[ /Title (CD74 HC85, CD74 HCT85 ) /Subject (High Speed CMOS Logic 4-Bit Magnitude Compara- CD74HC85, CD74HCT85 Data sheet acquired from Harris Semiconductor SCHS136 High Speed CMOS Logic 4-Bit Magnitude Comparator August 1997 Features Description • Buffered Inputs and Outputs The CD74HC85 and CD74HCT85 are high magnitude comparators that use silicon-gate technology to achieve operating speeds similar to with the low power consumption of standard integrated circuits. • Typical Propagation Delay: 13ns (Data to Output at VCC = 5V, CL = 15pF, TA = 25oC • Serial or Parallel Expansion Without External Gating speed CMOS LSTTL CMOS These 4-bit devices compare two binary, BCD, or other monotonic codes and present the three possible magnitude results at the outputs (A > B, A < B, and A = B). The 4-bit input words are weighted (A0 to A3 and B0 to B3), where A3 and B3 are the most significant bits. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times The devices are expandable without external gating, in both serial and parallel fashion. The upper part of the truth table indicates operation using a single device or devices in a serially expanded application. The parallel expansion scheme is described by the last three entries in the truth table. • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30%of VCC at VCC = 5V Ordering Information • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH PART NUMBER TEMP. RANGE (oC) PKG. NO. PACKAGE CD74HC85E -55 to 125 16 Ld PDIP E16.3 CD74HCT85E -55 to 125 16 Ld PDIP E16.3 CD74HC85M -55 to 125 16 Ld SOIC M16.15 CD74HCT85M -55 to 125 16 Ld SOIC M16.15 NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Die for this part number is available which meets all electrical specifications. Please contact your local sales office or Harris customer service for ordering information. Pinout CD74HC85, CD74HCT85 (PDIP, SOIC) TOP VIEW 16 VCC B3 1 (A < B) IN 2 15 A3 (A = B) IN 3 14 B2 (A > B) IN 4 13 A2 (A > B) OUT 5 12 A1 (A = B) OUT 6 11 B1 (A < B) OUT 7 10 A0 GND 8 9 B0 CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © Harris Corporation 1997 1 File Number 1770.1 CD74HC85, CD74HCT85 Functional Diagram 15 A3 13 A2 12 A1 10 A0 (A < B) IN (A = B) IN (A > B) IN B3 7 2 3 6 4 5 (A < B) OUT (A = B) OUT (A > B) OUT 1 14 B2 11 B1 9 B0 TRUTH TABLE COMPARING INPUTS A3, B3 A2, B2 A1, B1 CASCADING INPUTS OUTPUTS A0, B0 A>B A<B A=B A>B A<B A=B SINGLE DEVICE OR SERIES CASCADING A3 > B3 X X X X X X H L L A3 < B3 X X X X X X L H L A3 = B3 A2 >B2 X X X X X H L L A3 = B3 A2 < B2 X X X X X L H L A3 = B3 A2 = B2 A1 > B1 X X X X H L L A3 = B3 A2 = B2 A1 < B1 X X X X L H L A3 = B3 A2 = B2 A1 = B1 A0 > B0 X X X H L L A3 = B3 A2 = B2 A1 = B1 A0 < B0 X X X L H L A3 = B3 A2 = B2 A1 = B1 A0 = B0 H L L H L L A3 = B3 A2 = B2 A1 = B1 A0 = B0 L H L L H L A3 = B3 A2 = B2 A1 = B1 A0 = B0 L L H L L H PARALLEL CASCADING A3 = B3 A2 = B2 A1 = B1 A0 = B0 X X H L L H A3 = B3 A2 = B2 A1 = B1 A0 = B0 H H L L L L A3 = B3 A2 = B2S A1 = B1 A0 = B0 L L L H H L NOTE: H = High Voltage Level, L = Low Voltage, Level, X = Don’t Care 2 CD74HC85, CD74HCT85 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 3) θJA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90 SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 3. θJA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 3 CD74HC85, CD74HCT85 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) IO (mA) High Level Input Voltage VIH - - Low Level Input Voltage VIL - High Level Output Voltage CMOS Loads VOH VIH or VIL PARAMETER 25oC VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 4.5 to 5.5 2 - - 2 - 2 - V - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V ±0.1 - ±1 - ±1 µA HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC and GND 0 5.5 - ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load (Note) NOTE: For dual-supply systems theorectical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS A0-A3, B0-B3 and (A = B) IN 1.5 (A > B) IN, (A < B) IN 1 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Table, e.g. 360µA max at 25oC. Switching Specifications Input tr, tf = 6ns PARAMETER SYMBOL TEST CONDITIONS HC TYPES Propagation Delay, An, Bn to (A > B) OUT, (A < B) OUT tPLH, tPHL CL = 50pF An, Bn to (A = B) OUT -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 195 - 245 - 295 ns 4.5 - - 39 - 47 - 59 ns CL = 15pF 5 - 16 - - - - - ns CL = 50pF 6 - - 33 - 42 - 50 ns tPLH, tPHL CL = 50pF 2 - - 175 - 240 - 265 ns 4.5 - - 35 - 44 - 53 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 6 - - 30 - 37 - 45 ns 4 CD74HC85, CD74HCT85 Switching Specifications Input tr, tf = 6ns PARAMETER (Continued) TEST CONDITIONS SYMBOL (A > B) IN, (A < B) IN, (A = B) IN tPLH, tPHL CL = 50pF to (A > B) OUT, (A < B) OUT (A > B) IN to (A = B) OUT Output Transition Times (Figure 1) CPD CIN VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 140 - 175 - 210 ns 4.5 - - 28 - 35 - 42 ns 5 - 11 - - - - - ns CL = 50pF 6 - - 24 - 30 - 36 ns 2 - - 120 - 150 - 180 ns 4.5 - - 24 - 30 - 36 ns CL = 15pF 5 - 9 - - - - - ns CL = 50pF 6 - - 20 - 26 - 31 ns - 5 - 24 - - - - - pF 2 - - 75 - 95 - 110 ns tTLH, tTHL CL = 50pF Input Capacitance -55oC TO 125oC CL = 15pF tPLH, tPHL CL = 50pF Power Dissipation Capacitance (Notes 2, 3) -40oC TO 85oC 25oC - 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns - - - 10 - 10 - 10 pF HCT TYPES Propagation Delay, An, Bn to (A > B) OUT, (A < B) OUT tPLH, tPHL CL = 50pF CL = 15pF 4.5 - - 37 - 46 - 56 ns 5 - 15 - - - - - ns An, Bn to (A = B) OUT tPLH, tPHL CL = 50pF 4.5 - - 40 - 50 - 60 ns 5 - 17 - - - - - ns CL = 15pF (A > B) IN, (A < B) IN, (A = B) IN tPLH, tPHL CL = 50pF to (A > B) OUT, (A < B) OUT CL = 15pF 4.5 - - 30 - 38 - 45 ns 5 - 12 - - - - - ns (A > B) IN to (A = B) OUT tPLH, tPHL CL = 50pF CL = 15pF 4.5 - - 31 - 39 - 47 ns 5 - 13 - - - - - ns Output Transition Times (Figure 1) tTLH, tTHL CL = 50pF 4.5 - - 15 - 19 - 22 ns 5 - 26 - - - - - pF - - - 10 - 10 - 10 pF Power Dissipation Capacitance (Notes 4, 5) CPD Input Capacitance CIN - NOTES: 4. CPD is used to determine the dynamic power consumption, per gate/package. 5. PD = VCC2 fi (CPD + CL) where fi = Input Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tr = 6ns tf = 6ns 90% 50% 10% INPUT GND tTLH GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL tPHL tf = 6ns tr = 6ns VCC tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 2. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 5 CD74HC85, CD74HCT85 Test Circuits and Waveforms GND VCC GND LEAST SIGNIFICANT 4-BITS OF EACH WORD A0 A1 A2 A3 B0 B1 B2 B3 (A > B) IN (A = B) IN (A < B) IN A0 A1 CD74HC85 A2 CD74HCT85 A3 B0 B1 B2 B3 (A > B) IN (A = B) IN (A < B) IN A4 A5 A6 A7 B4 B5 B6 B7 MOST SIGNIFICANT 4-BITS OF EACH WORD A4 A5 A6 A7 B4 B5 B6 B7 A0 A1 A2 A3 B0 B1 B2 B3 CD74HC85 CD74HCT85 (A > B) OUT (A = B) OUT (A < B) OUT (A > B) IN (A = B) IN (A < B) IN A0 A1 A2 A3 B0 B1 B2 B3 FIGURE 3. SERIES CASCADING - COMPARING 12-BIT WORDS 6 CD74HC85 CD74HCT85 (A > B) OUT (A = B) OUT (A < B) OUT OUTPUTS Test Circuits and Waveforms B1 A1 B0 A0 GND VCC GND CD74HC85 B3 CD74HCT85 A3 B2 A2 (A < B) OUT B1 (A = B) OUT A1 (A > B) OUT B0 A0 (A < B) IN (A = B) IN (A > B) IN B6 A6 B5 A5 B4 A4 B3 A3 B2 GND A2 CD74HC85 B3 CD74HCT85 A3 B2 A2 (A < B) OUT B1 (A = B) OUT A1 (A > B) OUT B0 A0 (A < B) IN (A = B) IN (A > B) IN B11 A11 B10 A10 B9 A9 B8 A8 B7 GND A7 CD74HC85 B3 CD74HCT85 A3 B2 A2 (A < B) OUT B1 (A = B) OUT A1 (A > B) OUT B0 A0 (A < B) IN (A = B) IN (A > B) IN NC NC OUTPUTS B3 CD74HC85 CD74HCT85 A3 B2 A2 (A > B) OUT B1 (A = B) OUT A1 (A < B) OUT B0 A0 (A < B) IN (A = B) IN (A > B) IN FIGURE 4. PARALLEL CASCADING - COMPARING 12-BIT WORDS 7 OUTPUTS IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. 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