E2D0049-39-21 This version: Feb. 1999 MSA180 Previous version: May. 1997 ¡ Semiconductor MSA180 ¡ Semiconductor Piezo Speaker Amplifier GENERAL DESCRIPTION The MSA180 is a piezo speaker driver for OKI's speech synthesizers. Its voltage gain can be adjusted by a factor of up to 10. The differential output provides an amplitude of twice the voltage supply. A separate output connects to the base of an external transistor for controlling system voltage. A standby function eliminates power loss when no input signal is present. FEATURES • Power supply voltage : 2.0 V to 6.0 V (single supply voltage) • Low current consumption : 4.2 mA typ (VCC=3 V, no load) • Standby current : <1 mA • Differential output : Twice the supply voltage (maximum output amplitube) • Package options : 8-pin plastic DIP (DIP8-P-300-2.54) (Product name: MSA180RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name: MSA180MS-K) Chip BLOCK DIAGRAM VCC VCC MODE1 MODE2 BASE VCC 2.2 kW Logic + SP AV=20 – 1.3 kW + AIN AV=20 – 18 kW GND 6.6 kW SP 6.6 kW 1/16 ¡ Semiconductor MSA180 PIN CONFIGURATION (TOP VIEW) MODE2 1 8 MODE1 AIN 2 7 BASE GND 3 6 VCC SP 4 5 SP 8-Pin Plastic DIP or 8-Pin Plastic SOP PIN DESCRIPTIONS Pin Symbol Type Description 6 VCC — Power supply pin. 3 GND — Ground pin. 2 AIN I Voice signal input pin. This pin switches the device between operation and standby modes. 8 MODE1 I The IC is in operation mode if VIH > 1.0 V on the MODE1 pin and is in standby mode if VIL < 0.3 V on the MODE1 pin. When MODE1 is used, MODE2 must be connected to VCC. This pin switches the device between operation and standby modes. 1 MODE2 I The IC is in operation mode if VIL < VCC–1.0 V on MODE1 pin and is in standby mode if VIH > VCC–0.3 V on MODE1 pin. When MODE2 is used MODE1 must be connected to GND. This pin is connected to the base of an external transistor. If an 7 BASE O external transistor is not used to control system voltage, this pin must be left open. 4 SP O 5 SP O This is a speaker output pin that provides signals with the same phase as the input. This is a speaker output pin that provides signals with an inverted phase to the input. 2/16 ¡ Semiconductor MSA180 ABSOLUTE MAXIMUM RATINGS (Ta=25°C unless otherwise specified) Parameter Power Supply Voltage Symbol Condition Rating Unit VCC — –0.3 to +6.5 V Remarks — AIN Input Voltage MODE1 VIN — –0.3 to VCC+0.3 V IOMAX VCC=3 V ±80 mA PD Ta=25°C 400 mW DIP type 340 mW SOP type Junction Temperature TjMAX — 110 °C Chip Storage Temperature TSTG — –55 to +150 °C — MODE2 BASE Maximum Output Current Power Dissipation SP, SP RECOMMENDED OPERATING CONDITIONS Parameter Symbol Condition Min. Max. Unit Power Supply Voltage VCC — 2.0 6.0 V Load Impedance ZL — 200 — W Peak Load Current "H" Input Voltage "L" Input Voltage Operating Temperature IO-P — — ±30 mA VIH1 Applied to MODE1 pin 1.0 — V VIH2 Applied to MODE2 pin VCC–0.3 — V VIL1 Applied to MODE1 pin — 0.3 V VIL2 Applied to MODE2 pin — VCC–1.0 V Top — –40 +85 °C 3/16 ¡ Semiconductor MSA180 ELECTRICAL CHARACTERISTICS (Ta=25°C, VCC=2 V to 6 V unless otherwise specified) Parameter Voltage Gain AIN Input Resistance Symbol Condition Min. Typ. Max. Unit AV1 AINÆSP 4.25 5 5.75 V/V AV2 AINÆSP 4.25 5 5.75 V/V AV3 AINÆ(SP-SP) 8.5 10 11.5 V/V RIN — 17.2 24.6 32.0 kW Output DC Voltage *1 VO No signal Output DC Offset Voltage *2 DVO SP-SP VCC=2 V 0.7 1.0 1.3 V VCC=6 V 2.5 3.5 4.6 V VCC=2 V — — 0.2 V VCC=6 V — — 0.6 V SP, SP Output "H" Voltage VOH IOUT=–10 mA VCC–0.25 — — V SP, SP Output "L" Voltage VOL IOUT=10 mA — — 0.25 V — 4.2 6.2 mA — — 1 µA VCC=3 V ZL=• Operating Current ICC BASE=Open MODE1=MODE2=GND or MODE1=MODE2=VCC AIN=Open Circuit Current in Standby Mode ICCS MODE1=GND MODE2=VCC AIN Input DC Bias Voltage *3 VAIN VCC=2 V 0.18 0.26 0.34 V VCC=6 V 0.52 0.74 0.96 V MODE1=VCC — — 160 µA MODE1 "H" Input Current IIH1 MODE2 "H" Input Current IIH2 MODE2=VCC — — 1 µA MODE1 "L" Input Current IIL1 MODE1=GND –1 — — µA MODE2 "L" Input Current IIL2 MODE2=GND –160 — — µA 0.4 — — mA 1.6 — — mA IBO1 Base Output Current IBO2 VCC=2 V BASE=VCC VCC=6 V BASE=VCC *1 Typical value is VO = VCC ¥ 0.625 – 0.25. *2 Maximum value is DVO = VCC ¥ 0.1. *3 Typical value is VAIN = VCC ¥ 0.12 + 0.02. 4/16 ¡ Semiconductor MSA180 APPLICATION CIRCUITS How to Adjust Gain Gain control adjustment of the input signal level is shown below. When using OKI's speech synthesizer devices, insert a diode in series with the variable resistor to reduce pop noise. VDD Signal BASE R1 100 kW C1 0.1 mF VCC AIN PIEZO SPEAKER SP MODE2 MSA180 SP MODE1 GND The circuit below also implements gain adjustment for a higher impedance signal source. VDD BASE C1 0.1 mF AIN Signal R1 20 kW VCC PIEZO SPEAKER SP MODE2 MSA180 MODE1 GND SP 5/16 ¡ Semiconductor MSA180 How to Connect the Piezo Speaker To achieve the full gain level of 10 V, even at a low supply voltage (VCC=3 V), connect a coil in series with the piezo speaker. VDD BASE MODE2 AIN COIL VCC SP MSA180 PIEZO SPEAKER SP MODE1 GND The resonance frequency that occurs in the circuit containing the coil and the piezo speaker is : fQ = 1 [Hz] 2p CL ¥ LL Where CL is the piezo capacitance and LL the coil inductance. For instance, if the piezo capacitance is 0.1 mF and fQ is in a range of 2 to 3 kHz, then the coil inductance should be 30 mH. 6/16 ¡ Semiconductor MSA180 Application Example for Circuits Containing the MSM6378A/MSM6379 Speech Synthesizers This example shows how to connect the MSA180 with an MSM6378A or MSM6379 speech synthesizer using an external transistor and the MODE1 pin. The analog output of both synthesizers lowers to 0 V in their standby mode. For this reason, the voice signal can be used to control operation and standby modes of the MSA180. The circuit also controls the voltage via an external transistor. If this function is not used, leave the BASE pin open. START SWITCH VDD VDD MSM6378A or MSM6379 AOUT BASE R2 R1 C1 GND C2 VCC AIN PIEZO SPEAKER SP MODE2 MSA180 MODE1 GND SP Operation Flow 1. When the start switch is pressed, power is supplied to the VDD pins on the MSM6378A or MSM6379, and operation mode is invoked. Voice output level then rises. 2. When operation mode is involved, the voice signal rises above the GND level, and MODE1 on MSA180 goes high (H). 3. The BASE pin on MSA180 goes low (L) to drive the external transistor for power-supply control. 4. The audio IC continues to operate using the external transistor as a power supply. The device continues to operate and voice sounds, even if the start switch is released at this time. 5. When the sound ends, MODE1 on MSA180 falls low (L), the voice signal falls to GND level, and standby mode ensues. 6. The external transistor for power-supply control is switched off, switching the voice synthesizer off because the power supply is switched off. 7/16 ¡ Semiconductor MSA180 Supplemental Information When Using a Voice Signal on the MODE1 Pin When using the voice signal on MODE1, as in the circuit below, care must be taken regarding the voice input level. Application of the voice signal below VIH1level to the MODE1 pin causes the MSA180 to switch into standby mode, interrupting the voice reproduction flow, and causing undesired noises. VDD Signal BASE VCC R1 C1 AIN PIEZO SPEAKER SP MODE2 MSA180 SP MODE1 GND When using a voice signal lower than VIH, refer to the circuit below. With a low-pass filter consisting of R2 and C2, voice levels lower than VIH1 are passed through. However, select values for R2 and C2 such that the input voltage on MODE1 is greater than VIH2. VDD Signal BASE R2 VCC R1 C1 AIN MSA180 MODE1 GND C2 PIEZO SPEAKER SP MODE2 SP The cutoff frequency of the low-pass filter is calculated as follows: fC = 1 [Hz] 2p ¥ R2 ¥ C2 For instance, if the cutoff frequency is 50 Hz, C2 is 0.1 mF and R2 is 30 kW. For a lower cutoff frequency, use a larger value for C2 or R2. 8/16 ¡ Semiconductor MSA180 Application Example for Circuits Containing MSM6375/MSM6650 Family Speech Synthesizers The example below shows how to connect the MSA180 with the MSM6375 or MSM6650 family speech synthesizers using the synthesizer's BUSY output to control operation and standby mode of the MSA180. As voice output stops, BUSY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180. VDD VDD MSM6650 or MSM6375 GND AOUT BASE MODE2 BUSY R1 C1 AIN VCC PIEZO SPEAKER SP MSA180 MODE1 GND SP Notes: 1. The diode on AOUT reduces pop noise. 2. This circuit makes use of the BUSY output of the speech synthesizer. 3. As the voice reproduction stops, BUSY outputs a "H" level to MODE2, setting the standby function. 4. If MODE2 is used, MODE1 must be connected to GND. 5. Leave the BASE pin open if it is not used. 9/16 ¡ Semiconductor MSA180 Application Example for Circuits Containing the MSM6388/MSM6588 Speech Recorders The example below shows how to connect the MSA180 with the MSM6388 or MSM6588 family speech recording ICs using the recorders' STBY output to control operation and standby mode of the MSA180. As voice output stops, STBY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180. VDD VDD AOUT MSM6388 CS3(STBY) or MSM6588 GND BASE MODE2 R1 C1 AIN VCC PIEZO SPEAKER SP MSA180 MODE1 GND SP Notes: 1. The diode on AOUT reduces pop noise. 2. This circuit makes use of the STBY output of the speech synthesizer. 3. As the voice reproduction stops, STBY outputs a "H" level to MODE2, setting the standby function. 4. If MODE2 is used, MODE1 must be connected to GND. 5. Leave the BASE pin open if it is not used. 10/16 ¡ Semiconductor MSA180 Application Examples for Circuits Containing a Microcontroller or Other Peripheral Devices The circuit below uses a voice signal which rises high in operation mode. The MODE1 pin is used. Be sure to connect the MODE2 pin to VCC pin. VDD Signal BASE VCC C1 AIN R1 MSA180 SP MODE1 GND Control Signal Input PIEZO SPEAKER SP MODE2 Note: If the BASE pin is not used, leave it open. In the circuit below, the signal falls low in operation mode. The MODE2 pin is used. Be sure to connect the MODE1 pin to the GND pin. VDD Control Signal Input BASE Signal VCC R1 C1 AIN PIEZO SPEAKER SP MODE2 MSA180 MODE1 GND SP Note: If the BASE pin is not used, leave it open. 11/16 ¡ Semiconductor MSA180 OPERATING CHARACTERISTICS Power Supply Voltage vs. No-Load Circuit Current 14 No-load circuit current [mA] No-load circuit current [mA] 14 12 10 8 6 4 2 0 2 3 4 5 Power supply [V] No-Load Circuit Current vs. Temperature Characteristic 12 VCC=6 V 10 8 VCC=3 V 6 VCC=2 V 4 2 0 –50 6 Output "H" voltage VCC–VOH [V] Output "H" voltage VCC–VOH [V] VCC=6 V –0.5 VCC=2 V –1 VCC=3 V –1.5 –2 0 10 20 30 40 50 Output current [mA] 0 Ta=–40°C –1.5 0 Output "L" voltage VOL [V] Output "L" voltage VOL [V] 1 VCC=2 V VCC=3 V 0.5 0 VCC=6 V 0 10 20 30 40 50 Output current [mA] 60 10 20 30 40 50 Output current [mA] 60 Output "L" Voltage vs. Temperature Characteristic 2 1.5 100 Ta=25°C –1 Output "L" Voltage Characteristic 2 75 Ta=85°C VCC=3 V –0.5 –2 60 0 25 50 Temperature [°C] Output "H" Voltage vs. Temperature Characteristic Output "H" Voltage Characteristic 0 –25 1.5 VCC=3 V 1 Ta=25°C Ta=–40°C 0.5 0 0 10 Ta=85°C 20 30 40 50 Output current [mA] 60 12/16 6 Ta=85°C 5 Ta=25°C Ta=–40°C 4 2 3 4 5 Power Supply Voltage [V] 100 VCC=6 V 60 40 20 0 0 1 7 6 VCC=3 V 2 3 4 5 MODE1 input voltage [V] 6 VCC=6 V 5 VCC=2 V 4 –25 0 25 50 Temperature [°C] 75 100 MODE2 Input Voltage vs. Input Current 20 80 –20 Voltage Gain vs. Temperature Characteristics 3 –50 6 MODE1 Input voltage vs. Input Current 120 MODE1 input current [µA] Voltage gain, AV1 [Magnification] Power Supply Voltage vs. Voltage Gain 7 3 BASE pin output current [mA] MSA180 MODE2 input current [µA] Voltage gain, AV1 [Magnification] ¡ Semiconductor 0 –20 VCC=2 V –40 VCC=3 V –60 –80 –100 –120 VCC=6 V 0 1 2 3 4 5 MODE2 input voltage [V] 6 BASE Pin Output Current vs. Temperature Characteristic 3 Ta=85°C VCC=6 V 2.5 Ta=25°C 2 1.5 1 Ta=–40°C 0.5 0 0 1 2 3 4 BASE voltage [V] 5 6 13/16 ¡ Semiconductor MSA180 PAD CONFIGURATION • Chip Layout Chip size Chip thickness Pad size Board potential : : : : 2.00 mm ¥ 2.00 mm 350 µm ± 30 µm 110 µm ¥ 110 µm GND potential Y-axis 2 1 8 7 X-axis 3 4 5 6 Pad Coordinates (Chip center: X=0, Y=0) Pad Pad name X-coordinate [mm] Y-coordinate [mm] 1 MODE2 –655 835 2 AIN –835 835 3 GND –835 –835 4 SP –185 –789 5 SP 121 –789 6 VCC 815 –835 7 BASE 793 835 8 MODE1 613 835 14/16 ¡ Semiconductor MSA180 PACKAGE DIMENSIONS (Unit : mm) DIP8-P-300-2.54 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.46 TYP. 15/16 ¡ Semiconductor MSA180 (Unit : mm) SOP8-P-250-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 16/16 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. Printed in Japan