OKI MR27V6402G

FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
4M–Word × 16–Bit or 8M–Word × 8–Bit
Issue Date: Jun. 4, 2003
OTP
GENERAL DESCRIPTION
PIN CONFIGURATION (TOP VIEW)
The MR27V6402G is a 64 Mbit electrically One Time
Programmable Read-Only Memory that can be electrically
switched between 4,194,304-word × 16-bit and
8,388,608-word × 8-bit by the state of the BYTE# pin. The
MR27V6402G supports high speed asynchronous read
operation using a single 3.3V power supply.
FEATURES
· 4,194,304-word × 16-bit / 8,388,608-word × 8-bit electrically
switchable configuration
· +3.0 V to 3.6 V power supply
· Access time
80 ns MAX
· Operating current
20 mA MAX (5MHz)
· Standby current
10 µA MAX
· Input/Output TTL compatible
· Three-state output
A21
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
VSS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
44
2
43
3
42
4
41
5
40
6
39
7
38
8
37
9
36
10
35
11
34
12
33
13
32
14
31
15
30
16
29
17
28
18
27
19
26
20
25
21
24
22
23
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#/VPP
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
44SOP,
44TSOP(Type-II)
PACKAGES
· MR27V6402GMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27V6402GTP
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K)
· MR27V6402GTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
1
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
NC
NC
A21
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
A16
BYTE#/VPP
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
VSS
CE#
A0
48TSOP(Type-I)
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
BLOCK DIAGRAM
A–1
× 8/× 16 Switch
BYTE#/VPP
CE
OE
PGM
Row Decoder
OE#
Memory Cell Matrix
4M × 16-Bit or 8M × 8-Bit
Column Decoder
Address Buffer
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
CE#
Multiplexer
Output Buffer
D0
D2
D1
D4
D3
D6
D5
D8
D7
D10
D9
D12
D11
D14
D13
D15
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
PIN DESCRIPTIONS
Pin name
Functions
D15 / A–1
Data output / Address input
A0 to A21
Address inputs
D0 to D14
Data outputs
CE#
Chip enable input
OE#
Output enable input
BYTE#/VPP
Mode switch/Program power supply voltage
VCC
Power supply voltage
VSS
Ground
NC
No connect
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
FUNCTION TABLE
Mode
CE#
OE#
BYTE#/VPP
Read (16-Bit)
L
L
H
Read (8-Bit)
L
L
Output disable
L
∗
Program
L
H
Program inhibit
H
H
Program verify
H
L
D0 to D7
D8 to D14
D15/A–1
DOUT
L
3.0 V
H
H
H
Standby
VCC
DOUT
Hi–Z
to
L
L/H
Hi–Z
∗
3.6 V
H
Hi–Z
L
∗
DIN
VCC
VPP
Hi–Z
DOUT
∗: Don’t Care (H or L)
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Operating temperature under bias
Ta
Storage temperature
Condition
—
Tstg
Value
Unit
0 to 70
°C
–55 to 125
°C
Input voltage
VI
–0.5 to VCC+0.5
V
Output voltage
VO
–0.5 to VCC+0.5
V
Power supply voltage
VCC
–0.5 to 5
V
Program power supply voltage
VPP
Power dissipation per package
PD
relative to VSS
–0.5 to 11.5
V
1.0
W
—
RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
VCC power supply voltage
VCC
3.0
—
3.6
V
VPP power supply voltage
VPP
–0.5
—
VCC+0.5
V
Input “H” level
VIH
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
–0.5∗∗
—
0.6
V
VCC = 3.0 to 3.6 V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
PIN CAPACITANCE
(VCC = 3.3 V, Ta = 25°C, f = 1 MHz)
Parameter
Symbol
Input
CIN1
BYTE#/VPP
CIN2
Output
COUT
Condition
VI = 0 V
VO = 0 V
Min.
Typ.
Max.
—
—
8
—
—
200
—
—
10
Unit
pF
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OKI Semiconductor
MR27V6402G
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Input leakage current
Parameter
ILI
VI = 0 to VCC
—
—
10
µA
Output leakage current
ILO
VO = 0 to VCC
—
—
10
µA
VCC power supply current
ICCSC
CE# = VCC
—
—
10
µA
(Standby)
ICCST
CE# = VIH
—
—
1
mA
—
—
20
mA
—
—
10
µA
VCC power supply current
(Read)
CE# = VIL, OE# = VIH
ICCA
f=5MHz
VPP power supply current
IPP
VPP = VCC
Input “H” level
VIH
—
2.2
—
VCC+0.5∗
V
Input “L” level
VIL
—
–0.5∗∗
—
0.6
V
Output “H” level
VOH
IOH = –2mA
2.4
—
—
V
Output “L” level
VOL
IOL = 4mA
—
—
0.4
V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns.
AC Characteristics
(VCC = 3.3 V ± 0.3 V, Ta = 0 to 70°C)
Parameter
Symbol
Condition
Min.
Max.
Unit
tC
—
80
—
ns
tACC
CE# = OE# = VIL
—
80
ns
CE# access time
tCE
OE# = VIL
—
80
ns
OE# access time
tOE
CE# = VIL
—
30
ns
Address cycle time
Address access time
Output disable time
Output hold time
tCHZ
OE# = VIL
0
20
ns
tOHZ
CE# = VIL
0
20
ns
tOH
CE# = OE# = VIL
0
—
ns
Measurement conditions
Input signal level --------------------------------------0 V/3 V
Input timing reference level-------------------------1/2Vcc
Output load ---------------------------------------------50 pF
Output timing reference level-------------------- 1/2Vcc
Output load
Output
50 pF
(Including scope and jig)
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
TIMING CHART (READ CYCLE)
16-BIT READ MODE (BYTE# = VIH)
tC
tC
A0 to A21
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D15
Valid Data
Hi-Z
Valid Data
Hi-Z
8-BIT READ MODE (BYTE# = VIL)
tC
tC
A-1 to A21
tOH
tACC
tCE
CE#
tOE
tCHZ
tOH
OE#
tOHZ
tACC
D0 to D7
Hi-Z
Valid Data
Valid Data
Hi-Z
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION)
DC CHARACTERISTICS
(Ta = 25°C ± 5°C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
ILI
VI = VCC+0.5 V
—
—
10
µA
VPP power supply current (Program)
IPP2
CE# = VIL
—
—
50
mA
VCC power supply current
ICC
—
—
—
50
mA
Input “H” level
VIH
—
VCC-0.5
—
VCC+0.5
V
Input leakage current
Input “L” level
VIL
—
–0.5
—
0.8
V
Output “H” level
VOH
IOH = –400 µA
2.4
—
—
V
Output “L” level
VOL
IOL = 2.1 mA
—
—
0.45
V
Program voltage
VPP
—
8.0
8.2
8.4
V
VCC power supply voltage
VCC
—
3.9
4.0
4.1
V
Voltage is relative to VSS.
AC CHARACTERISTICS
(VCC = 4.0 V ± 0.1 V, BYTE#/VPP = 8.2 V ± 0.25 V, Ta = 25°C ± 5°C)
Symbol
Condition
Min.
Typ.
Max.
Unit
Address set-up time
Parameter
tAS
—
100
—
—
ns
OE# set-up time
tOES
—
2
—
—
µs
Data set-up time
tDS
—
100
—
—
ns
Address hold time
tAH
—
2
—
—
µs
Data hold time
tDH
—
100
—
—
ns
Output float delay time from OE#
tOHZ
—
0
—
100
ns
VPP voltage set-up time
tVS
—
2
—
—
µs
Program pulse width
tPW
—
7
8
9
µs
Data valid from OE#
tOE
—
—
—
100
ns
Address hold from OE# high
tAOH
—
0
—
—
ns
Pin Check Function
Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer.
Setting up address as following condition call the preprogrammed codes on device outputs.
(VCC = 3.0 V ± 0.1 V, CE# = VIL, OE# = VIL, BYTE#/VPP = VIH, Ta = 25°C ± 5°C)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21
0
1
0
1
0
1
0
1
0
VH
0
1
0
1
0
1
0
0
1
1
0
0
FF00
1
0
1
0
1
0
1
0
1
VH
1
0
1
0
1
0
1
1
0
0
1
1
00FF
Other conditions
DATA
FFFF
∗: VH = 7 V ± 0.25 V
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OKI Semiconductor
MR27V6402G
Consecutive Programming Waveforms
A0 to A21
tAS
tAH
CE#
tPW
High
OE#
tDH
tDS
Din
D0 to D15
Din
tVS
BYTE#/Vpp
Consecutive Program Verify Waveforms
A0 to A21
High
CE#
tACC
tAHO
OE#
tOE
D0 to D15
BYTE#/Vpp
tOHZ
Dout
Dout
8.2 V
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OKI Semiconductor
MR27V6402G
Program and Program Verify Cycle Waveforms
A0 to A21
tAS
tAHO
CE#
tPW
tOES
OE#
tOHZ
D0 to D15
BYTE#/Vpp
tDH
tDS
tOE
tOHZ
Dout
Din
8.2 V
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
Programming Flow Chart
Start
Address = First Location
VCC = 4.0 V
VPP = 8.2 V
Program 10 µs
Increment Address
NO
Last Address?
YES
Address = First Location
VCC = 4.0 V/VPP = 4.0V
Read(One Word)
NG
PASS
Increment Address
NO
Last Address?
YES
Address = First Location
VCC = 2.5 V/VPP = 2.5V
Read(One Word)
NG
PASS
Increment Address
NO
Last Address?
YES
Device Passed
Device Failed
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MR27V6402G
PACKAGE DIMENSIONS
(Unit: mm)
SOP44-P-600-1.27-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
2.10 TYP.
4/Dec. 5, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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OKI Semiconductor
MR27V6402G
(Unit: mm)
TSOP(2)44-P-400-0.80-K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.54 TYP.
3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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OKI Semiconductor
MR27V6402G
(Unit: mm)
TSOP(1)48-P-1220-0.50-1K
Mirror finish
5
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.55 TYP.
1/Dec. 2, 1999
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
REVISION HISTORY
Document
No.
FEDR27V6402G-01-01
FEDR27V6402G-01-02
Page
Date
Apr., 2003
Jun 4, 2003
Previous
Edition
Current
Edition
–
–
1
1
1, 4
1, 4
4
4
Description
Final edition 1
Change 48TSOP(1) package code to
–1K
Unify ICCA condition into f=5MHz
Change tCHZ, tOHZ to 20ns
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FEDR27V6402G-01-02
OKI Semiconductor
MR27V6402G
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party’s right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2003 Oki Electric Industry Co., Ltd.
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