TI SNJ54AHC00FK

SN54AHC00, SN74AHC00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCLS227I – OCTOBER 1995 – REVISED JULY 2003
D
Operating Range 2-V to 5.5-V VCC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
13
3
12
4
11
5
10
6
9
7
8
SN54AHC00 . . . FK PACKAGE
(TOP VIEW)
1B
1Y
2A
2B
2Y
14
1B
1A
NC
VCC
4B
1
1Y
NC
2A
NC
2B
13 4B
2
3
12 4A
4
11 4Y
10 3B
9 3A
5
6
7
8
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
4A
NC
4Y
NC
3B
2Y
GND
NC
3Y
3A
2
VCC
4B
4A
4Y
3B
3A
3Y
VCC
14
3Y
1
1A
1A
1B
1Y
2A
2B
2Y
GND
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SN74AHC00 . . . RGY PACKAGE
(TOP VIEW)
SN54AHC00 . . . J OR W PACKAGE
SN74AHC00 . . . D, DB, DGV, N, NS,
OR PW PACKAGE
(TOP VIEW)
GND
D
D
NC – No internal connection
description/ordering information
The ’AHC00 devices perform the Boolean function Y
+ A • B or Y + A ) B in positive logic.
ORDERING INFORMATION
Tape and reel
SN74AHC00RGYR
HA00
PDIP – N
Tube
SN74AHC00N
SN74AHC00N
Tube
SN74AHC00D
Tape and reel
SN74AHC00DR
SOP – NS
Tape and reel
SN74AHC00NSR
AHC00
SSOP – DB
Tape and reel
SN74AHC00DBR
HA00
Tube
SN74AHC00PW
Tape and reel
SN74AHC00PWR
TVSOP – DGV
Tape and reel
SN74AHC00DGVR
HA00
CDIP – J
Tube
SNJ54AHC00J
SNJ54AHC00J
CFP – W
Tube
SNJ54AHC00W
SNJ54AHC00W
LCCC – FK
Tube
SNJ54AHC00FK
SNJ54AHC00FK
TSSOP – PW
–55°C to 125°C
TOP-SIDE
MARKING
QFN – RGY
SOIC – D
–40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
AHC00
HA00
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54AHC00, SN74AHC00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCLS227I – OCTOBER 1995 – REVISED JULY 2003
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
Y
A
B
H
H
L
L
X
H
X
L
H
logic diagram, each gate (positive logic)
A
Y
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 2): N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
(see Note 2): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54AHC00, SN74AHC00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCLS227I – OCTOBER 1995 – REVISED JULY 2003
recommended operating conditions (see Note 4)
SN54AHC00
VCC
Supply voltage
VIH
VCC = 2 V
VCC = 3 V
High-level input voltage
Low-level input voltage
VI
VO
2
5.5
Output voltage
∆t/∆v
5.5
2.1
V
V
0.5
0.9
0.9
1.65
1.65
V
0
5.5
0
5.5
V
0
VCC
–50
0
VCC
–50
mA
VCC = 3.3 V ± 0.3 V
VCC = 5 V ± 0.5 V
VCC = 3.3 V ± 0.3 V
Input transition rise or fall rate
2
UNIT
1.5
3.85
VCC = 2 V
VCC = 3.3 V ± 0.3 V
Low-level output current
MAX
2.1
VCC = 5 V ± 0.5 V
VCC = 2 V
IOL
MIN
3.85
VCC = 3 V
VCC = 5.5 V
High-level output current
SN74AHC00
0.5
Input voltage
IOH
MAX
1.5
VCC = 5.5 V
VCC = 2 V
VIL
MIN
VCC = 5 V ± 0.5 V
–4
–4
–8
–8
50
50
4
4
8
8
100
100
20
20
V
mA
mA
mA
ns/V
TA
Operating free-air temperature
–55
125
–40
85
°C
NOTE 4: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –50 mA
VOH
IOH = –4 mA
IOH = –8 mA
IOL = 50 mA
VOL
IOL = 4 mA
IOL = 8 mA
MIN
TA = 25°C
TYP
MAX
2V
1.9
2
1.9
1.9
3V
2.9
3
2.9
2.9
4.5 V
4.4
4.5
4.4
4.4
3V
2.58
2.48
2.48
4.5 V
3.94
3.8
VCC
SN54AHC00
MIN
MAX
SN74AHC00
MIN
MAX
UNIT
V
3.8
2V
0.1
0.1
0.1
3V
0.1
0.1
0.1
4.5 V
0.1
0.1
0.1
V
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
0 V to 5.5 V
±0.1
±1*
±1
mA
IO = 0
5.5 V
2
VI = VCC or GND
5V
2
10
* On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V.
20
20
mA
10
pF
II
ICC
VI = 5.5 V or GND
VI = VCC or GND,
Ci
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54AHC00, SN74AHC00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCLS227I – OCTOBER 1995 – REVISED JULY 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
SN54AHC00
SN74AHC00
MIN
MAX
MIN
MAX
5.5*
7.9*
1*
9.5*
1
9.5
5.5*
7.9*
1*
9.5*
1
9.5
8
11.4
1
13
1
13
8
11.4
1
13
1
13
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
LOAD
CAPACITANCE
tPLH
tPHL
A or B
Y
CL = 15 pF
tPLH
tPHL
A or B
Y
CL = 50 pF
MIN
TA = 25°C
TYP
MAX
SN54AHC00
SN74AHC00
MIN
MAX
MIN
MAX
3.7*
5.5*
1*
6.5*
1
6.5
3.7*
5.5*
1*
6.5*
1
6.5
5.2
7.5
1
8.5
1
8.5
5.2
7.5
1
8.5
1
8.5
UNIT
ns
ns
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 5)
SN74AHC00
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.3
0.8
V
Quiet output, minimum dynamic VOL
–0.3
–0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
4.6
High-level dynamic input voltage
V
3.5
VIL(D)
Low-level dynamic input voltage
NOTE 5: Characteristics are for surface-mount packages only.
V
1.5
V
TYP
UNIT
9.5
pF
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
TEST CONDITIONS
Power dissipation capacitance
No load,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 1 MHz
SN54AHC00, SN74AHC00
QUADRUPLE 2-INPUT POSITIVE-NAND GATES
SCLS227I – OCTOBER 1995 – REVISED JULY 2003
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
S1
VCC
Open
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
Input
50% VCC
50% VCC
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PULSE DURATION
VCC
50% VCC
Input
50% VCC
0V
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
VOH
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH – 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
E. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-9682201Q2A
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
5962-9682201QCA
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
5962-9682201QDA
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
SN74AHC00D
ACTIVE
SOIC
D
14
50
Pb-Free
(RoHS)
CU NIPDAU
SN74AHC00DBLE
OBSOLETE
SSOP
DB
14
None
Call TI
SN74AHC00DBR
ACTIVE
SSOP
DB
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00DGVR
ACTIVE
TVSOP
DGV
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00DR
ACTIVE
SOIC
D
14
2500
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AHC00NSR
ACTIVE
SO
NS
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SN74AHC00PW
ACTIVE
TSSOP
PW
14
90
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00PWLE
OBSOLETE
TSSOP
PW
14
None
Call TI
SN74AHC00PWR
ACTIVE
TSSOP
PW
14
2000
Pb-Free
(RoHS)
CU NIPDAU
Level-1-250C-UNLIM
SN74AHC00RGYR
ACTIVE
QFN
RGY
14
1000
Pb-Free
(RoHS)
CU SN
Level-2-260C-1 YEAR
SNJ54AHC00FK
ACTIVE
LCCC
FK
20
1
None
Call TI
Level-NC-NC-NC
SNJ54AHC00J
ACTIVE
CDIP
J
14
1
None
Call TI
Level-NC-NC-NC
SNJ54AHC00W
ACTIVE
CFP
W
14
1
None
Call TI
Level-NC-NC-NC
Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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