DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1505GR 3.0 GHz PRESCALER DIVIDED BY 256, 128, 64 FOR BS/CS TUNER DESCRIPTION µPB1505GR is a silicon prescaler IC operating up to 3.0 GHz and divided by 256, 128, 64. Due to 3.0 GHz operation and high division, this IC can contribute to produce BS/CS tuners with kit-use of 17K series DTS controller or standard CMOS PLL IC. The package is 8 pin plastic SOP suitable for surface mounting. This IC is manufactured using NEC’s 20 GHz fT NESAT III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect the chips from external pollution and prevent corrosion/ migration. Thus, this IC has with excellent performance, uniformity and reliability. FEATURES • • • • • High toggle-frequency : 0.5 GHz to 3.0 GHz Low power-consumption : 14 mA TYP. at 5 V High divide-ratio : ÷256, ÷128, ÷64 High input-sensitivity : –14 to +10 dBm @ 1.0 GHz to 2.7 GHz Wide output-swing : 1.6 Vp-p (CL = 8 pF load) ORDERING INFORMATION PART NUMBER µPB1505GR-E1 PACKAGE SUPPLYING FORM 8 pin plastic SOP Embossed tape 12 mm wide. QTY 2.5 k/reel (225 mil) Pin 1 is in tape pull-out direction. Remarks To order evaluation samples, please contact your local NEC sales office. (Order number : µPB1505GR) PIN ASSIGNMENT (Top View) IN 1 8 IN VCC 2 7 GND SW1 3 6 SW2 OUT 4 5 GND Caution electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P10872EJ3V0DS00 (3rd edition) Date Published October 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1996,1999 µPB1505GR SELECTOR GUIDE FEATURES 2.5 GHz / ÷512, ÷256 2.5 GHz / ÷128, ÷64 3.0 GHz / ÷256, ÷128, ÷64 PRODUCT NUMBER ICC (mA) fin (GHz) VCC (V) PACKAGE µ PB586G µ PB588G µ PB1505GR 28 0.5 to 2.5 5 8 pin SOP 26 0.5 to 2.5 5 8 pin SOP 14 0.5 to 3.0 5 8 pin SOP PIN ASSIGNMENT NEC original Typical of prescaler Notice Typical performance. Please refer to Electrical Characteristics in detail. To know the associated products, please refer to their latest data sheets. INTERNAL BLOCK DIAGRAM VCC 2 INPUT 1 1 / 64 1/2 1/2 Buff. BYPASS 8 4 5, 7 3 6 GND SW1 SW2 OUTPUT PIN DESCRIPTIONS PIN NO. SYMBOL 1 IN 2 VCC ASSIGNMENT FUNCTIONS AND EXPLANATION Frequency input Input frequency from an external VCO output. pin Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Power supply pin Supply voltage 5.0±0.5 V for operation. Must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground impedance. 3 SW1 Divided ratio Divided ratio control can be governed by following input data to these pins. control input pin 1 SW2 6 SW2 Divided ratio control input pin 2 H L H 1/64 1/128 L 1/128 1/256 SW1 4 5 OUT GND Divided frequency This frequency output can be interfaced to CMOS PLL. output pin Must be coupled with capacitor (e.g. 1 000 pF) for DC cut. Ground pin This pin must be connected to the system ground with minimum inductance. 7 Ground pattern on the board should be formed as wide as possible. (Track length should be kept as short as possible.) 8 2 IN Frequency-input This pin must be connected bypass capacitor (e.g. 1 000 pF) to minimize ground bypass pin impedance. Data Sheet P10872EJ3V0DS00 µPB1505GR ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL RATING UNIT CONDITIONS Supply voltage VCC –0.5 to +6 V TA = +25 °C Input voltage VIN –0.5 to VCC +0.5 V TA = +25 °C Power dissipation PD 250 mW Operating temperature Topt –40 to +85 °C Storage temperature Tstg –55 to +150 °C Mounted on 50 × 50 × 1.6 mm double copper clad epoxy glass PWB (TA = +85 °C) RECOMMENDED OPERATING RANGE PARAMETER SYMBOL MIN. TYP. MAX. UNIT Supply voltage VCC 4.5 5.0 5.5 V Operating temperature Topt –40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = –40 to +85 °C, VCC = 4.5 to 5.5 V) PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS 14.0 19.5 mA No input signal Circuit current ICC 9.0 Upper response frequency 1 fin(U)1 3.0 GHz Pin = –10 to +10 dBm Upper response frequency 2 fin(U)2 2.7 GHz Pin = –14 to –10 dBm Lower response frequency 1 fin(L)1 0.5 GHz Pin = –10 to +8 dBm Lower response frequency 2 fin(L)2 1.0 GHz Pin = –14 to –10 dBm, +8 to +10 dBm Input sensitivity 1 Pin1 –10 +8 dBm fin = 0.5 to 1.0 GHz Input sensitivity 2 Pin2 –14 +10 dBm fin = 1.0 to 2.7 GHz Input sensitivity 3 Pin3 –10 +10 dBm fin = 2.7 to 3.0 GHz Output Swing VOUT 1.3 1.6 VP-P CL = 8 pF SW1 input voltage (H) VIH1 VCC VCC VCC V SW1 input voltage (L) VIL1 OPEN OPEN OPEN V SW2 input voltage (H) VIH2 VCC VCC VCC V SW2 input voltage (L) VIL2 OPEN OPEN OPEN V Data Sheet P10872EJ3V0DS00 3 µPB1505GR TEST CIRCUIT 1 000 pF 1 000 pF 1 50 Ω IN IN 8 C4 C1 S.G. 2 VCC GND 7 3 SW1 SW2 6 4 OUT GND 5 1 000 pF C3 VCC = +5.0 V ±10 % Divided Ratio Control MONITOR C2 1 000 pF 5 pF SW2 1 MΩ C5 3 pF H L H 1/64 1/128 L 1/128 1/256 SW1 OSCILLOSCOPE ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD KB-1505 IN 1 4 C 1 C VCC C2 B SW1 SW2 A 3 C 5 C OUT COMPONENT LIST 4 No. Value C1 to C4 1 000 pF C5 5 pF A, B shorting chip Note : (*1) 50 × 50 × 0.4 mm double copper clad polyimide board (*2) Back side : GND pattern (*3) Solder plated on pattern (*4) : Through holes (*5) pattern should be removed on this testing. Data Sheet P10872EJ3V0DS00 µPB1505GR TYPICAL CHARACTERISTICS (Unless otherwise specified TA = +25 °C) INPUT POWER vs. FREQUENCY CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 Pin – Input Power Level – dBm ICC – Circuit Current – mA 20 10 2.0 0 4.0 20 0 –20 –40 –60 6.0 VCC = 4.5 to 5.5 V Guaranteed operating range VCC = 4.5 to 5.5 V 0.2 0.5 OUTPUT SWING vs. FREQUENCY 1.8 X X X 1.6 X X 1.4 1.2 1.0 X: 0.2 0.5 VCC = 5.5 V : VCC = 5.0 V : VCC = 4.5 V 2.0 5.0 1.0 PO – Output Power Level – dBm VOUT – Output Swing – VP-P X X –8 –10 X X –14 0.2 X X X X X X X X X X X X X –12 –14 0.2 0.5 1.0 2.0 X X X X X X X X X X 1.0 2.0 5.0 OUTPUT POWER vs. FREQUENCY PO – Output Power Level – dBm PO – Output Power Level – dBm X X 0.5 –6 –8 X X f – Input Frequency – GHz X : VCC = 5.5 V TA = +25 °C Pin = –10 dBm : VCC = 5.0 V : VCC = 4.5 V X X –12 OUTPUT POWER vs. FREQUENCY –10 5.0 X : VCC = 5.5 V TA = –40 °C Pin = –10 dBm : VCC = 5.0 V : VCC = 4.5 V f – Input Frequency – GHz –6 2.0 OUTPUT POWER vs. FREQUENCY –6 2.0 X 1.0 f – Input Frequency – GHz VCC – Supply Voltage – V 5.0 X : VCC = 5.5 V TA = +85 °C Pin = –10 dBm : VCC = 5.0 V : VCC = 4.5 V –8 X X X X X X X X X X X –10 X X –12 –14 0.2 f – Input Frequency – GHz 0.5 1.0 2.0 5.0 f – Input Frequency – GHz Data Sheet P10872EJ3V0DS00 5 µPB1505GR PACKAGE DIMENSIONS 8 PIN PLASTIC SOP (225 mil) (UNIT: mm) 8 5 detail of lead end 3°+7° –3° 4 1 5.2 ± 0.2 6.5 ± 0.3 1.57 ± 0.2 1.49 4.4 ± 0.15 0.85 MAX. 1.27 0.42 +0.08 –0.07 0.6 ± 0.2 0.17 +0.08 –0.07 0.12 1.1 ± 0.2 0.10 M 0.1 ± 0.1 NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 6 Data Sheet P10872EJ3V0DS00 µPB1505GR NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired operation). (3) Keep the track length of the ground pins as short as possible. (4) Connect a bypass capacitor (e.g. 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPB1505GR Soldering conditions Recommended conditoin symbol Infrared ray reflow Package peak temperature : 235 °C, Hour : within 30 s. (more than 210 °C), Time : 3 time, Limited days : no. * IR35-00-3 VPS Package peak temperature : 215 °C, Hour : within 40 s. (more than 200 °C), Time : 3 time, Limited days : no. * VP-15-00-3 Wave soldering Soldering tub temperature : less than 260 °C, Hour : within 10 s. Time : 1 time, Limited days : no. * WS60-00-1 Pin part heating Pin area temperature : less than 300 °C, Hour : within 3 s./pin Limited days : no. * Soldering method * : It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Note 1. The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P10872EJ3V0DS00 7 µPB1505GR ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8