NEC PS7221-2A-F4

DATA SHEET
Solid State Relay
OCMOS FET
PS7221-2A
8-PIN SOP 200 V BREAK DOWN VOLTAGE
2-ch Optical Coupled MOS FET
DESCRIPTION
The PS7221-2A is solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on
the output side.
It is suitable for analog signal control because of their low offset and high linearity.
FEATURES
• 2 channel type (1 a + 1 a output)
• Low LED operating current (IF = 2 mA)
• Designed for AC/DC switching line changer
• Small and thin package (8-pin SOP, Height = 2.1 mm)
• Low offset voltage
• Ordering number of taping product: PS7221-2A-F3, F4
• UL approved: File No. E72422 (S)
• BSI approved: No. 8241/8242
• CSA approved: No. CA 101391
APPLICATIONS
• Exchange equipment
• Measurement equipment
• FA/OA equipment
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12672EJ4V0DS00 (4th edition)
Date Published October 1999 NS CP (K)
Printed in Japan
The mark • shows major revised points.
©
1997, 1999
PS7221-2A
PACKAGE DIMENSIONS
0.4±0.3
(in millimeters)
9.08±0.5
TOP VIEW
8
7
6
5
1
2
3
4
7.0±0.3
0.05+0.08
–0.05
2.05+0.08
–0.05
0.15+0.10
–0.05
4.4
2
0.5±0.3
2.54
0.40+0.10
–0.05
0.25 M
Data Sheet P12672EJ4V0DS00
1. LED Anode
2. LED Cathode
3. LED Anode
4. LED Cathode
5. MOS FET
6. MOS FET
7. MOS FET
8. MOS FET
PS7221-2A
ORDERING INFORMATION
Part Number
PS7221-2A
Package
8-pin SOP
Packing Style
Magazine case 45 pcs
PS7221-2A -F3
*1
Application Part Number
PS7221-2A
Embossed Tape 1 500 pcs/reel
PS7221-2A -F4
*1 For the application of the Safety Standard, following part number should be used.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Forward Current (DC)
IF
50
mA
Reverse Voltage
VR
5.0
V
PD
50
mW/ch
IFP
1
A
Break Down Voltage
VL
200
V
Continuous Load
Current
IL
150
mA
Pulse Load Current
(AC/DC Connection)
ILP
400
mA
Power Dissipation
PD
180
mW/ch
Isolation Voltage
BV
1 500
Vr.m.s.
Total Power Dissipation
PT
460
mW
Operating Ambient Temperature
TA
–40 to +80
°C
Storage Temperature
Tstg
–40 to +100
°C
Diode
Power Dissipation
Peak Forward Current
MOS FET
*1
*2
*3
*1 PW = 100 µs, Duty Cycle = 1 %
*2 PW = 100 ms, 1 shot
*3 AC voltage for 1 minute at TA = 25 °C, RH = 60 % between input and output
Data Sheet P12672EJ4V0DS00
3
PS7221-2A
RECOMMENDED OPERATING CONDITIONS (TA = 25 °C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
LED Operating Current
IF
2
10
20
mA
LED Off Voltage
VF
0
0.5
V
ELECTRICAL CHARACTERISTICS (TA = 25 °C)
Parameter
Diode
MOS FET
Coupled
Symbol
Conditions
Forward Voltage
VF
IF = 10 mA
Reverse Current
IR
VR = 5 V
Off-state Leakage Current
ILoff
VD = 200 V
Output Capacitance
Cout
VD = 0 V, f = 1 MHz
LED On-state Current
IFon
IL = 150 mA
On-state Resistance
Ron1
IF = 10 mA, IL = 10 mA
MIN.
IF = 10 mA, IL = 150 mA, t ≤ 10 ms
ton
IF = 10 mA, VO = 5 V, PW ≥ 10 ms
*1
toff
Isolation Resistance
RI-O
VI-O = 1.0 kVDC
Isolation Capacitance
CI-O
V = 0 V, f = 1 MHz
Unit
1.2
1.4
V
5.0
µA
1.0
µA
88
Ron2
Turn-off Time
MAX.
0.03
*1
Turn-on Time
TYP.
pF/ch
2.0
mA
4.0
8.0
Ω
0.16
1.0
ms
0.02
0.2
Ω
9
10
0.4
pF/ch
*1 Test Circuit for Switching Time
IF
Pulse Input
VL
50 %
Input
0
VO = 5 V
Input monitor
90 %
VO monitor
Output
Rin
RL
10 %
ton
4
Data Sheet P12672EJ4V0DS00
toff
PS7221-2A
TYPICAL CHARACTERISTICS (TA = 25 °C, unless otherwise specified)
MAXIMUM LOAD CURRENT vs.
AMBIENT TEMPERATURE
MAXIMUM FORWARD CURRENT vs.
AMBIENT TEMPERATURE
300
Maximum Load Current IL (mA)
Maximum Forward Current IF (mA)
100
80
60
40
20
0
–25
0
25
7580
50
250
200
150
100
50
0
–25
100
0
25
7580
50
Ambient Temperature TA (˚C)
Ambient Temperature TA (˚C)
FORWARD VOLTAGE vs.
AMBIENT TEMPERATURE
OUTPUT CAPACITANCE vs.
APPLIED VOLTAGE
1.6
100
125
1.4
IF = 50 mA
30 mA
20 mA
10 mA
5 mA
1.2
1.0
1 mA
0.8
–25
0
25
50
75
Output Capacitance Cout (pF)
Forward Voltage VF (V)
f = 1 MHz
100
100
75
50
25
0
20
40
60
Applied Voltage VD (V)
OFF-STATE LEAKAGE CURRENT vs.
APPLIED VOLTAGE
LOAD CURRENT vs. LOAD VOLTAGE
10
–6
TA = 80 ˚C
10–7
Load Current IL (mA)
Off-state Leakage Current ILoff (A)
IF = 10 mA
200
10
120
Ambient Temperature TA (˚C)
10–4
–5
100
80
25 ˚C
10–8
100
–1.0
–0.5
0
0.5
1.0
–100
10–9
–200
10–10
0
50
100
150
200
250
Load Voltage VL (V)
Applied Voltage VD (V)
Data Sheet P12672EJ4V0DS00
5
PS7221-2A
NORMALIZED ON-STATE RESISTANCE vs.
AMBIENT TEMPERATURE
ON-STATE RESISTANCE DISTRIBUTION
30
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
IL = 10 mA
2.5
2.0
1.5
1.0
n = 50 pcs,
IF = 10 mA,
IL = 10 mA
25
Number (pcs)
Normalized On-state Resistance Ron
3.0
0.5
20
15
10
5
0.0
–25
0
25
50
0
100
75
3.6
3.8
4.0
4.2
Ambient Temperature TA (˚C)
On-state Resistance Ron (Ω)
TURN-ON TIME vs. FORWARD CURRENT
TURN-OFF TIME vs. FORWARD CURRENT
2.5
0.5
VO = 5 V
2.0
Turn-off Time toff (ms)
Turn-on Time ton (ms)
VO = 5 V
1.5
1.0
0.5
0
5
10
15
20
0.3
0.2
0.1
0
30
25
0.4
15
n = 50 pcs,
IF = 10 mA,
VO = 5 V
15
10
5
20
15
10
5
0.16
0.24
30
n = 50 pcs,
IF = 10 mA,
VO = 5 V
25
Number (pcs)
20
25
20
30
25
Number (pcs)
10
TURN-OFF TIME DISTRIBUTION
TURN-ON TIME DISTRIBUTION
30
0
5
Forward Current IF (mA)
Forward Current IF (mA)
0
Turn-on Time ton (ms)
6
4.4
0.02
0.04
Turn-off Time toff (ms)
Data Sheet P12672EJ4V0DS00
PS7221-2A
NORMALIZED TURN-OFF TIME vs.
AMBIENT TEMPERATURE
NORMALIZED TURN-ON TIME vs.
AMBIENT TEMPERATURE
3.0
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
0
25
50
75
100
Normalized Turn-off Time toff
Normalized Turn-on Time ton
3.0
Normalized to 1.0
at TA = 25 ˚C,
IF = 10 mA,
VO = 5 V
2.5
2.0
1.5
1.0
0.5
0.0
–25
Ambient Temperature TA (˚C)
0
25
50
75
100
Ambient Temperature TA (˚C)
Remark The graphs indicate nominal characteristics.
Data Sheet P12672EJ4V0DS00
7
PS7221-2A
TAPING SPECIFICATIONS (in millimeters)
1.55±0.1
2.8±0.1
10.45±0.1
7.5±0.1
1.55±0.1
16.0±0.3
2.0±0.1
4.0±0.1
1.75±0.1
Outline and Dimensions (Tape)
0.3
7.6±0.1
12.0±0.1
Tape Direction
PS7221-2A-F3
PS7221-2A-F4
Outline and Dimensions (Reel)
100±5.0
330
2.0±0.5
13.0±1.0
21.0±0.8
2.5
16.4 +2.0
–0.0
Packing: 1 500 pcs/reel
8
Data Sheet P12672EJ4V0DS00
PS7221-2A
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering
• Peak reflow temperature
235 °C (package surface temperature)
• Time of temperature higher than 210 °C
30 seconds or less
• Number of reflows
Two
• Flux
Rosin flux containing small amount of chlorine (The flux with a
maximum chlorine content of 0.2 Wt % is recommended.)
Package Surface Temperature T (˚C)
Recommended Temperature Profile of Infrared Reflow
(heating)
to 10 s
235 ˚C (peak temperature)
210 ˚C
to 30 s
100 to 160 ˚C
60 to 120 s
(preheating)
Time (s)
(2) Dip soldering
• Temperature
260 °C or below (molten solder temperature)
• Time
10 seconds or less
• Number of times
One
• Flux
Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of
0.2 Wt % is recommended.)
(3) Cautions
• Fluxes
Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
• Avoid shorting between portion of frame and leads.
∗
∗
∗ : Portion of frame
Data Sheet P12672EJ4V0DS00
9
PS7221-2A
[MEMO]
10
Data Sheet P12672EJ4V0DS00
PS7221-2A
[MEMO]
Data Sheet P12672EJ4V0DS00
11
PS7221-2A
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8