TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 D Ideal for Notebook Computers, PDAs, and D D D D D D D D D D Other Small Portable Audio Devices 1 W Into 8-Ω From 5-V Supply 0.3 W Into 8-Ω From 3-V Supply Stereo Head Phone Drive Mono (BTL) Signal Created by Summing Left and Right Signals Internally Wide Power Supply Compatibility 2.5 V to 5.5 V Low Supply Current – 3.2 mA Typical at 5 V – 2.7 mA Typical at 3 V Shutdown Control . . . 1 µA Typical Shutdown Pin Is TTL Compatible –40°C to 85°C Operating Temperature Range Space-Saving, Thermally-Enhanced MSOP Packaging DGQ PACKAGE (TOP VIEW) FILT_CAP SHUTDOWN VDD BYPASS RIN 1 2 3 4 5 10 9 8 7 6 LO/MO– LIN GND ST/MN RO/MO+ description The TPA0253 is a 1-W mono bridge-tied-load (BTL) amplifier designed to drive speakers with as low as 8-Ω impedance. The mono signal is created by summing left and right inputs internally. The amplifier can be reconfigured on the fly to drive two stereo single-ended (SE) signals into headphones. This makes the device ideal for use in small notebook computers, PDAs, digital personal audio players, anyplace a mono speaker and stereo headphones are required. From a 5-V supply, the TPA0253 can deliver 1-W of power into an 8-Ω speaker. The gain of the input stage is set by the user-selected input resistor and a 50-kΩ internal feedback resistor (AV = – RF/RI). The power stage is internally configured with a gain of –1.25 V/V in SE mode, and –2.5 V/V in BTL mode. Thus, the overall gain of the amplifier is 62.5 kΩ/RI in SE mode and 125 kΩ/RI in BTL mode. The input terminals are high-impedance CMOS inputs, and can be used as summing nodes. The TPA0253 is available in the 10-pin thermally-enhanced MSOP package (DGQ) and operates over an ambient temperature range of –40°C to 85°C. AVAILABLE OPTIONS TA PACKAGED DEVICES MSOP† (DGQ) MSOP SYMBOLIZATION – 40°C to 85°C TPA0253DGQ AEL † The DGQ package are available taped and reeled. To order a taped and reeled part, add the suffix R to the part number (e.g., TPA0253DGQR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2002, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 schematic CBYP 4 BYPASS VDD 3 VDD GND 1 8 BYPASS FILT_CAP VDD 50 kΩ 1 µF 50 kΩ 1.25*R 100 kΩ 5 Right Audio Input Ci RIN M U X – R – + CC RO/MO+ 6 + Ri BYPASS BYPASS 100 kΩ 50 kΩ Stereo/Mono Control 50 kΩ ST/MN 7 LO/MO– 10 50 kΩ 1.25*R Left Audio Input Ci Ri 9 LIN M U X – R – + + 1 kΩ BYPASS BYPASS From System Control 2 2 SHUTDOWN CC Shutdown and Depop Circuitry POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 Terminal Functions TERMINAL NAME NO. I/O I DESCRIPTION BYPASS 4 FILT_CAP 1 Midrail bias voltage GND 8 LIN 9 I Left-channel input terminal LO/MO– 10 O Left-output in SE mode and mono negative output in BTL mode. RIN 5 I Right-channel input terminal RO/MO+ 6 O Right-output in SE mode and mono positive output in BTL mode SHUTDOWN 2 I TTL-compatible shutdown terminal ST/MN 7 I Selects between stereo and mono mode. When held high, the amplifier is in SE stereo mode; while held low, the amplifier is in BTL mono mode. VDD 3 I Positive power supply Terminal used to filter power supply Ground terminal absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VDD +0.3 V Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . internally limited (see Dissipation Rating Table) Operating free-air temperature range, TA (see Table 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C Operating junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE DGQ TA ≤ 25°C 2.14 W§ DERATING FACTOR 17.1 mW/°C TA = 70°C 1.37 W TA = 85°C 1.11 W ‡ Please see the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report (SLMA002), for more information on the PowerPAD package. The thermal data was measured on a PCB layout based on the information in the section entitled Texas Instruments Recommended Board for PowerPAD on page 33 of that document. PowerPAD is a trademark of Texas Instruments. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 recommended operating conditions ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ Supply voltage, VDD High-level High level in input ut voltage, VIH VDD = 3 V VDD = 5 V ST/MN MAX 2.5 5.5 V 4.5 V 2 VDD = 3 V VDD = 5 V ST/MN UNIT 2.7 SHUTDOWN Low-level input Low level in ut voltage, VIL MIN 1.65 2.75 V ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ SHUTDOWN 0.8 Operating free-air temperature, TA – 40 °C 85 electrical characteristics at specified free-air temperature, VDD = 3 V, TA = 25°C (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER TEST CONDITIONS MIN |VOO| Output offset voltage (measured differentially) RL = 4 Ω, ST/MN = 0 V, SHUTDOWN = 2 V PSRR Power supply rejection ratio VDD = 2.9 V to 3.1 V, BTL mode SHUTDOWN, VDD = 3.3 V, VI = VDD |IIH| High level input current High-level |IIL| Low level input current Low-level ZI IDD Input impedance IDD(SD) Supply current, shutdown mode RF Feedback resistor ST/MN, VDD = 3.3 V, TYP MAX UNIT 30 mV 65 dB 1 1 SHUTDOWN, VDD = 3.3 V, VI = VDD VI = 0 V ST/MN, VDD = 3.3 V, VI = 0 V 1 A µA 1 µA A 50 Supply current VDD = 2.5 V, SHUTDOWN = 2 V SHUTDOWN = 0 V VDD = 2.5 V, RL = 4 Ω, ST/MN = 1.375 V, SHUTDOWN = 2 V 47 kΩ 2.7 4 mA 1 10 µA 50 57 kΩ operating characteristics, VDD = 3 V, TA = 25°C, RL = 8 Ω, f = 1 kHz (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER TEST CONDITIONS BTL mode, Gain = 14 dB THD = 0.1% Gain = 1.9 dB SE mode, RL = 32 Ω PO Output power, see Note 1 THD + N Total harmonic distortion plus noise PO = 250 mW, f = 20 Hz to 20 kHz BOM Maximum output power bandwidth Gain = 1.9 dB, THD = 2% Vn Supple ripple rejection ratio kHz f = 1 kHz, 0 47 µF F C(BYP) = 0.47 Noise output voltage C(BYP) = 0.47 0 47 µF µF, f = 20 Hz to 20 kHz NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. 4 MIN THD = 0.1%, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TYP MAX UNIT 300 30 mW 0.2% 20 BTL mode 46 SE mode 68 BTL mode 83 SE mode 33 kHz dB µVRMS TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 electrical characteristics at specified free-air temperature, VDD = 5 V, TA = 25°C (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ PARAMETER TEST CONDITIONS MIN |VOO| Output offset voltage (measured differentially) RL = 4 Ω, ST/MN = 0 V, SHUTDOWN = 2 V PSRR Power supply rejection ratio VDD = 4.9 V to 5.1 V, BTL mode SHUTDOWN, VDD =5.5 V, VI = VDD TYP MAX UNIT 30 mV 62 dB 1 µA A |IIH| High level input current High-level |IIL| Low level input current Low-level ZI IDD Input impedance Supply current SHUTDOWN = 2 V 3.2 4.8 mA IDD(SD) Supply current, shutdown mode SHUTDOWN = 0 V 1 10 µA ST/MN, VDD = 5.5 V, SHUTDOWN, VDD = 5.5 V, ST/MN, VDD = 5.5 V, VI = VDD VI = 0 V 1 VI = 0 V 1 1 A µA 50 kΩ operating characteristics, VDD = 5 V, TA = 25°C, RL = 8 Ω, f = 1 kHz (unless otherwise noted) ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁ ÁÁÁÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁ ÁÁ PARAMETER TEST CONDITIONS THD = 0.1%, BTL mode THD = 0.1%, SE mode, PO Output power (see Note 1) THD + N Total harmonic distortion plus noise PO = 1 W, f = 20 Hz to 20 kHz BOM Maximum output power bandwidth Gain = 8 dB, THD = 2% Supple ripple rejection ratio kHz f = 1 kHz, 0 47 µF F C(BYP) = 0.47 Noise output voltage C(BYP) = 0.47 0 47 µF, F f = 20 Hz to 20 kHz Vn MIN RL = 32 Ω TYP MAX UNIT 1 W 85 mW 0.33% 20 BTL mode 46 SE mode 60 BTL mode 85 SE mode 34 kHz dB µV VRMS NOTE 1: Output power is measured at the output terminals of the device at f = 1 kHz. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 TPA0253 1-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS280D – JANUARY 2000 – REVISED NOVEMBER 2002 MECHANICAL DATA DGQ (S-PDSO-G10) PowerPAD PLASTIC SMALL-OUTLINE PACKAGE 0,27 0,17 0,50 10 0,25 M 6 Thermal Pad (See Note D) 0,15 NOM 3,05 2,95 4,98 4,78 Gage Plane 0,25 1 0°–ā6° 5 3,05 2,95 0,69 0,41 Seating Plane 1,07 MAX 0,15 0,05 0,10 4073273/A 04/98 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimension of the thermal pad is 1,40 mm (height as illustrated) × 1,80 (width as illustrated) mm (maximum). The pad is centered on the bottom of the package. PowerPAD is a trademark of Texas Instruments. 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TPA0253DGQ ACTIVE MSOPPower PAD DGQ 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA0253DGQG4 ACTIVE MSOPPower PAD DGQ 10 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA0253DGQR ACTIVE MSOPPower PAD DGQ 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPA0253DGQRG4 ACTIVE MSOPPower PAD DGQ 10 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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