DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUITS µPC2776TB 5 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER DESCRIPTION The µPC2776TB is a silicon monolithic integrated circuits designed as wideband amplifier. This amplifier has impedance near 50 Ω in HF band, so this IC suits to the system of HF to L band. This IC is packaged in super minimold package which is smaller than conventional minimold. The µPC2776TB has compatible pin connections and performance to the µPC2776T of conventional minimold version. So, in the case of reducing your system size, the µPC2776TB is suitable to replace from the µPC2776T. These IC is manufactured using NEC’s 20 GHz fT NESAT™ III silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability. FEATURES • High-density surface mounting: 6-pin super minimold package • Wideband response : fu = 2.7 GHzTYP. @ 3 dB bandwidth • Medium output power : Po (1 dB) = +6.5 dBm @ f = 1 GHz with external inductor • Supply voltage : VCC = 4.5 to 5.5 V • Power gain : GP = 23 dBTYP. @ f = 1 GHz • Port impedance : input/output 50 Ω APPLICATION • Systems required wideband operation from HF to 2.0 GHz ORDERING INFORMATION PART NUMBER µPC2776TB-E3 PACKAGE 6-pin super minimold MARKING C2L SUPPLYING FORM Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel. Remarks To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2776TB) Caution: Electro-static sensitive devices Document No. P12680EJ2V0DS00 (2nd edition) Date Published February 1998 N CP(K) Printed in Japan © 1997 µPC2776TB PIN CONNECTIONS Pin NO. 3 2 1 Pin name (Bottom View) C2L (Top View) 4 4 3 5 5 2 6 6 1 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP OF µPC2776 (TA = +25 °C, VCC = Vout = 5.0 V, ZL = ZS = 50 Ω) PART NO. µPC2776T fu (GHz) PO (1dB) (dBm) PO (sat) (dBm) GP (dB) NF (dB) ICC (mA) +6.5 +8.5 23 6 25 PACKAGE MARKING 6-pin minimold 2.7 µPC2776TB C2L 6-pin super minimold Remarks Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. Notice The package size distinguishes between minimold and super minimold. Selection point among product line-up µPC2709TB: Suits to 1 GHz 2.5 GHz operation due to small inductance (e.g. 10 nH) between VCC and output pin. µPC2776TB: Suits to HF to 2.0 GHz operation due to large inductance (e.g. 100 nH) between VCC and output pin. PIN FUNCTIONS PIN. SYMBOL APPLIED VOLTAGE (V) 1 INPUT − DESCRIPTION High-frequency signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. 2 3 5 GND 0 Ground pin. Form a ground pattern as wide as possible to maintain the minimum ground impedance. 4 OUTPUT 4.5 to 5.5 High-frequency signal output pin. Connect an inductor between this pin and VCC to supply current to the internal output transistors. 6 VCC Power supply pin, which biases the internal input transistor. Excellent RF characteristics are obtained by a two-stage amplifier circuit. To know the associated products, please refer to each latest data sheet. 2 EQUIVALENT CIRCUIT 6 4 1 3 2 5 µPC2776TB ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL CONDITION RATINGS UNIT Supply voltage VCC TA = +25 °C 6 V Total circuit current ICC TA = +25 °C 60 mA Power dissipation PD Mounted on 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85 °C) 200 mW Operating ambient temperature TA −40 to +85 °C TSTG −55 to +150 °C Storage temperature RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTICE Supply Voltage VCC 4.5 5.0 5.5 V The same voltage should be applied to pin 4 and 6 pin. Operating Ambient Temperature TA −40 +25 +85 °C ELECTRICAL CHARACTERISTICS (TA = +25 °C, VCC = Vout = 5.0 V, ZS = ZL = 50 Ω) PARAMETER SYMBOL TEST CONDITION MIN. TYP. MAX. UNIT Circuit current ICC No signals 18 25 33 mA Power gain GP f = 1 GHz 21 23 26 dB PO (1dB) f = 1 GHz +4.0 +6.5 − dBm NF f = 1 GHz − 6.0 7.5 dB 3 dB down below from gain at f = 100 MHz 2.3 2.7 − GHz Output 1 dB compression level Noise figure Upper limit operating frequency fu Isolation ISL f = 1 GHz 27 32 − dB Input return loss RLin f = 1 GHz 4.5 7.5 − dB Output return loss RLout f = 1 GHz 15 20 − dB STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25 °C, VCC = Vout = 5.0 V, ZL = ZS = 50 Ω) PARAMETER Gain flatness Saturated output power 3rd order intermodulation distortion SYMBOL ∆GP PO(sat) IM3 TEST CONDITION REFERENCE UNIT ±1 dB f = 1 GHz +8.5 dBm PO(each) = + 0 dBm, f1 = 1000 MHz, f2 = 1002 MHz −30 dBc f = 0.1 to 2.0 GHz 3 µPC2776TB TEST CIRCUIT VCC 1 000 pF C3 L 6 50 Ω C1 IN C2 4 1 1 000 pF 50 Ω OUT 1 000 pF 2, 3, 5 Components of test circuit for measuring electrical characteristics TYPE VALUE C3 Capacitor 1 000 pF L Bias Tee 1 000 nH C1 to C2 Bias Tee 1 000 pF Example of actural application components TYPE VALUE OPERATING FREQUENCY C1 to C3 Chip capacitor 1 000 pF 100 MHz or higher L Chip inductor 100 nH 100 MHz or higher 10 nH 1.0 GHz or higher INDUCTOR FOR THE OUTPUT PIN The internal output transistor of this IC consumes 20 mA, to output medium power. To supply current for output transistor, connect an inductor between the VCC pin (pin 6) and output pin (pin 4). Select large value inductance, as listed above. The inductor has both DC and AC effects. In terms of DC, the inductor biases the output transistor with minimum voltage drop to output enable high level. In terms of AC, the inductor make output-port impedance higher to get enough gain. In this case, large inductance and Q is suitable. CAPACITORS FOR THE VCC, INPUT, AND OUTPUT PINS Capacitors of 1 000 pF are recommendable as the bypass capacitor for the VCC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitance are therefore selected as lower impedance against a 50 Ω load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2πRfc). 4 µPC2776TB Illustration of the application circuit assembled on evaluation board AMP-2 2 3 Top View 2L 1 IN OUT C C C 6 5 4 L Mounting direction VCC C Component List Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. Value C 1 000 pF L 100 nH, etc 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes 5 µPC2776TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C) CIRCUIT CURRENT vs. OPERATING TEMPERATURE CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 40 VCC = 5.0 V 35 35 30 30 Circuit Current - ICC (mA) Circuit Current - ICC (mA) No Signals 25 20 15 10 25 20 15 10 5 5 0 0 1 4 3 2 Supply Voltage - VCC (V) 5 0 +20 +40 +60 +80 +100 –60 –40 –20 0 Operating Ambient Temperature - TA (°C) 6 POWER GAIN vs. FREQUENCY NOISE FIGURE, POWER GAIN vs. FREQUENCY 25 8 20 30 GP Power Gain - GP (dB) Noise Figure - NF (dB) VCC = 5.5 V 7 VCC = 5.0 V 25 Power Gain - GP (dB) 9 VCC = 4.5 V 15 NF VCC = 5.5 V VCC = 5.0 V TA = +25 °C TA = –40 °C TA = +85 °C 20 15 10 6 VCC = 5.0 V VCC = 4.5 V 5 0.1 5 1.0 0.3 Frequency - f (GHz) 10 0.1 3.0 3.0 INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 VCC = 5.0 V ISOLATION vs. FREQUENCY 0 1.0 0.3 Frequency - f (GHz) VCC = 5.0 V Input Return Loss - RLin (dB) Output Return Loss - RLout (dB) RLin Isolation - ISL (dB) –10 –20 –30 –40 –50 0.1 6 0.3 1.0 Frequency - f (GHz) 3.0 –10 –20 RLout –30 –40 –50 0.1 0.3 1.0 Frequency - f (GHz) 3.0 µPC2776TB OUTPUT POWER vs. INPUT POWER OUTPUT POWER vs. INPUT POWER +15 +15 f = 1.0 GHz VCC = 5.0 V +10 Output Power - Pout (dBm) Output Power - Pout (dBm) +5 VCC = 4.5 V –5 –10 –20 –35 –30 –25 –20 –15 –10 –5 0 Input Power - Pin (dBm) +5 0 –10 –20 0 –35 –30 –25 –20 –15 –10 –5 Input Power - Pin (dBm) +5 +10 +15 VCC = 5.0 V f = 2.0 GHz +10 VCC = 5.0 V f = 1.0 GHz VCC = 5.5 V Output Power - Pout (dBm) Output Power - Pout (dBm) +10 +5 0 –5 VCC = 4.5 V –10 –15 +5 0 f = 2.0 GHz –5 –10 –15 –20 –35 –30 –25 –20 –15 –10 –5 0 Input Power - Pin (dBm) –20 –35 –30 –25 –20 –15 –10 –5 0 Input Power - Pin (dBm) +5 +10 SATURATED OUTPUT POWER vs. FREQUENCY 3rd Order Intermodulation Distortion - IM3 (dBc) 20 Saturated Output Power - PO (sat) (dBm) +5 +10 OUTPUT POWER vs. INPUT POWER +15 18 16 14 VCC = 5.0 V VCC = 5.5 V 10 8 6 4 0 0.1 TA = –40 °C –5 OUTPUT POWER vs. INPUT POWER 2 TA = +85 °C –15 –15 12 VCC = 5.0 V f = 1.0 GHz TA = +25 °C VCC = 5.5 V 0 +10 VCC = 4.5 V 1.0 0.3 Frequency - f (GHz) 3.0 +5 +10 3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE –60 f1 = 1000 MHz f2 = 1002 MHz –50 VCC = 5.5 V –40 VCC = 5.0 V –30 VCC = 4.5 V –20 –10 –10 –8 –6 –4 –2 0 +2 +4 +6 +8 +10 Output Power of Each Tone - PO (each) (dBm) 7 µPC2776TB S-Parameter (VCC = Vout = 5.0 V) S11- FREQUENCY 0.1 G 1.0 G 3.0 G 2.0 G S22- FREQUENCY 3.0 G 1.0 G 0.1 G 2.0 G 8 µPC2776TB Typical S-Parameter Values (TA = +25 °C) µPC2776TB VCC = Vout = 5.0 V, ICC = 27 mA FREQUENCY MHz MAG S11 ANG MAG S21 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 .226 .240 .254 .267 .285 .308 .345 .386 .425 .449 .466 .478 .507 .533 .564 .568 .576 .571 .570 .569 .564 .548 .535 .516 .515 .508 .503 .489 .471 .457 .455 2.8 6.4 10.4 11.4 11.1 8.5 6.1 3.9 1.4 –1.5 –6.1 –12.0 –17.7 –24.7 –30.3 –36.4 –42.0 –48.5 –54.5 –59.7 –64.2 –69.6 –75.5 –81.8 –87.0 –90.9 –94.8 –97.6 –101.3 –106.7 –111.3 13.844 13.862 13.942 14.123 14.267 14.423 14.670 14.864 15.210 15.455 15.564 15.550 15.622 15.577 15.527 15.285 14.960 14.570 14.026 13.715 13.283 12.926 12.515 12.093 11.498 11.136 10.511 10.126 9.850 9.242 9.065 S12 S22 K ANG MAG ANG MAG ANG –5.9 –12.5 –18.6 –25.2 –31.8 –38.6 –45.5 –52.8 –60.1 –68.4 –76.6 –84.9 –93.1 –101.3 –110.6 –119.0 –127.8 –136.4 –144.7 –151.7 –159.8 –167.5 –174.8 177.9 170.1 163.1 156.6 148.3 143.2 135.5 128.9 .029 .029 .028 .029 .029 .029 .030 .030 .031 .030 .030 .030 .030 .029 .029 .027 .026 .024 .023 .022 .020 .018 .018 .016 .017 .015 .015 .018 .019 .022 .026 –1.5 0.3 3.2 4.8 7.2 9.3 10.7 11.0 11.9 11.8 10.6 11.7 13.4 13.2 13.5 11.3 12.6 14.8 15.8 18.2 23.5 27.1 36.3 41.9 53.3 64.3 67.9 85.0 93.7 100.0 108.0 .032 .024 .030 .031 .037 .038 .040 .043 .055 .072 .084 .093 .094 .114 .130 .154 .167 .179 .194 .212 .228 .240 .251 .268 .279 .296 .306 .315 .330 .343 .357 –177.4 –171.9 –176.3 –167.6 –167.3 –159.3 –160.7 –161.9 –169.0 –169.1 –169.1 –173.6 177.9 167.0 164.1 158.0 152.6 143.0 135.2 128.1 121.6 115.9 108.1 102.4 96.0 90.8 86.7 79.2 73.0 67.0 60.7 1.39 1.39 1.40 1.36 1.33 1.28 1.22 1.18 1.12 1.10 1.08 1.07 1.05 1.05 1.02 1.07 1.09 1.18 1.27 1.35 1.48 1.66 1.75 2.01 1.99 2.22 2.29 2.00 1.96 1.81 1.53 9 µPC2776TB PACKAGE DIMENSIONS 6 pin super minimold (unit: mm) 0.15 +0.1 –0 0.1 MIN. 1.25±0.1 2.1±0.1 0.2 +0.1 –0 0 to 0.1 0.65 0.65 1.3 0.7 0.9±0.1 2.0±0.2 10 µPC2776TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor (e.g. 1 000 pF) should be attached to VCC pin. (4) The inductor must be attached between VCC and output pin (e.g. 100 nH) (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. µPC2776TB Soldering method Soldering conditions Recommended condition symbol Infrared ray reflow Package peak temperature: 235 °C, Hour: within 30 s. Note (more than 210 °C), Time: 3 times, Limited days: no. IR35-00-3 VPS Package peak temperature: 215 °C, Hour: within 40 s. Note (more than 200 °C), Time: 3 times, Limited days: no. VP15-00-3 Wave soldering Soldering tub temperature: less than 260 °C, Hour: within 10 s. Note Time: 1 time, Limited days: no. WS60-00-1 Pin part heating Pin area temperature: less than 300 °C, Hour: within 3 s/pin. Note Limited days: no. Note It is the storage days after opening a dry pack, the storage conditions are 25 °C, less than 65 % RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 11 µPC2776TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 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Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. 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