DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2533 AM TUNER FOR ELECTRONIC TUNING CAR RADIOS The µPC2533 is an IC developed as an AM tuner for car stereos and car radios. It employs an up-conversion type double super-heterodyne configuration (IF1 = 10.71 MHz, IF2 = 450 kHz). The internal configuration consists of the MIX1 block (MIX1, OSC1, Buff1), MIX2 block (MIX2, OSC2, Buff2), IF amplifier, detection circuit, AGC circuit, signal meter circuit, SD (station detector) circuit, and Lo/DX (short range/long range) circuit. Features • Possible to select stations using only one varactor diode with narrow variable capacitance range • Tracking adjustment unnecessary • Coil switching between LW (long wave) and MW (middle wave) unnecessary • Less sensitivity deviation due to tracking error • High S/N: 60 dB • Signal meter output with good linearity • Signal meter output voltage inclination setting possible by external resistor. • Can be used with IF (intermediate frequency) counter turning system or high/low tuning system. SD Sensitivity Setting Type Number µPC2533GS-01 IF Counter Output High/Low Output Set by pin No. 7 Set by pin No. 9 µPC2533GS-02 Set by pin No. 7 Signal Meter Voltage Remarks Inclination Setting Depends on SD sensitivity setting SD sensitivity of IF counter system and high/low system can be set independently. Set by pin No. 9 Tilt of the signal meter voltage can be set without regard to SD sensitivity. • LO/DX function on-chip • Since IFT (intermediate frequency transformer) turn ratio is free from limitation for matching of ceramic filter impedance, it is easy to design MIX gain with IFT. The information in this document is subject to change without notice. Document No. S11989EJ4V0DS00 (4th edition) Date Published August 1998 N CP(K) Printed in Japan The mark shows major revised points. © 1993 µPC2533 Ordering Information Part Number Package µPC2533GS-01 36-pin plastic shrink SOP (300 mil) µPC2533GS-02 36-pin plastic shrink SOP (300 mil) RF AGC1 RF AGC2 RF AGC T.C. MIX1IN MIX1OUT MIX1OUT MIX1BYP Buff1IN GND Buff1OUT MIX2BYP MIX2OUT MIX2OUT MIX2IN Buff2IN Buff2OUT IF AGC T.C. IF2IN Block Diagram 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 RF AGC driver MIX 1 Buff 1 MIX 2 RF AGC detector MIX 2 AGC 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 LO/DX SEEK SD ACOUT SD ACadj [SDadj] SD IFIN SD DCadj [SMOUT] SD DCOUT OSC2 (B) OSC2 (E) Vref2 MIX2AGC T.C. VO (AF) GND VCC IF2OUT Detector Vref1 OSC 2 ALC OSC1 Buff 1 Station detector SEEK IF AGC Signal meter LO/DX OSC 1 IF amplifier Time constant selector switch AGC comparator OSC Buff Buff 2 Remarks 1. Bold lines indicate flow of audio signal. 2. µPC2533GS-02 pin names are in parentheses. Pins not in parentheses are used in both the µPC2533GS-01 and µPC2533GS-02. 2 µPC2533 Pin Configuration (Top View) 36-pin plastic shrink SOP (300 mil) • µPC2533GS-01 • µPC2533GS-02 OSC1 Buff 1 36 RF AGC1 ALC 2 35 RF AGC2 Vref 1 3 34 RF AGC T.C. LO/DX 4 33 MIX1IN SEEK 5 32 MIX1OUT SD ACOUT 6 31 MIX1OUT SD ACadj [SDadj] 7 30 MIX1BYP SD IFIN 8 29 Buff1IN SD DCadj [SMOUT] 9 28 GND SD DCOUT 10 27 Buff1OUT OSC2 (B) 11 26 MIX2BYP OSC2 (E) 12 25 MIX2OUT Vref 2 13 24 MIX2OUT MIX2AGC T.C. 14 23 MIX2IN VO (AF) 15 22 Buff2IN GND 16 VCC 17 IF2OUT 18 Remark µPC2533GS-02 pin names are in parentheses. 21 Buff2OUT 20 IF AGC T.C. 19 IF2IN Pins not in parentheses are used in both the µPC2533GS-01 and µPC2533GS-02. 3 µPC2533 1. Pin Description Names and symbols in parentheses indicate pin names for µPC2533GS-02. Names and symbols not in parentheses are pin names used in both the µPC2533GS-01 and µPC2533GS-02. (1/7) Pin No. 1 Symbol OSC1 Buff Name Equivalent Circuit OSC1 Buff output VCC ZO = 30 Ω ±20 % 1 2 ALC OSC1 ALC VCC 3 Vref1 Reference voltage 4 LO/DX LO/DX control 2 Reference voltage (5.3 V) VCC 4 5 SEEK Seek request Vref 5 kΩ 5 60 kΩ 4 µPC2533 (2/7) Pin No. 6 Symbol SD ACOUT Name Equivalent Circuit SD AC output RO = 20.5 kΩ ±20 % 500 Ω 6 20 kΩ 7 SD ACadj SD AC sensitivity setting (and signal meter ouput) ( µ PC2533GS-01) VCC 5 kΩ 7 [SDadj] [SD AC sensitivity and SD DC sensitivity setting] ( µ PC2533GS-02) VCC 5.2 V 5 kΩ 7 8 SD IFIN SD IF input Vref 60 kΩ 500 Ω 8 5 µPC2533 (3/7) Pin No. 9 Symbol SD DCadj Name Equivalent Circuit SD DC sensitivity setting (and signal meter output) ( µ PC2533GS-01) VCC 5 kΩ 9 [SMOUT] [Signal meter output] ( µ PC2533GS-02) VCC 5.2 V 5 kΩ 9 10 SD DCOUT SD DC output (Active high) 10 11 12 OSC2 (B) OSC2 (E) OSC2 (base) OSC2 (emitter) ZIN = 5 kΩ ±20 % 11 Vref ZO = 240 Ω ±20 % 12 13 6 Vref2 Reference voltage Reference voltage (6.0 V) VCC µPC2533 (4/7) Pin No. 14 Symbol MIX2AGC T.C. Name Equivalent Circuit MIX2 AGC smoothing 14 RT = 1 kΩ ±20 % RT Vref 15 VO(AF) Audio output VCC ZO = 300 Ω ±20 % 15 20 16 GND Ground GND (low frequency) 17 VCC Power supply voltage VCC 18 IF2OUT IF amplifier output 18 19 IF2IN IF amplifier input 20 IF AGC T.C. IF AGC input 19 VCC 15 RT 20 RT = 100 kΩ ±20 % 7 µPC2533 (5/7) Pin No. 21 Symbol Name Buff2OUT 2nd IF burffer output Equivalent Circuit ZO = 2 kΩ ±20 % 21 22 Buff2IN Vref 2nd IF buffer input 22 ZIN = 30 kΩ ±20 % 23 MIX2IN MIX2 input 23 26 ZIN = 330 Ω ±20 % 24 25 MIX2OUT MIX2OUT MIX2 output MIX2 output 26 MIX2BYP MIX2 bypass 25 23 24 26 ZIN = 330 Ω ±20 % 27 Buff1OUT 1st IF buffer output 27 ZO = 330 Ω ±20 % 8 µPC2533 (6/7) Pin No. Symbol Name 28 GND Ground 29 Buff1IN 1st IF buffer input Equivalent Circuit GND (high frequency) Vref 29 ZIN = 15 kΩ ±20 % 30 MIX1BYP MIX1 bypass 33 30 ZIN = 1.2 kΩ ±20 % 31 32 MIX1OUT MIX1OUT MIX1 output MIX1 output 31 32 Vref 33 MIX1IN MIX1 input 33 30 ZIN = 1.2 kΩ ±20 % 34 RF AGC T.C. RF AGC smoothing 34 ZO = 12 kΩ ±20 % 9 µPC2533 (7/7) Pin No. 35 Symbol RF AGC2 Name Equivalent Circuit RF AGC output (cascade base) Vref ZO = 11 kΩ ±20 % 35 36 RF AGC1 RF AGC output (PIN diode) 36 ZO = 22 kΩ ±20 % 10 µPC2533 2. Operation of Each Block 2.1 FR Amplifier Circuit Block Fig. 2-1 RF Ampliier Circuit VCC R1 LPF C8 L3 R2 L4 C6 L5 33 MIX1 Q1 + Q2 L1 C3 C4 30 C5 From MIX2 C9 C7 35 L2 36 C1 C2 RF AGC LO/DXNote 34 + 4 Note LO : 3 V or higher DX : 1 V or lower In the AM band, the capacitance of a car radio antenna depends on its length, diameter, cable length, etc. Therefore, J-FET is used in the µPC2533 to raise RF input impedance. Since the µPC2533 raises the first IF (intermediate frequency) to 10.71 MHz, there is no need for a tuning circuit between the RF amplifier circuit and MIX1. Instead, it employs an LPF (about 6 MHz) consisting of L4, L5 and C3 to C5 between the RF amplifier circuit and MIX1 in order to cut image frequency (21.4 MHz or higher). Because this allows a wide-band RF amplifier circuit to be configured without using a tuning circuit, frequency sensitivity deviation can be minimized to a high degree. The AGC circuit consists of RF AGC1 by the PIN diode connected to the FET gate and RF AGC2 by the cascade transistor Q1. Use a low-noise transistor even with low current for the cascade transistor Q1 (if a high-noise one is used, the S/N ratio deteriorates). Remark Set bias voltage for cascade transistor Q1 to VC > VB. 11 µPC2533 2.2 MIX1 Block Fig. 2-2 MIX1 Block T1 VT VCC + 3 29 27 Q104 Q101 Q102 R11 17 32 31 R112 Q103 Buff1 OSC1 Q105 Q109 Q106 Q107 Q108 R109 Bias circuit 2 To 10.7 MHz BPF Note R111 1 R110 R107 R108 28 From LPF 33 To RF AGC circuit (Fig. 2-4) 30 Note Output impedance and input impedance of Buff1 are 330 Ω and 15 kΩ, respectively. MIX1 (Q101 to Q108) is a DBM (double balanced mixer). MIX1 output is supplied to 10.7 MHz ceramic filter via Buff1 (output impedance: 330 Ω) for impedance matching. The local oscillation signal is applied to the bases of Q101 to Q104, and the RF signal to the base of Q105. MIX1 (Q101 to 108) multiplies the local oscillation signal by RF signal, and converts to the resonance frequency of IFT T1 for output. The local oscillation signal is output from pin 1 via Q109 (OSC Buff). It has an amplitude of 110 dBµV and can be directly input to CMOS LSI for use by the PLL synthesizer. The RF signal applied to the base of Q105 is also input to the detector of the RF AGC circuit. 12 µPC2533 2.3 MIX2 Block Fig. 2-3 MIX2 Block VCC Xtal Note From 10.7 MHz BPF To IF amplifier + 28 23 17 24 25 14 Current control circuit R211 13 12 11 22 21 R212 Buff2 Note Q201 Q202 Q204 Q203 Q203 Bias circuit OSC2 R210 Q207 Q205 Q208 Q206 R209 R207 R208 To RF AGC circuit (Fig. 2-4) From IF AGC (Fig. 2-6) Note Output impedance and input impedance of Buff2 are 2 kΩ and 30 kΩ, respectively. MIX2 (Q201 to Q208) is a DBM with a configuration similar to that of MIX1. The major difference from the MIX1 is that MIX2 is equipped with a current control circuit for output and is controlled by the AGC. Input impedance of MIX2 is 330 Ω to match the 10.7 MHz ceramic filter. Output impedance of Buff2 is 2 kΩ to match the 450 kHz ceramic filter. IF signal input from pin 23 is also input to the detector of the RF AGC. The RF AGC is detected by both MIX1 and MIX2 blocks. The Buff1 and Buff2 ensure impedance matching between MIX1 and MIX2 outputs and each ceramic filter. As a result, IFT design is not restricted by the need to match ceramic filter impedance. For turn ratio, etc., only conversion gain need be taken input account, so it is easy to design. 13 µPC2533 2.4 RF AGC Block Fig. 2-4 RF AGC Block R412 R403 Q407 Q408 Bias circuit Q401 R405 Q405 Q402 Time constant switchover Q403 R409 Q404 R402 36 35 AMP. + – AMP. Q406 D401 R404 R406 To RF amplifier circuit (Fig. 2-1) Detection and addition circuit + – From MIX2 (Fig. 2-3) From MIX1 (Fig. 2-2) R410 R408 34 + The configuration of the RF AGC is shown in Fig. 2-4. After being detected by the RF AGC detector and added, the input signal from MIX1 and MIX2 is smoothed by external capacitor of pin 34, and its DC voltage controls the RF AGC. RF AGC output controls the PIN diode from pin 36 and controls base voltage of cascade transistor which determines FET VDS from pin 35. In addition, by detecting sudden fluctuation of pin 34 voltage and switching over time constants, RF AGC response convergence when the electric field suddenly changes is improved. Operation start time of the RF AGC can be delayed slightly by connecting a resistor parallel to the external capacitor of pin 34. 14 µPC2533 2.5 IF Amplifier Block and Detection Block Fig. 2-5 IF Amplifier and Detection Block R19 T3 From 450kHz BPF + To SD circuit C19 19 VCC 18 17 Bias circuit IF amp – Q301 R301 R302 + Q302 15 R303 From IF AGC circuit (Fig. 2-6) Audio output R304 To IF AGC circuit (Fig. 2-6) In the IF amplifier block, DC feedback is carried to pin 19 via an external low pass filter (composed of T3 and C19) from pin 18, an output pin. The DC electric potential of pin 18 is designed to be fixed approximately equal to the (+) side input of the IF amplifier. The value of R19 is the input impedance, so impedance matching to 450 kHz ceramic filter is possible. The output signal current of the IF amplifier is converted to signal voltage by being resonated by T3 and input to the detection circuit after frequency selection. Emitter follower detection by Q302 is adopted for the detection circuit block. 15 µPC2533 2.6 IF AGC Block Fig. 2-6 IF AGC Block (for µPC2533GS-01) To MIX2 (Fig. 2-3) From detection circuit (Fig. 2-5) To IF amp. (Fig. 2-5) VCC Signal meter circuit Bias circuit Q503 D501 Q501 Q502 Time constant switchover Q504 D502 Note In the case of µPC2533GS-02, the part enclosed by the dotted line is illustrated as shown below. Note R501 R502 5 kΩ 5 kΩ Voltage limiter R501 R502 5 kΩ 5 kΩ To SD circuit (Fig. 2-7) From SD circuit (Fig. 2-7) 7 9 20 + IF AGC block configuration is shown in Fig. 2-6. The signal detected from pin 15 is smoothed by the capacitor of pin 20, and its DC voltage controls the IF AGC. The IF AGC controls the IF amplifier and MIX2. In the operation sequence, it first controls the gain of the IF amplifier, then controls the gain of MIX2. The signal meter circuit output (current output) is in proportion to the DC voltage smoothed by pin 20, and converted to voltage by the external resistor of pin 7 or 9. Therefore, output voltage value and gain can be set by the value of the external resistor. Note Note For relation between the external resistor and the signal meter, refer to Signal meter output voltage (adjustment by resistor between pin 9 and GND) in section 4. Characteristic Curves. 16 µPC2533 2.7 Station Detector Circuit Block Fig. 2-7 Station Detector Circuit Block ON/OFF + + – Bias circuit Bias circuit 1.0 V Detection comparator 1 Detection comparator 2 – 1.0 V – + From signal meter circuit (Fig. 2-6) To time constant switchover circuit (Fig. 2-6) 10 5 6 8 From DTS (request) SD output (Active high) SD AC output 450kHz IF input (from T3) The configration station detector (SD) circuit block is shown in Fig. 2-7. The SD circuit stops scanning or seeking when a broadcast wave is received when auto scanning or seek tuning. Since the µPC2533 has two outputs (DC high/low signal (open collector) and AC IF signal (f = 450 kHz)), it can be used according to DTS (digital tuning system) type. Input the SD request signal from DTS to pin 5. The SD sensitivity setting methods of the µPC2533GS-01 and µPC2533GS-02 differ. With the µPC2533GS-01, SD sensitivities in the IF counter output system and in the high/low output system are set by external resistor between pin 7 and GND and by external resistor between pin 9 and GND. With the µPC2533GS-02, SD sensitivities in both the IF counter output system and high/low output system are set by external resistor between pin 7 and GND (refer to Fig. 2-6). Table 2-1 SD Sensitivity Setting Examples Value of Resistor between Pin 9 or Pin 7 and GND SD Sensitivity (AC, DC) 51 kΩ 27 dBµV 24 kΩ 29 dBµV 10 kΩ 33 dBµV 17 µPC2533 The reference voltage of the µPC2533-01 and µPC2533-02 detection comparator has been internally fixed at 1.0 V. Under the influence of R501 (5 kΩ) and R502 (5 kΩ) of the siganl meter circuit (Fig. 2-6), signal meter output voltage and detection comparator input voltage do not perfectly coincide. For SD sensitivity setting, refer to the following formula. Detection comparator input voltage = Signal meter output voltage × (1 + R501 Value of resistor between pin 7 and GND ) Remark Because DC output is open-collector type (Active high), connect pull-up resistor to pin 10 to use. 18 µPC2533 3. Electical Characteristics Absolute Maximum Ratings (TA = 25 °C) Item Symbol Rating Unit Power supply voltage VCC 10 V Power dissipation PD 600 mW Operating ambient temperature TA –40 to +85 °C Storage temperature Tstg –55 to +125 °C Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. Recommended Operating Conditions (TA = 25 ˚C) Item Symbol Power supply voltage VCC Input voltage VIN Conditions MIN. TYP. MAX. Unit 7.5 8.0 8.5 V 132 dBµV Electrical Characteristics (Unless specified, TA = 25 °C, VCC = 8 V, fIN = 999 kHz, fMOD = 400 Hz, AMMOD = 30 %, RSD1 (resistor between pin 7 and GND) = RSD2 (resistor between pin 9 and GND) = 24 kΩ, 15-pin measurement load = 100 kΩ) Item Symbol Conditions MIN. TYP. MAX. Unit – 45 55 mA Circuit current ICC No input (excluding FET) Detection output VO VIN = 74 dBµV 150 180 210 mVrms Signal-to-noise ratio S/N VIN = 74 dBµV 53 60 – dB Total harmonic distortion 1 THD1 VIN = 74 dBµV – 0.3 1.0 % Total harmonic distortion 2 THD2 VIN = 74 dBµV, AMMOD = 80 % – 0.7 1.0 % Total harmonic distortion 3 THD3 VIN = 130 dBµV, AMMOD = 80 % – 0.7 1.5 % Signal meter output voltage 1 VS1 No input – 0 0.2 V VS2 VIN = 30 dBµV 0.5 1.5 2.5 V VS3 VIN = 74 dBµV 4.8 (4.3) 5.5 (5.0) 6.7 (5.5) V VOSC 1-pin load: 20 pF or less 106 110 114 dBµV Signal meter output voltage 2 Signal meter output voltage 3 Local buffer output 1 Note Note Specifications in parentheses for signal meter output voltage 3 are for µPC2533GS-02. Values of other items are the same for µPC2533GS-01 and µPC2533GS-02. 19 µPC2533 Reference Characteristics Item Symbol Conditions MIN. TYP. MAX. Unit Maximum sensitivity MS VIN making VO –10 dB, where VO = 0 dB at VIN = 74 dBµV – 13 – dBµV S/D sensitivity (AC) SS(AC) VIN making SEEK, SD AC OUT level 101 dBµV or more – 29 – dBµV S/D sensitivity (DC) SS(DC) VIN making SEEK, SD AC OUT voltage 4.8 V or more – 29 – dBµV S/D output time T-SD Delay time from the time when changing SEEK VIN = 0 → 40 dBµV to the time when pin 10 voltage becomes 4.8 V or more 0 5 25 ms Vo stabilization time T-VO VIN = 60 → 100 dBµV, VO = ±3 dB 60 160 260 ms Tweet TW VIN = 74 dBµV, 2IF – 60 – dB 2nd local buffer negative impedance ZOSC2 Maximum value of a series resistor with which the crystal can oscillate 400 – – Ω Usable sensitivity US VIN making S/N = 20 dB – 25 – dBµV 20 µPC2533 4. Characteristic Curves MS (VO = 0 –10 dB) 7 6 5 4 3 2 1 Total harmonic level VO (dB), Noise (dB) Total harmonic distortion THD (%), Signal meter voltage (V) Input/Output Characteristics (1) VO –10 US (at S/N=20 dB) –20 (µ PC2533GS-01) Signal meter voltage VCC =8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 kΩ (µ PC2533GS-02) –30 –40 –50 Noise –60 THD 30 % –70 THD 80 % 0 0 10 20 30 40 50 MS = 14 dB µ V US = 25 dB µ V 60 70 80 90 100 110 120 130 Signal input level (dB µV) 0 7 6 5 4 3 2 1 0 Detection output level VO (dB), Noise (dB) Total harmonic distortion THD (%), Signal meter voltage (V) Input/Output Characteristics (2) –10 –20 VO MS (VO = –10 dB) US (at S/N=20 dB) (µ PC2533GS-01) VCC = 8 V fIN = 216 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 kΩ Signal meter voltage (µ PC2533GS-02) –30 –40 –50 Noise –60 THD 30 % –70 THD 80 % 0 10 20 30 40 50 MS = 12.5 dB µ V US = 28 dB µ V 60 70 80 90 100 110 120 130 Signal input level (dB µ V) 21 µPC2533 Input/Output Characteristics (3) (FET Load: 255 Ω) (Reference Only) VO Detection output level VO (dB), Noise (dB) 0 –10 VCC = 8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 kΩ –20 –30 –40 Noise –50 –60 –70 0 10 20 30 40 50 60 70 80 Signal input level (dBµ V) 90 100 110 120 130 Detection output level VO (dB), Noise VN (dB) Input/Output Characteristics (4) VO 0 VO –10 29 dB –20 –30 –40 LO/DX low LO/DX high –50 VN –60 –70 VN 0 10 20 30 40 50 60 70 80 Signal input level (dBµ V) 22 VCC = 8 V fIN = 999 kHz fMOD = 400 Hz AMMOD = 30 % RSD1 = RSD2 = 24 kΩ 90 100 110 120 130 µPC2533 Cross-Modulation Characteristics (40 kHz Detuning) Desired: V = 100 dBµ V 80 dBµV Detection output level VO (dB) 0 –10 –20 –30 –40 –50 40 dBµ V VCC = 8 V Desired: f = 999 kHz Interference: f = 1039 kHz 45 dBµ V 60 dBµ V Desired: V = 40 dBµV 45 dBµ V 60 dBµ V 100 dBµV 80 dBµ V –60 Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation 50 60 70 80 90 100 110 120 130 140 Interference signal input level (dBµV) Cross-Modulation Characteristics (40 kHz Detuning, FET Load 255 Ω) (Reference Only) Desired: V = 100 dBµ V 80 dBµ V Detection output level VO (dB) 0 –10 40 dBµV –20 –30 45 dBµ V –50 65 dBµ V 60 dBµV VCC = 8 V Desired: f = 999 kHz Interference: f = 1039 kHz Desired: V = 40 dBµV –40 –60 45 dBµV 100 dBµV 80 dBµ V Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation 0 50 60 70 80 90 100 110 120 130 140 Interference signal input level (dBµV) 23 µPC2533 Cross-Modulation Characteristics (400 kHz Detuning) Desired: V = 100 dBµ V 80 dBµ V Detection output level VO (dB) 0 –10 VCC = 8 V Desired: f = 999 kHz Interference: f = 1399 kHz 40 dBµ V 60 dBµV –20 Desired: V = 40 dBµV –30 –40 60 dBµ V –50 100 dBµV 80 dBµ V –60 Desired: 400 Hz 30% modulation; interference: non-modulation Desired: non-modulation; interference: 400 Hz 30% modulation Desired: non-modulation; interference: non-modulation 50 60 70 80 90 100 110 120 130 140 Interference signal input level (dBµV) 40 30 20 10 0 VO 0 Recommended operating range –10 6 VS3 –20 5 –30 4 SS –40 US –50 2 VS2 –60 S/N 6 7 8 9 10 Power supply voltage (V) 24 3 1 MS THD 80 % THD 30 % Total harmonic distortion THD (%), Signal meter output voltage 2 VS2 (V) Signal meter output voltage 3 VS3 (V) 50 Detection output level VO (dB), signal-to-noise ratio S/N (dB) Maximum sensitivity MS (dB µV), usable sensitivity US (dBµ V), S/D sensitivity SS (dBµ V) Power Supply Voltage Characteristics µPC2533 Modulation Factor Characteristics 600 500 Detection output level VO (mVrms) Total harmonic distortion THD (%) VCC = 8 V fIN = 999 kHz 3 2 1 VO 400 300 200 100 THD 0 0 20 40 60 80 100 Modulation factor (%) Detuning Frequency Characteristics (Maximum Sensitivity), Signal Selectivity Characteristics 90 80 Signal input level (dBµV) 70 60 50 40 30 20 10 –15 –10 –5 0 5 10 15 Detuning frequency (kHz) 25 µPC2533 Modulation Frequency Characteristics 0 Detection output level (dB) Total harmonic distortion THD (%) VO 5 4 3 2 –10 VCC = 8 V –20 –30 –40 –50 THD 1 –60 0 10 50 100 500 1k 5k 10k Modulation frequency (Hz) Signal Meter Output Voltage (Adjustment by Resistor between Pin 9 and GND) 7 51 kΩ 36 kΩ Signal meter output voltage (V) 6 VCC = 8 V fIN = 999 kHz AMMOD = 30 % fMOD = 400 Hz 5 24 kΩ (51 kΩ) (24 kΩ) 20 kΩ 4 3 12 kΩ 2 6.2 kΩ (6.2 kΩ) 1 1 kΩ (1 kΩ) 0 10 20 30 40 50 60 70 Signal input level (dBµV) 80 90 100 Remark Figures in parentheses indicate setting value (resistor between pin 9 and GND) for µPC2533GS-02. A circuit that restricts output current from pin 9 is mounted on µPC2533GS-02. 26 µPC2533 Receiving Frequency Characteristics 0 (LW band) (MW band) VO Maximum sensitivity MS (dB µV), usable sensitivity US (dB µV) 50 40 30 20 Detection output level VO (dB), signal-to-noise ratio S/N (dB) –10 –20 –30 (LW band) –40 (MW band) US –50 (LW band) 10 –60 0 –70 S/N (MW band) MS (MW band) (LW band) 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Receiving frequency (MHz) Temperature Characteristics (Signal Meter Voltage vs. Operating Ambient Temperature) 10 Signal meter output voltage 2 VS2 (V), signal meter output voltage 3 VS3 (V) 9 8 7 6 VS3 5 4 3 2 VS2 1 0 –40 –20 0 20 40 60 80 100 Operating ambient temperature TA (°C) 27 µPC2533 Temperature Characteristics (Maximum Sensitivity, Usable sensitivity vs. Operating Ambient Temperature) Maximum sensitivity, Usable sensitivity (dBµV) 50 40 30 Usable sensitivity 20 Maximum sensitivity 10 0 –40 –20 0 20 40 60 80 100 Operating ambient temperature TA (°C) 200 0 180 –10 VO 160 140 –30 120 –40 100 –50 S/N 80 –60 60 –70 40 –40 –20 0 20 40 60 Operating ambient temperature TA (°C) 28 –20 80 100 –80 Signal-to-noise ratio S/N (dB) Detection output level VO (mVrms) Temperature Characteristics (Detection Output Level, Signal-to-Noise Ratio vs. Operating Ambient Temperatue) µPC2533 Temperature Characteristics (THD vs. Operating Ambient Temperatue) Total harmonic distortion THD (%) 5 4 Input: 74 dBµV Modulation factor: 30 % Input: 74 dBµV Modulation factor: 80 % Input: 130 dBµV Modulation factor: 80 % 3 2 1 0 –40 –20 THD3 THD2 THD1 0 20 40 60 80 100 Operating ambient temperature TA (°C) 29 µPC2533 510 Ω 12 µ H 0.047 µ F L3 12 µ H 22 Ω SFE10.7MHY-A 0.047 µ F CFWS450HT 47 pF 100 pF + 47 µ F 0.022 µ F 0.022 µ F 10 µ F 3300 pF 36 2SK1000 35 34 33 32 RF AGC driver 31 30 29 MIX1 28 50 Ω 27 26 2.2 µF 4.7 µF 0.022 µ F 0.022 µ F 50 Ω 0.022 µF + 2 kΩ T2 25 Buff1 24 0.022 µF 23 + 22 MIX2 + 21 20 19 Buff2 L2 L1 AGC comparator 15 pF 30 Ω Time constant selector switch 47 pF KV1310 (TOKO, Inc.) 7 39 pF 8 9 10 11 0.01 µF 0.01 µF 12 15 pF 47 pF RSD2 100 kΩ 6 51 kΩ 5V SD DC OUT 1 µF VTUNE + 5 SD DCadj [SMOUT] L4 4 Detector OSC2 SDIN 3 RSD1 330 pF 2 Station detector SD AC OUT 1 IF AGC SEEK LO/DX (LO: 3 V or higher; DX: 1 V or lower) 0.01 µ F OSC1 Buff OUT OSC1 SEEK (ON: 1.5 V or higher; OFF: 0.3 V or lower) OSC Buff SG IN 5. Measurement Circuit Signal meter LO/DX SD ACadj [SDadj] 65 pF IF amplifier MIX2 AGC RF AGC detection Dummy antenna 10.26 MHz 13 14 15 16 17 18 0.01 µ F + 10 µ F 2.7 kΩ 0.047 µ F (2) (4) (1) + 47 µ F 0.033 µ F T3 AUDIO OUT (6) VCC (3) 30 T1 Remark Pin names in parentheses are those of µPC2533GS-02. 150 pF 2SC1844 µPC2533 Coil Specifications (TOKO, Inc.) Product No. Connection Diagram L1 Prototype No. X119FNS-16314Z Specifications (4) (1) - (3) 15T (1) (6) L = 4.7 µH Qu > 60 (3) (4) (4) - (6) 1440T (1) (6) L = 100 mH Qu > 45 (3) (4) (1) - (3) 274T (1) (6) L = 2 mH Qu > 50 (3) (4) (1) - (3) 8T (1) (6) L = 1.8 µH Qu > 70 (3) (4) (3) (2) L2 388DN-1043BS (2) L3 247BR-0147Z (2) L4 392AN - 1871Y (2) T1 392AC-1883N (2) (1) (6) (3) (4) T2 (2) (6) (3) (4) T3 (1) (6) (1) - (3) 152T (1) - (2) 76T C = 180 pF Qu > 25 fO = 450 kHz CX7YCS-8986N (2) (1) - (2) 7T C = 43 pF Qu > 50 fO = 10.7 MHz 7PSYC-1779N (1) (1) - (3) 14T (1) - (2) 4T (1) - (3) 148T (1) - (2) 43T C = 180 pF Qu > 40 ±20 % fO = 450 kHz (2) - (3) 4T (2) - (3) 7T (4) - (6) 3T (2) - (3) 76T (4) - (6) 40T (2) - (3) 105T (4) - (6) 30T • BPF SFE10.7 MHY-A (MURATA mfg. Co., Ltd.) CFWS450HT (MURATA mfg. Co., Ltd.) • RF FET 2SK1000 (NEC) 31 µPC2533 6. Package Drawing 36 PIN PLASTIC SSOP (300 mil) 36 19 detail of lead end R 1 18 A H F I G J S C L B N K D M S M E NOTE Each lead centerline is located within 0.10 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A B 15.3±0.24 0.97 MAX. C 0.8 (T.P.) D 0.37 +0.08 −0.07 E 0.125±0.075 F 1.675+0.125 −0.175 G 1.55 H I 7.7±0.3 5.6±0.15 J 1.05±0.2 K 0.22 +0.08 −0.07 L 0.6±0.2 M 0.10 N 0.10 R 5°±5° P36GM-80-300B-4 32 µPC2533 7. Recommended Soldering Conditions When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Surface mount device µPC2533GS-01, 2533GS-02: 36-pin plastic shrink SOP (300 mil) Process Infrared ray reflow Conditions Peak temperature: 235 °C or below (Package surface temperature), Symbol IR35-00-2 Reflow time: 30 seconds or less (at 210 °C or higher), Maximum number of reflow processes: 2 times. Peak temperature: 215 °C or below (Package surface temperature), VPS VP15-00-2 Reflow time: 40 seconds or less (at 200 °C or higher), Maximum number of reflow processes: 2 times. Wave soldering Solder temperature: 260 °C or below, Flow time: 10 seconds or less, WS60-00-1 Maximum number of flow processes: 1 time, Pre-heating temperature: 120 °C or below (Package surface temperature). Partial heating method Pin temperature: 300 °C or below, – Heat time: 3 seconds or less (Per each side of the device). Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. 33 µPC2533 [MEMO] 34 µPC2533 [MEMO] 35 µPC2533 [MEMO] The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 34