NEC UPC2792TB

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUITS
µPC2791TB, µPC2792TB
5 V, SUPER MINIMOLD SILICON MMIC
VHF-UHF WIDEBAND AMPLIFIER
DESCRIPTION
The µPC2791TB and µPC2792TB are silicon monolithic integrated circuits designed as 2nd IF buffer amplifier for
DBS tuners. These ICs are packaged in super minimold package which is smaller than conventional minimold. So,
in the case of reducing your system size, µPC2791TB and µPC2792TB are suitable. Among the 6-pin mini/superminimold amplifiers, µPC2791TB and µPC2792TB have unique pin locations taken over from conventional 4-pin
minimold µPC1675G, µPC1676G and µPC1688G.
These ICs are manufactured using NEC’s 10GHz fT NESAT™ II AL silicon bipolar process. This process uses
silicon nitride passivation film.
The material can protect chip surface from external pollution and prevent
corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
FEATURES
•
High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
•
Supply voltage
: VCC = 4.5 to 5.5 V
•
Wideband response
: µPC2791TB; fu = 1.9 GHz TYP. @3 dB bandwidth
•
Power gain
: µPC2791TB; GP = 12 dB TYP. @f = 500 MHz
µPC2792TB; fu = 1.2 GHz TYP. @3 dB bandwidth
µPC2792TB; GP = 22 dB TYP. @f = 500 MHz
APPLICATION
•
400 MHz band 2nd IF buffer amplifiers in DBS tuners (2nd frequecy converter block), etc.
ORDERING INFORMATION
Part Number
µPC2791TB-E3
Package
Marking
6-pin super minimold
C2S
µPC2792TB-E3
Remark
C2T
Supplying Form
Embossed tape 8 mm wide.
1, 2, 3 pins face to perforation side of the tape.
Qty 3kpcs/reel.
To order evaluation samples, please contact your local NEC sales office. (Part number for sample
order: µPC2791TB, µPC2792TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P11863EJ2V0DS00 (2nd edition)
Date Published February 2000 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1996, 2000
µPC2791TB, µPC2792TB
PIN CONNECTIONS
3
2
1
C2S
(Top View)
(Bottom View)
4
4
3
5
5
2
6
6
1
Marking is an example of µPC2791TB
Pin No.
Pin Name
1
GND
2
GND
3
OUTPUT
4
VCC
5
GND
6
INPUT
Caution µPC2791TB, µPC2792TB pin locations are different from the other 6-pin mini/super-minimold
amplifiers.
PRODUCT LINE-UP (TA = +25°°C, VCC = 5.0 V, ZS = ZL = 50 Ω)
Part Number
µPC1675G
fu
(GHz)
Po(sat)
(dBm)
GP
(dB)
NF
(dB)
ICC
(mA)
1.9
+4.0
12
5.5
17
Package
µPC2791TB
Marking
4-pin minimold
C1A
6-pin super minimold
C2S
µPC1688G
1.1
+4.0
21
4.0
19
4-pin minimold
C1C
µPC1676G
1.2
+5.0
22
4.5
19
4-pin minimold
C1B
20
3.5
6-pin super minimold
C2T
µPC2792TB
Remarks
Caution
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
This document is to specified for µPC2791TB and µPC2792TB. For the other part numbers
mentioned in this document, the data sheet of each part number should be referred.
SYSTEM APPLICATION EXAMPLE
Example of DBS tuners (2nd frequecy converter block)
1st IF input
from DBS converter
MIX
Baseband output
BPF
µPC2712TB
µ PC2711TB
SAW
FM Demo.
µ PC2791TB
µ PC2792TB
Prescaler
OSC
µPC2711TB
LPF
2
AGC Amp.
Data Sheet P11863EJ2V0DS00
PLL Synth.
µPC2791TB, µPC2792TB
PIN EXPLANATION
Pin
No.
Pin
Name
Applied
Voltage
(V)
Pin
Voltage
Note
(V)
1
2
5
GND
0

3
OUTPUT

3.92
3.96
4
6
VCC
INPUT
4.5 to 5.5


1.11
0.92
Note
Function and Applications
Ground pin. This pin should be
connected to system ground with
minimum inductance. Ground pattern
on the board should be formed as wide
as possible.
All the ground pins must be connected
together with wide ground pattern to
decrease impedance difference.
Signal output pin. A internal matching
circuit, configured with resistors, enables
50 Ω connection over a wide band.
This pin must be coupled to next stage
with capacitor for DC cut.
Power supply pin. This pin should be
externally equipped with bypass
capacity to minimize ground
impedance.
Signal input pin. A internal matching
circuit, configured with resistors, enables
50 Ω connection over a wide band.
A multi-feedback circuit is designed to
cancel the deviations of hFE and
resistance.
This pin must be coupled to front stage
with capacitor for DC cut.
Internal Equivalent Circuit
µPC2791TB
4 VCC
3 OUT
IN 6
2
GND
5
µPC2792TB
1 GND
4 VCC
3 OUT
IN 6
2
GND
5
1 GND
Pin voltage is measured at VCC = 5.0 V. Above: µPC2791TB, Below: µPC2792TB
Data Sheet P11863EJ2V0DS00
3
µPC2791TB, µPC2792TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Conditions
Ratings
Unit
6
V
200
mW
Supply Voltage
VCC
TA = +25°C
Power Dissipation
PD
Mounted on doublesided copper clad
50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C)
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Input Power
Pin
+10
dBm
TA = +25°C
RECOMMENDED OPERATING CONDITIONS
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Supply Voltage
VCC
4.5
5.0
5.5
V
Operating Ambient Temperature
TA
−40
+25
+85
°C
ELECTRICAL CHARACTERISTICS (TA = +25°°C, VCC = 5.0 V, ZS = ZL = 50Ω
Ω)
µPC2791TB
Parameter
µPC2792TB
Test Conditions
Unit
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
Circuit Current
ICC
No signal
12
17
22
14
19
24
mA
Power Gain
GP
f = 500 MHz
10
12
14
17
20
22
dB
Noise Figure
NF
f = 500 MHz

5.5
7.0

3.5
6.0
dB
3 dB down from
flat gain
1.6
1.9

1.0
1.2

GHz
Upper Limit Operating Frequency
4
Symbol
fu
Isolation
ISL
f = 500 MHz
20
24

24
28

dB
Input Return Loss
RLin
f = 500 MHz
9
12

12
15

dB
Output Return Loss
RLout
f = 500 MHz
8
11

9
12

dB
Saturated Output Power
PO(sat)
f = 500 MHz,
Pin = 0 dBm
+2.0
+4.0

+3.0
+5.0

dBm
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
TEST CIRCUIT
VCC
1 000 pF
C3
4
50 Ω
C1
IN
6
1 000 pF
50 Ω
C2
3
OUT
1 000 pF
1, 2, 5
EXAMPLE OF APPLICATION CIRCUIT
VCC
1 000 pF
1 000 pF
C3
C6
4
50 Ω
C1
6
IN
4
3
1 000 pF
C4
C5
C2
6
1 000 pF
3
1 000 pF
50 Ω
OUT
1 000 pF
R1
50 to 200 Ω
1, 2, 5
 To stabilize operation, 
 please connect R1, C5 
1, 2, 5
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS
1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output
pins.
Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be
supplied against VCC fluctuation.
Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC.
To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF
capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling
capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).]
Data Sheet P11863EJ2V0DS00
5
µPC2791TB, µPC2792TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
AMP-3
Top View
1
2
3
C2
S
OUT
IN
6
C
C
5
4
Mounting direction
(Marking is an example
for µ PC2791TB)
VCC
C
COMPONENT LIST
Notes
1. 30 × 30 × 0.4 mm double sided copper clad polyimide board.
C
Value
2. Back side : GND pattern
1 000 pF
3. Solder plated on pattern
: Through holes
4.
For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS
OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC
(P11976E).
6
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°°C)
− µPC2791TB −
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE
30
No Signal
VCC = 5.0 V
25
30
No Signal
Circuit Current ICC (mA)
Circuit Current ICC (mA)
25
20
15
10
15
10
5
5
0
20
0
1
2
3
4
5
0
−60 −40 −20
6
Supply Voltage VCC (V)
6
GP
VCC = 4.5 V
10
VCC = 5.5 V
5
NF
15
VCC = 4.5 V
TA = +25 °C
VCC = 5.0 V
Insertion Power Gain GP (dB)
7
Insertion Power Gain GP (dB)
8
+20 +40 +60 +80 +100
INSERTION POWER GAIN vs. FREQUENCY
NOISE FIGURE, INSERTION POWER GAIN vs. FREQUENCY
15
VCC = 5.0 V
VCC = 5.5 V
10
TA = +85 °C
TA = −40 °C
5
5
VCC = 5.0 V
0
0.1
4
0.3
1.0
0
0.1
3.0
1.0
3.0
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY
0
RLin
VCC = 5.0 V
VCC = 5.0 V
Input Return Loss RLin (dB)
Output Return Loss RLout (dB)
−10
−20
−30
−40
−50
0.1
0.3
Frequency f (GHz)
0
Isolation ISL (dB)
Noise Figure NF (dB)
9
0
Operating Ambient Temperature TA (°C)
0.3
1.0
3.0
−10
−20
RLout
−30
−40
−50
0.1
Frequency f (GHz)
0.3
1.0
3.0
Frequency f (GHz)
Data Sheet P11863EJ2V0DS00
7
µPC2791TB, µPC2792TB
− µPC2791TB −
OUTPUT POWER vs. INPUT POWER
+10
OUTPUT POWER vs. INPUT POWER
+10
VCC = 5.5 V
f = 500 MHz
+5
TA = +25 °C
Output Power Pout (dBm)
Output Power Pout (dBm)
VCC = 5.0 V
0
VCC = 4.5 V
−5
−10
−15
−20
−25
−35
0
TA = −40 °C
−5
−10
−15
−20
−30
−25
−20
−15
−10
−5
−25
−35
0
Input Power Pin (dBm)
VCC = 5.0 V
+2
0
VCC = 4.5 V
−2
−4
0.3
1.0
−20
−15
−10
−5
0
3.0
−60
f1 = 500 MHz
f2 = 504 MHz
−50
VCC = 5.5 V
−40
−30
VCC = 5.0 V
−20
VCC = 4.5 V
−10
0
−14 −12 −10
Frequency f (GHz)
8
−25
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
Third Order Intermodulation Distortion IM3 (dBc)
Saturated Output Power PO (sat) (dBm)
+6
+4
−30
Input Power Pin (dBm)
SATURATED OUTPUT POWER vs. FREQUENCY
+8
VCC = 5.5 V
f = 500 MHz
−6
0.1
TA = +85 °C
f = 500 MHz
+5 VCC = 5.0 V
−8
−6
−4
−2
0
Output Power of Each Tone PO (each) (dBm)
Data Sheet P11863EJ2V0DS00
+2
µPC2791TB, µPC2792TB
S-PARAMETER (TA = +25°°C, VCC = 5.0 V)
− µPC2791TB −
S11-FREQUENCY
1.0 G
0.1 G
3.0 G
2.0 G
S22-FREQUENCY
0.1 G
1.0 G
2.0 G
Data Sheet P11863EJ2V0DS00
9
µPC2791TB, µPC2792TB
TYPICAL S-PARAMETER VALUES (TA = +25°°C)
− µPC2791TB −
VCC = 5.0 V, ICC = 17.0 mA
FREQUENCY
10
S11
S21
S12
S22
K
MHz
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
0.155
11.8
4.157
–8.1
0.085
–4.4
0.211
174.9
1.53
200.0000
0.191
21.7
4.179
–16.4
0.081
–7.2
0.203
168.6
1.56
300.0000
0.240
25.3
4.193
–24.6
0.079
–11.0
0.192
163.1
1.56
400.0000
0.290
25.6
4.245
–33.2
0.075
–11.1
0.179
156.8
1.59
500.0000
0.337
22.9
4.288
–42.4
0.068
–13.2
0.161
152.3
1.65
600.0000
0.383
18.1
4.320
–51.7
0.064
–13.3
0.140
149.8
1.69
700.0000
0.418
11.0
4.316
–61.9
0.059
–13.2
0.115
149.8
1.74
800.0000
0.459
3.2
4.316
–72.0
0.054
–11.4
0.087
156.4
1.81
900.0000
0.499
–4.9
4.268
–82.3
0.049
–8.3
0.067
175.9
1.90
1000.0000
0.553
–12.7
4.243
–91.9
0.045
–1.1
0.069
–155.3
1.88
1100.0000
0.604
–19.5
4.218
–102.2
0.045
4.7
0.097
–138.9
1.72
1200.0000
0.647
–26.4
4.140
–113.2
0.041
13.4
0.133
–137.3
1.71
1300.0000
0.670
–33.9
3.981
–124.8
0.045
20.2
0.175
–140.2
1.53
1400.0000
0.672
–42.4
3.753
–136.1
0.049
27.7
0.214
–145.4
1.50
1500.0000
0.665
–50.1
3.473
–146.3
0.054
28.4
0.251
–152.7
1.47
1600.0000
0.659
–57.4
3.169
–155.5
0.058
33.3
0.279
–159.6
1.53
1700.0000
0.653
–65.1
2.924
–164.3
0.063
32.8
0.302
–166.3
1.55
1800.0000
0.645
–71.8
2.680
–172.6
0.067
33.0
0.320
–172.9
1.60
1900.0000
0.642
–77.8
2.490
–179.7
0.071
31.2
0.328
–178.8
1.63
2000.0000
0.621
–83.3
2.302
173.0
0.071
31.0
0.336
175.6
1.84
2100.0000
0.605
–89.3
2.137
166.6
0.072
30.6
0.340
170.4
1.98
2200.0000
0.577
–94.9
1.977
160.2
0.074
30.3
0.344
165.3
2.19
2300.0000
0.561
–101.0
1.838
154.2
0.076
31.4
0.343
161.7
2.35
2400.0000
0.536
–106.7
1.714
148.2
0.075
30.8
0.345
158.1
2.62
2500.0000
0.521
–111.7
1.596
142.9
0.078
31.2
0.343
154.9
2.77
2600.0000
0.509
–116.1
1.499
137.1
0.078
31.4
0.342
151.7
2.98
2700.0000
0.493
–120.9
1.416
132.2
0.080
32.1
0.340
149.4
3.12
2800.0000
0.482
–125.0
1.353
126.6
0.080
34.2
0.336
146.9
3.33
2900.0000
0.467
–128.6
1.283
122.6
0.082
33.8
0.341
144.6
3.45
3000.0000
0.453
–132.3
1.222
116.8
0.085
34.0
0.341
142.5
3.55
3100.0000
0.441
–137.2
1.172
113.1
0.087
34.2
0.341
140.4
3.68
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°°C)
− µPC2792TB −
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE
35
No Signal
VCC = 5.0 V
30
35
No Signal
Circuit Current ICC (mA)
Circuit Current ICC (mA)
30
25
20
15
10
20
15
10
5
5
0
25
0
1
2
3
4
5
0
−60 −40 −20
6
Supply Voltage VCC (V)
0
+20 +40 +60 +80 +100
Operating Ambient Temperature TA (°C)
INSERTION POWER GAIN vs. FREQUENCY
NOISE FIGURE, INSERTION POWER GAIN vs. FREQUENCY
25
VCC = 5.5 V
VCC = 5.0 V
25
TA = +25 °C
VCC = 5.0 V
5
4
20
Insertion power Gain GP (dB)
6
VCC = 4.5 V
15
10
VCC = 5.5 V
5
3
20
TA = −40 °C
15
TA = +85 °C
10
5
VCC = 5.0 V
NF
VCC = 4.5 V
0
0.1
0.3
1.0
0
0.1
3.0
0.3
VCC = 5.0 V
Input Return Loss RLin (dB)
Output Return Loss RLout (dB)
−10
−20
−30
−40
0.3
1.0
3.0
INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY
0
VCC = 5.0 V
RLout
ISOLATION vs. FREQUENCY
0
−50
0.1
1.0
Frequency f (GHz)
Frequency f (GHz)
Isolation ISL (dB)
Noise Figure NF (dB)
7
Insertion Power Gain GP (dB)
GP
3.0
−10
−20
−30
RLin
−40
−50
0.1
Frequency f (GHz)
0.3
1.0
3.0
Frequency f (GHz)
Data Sheet P11863EJ2V0DS00
11
µPC2791TB, µPC2792TB
− µPC2792TB −
OUTPUT POWER vs. INPUT POWER
+10
OUTPUT POWER vs. INPUT POWER
+10
VCC = 5.5 V
f = 500 MHz
f = 500 MHz
+5 VCC = 5.0 V
Output Power Pout (dBm)
Output Power Pout (dBm)
+5
0
VCC = 5.0 V
−5
VCC = 4.5 V
−10
−15
−20
−25
−40
TA = +85 °C
0
−5
−15
−35
−30
−25
−20
−15
−10
−25
−40
−5
VCC = 5.0 V
+4
+2
VCC = 4.5 V
0
−2
0.3
1.0
3.0
Third Order Intermodulation Distortion IM3 (dBc)
Saturated Output Power PO (sat) (dBm)
+8
+6
−35
−30
−25
−20
−15
−10
−5
Input Power Pin (dBm)
SATURATED OUTPUT POWER vs. FREQUENCY
+10
f = 500 MHz
VCC = 5.5 V
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
−60
f1 = 500 MHz
VCC = 5.5 V
f2 = 504 MHz
−50
VCC = 5.0 V
−40
−30
VCC = 4.5 V
−20
−10
0
−16 −14 −12 −10 −8
Frequency f (GHz)
12
TA = −40 °C
−20
Input Power Pin (dBm)
−4
0.1
TA = +25 °C
−10
−6
−4
−2
0
+2
Output Power of Each Tone PO (each) (dBm)
Data Sheet P11863EJ2V0DS00
+4
µPC2791TB, µPC2792TB
S-PARAMETER (TA = +25°°C, VCC = 5.0 V)
− µPC2792TB −
S11-FREQUENCY
0.1 G
1.0 G
2.0 G
S22-FREQUENCY
0.1 G
1.0 G
2.0 G
Data Sheet P11863EJ2V0DS00
13
µPC2791TB, µPC2792TB
TYPICAL S-PARAMETER VALUES (TA = +25°°C)
− µPC2792TB −
VCC = 5.0 V, ICC = 19.0 mA
FREQUENCY
14
S11
S21
S12
S22
K
MHz
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
MAG.
ANG.
100.0000
0.029
–8.4
11.334
–11.1
0.038
0.4
0.205
169.7
1.34
200.0000
0.040
12.5
11.414
–22.4
0.038
1.8
0.194
157.6
1.34
300.0000
0.056
16.9
11.459
–34.1
0.036
2.7
0.180
145.4
1.37
400.0000
0.076
17.9
11.525
–46.2
0.036
3.7
0.160
130.1
1.39
500.0000
0.090
10.7
11.506
–58.9
0.035
5.3
0.137
113.0
1.42
600.0000
0.103
0.3
11.394
–72.0
0.034
8.9
0.110
91.0
1.47
700.0000
0.122
–14.9
11.159
–85.6
0.034
11.6
0.090
56.4
1.48
800.0000
0.148
–28.8
10.840
–99.5
0.034
13.9
0.094
8.9
1.50
900.0000
0.181
–40.4
10.239
–113.7
0.032
19.9
0.127
–26.9
1.58
1000.0000
0.219
–48.0
9.577
–127.1
0.031
22.9
0.174
–51.7
1.68
1100.0000
0.248
–54.0
8.783
–140.5
0.031
27.1
0.222
–71.0
1.71
1200.0000
0.271
–60.3
7.883
–153.0
0.032
32.3
0.264
–86.7
1.76
1300.0000
0.277
–67.2
6.929
–164.4
0.034
39.4
0.299
–101.0
1.87
1400.0000
0.286
–77.3
6.074
–174.3
0.035
44.0
0.322
–112.8
1.99
1500.0000
0.298
–86.0
5.338
177.3
0.038
49.1
0.341
–123.3
2.04
1600.0000
0.311
–93.2
4.709
169.7
0.040
54.9
0.350
–131.9
2.20
1700.0000
0.328
–99.6
4.206
162.6
0.046
56.5
0.358
–139.2
2.11
1800.0000
0.338
–105.2
3.793
156.0
0.048
58.3
0.360
–145.8
2.24
1900.0000
0.347
–110.0
3.474
150.4
0.053
60.5
0.356
–151.1
2.22
2000.0000
0.345
–115.4
3.179
144.6
0.055
60.4
0.355
–156.0
2.33
2100.0000
0.349
–121.1
2.926
138.7
0.059
60.3
0.350
–160.4
2.37
2200.0000
0.353
–126.8
2.704
133.6
0.063
60.5
0.346
–164.6
2.42
2300.0000
0.365
–131.5
2.513
128.2
0.069
61.7
0.339
–166.9
2.37
2400.0000
0.371
–136.3
2.345
122.8
0.072
60.7
0.335
–169.0
2.42
2500.0000
0.377
–139.3
2.192
118.0
0.077
60.6
0.329
–170.9
2.42
2600.0000
0.378
–142.3
2.059
112.6
0.082
61.3
0.324
–172.3
2.44
2700.0000
0.380
–146.4
1.931
108.2
0.083
59.9
0.316
–173.1
2.56
2800.0000
0.382
–150.0
1.827
102.7
0.091
59.9
0.314
–174.0
2.48
2900.0000
0.381
–153.4
1.727
99.0
0.094
59.4
0.317
–174.5
2.52
3000.0000
0.380
–157.0
1.633
93.7
0.098
57.4
0.318
–175.1
2.56
3100.0000
0.390
–160.4
1.557
90.1
0.102
58.2
0.318
–175.2
2.54
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
PACKAGE DIMENSIONS
6 PIN SUPER MINIMOLD (UNIT: mm)
+0.1
0.1 MIN.
0.15 +0.1
–0.05
1.25 ±0.1
2.1 ±0.1
0.2 –0.05
0 to 0.1
0.65
0.65
1.3
0.7
0.9 ±0.1
2.0 ±0.2
Data Sheet P11863EJ2V0DS00
15
µPC2791TB, µPC2792TB
NOTES ON CORRECT USE
(1) Observe precautions for handiling because of electro-static sensitive devices.
(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).
All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to VCC line.
(4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions.
For soldering methods and
conditions other than those recommended below, contact your NEC sales representative.
Soldering Method
Soldering Conditions
Recommended Condition Symbol
Infrared Reflow
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Note
Count: 3, Exposure limit: None
IR35-00-3
VPS
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Note
Count: 3, Exposure limit: None
VP15-00-3
Partial Heating
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Note
Exposure limit: None
–
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
16
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
[MEMO]
Data Sheet P11863EJ2V0DS00
17
µPC2791TB, µPC2792TB
[MEMO]
18
Data Sheet P11863EJ2V0DS00
µPC2791TB, µPC2792TB
[MEMO]
Data Sheet P11863EJ2V0DS00
19
µPC2791TB, µPC2792TB
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
SENSITIVE
DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8