DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µ PC1943,1944 ADJUSTABLE PRECISION SHUNT REGULATORS DESCRIPTION The µ PC1943,1944 are adjustable precision shunt regulators with guaranteed thermal stability. The output voltage can be set to any value between reference voltage (1.26 V) and 24 V by two external resistors. These ICs can apply to error amplifier of switching regulators. FEATURES • Low voltage operation and High accuracy. VREF = 1.26 V ± 2.4 % • Adjustable output voltage by two external resistors. VREF ≤ VOUT ≤ 24 V • Pin compatible to µ PC1093. ORDERING INFORMATION BLOCK DIAGRAM Part Number Package K µ PC1943T Power mini mold (SOT-89) µ PC1944T Power mini mold (SOT-89) µ PC1944J 3-pin plastic SIP (TO-92) µ PC1944GR 8-pin plastic SOP (5.72 mm (225)) REF A PIN CONFIGURATION (Marking Side) Power mini mold (SOT-89) µ PC1943T µ PC1944T A A 3-pin plastic SIP (TO-92) µ PC1944J 3-pin plastic SOP (5.72 mm (225)) µ PC1944GR 8 REF K 1 1 1 REF 2 A 3 K 1 K 2 A 2 3 3 REF REF A K NC 2 7 NC NC 3 6 A NC 4 5 NC A: Anode K: Cathode REF: Reference NC: No Connection The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G10239EJ3V0DS00 (3rd edition) (Previous No. IC-3454) Date Published March 2000 NS CP (K) Printed in Japan The mark shows major revised points. © 1994, 2000 µ PC1943,1944 ABSOLUTE MAXIMUM RATINGS (TA = +25 °C, unless otherwise specified.) Parameter Symbol Ratings Unit Cathode Voltage VKA 25 V Cathode Current IK 50 mA Cathode to Anode Reverse Current − IK −30 mA Reference Voltage VREF 7 V Reference Input Current IREF 50 µA Reference to Anode Reverse Current − IREF Total Power Dissipation µ PC1943T − 10 PT mA Note mW Note mW 320 (1600 µ PC1944T ) 320 (1600 ) µ PC1944J 560 mW µ PC1944GR 385 mW Operating Ambient Temperature TA − 30 to + 85 °C Operating Junction Temperature TJ − 30 to + 125 °C Storage Temperature Tstg − 65 to + 125 °C Note with 16 cm2 × 0.7 mm ceramic substrate. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. TYPICAL CONNECTION R0 VIN VOUT R1 K REF VOUT R2 A GND 2 Data Sheet G10239EJ3V0DS00 (1 + R1 ) · VREF R2 µ PC1943,1944 RECOMMENDED OPERATING CONDITIONS Parameter Symbol MIN. Cathode Voltage VKA VREF Cathode Current IK Total Power Dissipation µ PC1943T 1 TYP. MAX. Unit 24 V 10 30 mA Note ) mW µ PC1944T PT 45 (240Note) 45 (240 mW µ PC1944J 83 mW µ PC1944GR 57 mW Operating Ambient Temperature TA −30 +85 °C Operating Junction Temperature TJ −30 +100 °C Note with 16 cm2 × 0.7 mm ceramic substrate. Caution The recommended operating range may be exceeded without causing any problems provided that the absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds the recommended operating conditions, the margin between the actual conditions of use and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The recommended operating conditions do not imply that the device can be used with all values at their maximum values. ELECTRICAL CHARACTERISTICS (IK = 10 mA, TA = +25 °C, unless otherwise specified.) Parameter Symbol Conditions MIN. TYP. MAX. Unit 1.23 1.26 1.29 V ±5 ± 30 mV Reference Voltage VREF VKA = VREF Reference Voltage Deviation ∆ VREF VKA = VREF, 0 °C ≤ TA ≤ 70 °C ∆ VREF/∆ VKA | VREF | ≤ VKA ≤ 5V 2.7 mV/V 5 V ≤ VKA ≤ 24V 2.0 mV/V 2.0 4.0 µA 0.3 1.2 µA 0.16 1.0 mA Over Temperature Reference Voltage Deviation Over Cathode Voltage = 10 kΩ, R2 = ∞ Reference Input Current IREF VKA Reference Input Current Deviation ∆ IREF VKA = VREF, 0 °C ≤ TA ≤ 70 °C, = VREF, R1 R1 = 10 kΩ, R2 = ∞ Over Temperature IKmin VKA = VREF, ∆ VREF = 2 % Off-state Cathode Current IKoff VKA = 24 V, VREF = 0 V 0.01 1.0 µA Dynamic Impedance | ZKA | VKA = VREF, f ≤ 1 kHz, 0.12 0.5 Ω Minimum Cathode Current 1 mA ≤ IK ≤ 30 mA Data Sheet G10239EJ3V0DS00 3 µ PC1943,1944 TYPICAL CHARACTERISTIC (TA = +25 °C, unless otherwise specified. Nominal) PT vs TA ( I ) PT vs TA ( II ) 2.0 500 400 µ PC1944GR 0 °C / W 31 5 °C /W 100 0 1.0 0.5 0 25 50 75 100 125 150 TA - Operating Ambient Temperature - °C /W °C 200 26 µ PC1943T, 1944T 1.5 .5 µ PC1943T, 1944T W C/ 0° 300 25 50 75 100 125 150 TA - Operating Ambient Temperature - °C ∆ VREF vs TA IK vs VKA ( I ) 2.0 20 VKA = VREF 10 IK - Cathode Current - mA ∆ VREF - Reference Voltage Deviation - mV with 16 cm2 × 0.7 mm ceramic substrate 62 PT - Total Power Dissipation - W µ PC1944J 18 PT - Total Power Dissipation - mW 600 0 −10 −20 1.0 IK = 10 mA VKA = VREF −40 −20 0 20 40 60 80 100 120 TA - Operating Ambient Temperature - °C 0 IK vs VKA (II) 0.2 0.4 0.6 0.8 1.0 1.2 VKA - Cathode Voltage - V 1.4 IK vs VKA (III) 50 0 40 30 20 10 0 4 IK - Cathode Current - mA IK - Cathode Current - mA VKA = VREF 0.5 1.0 VKA - Cathode Voltage - V 1.5 −10 −20 −30 −1.0 Data Sheet G10239EJ3V0DS00 VKA = VREF −0.8 −0.6 −0.4 −0.2 VKA - Cathode Voltage - V 0 µ PC1943,1944 IREF vs TA IKoff vs TA 0.2 3.0 2.0 1.0 0 −20 0 20 40 60 80 100 120 TA - Operating Ambient Temperature - °C Av, φ vs f Av 40 φ −90 220 Ω IK 0 υo −180 10 kΩ υin 50 0 20 10 kΩ −20 1k (IK = 10 mA) 10k −270 10M 100k 1M f - Frequency - Hz −20 0 20 40 60 80 100 120 TA - Operating Ambient Temperature - °C | ZKA | vs f +90 60 Av - Voltage Gain - dB 0.1 | ZKA | - Dynamic Impedance - Ω 0 VKA = 24 V VREF = 0 V IKoff - Off State Cathode Current - µ A VKA = VREF, IK = 10 mA, R1 = 10 kΩ, R2 = ∞ φ - Phase - ° IREF - Reference Input Current - µ A 4.0 VKA = VREF 1mA ≤ IK ≤ 30 mA 10 1.0 0.1 1k 10k 100k 1M f - Frequency - Hz Stability Area Test Circuit IKA - Cathode Current - mA 2.0 1.8 1.6 a: a: VKA = VREF b: VKA = 3 V c: VKA = 5 V 1.0 CKA Stable a Stable c 0.8 b, c: 0.6 150 Ω b 0.4 0.2 0 0.001 150 Ω IKA 1.4 1.2 10M Unstable IKA R CKA 0.01 0.1 1 CKA - Lode Capacitance - µ F 10 10 kΩ CKA: Monolithic Ceramic Capacitor Caution of Stability Area If the Aluminum electrolytic capacitor is used, it should be kept CKA ≥ 6.8 µ F. When using plural different types of capacitors, each capacitor is needed to be stable independently. Data Sheet G10239EJ3V0DS00 5 µ PC1943,1944 PACKAGE DRAWINGS POWER MINI MOLD (SOT-89) (Unit: mm) 4.5±0.1 1.6±0.2 0.8 MIN. 0.42±0.06 0.42±0.06 0.47 ±0.06 1.5 3.0 6 4.0±0.25 2.5±0.1 1.5±0.1 0.41+0.03 −0.05 Data Sheet G10239EJ3V0DS00 µ PC1943,1944 8-PIN PLASTIC SOP (5.72 mm (225)) 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.) D 0.42 +0.08 −0.07 E 0.1±0.1 F 1.59±0.21 G 1.49 H 6.5±0.3 I 4.4±0.15 J 1.1±0.2 K 0.17 +0.08 −0.07 L 0.6±0.2 M 0.12 N 0.10 P 3° +7° −3° S8GM-50-225B-6 Data Sheet G10239EJ3V0DS00 7 µ PC1943,1944 3-PIN PLASTIC SIP (TO-92) A N M 1 3 Y V J H F G U M NOTE ITEM Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. MILLIMETERS A 5.0±0.2 F 0.50+0.30 −0.10 G 0.12 H 1.27 J 1.33 MAX. M 5.0±0.5 N 4.0±0.2 U V 2.8 MAX. 0.50±0.10 Y 15.0±0.7 P3J-127B-3 8 Data Sheet G10239EJ3V0DS00 µ PC1943,1944 RECOMMENDED SOLDERING CONDITIONS When soldering these products, there are highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “Semiconductor Device Mounting Technology Manual” (C10535E). Type of Surface Mount Device µ PC1943T, 1944T : Power mini mold (SOT-89) Process Infrared ray reflow Conditions Peak temperature: 235 °C or below (Package surface temperature), Symbol IR35-00-2 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 2 times. Peak temperature: 215 °C or below (Package surface temperature), VPS VP15-00-2 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 2 times. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. µ PC1944GR : 8-pin plastic SOP (5.72 mm (225)) Process Infrared ray reflow Conditions Peak temperature: 235 °C or below (Package surface temperature), Symbol IR35-00-1 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 1 time. VPS Peak temperature: 215 °C or below (Package surface temperature), VP15-00-1 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 1 time. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Caution Apply only one kind of soldering condition to a device, or the device will be damaged by heat stress. Type of Through-hole Device µ PC1944J : 3-pin plastic SIP (TO-92) Process Wave soldering (only to leads) Conditions Solder temperature: 260 °C or below, Flow time: 10 seconds or less. Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. Data Sheet G10239EJ3V0DS00 9 µ PC1943,1944 REMARK OF THE PACKAGE MARK The package marks of the µ PC1943T and the µ PC1944T are the symbols as follows. Part Number Mark µ PC1943T 9B µ PC1944T 9C REFERENCE DOCUMENTS Semiconductor Device Mounting Technology Manual C10535E Semiconductor Selection Guide -Products and Packages- X13769X 10 Data Sheet G10239EJ3V0DS00 µ PC1943,1944 [MEMO] Data Sheet G10239EJ3V0DS00 11 µ PC1943,1944 [MEMO] • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8