NEC UPG2015TB-E3

NEC's 1W SINGLE CONTROL
L, S-BAND SPDT SWITCH UPG2015TB
FEATURES
DESCRIPTION
• SUPPLY VOLTAGE:
VDD = 2.7 to 3.0 V (2.8 V TYP.)
NEC's UPG2015TB is a single control GaAs MMIC L, S-band
SPDT (Single Pole Double Throw) switch for mobile phone
and L, S-band applications.
• SINGLE SWITCH CONTROL VOLTAGE:
Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.)
Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
This device can operate frequency from 0.5 to 2.5 GHz, with
low insertion loss and high isolation.
• LOW INSERTION LOSS:
LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
LINS2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz,VDD = 2.8 V, Vcont = 2.8 V/0 V
LINS3 = 0.35 dB TYP. @ f = 2.5 GHz,VDD = 2.8 V, Vcont = 2.8 V/0 V
• HIGH ISOLATION:
ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
ISL2 = 24 dB TYP. @ f =2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
• POWER HANDLING:
Pin (0.1 dB) = +27.0 dBm TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V
This device is housed in a 6-pin super minimold package,
suitable for high-density surface mounting.
APPLICATIONS
• L, S-band digital cellular or cordless handsets
• PCS, W-LAN, WLL and BluetoothTM
• Short Range Wireless
• HIGH-DENSITY SURFACE MOUNTING:
6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
ORDERING INFORMATION
Part Number
Package
UPG2015TB-E3
6-pin super minimold
Marking
G3J
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 2, 3 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: UPG2015TB
Caution
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
California Eastern Laboratories
UPG2015TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
(Top View)
2
(Bottom View)
4 3
G3J
3
(Top View)
1
4 4
5 2
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
VCont
5
INPUT
6
VDD
3
5 5
6 1
Pin No.
2
1
6 6
TRUTH TABLE
Vcont
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
OFF
ON
High
ON
OFF
ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
VDD
+6.0
V
Switch Control Voltage
Vcont
+6.0
V
Input Power
Pin
+33
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified)
Parameter
Supply Voltage
Symbol
MIN.
TYP.
MAX.
Unit
VDD
2.7
2.8
3.0
V
Switch Control Voltage (H)
Vcont (H)
2.7
2.8
3.0
V
Switch Control Voltage (L)
Vcont (L)
−0.2
0
0.2
V
UPG2015TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Insertion Loss 1
LINS1
f = 0.5 to 1.0 GHz
−
0.25
0.45
dB
Insertion Loss 2
LINS2
f = 1.0 to 2.0 GHz
−
0.30
0.50
dB
Insertion Loss 3
LINS3
f = 2.5 GHz
−
0.35
0.55
dB
Isolation 1
ISL1
f = 0.5 to 2.0 GHz
23
27
−
dB
Isolation 2
ISL2
f = 2.5 GHz
20
24
−
dB
dB
Input Return Loss
RLin
f = 0.5 to 2.5 GHz
15
20
−
Output Return Loss
RLout
f = 0.5 to 2.5 GHz
15
20
−
dB
Pin (0.1 dB) f = 2.0 GHz
+25.5
+27.0
−
dBm
f = 2.5 GHz
+25.5
+27.0
−
dBm
0.1 dB Gain Compression
Input Power Note
Supply Current
IDD
−
50
100
µA
Switch Control Current
Icont
−
4
20
µA
tSW
−
0.3
2.0
µs
Switch Control Speed
Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear
range.
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
Parameter
Symbol
1 dB Gain Compression
Input Power Note
Pin (1 dB)
Test Conditions
f = 2.0 GHz
MIN.
TYP.
MAX.
Unit
−
+30.0
−
dBm
Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear
range.
Caution
It is necessary to use DC blocking capacitors with the device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation,
bandwidth, switching speed and the condition with actual board of your system. The range of recommended
DC blocking capacitor value is less than 100 pF.
UPG2015TB
EVALUATION CIRCUIT
(VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF)
OUTPUT1
OUTPUT2
56 pF
56 pF
1
2
3
6
5
4
56 pF
1 000 pF
VDD
INPUT
1 000 pF
Vcont
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4-277
UPG2015TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
VDD
6pin SMM SPDT SW
Vc1
OUTPUT1
C2
C
2
C
4
OUT 1
C1
G3J
INPUT
C3
C1
C1
IN
C
C
1
5
C2
OUT 2
OUTPUT2
Vc2
Vcont
USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
56 pF
1 000 pF
UPG2015TB
TYPICAL CHARACTERISTICS
(TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified)
INPUT–OUTPUT2
INSERSION LOSS vs. FREQUENCY
0.5
0
0
Insersion Loss LINS (dB)
0.5
–0.5
–1.0
–1.5
–2.0
–0.5
–1.0
–1.5
–2.0
–2.5
–2.5
–3.0
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–3.0
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT–OUTPUT1
ISOLATION vs. FREQUENCY
INPUT–OUTPUT2
ISOLATION vs. FREQUENCY
20
10
10
0
0
Isolation ISL (dB)
20
–10
–20
–30
–10
–20
–30
–40
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
INPUT–OUTPUT1
INPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
INPUT RETURN LOSS vs. FREQUENCY
20
20
10
10
Input Return Loss RLin (dB)
Input Return Loss RLin (dB)
Isolation ISL (dB)
Insersion Loss LINS (dB)
INPUT–OUTPUT1
INSERSION LOSS vs. FREQUENCY
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
UPG2015TB
INPUT–OUTPUT1
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
OUTPUT RETURN LOSS vs. FREQUENCY
20
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
20
10
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
10
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
32 f = 1.0 GHz
30
28
26
24
22
20
18
16
14
12
10
8
10 12 14 16 18 20 22 24 26 28 30 32 34
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
OUTPUT POWER vs. INPUT POWER
30
28
Output Power Pout (dBm)
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER
f = 2.5 GHz
26
24
22
20
18
16
14
12
10
8
10 12 14 16 18 20 22 24 26 28 30 32
Input Power Pin (dBm)
UPG2015TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
0.2+0.1
-0.05
0.65
0.65
1.3
0.15+0.1
-0.05
0 to 0.1
0.7
0.1 MIN.
0.9±0.1
2.0±0.2
1.25±0.1
UPG2015TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering methods and
conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature)
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
: 260°C or below
: 10 seconds or less
: 120°C or below
: 1 time
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
HS350
Caution
Do not use different soldering methods together (except for partial heating).
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected
to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify
CEL for all damages resulting from such improper use or sale.
02/18/2004
A Business Partner of NEC Compound Semiconductor Devices, Ltd.