NEC UPG139GV

DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG139GV
L-BAND DPDT MMIC SWITCH
DESCRIPTION
The µPG139GV is L-Band Double Pole, Double Throw (DPDT) switch developed for digital cellular or cordless
telephone and PCS applications.
This device feature low insertion loss, high handling power with low voltage
operation. It is housed in a very small 8-pin plastic SSOP package available on tape-and-reel and easy to install and
contributes to miniaturizing the systems.
FEATURES
{ High-Power Switching : Pin(1 dB) = +34 dBm typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 100 M to 2 GHz
Pin(0.5 dB) = +36 dBm typ. @ANT1, 2-TX, VDD = 5.0 V, VCONT = 5.0 V, f = 100 M to 2 GHz
{ Low Insertion Loss
: Lins1 = 0.70 dB typ. @ANT1, 2-TX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz
Lins4 = 0.85 dB typ. @ANT1, 2-RX, VDD = 3.0 V, VCONT = 3.6 V, f = 1 GHz
{ Small 8-pin SSOP (175 mil) Package
APPLICATION
{ Digital Cellular: PDC, GSM, IS-95, IS-136 etc.
{ PCS, PHS Base station etc.
ORDERING INFORMATION
Part Number
µPG139GV-E1
Package
Packing Form
8-pin SSOP (175 mil)
Carrier tape width is 12 mm, Quantity is 2 kpcs per reel.
Remark
For sample order, please contact your local NEC sales office. (Part number for sample order: µPG139GV)
Caution
The IC must be handled with care to prevent static discharge because its circuit composed of GaAs
MESFET.
The information in this document is subject to change without notice.
Document No. P13144EJ2V0DS00 (2nd edition)
Date Published July 1998 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1998
µPG139GV
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameters
Symbol
Supply Voltage
Conditions
Ratings
VDD
Control Voltage 1, 2
Unit
VCONT (H)
V
Note1
–6.0 to +6.0
VCONT1, 2
V
Input Power (ANT1, 2-TX)
Pin
VCONT = +5 V/0 V
+36
dBm
Input Power (ANT1, 2-RX)
Pin
VCONT = +5 V/0 V
+34
dBm
Input Power (ANT1, 2-TX)
Pin
VCONT = +3 V/0 V
+34
dBm
Input Power (ANT1, 2-RX)
Pin
VCONT = +3 V/0 V
+32
dBm
Note 2
0.7
Total Power Dissipation
Ptot
W
Operating Temperature
TA
–50 to +80
°C
Storage Temperature
Tstg
–65 to +150
°C
Notes 1. 2.7 V ≤ | VCONT1 – VCONT2 | ≤ 6.0
2. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C
PIN CONNECTION (Top View)
1
8
3
Connection
Pin No.
Connection
1
TX
5
RX
2
VDD
6
VCONT1
3
VCONT2
7
GND
4
ANT2
8
ANT1
7
G139
2
Pin No.
6
4
5
SWITCH IC SERIES PRODUCTS
Pin (1 dB)
(dBm)
LINS (dB)
ISL (dB)
VCONT (V)
Package
µPG130G
+34
0.5@1G
32@1G
–5/0
8-pin SSOP
PDC, IS-136, PHS
µPG131G
+30
0.6@2G
23@2G
–4/0
(175 mil)
PHS, PCS, WLAN
µPG132G
+30
0.6@2G
22@2G
+3/0
PHS, PCS, WLAN
µPG133G
+25
0.6@2G
20@2G
–3/0
DIVERSITY, VCO
µPG137GV
+34
0.55@1G
25@2G
+3/0
PDC, GSM, IS-136
µPG138GV
+34
+37
0.55@1G
30@1G
–3/0
–5/0
PDC, GSM, IS-136
µPG139GV
(ANT1, 2-TX)
+34
1.20@2G
12.5@2G
+3.6/0
PDC, IS-95, IS-136
µPG139GV
(ANT1, 2-RX)
+30
1.00@2G
14@2G
+3.6/0
PDC, IS-95, IS-136
Part Number
Remark
2
As for detail information of series products, please refer to each data sheet.
Application
µPG139GV
RECOMMENDED OPERATING CONDITIONS (TA = 25°C)
Parameters
Symbol
MIN.
TYP.
MAX.
Unit
Control Voltage (High)
VCONT(H)
+2.7
+3.6
+5.3
V
Control Voltage (Low)
VCONT(L)
–0.2
0
+0.2
V
Supply Voltage
VDD
VCONT(H) – 0.7
VCONT(H) – 0.6
VCONT(H) – 0.5
V
Input Power (ANT1, 2-TX, VCONT = +5 V)
Pin
+36
dBm
Input Power (ANT1, 2-RX, VCONT = +5 V)
Pin
+33
dBm
Input Power (ANT1, 2-TX, VCONT = +3 V)
Pin
+33
dBm
Input Power (ANT1, 2-RX, VCONT = +3 V)
Pin
+31
dBm
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, TA = 25°C, VCONT = +3.6 V/0 V, VDD = +3.0 V, ZS = ZL = 50 Ω)
Parameters
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
LINS1
ANT1, 2-TX, f = 100 M to 1 GHz
0.70
0.85
dB
Insertion Loss 2
LINS2
ANT1, 2-TX, f = 1.5 GHz
0.90
1.00
dB
Insertion Loss 3
LINS3
ANT1, 2-TX, f = 2 GHz
1.20
1.30
dB
Insertion Loss 4
LINS4
ANT1, 2-RX, f = 100 M to 1 GHz
0.85
0.95
dB
Insertion Loss 5
LINS5
ANT1, 2-RX, f = 1.5 GHz
1.05
1.15
dB
Insertion Loss 6
LINS6
ANT1, 2-RX, f = 2 GHz
1.30
1.40
dB
Isolation 1
ISL1
ANT1, 2-TX, f = 100 M to 1.5 GHz
13.5
15.5
dB
Isolation 2
ISL2
ANT1, 2-TX, f = 2 GHz
10.5
12.5
dB
Isolation 3
ISL3
ANT1, 2-RX, f = 100 M to 1.5 GHz
13.5
15.5
dB
Isolation 4
ISL4
ANT1, 2-RX, f = 2 GHz
10.5
12.5
dB
Input Return Loss
RLin
f = 100 M to 2 GHz
11
15
dB
Output Return Loss
RLout
f = 100 M to 2 GHz
11
15
dB
1 dB Compression PointNote
Pin(1 dB)1
ANT1, 2-TX, f = 100 M to 2 GHz
+32
+34
dBm
Note
Pin(1 dB)2
ANT1, 2-RX, f = 100 M to 2 GHz
+27
+30
dBm
Input Power at 0.5 dB
Compression PointNote
Pin(0.5 dB)3
ANT1, 2-TX, f = 100 M to 2 GHz
VCONT = +5 V/0 V VDD = +5.0 V
+36
dBm
Input Power at 0.5 dB
Compression PointNote
Pin(0.5 dB)4
ANT1, 2-RX, f = 100 M to 2 GHz
VCONT = +5 V/0 V VDD = +5.0 V
+33
dBm
RF OFF
15
1 dB Compression Point
Control Current
ICONT
Switching Speed
tsw
60
50
µA
nS
Note Pin (1 dB) and Pin (0.5 dB) are measured the input power level when the insertion loss increase more 1 dB
or 0.5 dB than that of linear range. All other characteristics are measured in linear range.
3
µPG139GV
EVALUATION CIRCUIT
51 PF
TX
51 PF
1
Z0 = 50 Ω
VDD = 3.0 V
VCONT2 = +3.6 V/0 V
ANT2
Z0 = 50 Ω
2
7
3
6
4
5
51 PF
SWITCH LOGIC TABLES
4
8
VCONT1
VCONT2
Switching Portes
Low
High
ANT1-RX ON, ANT2-TX ON
ANT1-TX OFF, ANT2-RX OFF
High
Low
ANT1-TX ON, ANT2-RX ON
ANT1-RX OFF, ANT2-TX OFF
Z0 = 50 Ω
GND
ANT1
VCONT1 = 0 V/+3.6 V
RX
51 PF
Z0 = 50 Ω
µPG139GV
PACKAGE DIMENSIONS
8 PIN PLASTIC SHRINK SOP (175 mil) (Unit: mm)
8
5
3° –3°
+7°
Detail of lead end
1
4
4.94 ± 0.2
3.2 ± 0.1
0.15–0.05
0.65
0.1 ± 0.1
0.87 ± 0.2
+0.10
1.5 ± 0.1
1.8 MAX.
3.0 MAX.
0.5 ± 0.2
0.575 MAX.
+0.10
0.3 –0.05
0.10 M
0.15
5
µPG139GV
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Soldering Conditions
Symbol
Infrared Ray Reflow
Peak package’s surface temperature: 235°C or below
Reflow time: 30 seconds or less (at 210°C)
Number of reflow process: 3, Exposure limitNote: None
IR35-00-3
VPS
Peak package’s surface temperature: 215°C or below
Reflow time: 40 seconds or less (at 200°C)
Number of reflow process: 3, Exposure limitNote: None
VP15-00-3
Wave Soldering
Solder temperature: 260°C or below
Flow time: 10 seconds or less
Number of flow process: 1, Exposure limitNote: None
WS60-00-1
Partial Heating Method
Terminal temperature: 300°C
Flow time: 3 seconds or less (per one pin),
Exposure limitNote: None
Note Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25°C and relative humidity at 65% or less.
Caution
6
Do not apply more than a single process at once, except for “partial heating method”.
µPG139GV
[MEMO]
7
µPG139GV
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5