SN74CBTK16245 16-BIT FET BUS SWITCH WITH ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS105D – APRIL 2000 – REVISED NOVEMBER 2001 D D D D D D D D DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus Family Standard ’16245-Type Pinout 5-Ω Switch Connection Between Two Ports TTL-Compatible Input Levels Ioff Supports Partial-Power-Down Mode Operation Active-Clamp Undershoot-Protection Circuit on the I/Os Clamps Undershoots up to –2 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) – 1000-V Charged-Device Model (C101) NC 1B1 1B2 GND 1B3 1B4 VCC 1B5 1B6 GND 1B7 1B8 2B1 2B2 GND 2B3 2B4 VCC 2B5 2B6 GND 2B7 2B8 NC description The SN74CBTK16245 device provides 16 bits of high-speed TTL-compatible bus switching in a standard ’16245 device pinout. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The A and B ports have an active-clamp undershoot-protection circuit. When there is an undershoot, the active-clamp circuit is enabled, and current from VCC is supplied to clamp the output, preventing the pass transistor from turning on. 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1OE 1A1 1A2 GND 1A3 1A4 VCC 1A5 1A6 GND 1A7 1A8 2A1 2A2 GND 2A3 2A4 VCC 2A5 2A6 GND 2A7 2A8 2OE NC – No internal connection The device is organized as two 8-bit low-impedance switches with separate output-enable (OE) inputs. When OE is low, the switch is on, and data can flow from the A port to the B port, or vice versa. When OE is high, the switch is open, and the high-impedance state exists between the two ports. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION SSOP – DL 40°C to 85°C –40°C ORDERABLE PART NUMBER PACKAGE† TA TSSOP – DGG TOP-SIDE MARKING Tube SN74CBTK16245DL Tape and reel SN74CBTK16245DLR Tape and reel SN74CBTK16245DGGR CBTK16245 CBTK16245 TVSOP – DGV Tape and reel SN74CBTK16245DGVR CP245 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. Copyright 2001, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN74CBTK16245 16-BIT FET BUS SWITCH WITH ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS105D – APRIL 2000 – REVISED NOVEMBER 2001 FUNCTION TABLE (each 8-bit bus switch) INPUT OE FUNCTION L A port = B port H Disconnect logic diagram (positive logic) 1A1 VCC VCC UC† UC† 2 47 VCC VCC UC† UC† 1B1 12 37 1A8 1B8 48 1OE 2A1 VCC VCC UC† UC† 36 13 VCC VCC UC† UC† 26 23 2A8 2B8 25 2OE † Undershoot clamp 2 2B1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBTK16245 16-BIT FET BUS SWITCH WITH ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS105D – APRIL 2000 – REVISED NOVEMBER 2001 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN MAX 5.5 VCC VIH Supply voltage 4 High-level control input voltage 2 VIL TA Low-level control input voltage Operating free-air temperature –40 UNIT V V 0.8 V 85 °C NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP‡ MAX UNIT –1.2 V –2 V VIK VIKU VCC = 4.5 V, VCC = 5.5 V, II = –18 mA 0 mA ≥ II ≥ –50 mA, II VCC = 0, VCC = 5.5 V, VI = 5.5 V VI = 5.5 V or GND 10 Ioff ICC VCC = 0, VCC = 5.5 V, VI or VO = 0 to 5.5 V VI = VCC or GND, 20 VCC = 5.5 V, VI = 3 V or 0 One input at 3.4 V, VO = 3 V or 0, VCC = 4 V, TYP at VCC = 4 V OE = VCC ∆ICC§ Ci Cio(OFF) Control inputs Control inputs ron¶ VCC = 4.5 V OE = 5.5 V ±1 IO = 0 Other inputs at VCC or GND µA µA 3 µA 2.5 mA 3.5 pF 5.5 pF VI = 2.4 V, II = 15 mA 14 20 VI = 0 II = 64 mA II = 30 mA 5 7 5 7 Ω VI = 2.4 V, II = 15 mA 8 12 ‡ All typical values are at VCC = 5 V, TA = 25°C. § This is the increase in supply current for each input that is at the specified TTL-voltage level rather than VCC or GND. ¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by the lower of the voltages of the two (A or B) terminals. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN74CBTK16245 16-BIT FET BUS SWITCH WITH ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS105D – APRIL 2000 – REVISED NOVEMBER 2001 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3) VCC = 4 V VCC = 5 V ± 0.5 V MIN MIN FROM (INPUT) TO (OUTPUT) tpd† A or B B or A 0.35 ten OE A or B 7.4 PARAMETER MAX 1.6 UNIT MAX 0.25 ns 4.9 ns tdis A or B 7.4 4.2 7.5 ns OE † The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). undershoot characteristics PARAMETER TEST CONDITIONS VOUTU See Figures 1 and 2, and Table 1 ‡ All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C. VCC MIN TYP‡ 2 VOH–0.3 MAX UNIT V VTR R1 50 Ω DUT VIN R2 10 pF 5.5 V 0V –2 V Figure 1. Device Test Setup Figure 2. Transient Input Voltage Waveform Table 1. Device Test Conditions PARAMETER VALUE B port under test§ See Figure 1 UNIT VIN tw See Figure 2 V 20 ns tr tf 2 ns 2 ns R1 = R2 100 kΩ VTR VCC 11 V 5.5 V § Other B-port outputs are open. 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN74CBTK16245 16-BIT FET BUS SWITCH WITH ACTIVE-CLAMP UNDERSHOOT-PROTECTION CIRCUIT SCDS105D – APRIL 2000 – REVISED NOVEMBER 2001 PARAMETER MEASUREMENT INFORMATION TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open 7V Open 7V S1 500 Ω From Output Under Test Open GND CL = 50 pF (see Note A) 500 Ω 3V Output Control LOAD CIRCUIT 1.5 V 1.5 V 0V tPZL 3V Input 1.5 V 1.5 V 0V tPLH 1.5 V tPLZ 3.5 V 1.5 V tPZH tPHL VOH Output Output Waveform 1 S1 at 7 V (see Note B) 1.5 V VOL Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VOL + 0.3 V VOL tPHZ 1.5 V VOH VOH – 0.3 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74CBTK16245DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBTK16245DGGRG4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBTK16245DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBTK16245DGVRG4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74CBTK16245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTK16245DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTK16245DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTK16245DL ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTK16245DLG4 ACTIVE SSOP DL 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTK16245DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 8.6 15.8 1.8 12.0 24.0 Q1 SN74CBTK16245DGGR TSSOP DGG 48 2000 330.0 24.4 SN74CBTK16245DGVR TVSOP DGV 48 2000 330.0 24.4 6.8 10.1 1.6 12.0 24.0 Q1 SN74CBTK16245DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CBTK16245DGGR TSSOP DGG 48 2000 346.0 346.0 41.0 SN74CBTK16245DGVR TVSOP DGV 48 2000 346.0 346.0 41.0 SN74CBTK16245DLR SSOP DL 48 1000 346.0 346.0 49.0 Pack Materials-Page 2 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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