54ABT620 . . . J PACKAGE
SN74ABT620 . . . DB, DW, N, OR PW PACKAGE
(TOP VIEW)
OEAB
A1
A2
A3
A4
A5
A6
A7
A8
GND
20
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
10
11
VCC
OEBA
B1
B2
B3
B4
B5
B6
B7
B8
SN54ABT620 . . . FK PACKAGE
(TOP VIEW)
description
These octal bus transceivers provide for
asynchronous communication between data
buses. The control-function implementation
allows for maximum flexibility in timing. The
’ABT620 devices provide inverted data at the
outputs.
1
A3
A4
A5
A6
A7
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
B1
B2
B3
B4
B5
A8
GND
B8
B7
B6
These devices allow data transmission from the
A bus to the B bus or from the B bus to the A bus,
depending on the logic levels at the output-enable
(OEAB and OEBA) inputs.
OEBA
D
State-of-the-Art EPIC-ΙΙB  BiCMOS Design
Significantly Reduces Power Dissipation
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA Per
JESD 17
Typical VOLP (Output Ground Bounce) < 1 V
at VCC = 5 V, TA = 25°C
High-Drive Outputs (–32-mA IOH,
64-mA IOL )
Package Options Include Plastic
Small-Outline (DW), Shrink Small-Outline
(DB), and Thin Shrink Small-Outline (PW)
Packages, Ceramic Chip Carriers (FK), and
Plastic (N) and Ceramic (J) DIPs
A2
A1
OEAB
VCC
D
The output-enable inputs can be used to disable the device so that the buses are effectively isolated. The
dual-enable configuration gives the transceivers the capability of storing data by simultaneously enabling OEAB
and OEBA. When both OEAB and OEBA are enabled and all other data sources to the two sets of bus lines
are at high impedance, both sets of bus lines (16 total) remain at their last states. In this way, each output
reinforces its input in this configuration.
To ensure the high-impedance state during power up or power down, OEBA should be tied to VCC through a
pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
OEAB should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by
the current-sourcing capability of the driver.
The SN54ABT620 is characterized for operation over the full military temperature range of –55°C to 125°C. The
SN74ABT620 is characterized for operation from –40°C to 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC-ΙΙB is a trademark of Texas Instruments Incorporated.
Copyright  1998, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
FUNCTION TABLE
INPUTS
OEAB
L
L
B data to A bus
H
B data to A bus,
A data to B bus
L
H
L
Isolation
H
H
A data to B bus
logic symbol†
19
OEBA
OEAB
1
OPERATION
OEBA
logic diagram (positive logic)
OEBA
EN1
EN2
OEAB
A1
A2
A3
A4
A5
A6
A7
A8
2
18
1
3
1
1
2
17
4
16
5
15
6
14
7
13
8
12
9
11
19
1
B1
A1
2
18
B1
B2
B3
B4
B5
To Seven Other Channels
B6
B7
B8
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V
Current into any output in the low state, IO: SN54ABT620 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA
SN74ABT620 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA
Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace
length of zero.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
recommended operating conditions (see Note 3)
SN54ABT620
VCC
VIH
Supply voltage
VIL
VI
Low-level input voltage
IOH
IOL
High-level output current
∆t/∆v
Input transition rise or fall rate
High-level input voltage
SN74ABT620
MIN
MAX
MIN
MAX
4.5
5.5
4.5
5.5
2
2
0.8
Input voltage
0
Low-level output current
Outputs enabled
VCC
–24
V
V
0.8
0
UNIT
VCC
–32
V
V
mA
48
64
mA
5
5
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 3: All unused pins (control or I/O) of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VIK
VOH
TEST CONDITIONS
VCC = 4.5 V,
VCC = 4.5 V,
II = –18 mA
IOH = –3 mA
VCC = 5 V,
VCC = 4
4.5
5V
VOL
VCC = 4
4.5
5V
MIN
MIN
–1.2
MAX
SN74ABT620
MIN
–1.2
2.5
IOH = –3 mA
IOH = –24 mA
3
3
3
2
2
IOH = –32 mA
IOL = 48 mA
2*
IOZH‡
IOZL‡
VCC = 5.5 V,
VCC = 5.5 V,
VO = 2.7 V
VO = 0.5 V
Ioff
VCC = 0,
VCC = 5.5 V,
VO = 5.5 V
VI or VO ≤ 4.5 V
VCC = 5.5 V,
VO = 2.5 V
Outputs high
IO§
0.55
0.55*
0.55
A or B ports
Data inputs
inp ts
∆ICC¶
Control inputs
Ci
Control inputs
Cio
A or B ports
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
VCC = 5.5 V,
One input at 3.4 V,,
Other inputs at
VCC or GND
Outputs high
V
mV
±1
±1
±1
±100
±100
±100
50
50
50
µA
–50
–50
±100
50
–50
V
2
0.55
IOL = 64 mA
VI = VCC or GND
A or B ports
UNIT
V
100
Control inputs
ICEX
–100
–180
50
–50
–180
–50
µA
–50
µA
±100
µA
50
µA
–180
mA
5
250
250
250
µA
Outputs low
24
30
30
30
mA
Outputs disabled
0.5
250
250
250
µA
Outputs enabled
1.5
1.5
1.5
Outputs disabled
0.05
0.05
0.05
1.5
1.5
1.5
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
VI = 2.5 V or 0.5 V
VO = 2.5 V or 0.5 V
pF
7
pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
mA
4
* On products compliant to MIL-PRF-38535, this parameter does not apply.
† All typical values are at VCC = 5 V.
‡ The parameters IOZH and IOZL include the input leakage current.
§ Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
4
MAX
–1.2
2.5
VCC = 5
5.5
5V
V,
ICC
SN54ABT620
2.5
Vhys
II
TA = 25°C
TYP†
MAX
• DALLAS, TEXAS 75265
SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A or B
B or A
tPZH
tPZL
OEBA
A
tPHZ
tPLZ
OEBA
A
tPZH
tPZL
OEAB
B
tPHZ
tPLZ
OEAB
B
PARAMETER
VCC = 5 V,
TA = 25°C
SN54ABT620
MIN
MAX
MIN
1
4.1
1
MAX
SN74ABT620
MIN
MAX
1
1
4.8
4.3
1
1
4.8
1.3
4.6
1.3
1.3
5.5
1
6.1
1
1
7.1
2
6.3
2
2
7
1.4
5.4
1.4
1.4
5.8
1.6
6.2
1.6
1.6
6.8
2
5.9
2
2
6.4
1.2
5.6
1.2
1.2
6.5
1.1
4.7
1.1
1.1
5.6
UNIT
ns
ns
ns
ns
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54ABT620, SN74ABT620
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS113D – FEBRUARY 1991 – REVISED APRIL 1998
PARAMETER MEASUREMENT INFORMATION
7V
S1
500 Ω
From Output
Under Test
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
LOAD CIRCUIT
3V
Timing Input
1.5 V
0V
tw
tsu
3V
Input
1.5 V
1.5 V
th
3V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
3V
1.5 V
Input
1.5 V
0V
tPHL
tPLH
VOH
1.5 V
Output
1.5 V
VOL
tPHL
tPLH
VOH
Output
1.5 V
1.5 V
VOL
3V
Output
Control
1.5 V
1.5 V
0V
tPZL
tPLZ
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
1.5 V
tPZH
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
3.5 V
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH – 0.3 V
VOH
[0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74ABT620DBLE
OBSOLETE
SSOP
DB
20
SN74ABT620DBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620DWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT620NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74ABT620NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABT620NSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ABT620DBR
SSOP
DB
20
2000
330.0
16.4
8.2
7.5
2.5
12.0
16.0
Q1
SN74ABT620DWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74ABT620NSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ABT620DBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74ABT620DWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74ABT620NSR
SO
NS
20
2000
346.0
346.0
41.0
Pack Materials-Page 2
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