OKI MSM5416262

E2L0018-17-Y1
¡ Semiconductor
MSM5416262
¡ Semiconductor
This version:
Jan. 1998
MSM5416262
Previous version: Dec. 1996
262,144-Word ¥ 16-Bit Multiport DRAM
DESCRIPTION
The MSM5416262 is a 4-Mbit CMOS multiport DRAM composed of a 262,144-word by 16-bit
dynamic RAM, and a 512-word by 16-bit SAM. Its RAM and SAM operate independently and
asynchronously.
It supports three types of operations: random access to RAM port, high speed serial access to
SAM port, and bidirectional transfer of data between any selected row in the RAM port and the
SAM port. In addition to the conventional multiport DRAM operating modes, the MSM5416262
features block write, flash write functions on the RAM port and a split data transfer capability
on the SAM port. The SAM port requires no refresh operation because it uses static CMOS flipflops.
FEATURES
• Single power supply: 5 V ±10%
• RAS only refresh
• Full TTL compatibility
• CAS before RAS refresh
• Multiport organization
• Hidden refresh
RAM : 256K word ¥ 16 bits
• Serial read/write
SAM : 512 word ¥ 16 bits
• 512 tap location
• Fast page mode
• Bidirectional data transfer
• Write per bit
• Split transfer
• Byte write
• Masked write transfer
• Masked flash write
• Refresh: 512 cycles/8 ms
• Masked block write (4 ¥ 4 ¥ 4)
• Package:
64-pin 525 mil plastic SSOP (SSOP64-P-525-0.80-K) (Product : MSM5416262-xxGS-K)
xx indicates speed rank.
PRODUCT FAMILY
Family
Access Time
Cycle Time
Power Dissipation
RAM
SAM
RAM
SAM
Operating
Standby
MSM5416262-50
50 ns
17 ns
110 ns
20 ns
180 mA
9 mA
MSM5416262-60
60 ns
18 ns
120 ns
22 ns
170 mA
9 mA
MSM5416262-70
70 ns
20 ns
140 ns
22 ns
160 mA
9 mA
1/37
¡ Semiconductor
MSM5416262
PIN CONFIGURATION (TOP VIEW)
VCC
TRG
VSS
SDQ0
DQ0
SDQ1
DQ1
VCC
SDQ2
DQ2
SDQ3
DQ3
VSS
SDQ4
DQ4
SDQ5
DQ5
VCC
SDQ6
DQ6
SDQ7
DQ7
VSS
WEL
WEU
RAS
A8
A7
A6
A5
A4
VCC
1
64
2
63
3
62
4
61
5
60
6
59
7
58
8
57
9
56
10
55
11
54
12
53
13
52
14
51
15
50
16
49
17
48
18
47
19
46
20
45
21
44
22
43
23
42
24
41
25
40
26
39
27
38
28
37
29
36
30
35
31
34
32
33
SC
SE
VSS
SDQ15
DQ15
SDQ14
DQ14
VCC
SDQ13
DQ13
SDQ12
DQ12
VSS
SDQ11
DQ11
SDQ10
DQ10
VCC
SDQ9
DQ9
SDQ8
DQ8
VSS
DSF
NC
CAS
QSF
A0
A1
A2
A3
VSS
64-Pin Plastic SSOP
Pin Name
A0 - A8
Function
Pin Name
Function
Address Input
SC
Serial Clock
DQ0 - DQ15
RAM Inputs/Outputs
SE
SAM Port Enable
SDQ0 - SDQ15
SAM Inputs/Outputs
DSF
Special Function Input
RAS
Row Address Strobe
QSF
Special Function Output
CAS
Column Address Strobe
VCC
Power Supply (5 V)
WEL
Write Enable Lower
VSS
Ground (0 V)
WEU
Write Enable Upper
NC
No Connection
TRG
Transfer/Output Enable
Note:
The same power supply voltage must be provided to every VCC pin, and the same GND
voltage level must be provided to every VSS pin.
2/37
Block Write
Control
Column Mask
Register
Sense Amp.
I/O Control
Color Register
RAM Input
Buffer
Mask Register
A0 - A8
Refresh
Counter
Row Decoder
Row
Address
Buffer
512 ¥ 512 ¥ 16
RAM ARRAY
Gate
Gate
SAM
SAM
Serial Decoder
SAM
Address
Buffer
¡ Semiconductor
Column Decoder
BLOCK DIAGRAM
Column
Address
Buffer
DQ 0 - 15
RAM Output
Buffer
Flash Write
Control
SAM Input
Buffer
RAS
CAS
SDQ 0 - 15
SAM Output
Buffer
Timing
Generator
TRG
WEU / WEL
DSF
SC
SAM Address
Counter
SE
VCC
VSS
3/37
MSM5416262
SAM Stop
Control
QSF
¡ Semiconductor
MSM5416262
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(Note: 1)
Parameter
Symbol
Condition
Rating
Unit
Input Output Voltage
VT
Ta = 25°C
–1.0 to 7.0
V
Output Current
IOS
Ta = 25°C
50
mA
Power Dissipation
PD
Topr
Ta = 25°C
1
W
Operating Temperature
—
0 to 70
°C
Storage Temperature
Tstg
—
–55 to 150
°C
Recommended Operating Conditions
(Ta = 0°C to 70°C) (Note: 2)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Power Supply Voltage
VCC
4.5
5.0
5.5
V
Input High Voltage
VIH
2.4
—
6.5
V
Input Low Voltage
VIL
–1.0
—
0.8
V
Capacitance
(VCC = 5 V ±10%, f = 1 MHz, Ta = 25°C)
Parameter
Input Capacitance
Input/Output Capacitance
Output Capacitance
Note:
Symbol
Min.
Max.
Unit
Ci
—
8
pF
Cio
—
9
pF
Co(QSF)
—
9
pF
This parameter is periodically sampled and is not 100% tested.
DC Characteristics 1
Symbol
Condition
Min.
Max.
Output "H" Level Voltage
Parameter
VOH
IOH = –1 mA
2.4
—
Output "L" Level Voltage
VOL
IOL = 2.1 mA
—
0.4
Input Leakage Current
ILI
All other pins not
–10
10
Unit
V
0 £ VIN £ VCC
mA
under test = 0 V
Output Leakage Current
ILO
0 £ VOUT £ 5.5 V
Output Disable
–10
10
4/37
¡ Semiconductor
MSM5416262
DC Characteristics 2
(VCC = 5 V ±10%, Ta = 0°C to 70°C)
Item (RAM)
Operating Current
(RAS, CAS Cycling, tRC = tRC min.)
Standby Current
(RAS, CAS = VIH)
RAS Only Refresh Current
(RAS Cycling, CAS = VIH, tRC = tRC min.)
Page Mode Current
(RAS = VIL, CAS Cycling, tPC = tPC min.)
CAS before RAS Refresh Current
(RAS Cycling, CAS before RAS, tRC = tRC min.)
Data Transfer Current
(RAS, CAS Cycling, tRC = tRC min.)
Flash Write Current
(RAS, CAS Cycling, tRC = tRC min.)
Block Write Current
(RAS, CAS Cycling, tRC = tRC min.)
-50
-60
-70
SAM
Symbol
Standby
ICC1
140
130
120
3, 4
17
Max. Max. Max.
Active
ICC1A
180
170
160
Standby
ICC2
9
9
9
Unit Note
Active
ICC2A
60
55
55
3, 4
Standby
ICC3
140
130
120
3, 4
Active
ICC3A
180
170
160
17
Standby
ICC4
120
110
100
3, 4
Active
ICC4A
180
170
160
Standby
ICC5
140
130
120
Active
ICC5A
180
170
160
3, 4
Standby
ICC6
140
130
120
3, 4
Active
ICC6A
180
170
160
17
Standby
ICC7
140
130
120
3, 4
Active
ICC7A
180
170
160
3, 4
Standby
ICC8
140
130
120
3, 4
Active
ICC8A
180
170
160
3, 4
mA
18
3, 4
5/37
¡ Semiconductor
MSM5416262
AC Characteristics (1/3)
Parameter
Random Read or Write Cycle Time
Read Modify Write Cycle
Fast Page Mode Cycle Time
Fast Page Mode Read Modify Write Cycle Time
Symbol
-50
-60
-70
Min. Max. Min. Max. Min. Max.
Unit Note
tRC
110
—
120
—
140
—
ns
tRWC
145
—
170
—
185
—
ns
tPC
35
—
40
—
45
—
ns
tPRWC
80
—
85
—
90
—
ns
Access Time from RAS
tRAC
—
50
—
60
—
70
ns
8, 14
Access Time from Column Address
tAA
—
25
—
30
—
35
ns
8, 14
Access Time from CAS
tCAC
—
15
—
18
—
20
ns
8, 15
Access Time from CAS Precharge
tCPA
—
30
—
35
—
40
ns
8, 15
Output Buffer Turn-off Delay
tOFF
0
12
0
15
0
17
ns
10
7
Transition Time (Rise and Fall)
tT
3
35
3
35
3
35
ns
RAS Precharge Time
tRP
40
—
50
—
60
—
ns
RAS Pulse Width
tRAS
50
10k
60
10k
70
10k
ns
RAS Pulse Width (Fast Page Mode Only)
tRASP
50
100k
60
100k
70
100k
ns
RAS Hold Time
tRSH
15
—
15
—
20
—
ns
CAS Hold Time
tCSH
50
—
60
—
70
—
ns
CAS Pulse Width
tCAS
12
10k
15
10k
20
10k
ns
RAS to CAS Delay Time
tRCD
18
35
20
42
20
50
ns
14
RAS to Column Address Delay Time
tRAD
13
25
15
30
15
35
ns
14
Column Address to RAS Lead Time
tRAL
25
—
30
—
35
—
ns
CAS to RAS Precharge Time
tCRP
5
—
5
—
10
—
ns
CAS Precharge Time (Fast Page Mode)
tCP
8
—
10
—
10
—
ns
Row Address Set-up Time
tASR
0
—
0
—
0
—
ns
Row Address Hold Time
tRAH
8
—
10
—
10
—
ns
Column Address Set-up Time
tASC
0
—
0
—
0
—
ns
Column Address Hold Time
tCAH
10
—
10
—
10
—
ns
Column Address Hold Time referenced to RAS
tAR
40
—
50
—
55
—
ns
Read Command Set-up Time
tRCS
0
—
0
—
0
—
ns
Read Command Hold Time
tRCH
0
—
0
—
0
—
ns
11
Read Command Hold Time referenced to RAS
tRRH
0
—
0
—
0
—
ns
11
Write Command Set-up Time
tWCS
0
—
0
—
0
—
ns
13
Write Command Hold Time
tWCH
8
—
10
—
12
—
ns
Write Command Hold Time referenced to RAS
tWCR
40
—
50
—
55
—
ns
Write Command Pulse Width
tWP
8
—
10
—
12
—
ns
Write Command to RAS Lead Time
tRWL
12
—
15
—
20
—
ns
Write Command to CAS Lead Time
tCWL
12
—
15
—
20
—
ns
6/37
¡ Semiconductor
MSM5416262
AC Characteristics (2/3)
Parameter
Symbol
-50
-60
-70
Min. Max. Min. Max. Min. Max.
Unit Note
Data Set-up Time
tDS
0
—
0
—
0
—
ns
12
Data Hold Time
tDH
10
—
10
—
12
—
ns
12
Data Hold Time referenced to RAS
tDHR
40
—
50
—
55
—
ns
RAS to WE Delay Time
tRWD
70
—
80
—
90
—
ns
13
Column Address to WE Delay Time
tAWD
45
—
50
—
55
—
ns
13
CAS to WE Delay Time
tCWD
30
—
35
—
40
—
ns
13
Data to CAS Delay Time
tDZC
0
—
0
—
0
—
ns
Data to TRG Delay Time
tDZO
0
—
0
—
0
—
ns
Access Time from TRG
tOEA
—
15
—
18
—
20
ns
Output Buffer Turn-off Delay from TRG
tOEZ
0
12
0
15
0
17
ns
TRG Command Hold Time
tOEH
8
—
10
—
10
—
ns
RAS Hold Time referenced to TRG
tROH
10
—
10
—
15
—
ns
CAS Set-up Time for CAS before RAS Cycle
tCSR
8
—
10
—
10
—
ns
CAS Hold Time for CAS before RAS Cycle
tCHR
8
—
10
—
10
—
ns
RAS Precharge to CAS Active Time
tRPC
0
—
0
—
0
—
ns
Refresh Period
tREF
—
8
—
8
—
8
ms
WE Set-up Time
tWSR
0
—
0
—
0
—
ns
WE Hold Time
tRWH
10
—
10
—
10
—
ns
DSF Set-up Time referenced to RAS
tFSR
0
—
0
—
0
—
ns
DSF Hold Time referenced to RAS (1)
tRFH
10
—
10
—
10
—
ns
DSF Hold Time referenced to RAS (2)
tFHR
40
—
50
—
55
—
ns
DSF Set-up Time referenced to CAS
tFSC
0
—
0
—
0
—
ns
DSF Hold Time referenced to CAS
tCFH
10
—
10
—
10
—
ns
Write Per Bit Mask Data Set-up Time
tMS
0
—
0
—
0
—
ns
Write Per Bit Mask Data Hold Time
tMH
10
—
10
—
10
—
ns
TRG High Set-up Time
tTHS
0
—
0
—
0
—
ns
TRG High Hold Time
tTHH
10
—
10
—
10
—
ns
TRG Low Set-up Time
tTLS
0
—
0
—
0
—
ns
TRG Low Hold Time
tTLH
10
10k
10
10k
10
10k
ns
TRG Low Hold Time referenced to RAS
tRTH
40
10k
50
10k
60
10k
ns
TRG Low Hold Time referenced to Column Address
tATH
20
—
20
—
25
—
ns
TRG Low Hold Time referenced to CAS
tCTH
15
—
15
—
20
—
ns
TRG to RAS Precharge Time
tTRP
40
—
50
—
60
—
ns
TRG Precharge Time
tTP
15
—
20
—
20
—
ns
RAS to First SC Delay Time (Read Transfer)
tRSD
50
—
60
—
70
—
ns
Column Address to First SC Delay Time
tASD
35
—
40
—
45
—
ns
CAS to First SC Delay Time (Read Transfer)
tCSD
20
—
20
—
20
—
ns
Last SC to TRG Lead Time
tTSL
5
—
5
—
5
—
ns
7/37
¡ Semiconductor
MSM5416262
AC Characteristics (3/3)
Parameter
Symbol
-50
-60
-70
Min. Max. Min. Max. Min. Max.
Unit Note
TRG to First SC Delay Time (Read Transfer)
tTSD
15
—
15
—
15
—
ns
Last SC to RAS Set-up Time (Serial Input)
tSRS
20
—
20
—
25
—
ns
Serial Output Buffer Turn-off Delay from RAS
tSDZ
10
30
10
30
10
40
ns
SC Cycle Time
tSCC
20
—
22
—
22
—
ns
10
SC Pulse Width (SC High Time)
tSC
5
—
5
—
5
—
ns
SC Precharge Time (SC Low Time)
tSCP
5
—
5
—
5
—
ns
Access Time from SC
tSCA
—
17
—
18
—
20
ns
9
Serial Output Hold Time from SC
tSOH
5
—
5
—
5
—
ns
19
Access Time from SE
tSEA
—
17
—
18
—
20
ns
9
SE Pulse Width
tSE
10
—
10
—
10
—
ns
SE Precharge Time
tSEP
10
—
10
—
10
—
ns
Serial Output Buffer Turn-off Delay from SE
tSEZ
0
14
0
15
0
17
ns
Split Transfer Set-up Time
tSTS
25
—
25
—
25
—
ns
Split Transfer Hold Time
tSTH
25
—
25
—
25
—
ns
SC-QSF Delay Time
tSQD
—
25
—
25
—
25
ns
TRG-QSF Delay Time
tTQD
—
25
—
25
—
25
ns
CAS-QSF Delay Time
tCQD
—
30
—
30
—
35
ns
RAS-QSF Delay Time
tRQD
—
70
—
70
—
75
ns
RAS to Serial Input Delay Time
tSDD
30
—
30
—
40
—
ns
Serial Input Set-up Time
tSDS
0
—
0
—
0
—
ns
Serial Input Hold Time
tSDH
8
—
10
—
10
—
ns
Serial Input to SE Delay Time
tSZE
0
—
0
—
0
—
ns
Serial Input to First SC Delay Time
tSZS
0
—
0
—
0
—
ns
Serial Write Enable Set-up Time
tSWS
0
—
0
—
0
—
ns
Serial Write Enable Hold Time
tSWH
8
—
10
—
10
—
ns
Serial Write Disable Set-up Time
tSWIS
0
—
0
—
0
—
ns
Serial Write Disable Hold Time
tSWIH
8
—
10
—
10
—
ns
10
8/37
¡ Semiconductor
Notes:
MSM5416262
1. Exposure beyond the "Absolute Maximum Ratings" may cause permanent damage
to the device.
2. All voltages are referenced to VSS.
3. These parameters depend on the cycle rate.
4. These parameters depend on output loading. Specified values are obtained with the
output open.
5. An initial pause of 200 ms is required after power up followed by any 8 RAS cycles
(TRG = "high") and any 8 SC cycles before proper device operation is achieved.
In the case of using an internal refresh counter, a minimum of 8 CAS before RAS
cycles instead of 8 RAS cycles are required.
6. AC measurements assume tT = 5 ns.
7. VIH (Min.) and VIL (Max.) are reference levels for measuring timing of input signals.
Also, transition times are measured between VIH and VIL.
8. RAM port outputs are measured with a load equivalent to 1 TTL load and 50 pF.
DOUT reference levels : VOH/VOL = 2.0 V/0.8 V.
9. SAM port outputs are measured with a load equivalent to 1 TTL load and 30 pF.
DOUT reference levels : VOH/VOL = 2.0 V/0.8 V.
10. tOFF (Max.), tOEZ (Max.), tSDZ (Max.) and tSEZ (Max.) define the time at which the
outputs achieve the open circuit condition, and are not referenced to output voltage
levels. This parameter is sampled and not 100% tested.
11. Either tRCH or tRRH must be satisfied for a read cycle.
12. These parameters are referenced to CAS leading edge of early write cycles, and to
WE leading edge in TRG controlled write cycles and read modify write cycles.
13. tWCS, tRWD, tCWD and tAWD are not restrictive operating parameters.
They are included in the data sheet as electrical characteristics only.
If tWCS ≥ tWCS (Min.), the cycle is an early write cycle, and the data out pin will
remain open circuit throughout the entire cycle; If tRWD ≥ tRWD (Min.), tCWD ≥ tCWD
(Min.) and tAWD ≥ tAWD (Min.), the cycle is a read modify write cycle, and the data
out will contain data read from the selected cell; If neither of the above sets of
conditions are satisfied, the condition of the data out is indeterminate.
14. Operation within the tRCD (Max.) limit ensures that tRAC (Max.) can be met.
tRCD (Max.) is specified as a reference point only: If tRCD is greater than the specified
tRCD (Max.) limit, then access time is controlled by tCAC.
15. Operation within the tRAD (Max.) limit ensures that tRAC (Max.) can be met. tRAD
(Max.) is specified as a reference point only: If tRAD is greater than the specified tRAD
(Max.) limit, then access time is controlled by tAA.
16. Input levels at the AC testing are 3.0 V/0 V.
17. Address (A0 - A8) may be changed two times or less while RAS = VIL.
18. Address (A0 - A8) may be changed once or less while CAS = VIH and RAS = VIL.
19. This is guaranteed by design. (tSOH/tCOH = tSCA/tCAC - output transition time)
This parameter is not 100% tested.
9/37
¡ Semiconductor
MSM5416262
TIMING WAVEFORM
Read Cycle
tRC
tRAS
tRP
RAS
tCSH
tCRP
tRSH
tCAS
tRCD
CAS
,
,
tAR
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
tCAH
Column
tFHR
tFSR
tRFH
tFSC
tCFH
DSF
tRCS
tRCH
WEL
tRRH
tRCS
WEU
tRCH
tRRH
tCAC
tOFF
tAA
tRAC
DQ0 - 7
Open
Valid Data
DQ8 - 15
Open
Valid Data
tROH
tTHS
tTHH
tOEA
tOEZ
TRG
"H" or "L"
10/37
¡ Semiconductor
MSM5416262
Fast Page Mode Read Cycle
tRASP
tRP
,
,,,
RAS
tCSH
tCRP
tPC
tRCD
CAS
tCAS
tCP
tRSH
tCAS
tCP
tAR
tRAD
tASR
Address
tCAS
tRAL
tRAH
tASC
Row
tCAH
tASC
Column
tCAH
tASC
Column
tCAH
Column
tFHR
tFSR
tRFH
tFSC
tCFH
tFSC
tCFH
tFSC
tCFH
DSF
tRCS
tRCS
tRCH
tRCS
tRRH
tRCH
WEL
tRCS
tRCS
tRCH
tRCS
tRCH
tRRH
tRCH
WEU
tCAC
tOFF
tAA
Open
DQ0 - 7
tCAC
Valid Data
Open
Valid Data
tTHS
tTHH
tOEA
Valid Data
tOFF
tOFF
Valid Data
tAA
tCPA
tRAC
tRCH
tOFF
tOFF
Valid Data
tOFF
DQ8 - 15
tCAC
Valid Data
tAA
tCPA
tOEZ
TRG
"H" or "L"
11/37
¡ Semiconductor
MSM5416262
Write Cycle Function Table
RAS Falling Edge
Code
A
C
DSF WEL/U
CAS Falling Edge
D
B
E
Function
DQ
DSF
DQ
RWM
0
0
Write Mask
0
Valid Data
BWM
0
0
Write Mask
1
Column Mask
Masked Block Write
FWM
1
0
Write Mask
X
X
Masked Flash Write
RW
0
1
X
0
Valid Data
BW
0
1
X
1
Column Mask
LCR
1
1
X
1
Color Data
Masked Write
Normal Write
Block Write
Load Color Register
WRITE MASK DATA: "Low" = Mask, "High" = No Mask
Column Mask Data
DQ0 - 15
Column Mask Data
DQ0
Column 0 (A0 = 0, A1 = 0)
DQ1
Column 1 (A0 = 1, A1 = 0)
Low: Mask
DQ2
Column 2 (A0 = 0, A1 = 1)
High: No Mask
DQ3
Column 3 (A0 = 1, A1 = 1)
DQ4
Column 0 (A0 = 0, A1 = 0)
DQ5
Column 1 (A0 = 1, A1 = 0)
Low: Mask
DQ6
Column 2 (A0 = 0, A1 = 1)
High: No Mask
DQ7
Column 3 (A0 = 1, A1 = 1)
DQ8
Column 0 (A0 = 0, A1 = 0)
DQ9
Column 1 (A0 = 1, A1 = 0)
Low: Mask
DQ10
Column 2 (A0 = 0, A1 = 1)
High: No Mask
DQ11
Column 3 (A0 = 1, A1 = 1)
DQ12
Column 0 (A0 = 0, A1 = 0)
DQ13
Column 1 (A0 = 1, A1 = 0)
Low: Mask
DQ14
Column 2 (A0 = 0, A1 = 1)
High: No Mask
DQ15
Column 3 (A0 = 1, A1 = 1)
12/37
¡ Semiconductor
MSM5416262
Early Write Cycle
tRC
tRAS
tRP
RAS
tCSH
,
,
,,
,
,,,,
,,
tCRP
tRSH
tCAS
tRCD
CAS
tAR
tRAD
tASR
Address
tRAH
tRAL
tASC
Row
tCAH
Column
tFHR
tFSR
DSF
tRFH
tFSC
A
tCFH
B
tCWL
tWSR
WEL
tRWL
tRWH
tWP
C
tWCR
tWSR
WEU
tRWH
tWCS
tWCH
C
tMS
DQ0 - 7
tMH
tDHR
tDS
D
tDH
E
tDHR
tMS
DQ8 - 15
tMH
D
tTHS
tDS
tDH
E
tTHH
TRG
"H" or "L"
13/37
¡ Semiconductor
MSM5416262
Late Write Cycle
tRC
tRAS
tRP
RAS
tCSH
,
,
,,
,,
,,
tCRP
tRSH
tRCD
CAS
tCAS
tAR
tRAD
tASR
Address
tRAH
tRAL
tASC
Row
tCAH
Column
tFHR
tFSR
DSF
tRFH
tFSC
A
tCFH
B
tCWL
tWSR
WEL
tRWH
tRWL
tRCS
tWP
C
tWCR
tWSR
WEU
tRWH
tRCS
C
tDHR
tMS
DQ0 - 7
tDS
tMH
D
tDH
E
tDHR
tMS
DQ8 - 15
tMH
D
tTHS
tDS
tDH
E
tOEH
TRG
"H" or "L"
14/37
¡ Semiconductor
MSM5416262
Read Modify Write Cycle
tRWC
tRAS
tRP
RAS
tCSH
,
,
,,
,
,
,,
tCRP
tRSH
tRCD
CAS
tCAS
tAR
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
Column
tAWD
tFHR
tFSR
DSF
tCAH
tFSC
tRFH
A
tCFH
B
tCWL
tWSR
WEL
tRCS
tRWH
tCWD
tRWL
tWP
C
tRWD
tWSR
WEU
tRCS
tRWH
C
tMS
DQ0 - 7
tCAC
tMH
tRAC
tDZC
Valid
Data
D
tMS
DQ8 - 15
tDS
tDH
E
tDS
tMH
Valid
Data
D
tDH
E
tDZO
tTHS
tTHH
tOEA tOEZ
tOEH
TRG
"H" or "L"
15/37
¡ Semiconductor
MSM5416262
,,,
,,,,
Fast Page Mode Early Write Cycle
tRASP
tRP
RAS
tCSH
tCRP
tPC
tCAS
tRCD
CAS
tCP
tCAS
tRSH
tCP
tCAS
tAR
tRAL
tRAD
tASR tRAH
Address
tASC
Row
tCAH
tASC
Column
tCAH
tASC
Column
tCAH
Column
tFHR
tFSR
DSF
tRFH
tFSC tCFH
A
tCFH
tFSC
B
B
tCWL
tCFH
tFSC
B
tCWL
tCWL
tWSR tRWH
tWP
WEL
tWP
tWP
C
tWSR tRWH
WEU
tWCS
tWCH
tWCS
tWCH
tWCS
tWCH
C
tMS
DQ0 - 7
tMH
tDS
D
tMS
DQ8 - 15
tDS
E
tMH
D
tTHS
tDH
tDS
tDS
E
tDH
E
tDH
tDS
E
tDH
E
tDH
tDS
tDH
E
tTHH
TRG
"H" or "L"
16/37
¡ Semiconductor
MSM5416262
,
,,,
,
,
,
Fast Page Mode Read Modify Write Cycle
tRASP
tRP
RAS
tCSH
tCRP
tPRWC
tCAS
tRCD
CAS
tCP
tRSH
tCAS
tCP
tCAS
tAR
tRAL
tRAD
tASR
Address
tRAH
tASC
tCAH
Row
tCAH
tASC
Column
tCAH
tASC
Column
Column
tFHR
tFSR
DSF
tRFH
tFSC tCFH
A
B
tWSR
WEL
tCFH
tFSC
B
tCWL
tAWD
tRWH
tCFH
tFSC
B
tCWL
tAWD
tCWL
tAWD
C
tWP
tWSR
WEU
tRWH
tRCS
tWP
tWP
tCWD
tCWD
tCWD
tCAC
tCAC
tCAC
C
DQ0 - 7
tMH
tMS
tDH
tAA
tDS
tDS
Out
In
Out
In
Out
In
Out
In
Out
In
Out
In
tMH
D
tOEZ
tTHS
tDH
tAA
tDS
D
DQ8 - 15
tDH
tAA
tMS
tTHH
tOEA
tOEZ
tOEA
tOEZ
tOEA
TRG
"H" or "L"
17/37
¡ Semiconductor
MSM5416262
RAS Only Refresh Cycle
tRC
tRAS
tRP
RAS
tCRP
tRPC
,,,,
,
,,,
CAS
tASR
Address
tRAH
Row
tFSR
tRFH
DSF
WEL
WEU
DQ0 - 7
Open
DQ8 - 15
Open
tTHS
tTHH
TRG
"H" or "L"
18/37
¡ Semiconductor
MSM5416262
CAS before RAS Refresh Cycle
tRC
tRP
tRAS
tRP
RAS
,,,,
,,,,
tRPC
CAS
tCSR
tCHR
tRPC
Inhibit Falling Transition
Address
DSF
WEL
WEU
tOFF
Open
DQ0 - 7
tOFF
DQ8 - 15
Open
TRG
"H" or "L"
19/37
¡ Semiconductor
MSM5416262
Hidden Refresh Cycle
tRC
tRAS
tRP
tRAS
RAS
,,
,,
,,
tCRP
tRCD
CAS
tAR
tRAD
tASR
Address
tRSH
tRAH
tCHR
tRAL
tASC
Row
tCAH
Column
tFHR
tFSR
tRFH
tFSC
tCFH
DSF
tRCS
WEL
tRCS
WEU
tRRH
tCAC
tOFF
tAA
DQ0 - 7
Open
Valid Data
DQ8 - 15
Open
Valid Data
tRAC
tTHS
tTHH
tOEA
tOEZ
TRG
"H" or "L"
20/37
¡ Semiconductor
MSM5416262
Read Transfer 1
tRC
tRAS
tRP
RAS
tCSH
tRSH
tCAS
,,
tRCD
CAS
tAR
tRAD
Address
tRAL
tASC
tRAH
tASR
Row
tFSR
tCAH
SAM Start
tRFH
DSF
tWSR tRWH
WEL/U
tASD
tCSD
DQ0 - 15
tRSD
Open
tTRP
tTLS
tTLH
tTP
tSC
tTSD
tSCP
TRG
tSRS
Note 2
SC
tSIS
SDQ0 - 15
tSCA
tSZS
tSIH
tSCA
tSOH
Data Out
Din
tRQD
QSF
tSCC
tSC
tCQD
Note 3
tTQD
Note 3
"H" or "L"
Note 1: SE = "L"
Note 2: There must be no rising transitions
Note 3: QSF = "L"-- Lower SAM (0 - 255) is active
QSF = "H"-- Upper SAM (256 - 511) is active
21/37
¡ Semiconductor
MSM5416262
Read Transfer 2 (Real Time Read Transfer)
tRC
tRAS
tRP
RAS
tCSH
tRSH
tCAS
tRCD
CAS
tAR
tRAD
Address
tRAL
tASC
tRAH
tASR
Row
tFSR
tCAH
SAM Start
tRFH
DSF
tWSR tRWH
WEL/U
tCTH
tATH
DQ0 - 15
Open
tTRP
tTLS
tTP
tRTH
TRG
tSCC
tSCP
tTSL
tSC
tTSD
SC
tSCA
tSOH
SDQ0 - 15
tSCA
tSOH
Data Out
Data Out
Data Out
Data Out
tTQD
QSF
Note 2
Note 2
"H" or "L"
Note 1: SE = "L"
Note 2: QSF = "L"-- Lower SAM (0 - 255) is active
QSF = "H"-- Upper SAM (256 - 511) is active
22/37
¡ Semiconductor
MSM5416262
Split Read Transfer
tRC
tRAS
tRP
RAS
,
,,,
tCSH
tRSH
tCAS
tRCD
CAS
tAR
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
tFSR
tCAH
SAM Start Sj
tRFH
DSF
tWSR tRWH
WEL/U
tCTH
tATH
DQ0 - 15
Open
tRTH
tTLS
tTLH
TRG
tSTS
SC
SDQ0 - 15
255,
511
tSCA
tSOH
Data Out
tSCC
tSCP
tSC
511,
255
Si
Sj
tSCA
tSOH
Data Out
Data Out
Data Out
Data Out
Data Out
"H" or "L"
Note 1: SE = "L"
Note 2: Si is the SAM start address in before SRT
23/37
¡ Semiconductor
MSM5416262
Masked Write Transfer
tRC
tRAS
tRP
RAS
tCSH
tRSH
tCAS
,
tRCD
CAS
tAR
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
tFSR
tCAH
SAM Start
tRFH
DSF
tWSR tRWH
WEL/U
tMS
DQ0 - 15
tCSD
tMH
Open
Mask Data
tRSD
tTLS
tTLH
TRG
tSRS
tSCC
tSCP
tSC
tSC
Note 2
SC
tSDZ
tSDS
tSOH
SDQ0 - 15
Dout
Dout
tSDH
tSDS
Data In
tSDD
tSDH
Data In
tCQD
tRQD
QSF
Note 3
Note 3
"H" or "L"
Note 1: SE = "L"
Note 2: There must be no rising transitions
Note 3: QSF = "L"-- Lower SAM (0 - 255) is active
QSF = "H"-- Upper SAM (256 - 511) is active
24/37
¡ Semiconductor
MSM5416262
Masked Split Write Transfer
tRC
tRAS
tRP
RAS
,
,,,
tCSH
tRSH
tCAS
tRCD
CAS
tAR
tRAD
tASR
Address
tRAL
tASC
tRAH
Row
tFSR
tCAH
SAM Start Sj
tRFH
DSF
tWSR tRWH
WEL/U
tMS
DQ0 - 15
tCTH
tATH
tMH
Mask Data
tTLS
Open
tRTH
tTLH
TRG
tSTS
SC
tSCC
tSCP
tSC
255,
511
tSDS
SDQ0 - 15
Data In
511,
255
Si
tSDH
Data In
tSDS
Sj
tSDH
Data In
Data In
Data In
Data In
"H" or "L"
Note 1: SE = "L"
Note 2: Si is the SAM start address in before SWT
25/37
¡ Semiconductor
MSM5416262
Serial Read Cycle
tSEP
SE
tSCC
tSC
SC
tSCA
tSCP
tSOH
SDQ0 - 15
tSEA
tSEZ
Data Out
Data
tSCA
tSCA
tSOH
tSOH
Data
Data Out
Data Out
,,
Serial Write Cycle
tSEP
SE
tSCC
tSC
SC
tSWH
Data In
tSWIH
tSWS
tSCP
tSDS
SDQ0 - 15
tSWIS
tSDH
Data In
tSZE
tSDS
tSDH
Data In
Data In
"H" or "L"
26/37
¡ Semiconductor
MSM5416262
PIN FUNCTIONS
Address Input: A0 - A8
The 18 address bits decode 16 bits of the 4,194,304 locations in the MSM5416262 memory array.
The address bits are multiplexed to 9 address input pins (A0 - A8) as standard DRAM. 9 row
address bits are latched at the falling edge of RAS. The following 9 column address bits are
latched at the falling edge of CAS.
Row Address Strobe: RAS
RAS is a basic RAM control signal. The RAM port is in standby mode when the RAS level is
"high". As the standard DRAM’s RAS signal function, RAS is the control input that latches the
row address bits, and a random access cycle begins at the falling edge of RAS.
In addition to the conventional RAS signal function, the level of the input signals CAS, TRG,
WEL, WEU and DSF at the falling edge of RAS, determines the MSM5416262 operation mode.
Column Address Strobe: CAS
As the standard DRAM’s CAS signal function, CAS is the control input signal that latches the
column address input, and the state of the special function input DSF to select in conjunction with
the RAS control, either read/write operations or the special block write feature on the RAM port
when the DSF is held "low" at the falling edge of RAS.
CAS also acts as a RAM port output enable signal.
Data Transfer/Output Enable: TRG
TRG is also a control input signal having multiple functions. As the standard DRAM’s OE signal
function, TRG is used as an output enable control when TRG is "high" at the falling edge of RAS.
In addition to the conventional OE signal function, a data transfer operation is started between
the RAM port and the SAM port when TRG is "low" at the falling edge of RAS.
Write Per Bit/Write Enable: WEL and WEU
WEL and WEU are control input signals having multiple functions. As the standard DRAM’s WE
signal function, these are used to write data into the memory on the RAM port when WEL and
WEU are both "high" at the falling edge of RAS.
In addition to the conventional WE signal function, both WEL and WEU determine the write-perbit function, when either WEL or WEU is "low" at the falling edge of RAS during RAM port
operations.
The WEL and WEU also determine the direction of data transfer between the RAM and SAM.
When both WEL and WEU are "high" at the falling edge of RAS, the data is transferred from RAM
to SAM (read transfer). When either WEL or WEU is "low" at the falling edge of RAS, the data
is transferred SAM to RAM (write transfer).
27/37
¡ Semiconductor
MSM5416262
Write Mask Data/Data Input and Output: DQ0 - DQ15
In conventional write-per bit mode, the DQ pins function as mask data at the falling edge of RAS.
Data is written only to high DQ pins. Data on low DQ pins is masked and internal data is retained.
After that, they function as input/output pins similar to a standard DRAM.
Serial Clock: SC
SC is a main serial cycle control input signal. All operations of the SAM port are synchronized
with the serial clock SC. Data is shifted in or out of the SAM registers at the rising edge of SC. In
a serial read cycle, the output data becomes valid on the SDQ pins after the maximum specified
serial access time tSCA from the rising edge of SC.
In a serial write cycle, data on SDQ pins at the rising edge of SC are fetched into the SAM register.
Serial Enable: SE
The SE is a serial access enable control and serial read/write control signal. In a serial read cycle,
SE is used as an output control. In a serial write cycle, SE is used as a write enable control. When
SE is "high", serial access is disabled. However, the serial address pointer location is still
incremented when SC is clocked even when SE is "high".
Special Function Input: DSF
The DSF is latched at the falling edge of RAS and CAS. It allows for the selection of several RAM
ports and transfer operating modes. In addition to the conventional multiport DRAM, the special
functions consisting of flash write, block write, load/read color register, and split read/write
transfer can be invoked.
Special Function Output: QSF
QSF is an output signal, which during split register mode indicates which half of the split SAM
is being accessed. QSF "low" indicates that the lower split SAM (0 - 255) is being accessed. QSF
"high" indicates that the upper SAM (256 - 511) is being accessed.
Serial Input/Output: SDQ0 - SDQ15
Serial input/output mode is determined by the most recent read or write transfer cycle. When
a read transfer cycle is performed, the SAM port is in the output mode. When a write transfer
cycle is performed, the SAM port is switched from output mode to input mode.
28/37
¡ Semiconductor
MSM5416262
OPERATION MODES
Table-1 shows the function truth table for a listing of all available RAM ports, and transfer
operations of the MSM5416262.
The RAM port and data transfer operations are determined by the state of CAS, TRG, WEL, WEU
and DSF at the falling edge of RAS, and by the level of DSF at the falling edge of CAS.
Table-1. Function Truth Table
RASØ
Code
CASØ Address
CAS TRG WE DSF DSF RASØ CASØ RASØ
CBR
0
*
*
*
—
ROR
1
1
*
0
— Row
MWT
1
0
0
0
*
MSWT
1
0
0
1
RT
1
0
1
SRT
1
0
RWM
1
1
*
—
CBR Refresh
—
*
—
—
—
RAS Only Refresh
Row TAP WM1
*
Yes
—
Masked Write Transfer
*
Row TAP WM1
*
Yes
—
0
*
Row TAP
*
*
—
—
Read Transfer
1
1
*
Row TAP
*
*
—
—
Split Read Transfer
0
0
0
Row Column WM1 Din,Dout
Yes
—
Yes
Use
Masked Block Write
Yes
Use
Masked Flash Write
No
—
No
Use
—
Load
Column
0
1
Row
FWM
1
1
0
1
*
Row
RW
1
1
1
0
0
Row Column
1
1
Function
—
0
LCR
Color
Register
*
1
1
/WEØ
Write
Mask
*
1
1
CAS
*
BWM
BW
W/IO
1
1
0
1
1
1
Row
Row
A2c - 8c
*
Column
A2c - 8c
*
WM1
Column
Select
WM1 —
*
*
*
Din,Dout
Column
Select
Color
Data
Masked Split
Write Transfer
Read/Write
(Mask)
Read/Write
(No Mask)
Block Write
(No Mask)
Load Color Register
If the DSF is "high" at the falling edge of RAS, special functions such as split transfer, flash write,
load color register can be invoked.
If the DSF is "low" at the falling edge of RAS and "high" at the falling edge of CAS, the block write
feature can be invoked.
29/37
¡ Semiconductor
MSM5416262
RAM PORT OPERATION
RAM Read Cycle:
RAS falling edge --- TRG = CAS = "H", DSF = "L"
CAS falling edge --- DSF = "L"
Row address is entered at the falling edge of RAS and column address at the falling edge of CAS
to the device as in conventional DRAM. When both WEL and WEU are "high" and TRG is "low"
while CAS is "low", the data outputs through DQ pins.
RAM Write Cycle: RAS falling edge --- TRG = CAS = "H", DSF = "L"
CAS falling edge --- DSF = "L"
1) Write cycle with no mask: RAS falling edge -- WEL = WEU = "H"
If either WEL or WEU is set "low" at the falling edge of CAS after RAS goes "low", a write cycle
is excuted. If either WEL or WEU is set "low" before the CAS falling edge, this cycle becomes an
early write cycle, and all DQ pins attain high impedance.
If either WEL or WEU is "low" when CAS goes "low", the write affects only those corresponding
8 bits with the latched data.
If both WEL and WEU are set "low" after the CAS falling edge, this cycle becomes a late write
cycle, and all 16 data are latched on the falling edge of WEL or WEU.
Byte write occurs if either WEL or WEU falls during the cycle. DQ pins don't achieve high
impedance in this cycle, so data should be entered with TRG in "high".
2) Write cycle with mask: RAS falling edge -- WEL or WEU = "L"
If either WEL or WEU is set "low" at the falling edge of RAS, the mask write mode can be invoked.
Mask data is loaded and used. The mask data on DQ0 - DQ15 is latched into the write mask
register at the falling edge of RAS. When the mask data is low, writing is inhibited into the RAM
and the mask data is high, data is written into the RAM. This mask data is in effect during the RAS
cycle. In page mode cycles, the mask data is retained during the page access.
30/37
¡ Semiconductor
Load/Read Color Register:
MSM5416262
RAS falling edge --- CAS = TRG = WEL = WEU = DSF = "H"
CAS falling edge --- DSF = "H"
The MSM5416262 is provided with an on-chip 16-bit color register for use during the flash write
or block write operation. Each bit of the color register corresponds to one of the DRAM I/O
blocks.
The data presented on the DQi lines is subsequently latched into the color register at the falling
edge of either CAS or WE whichever occurs later.
The read color register cycle is activated by holding both WEL and WEU "high" at the falling edge
of CAS, and throughout the remainder of the cycle. The data in the color register becomes valid
on the DQi lines after the specified access times from RAS and TRG are satisfied.
During the load/read color register cycle, the memory cells on the row address latched at the
falling edge of RAS are refreshed.
Flash Write: RAS falling edge --- CAS = TRG = DSF = "H", WEL = WEU = "L"
Flash write allows for the data in the color register to be written into all the memory locations of
a selected row.
Each bit of the color register corresponds to one of the DRAM I/O blocks. The flash write
operation can be selectively controlled on an I/O basis in the same manner as the write per bit
operation. The mask data is the same as that of a RAM write cycle.
31/37
¡ Semiconductor
MSM5416262
Block Write: RAS falling edge --- CAS = TRG = "H", DSF = "L"
CAS falling edge --- DSF = "H"
I/O Mask
1111 1010 0110 1011
Column Mask
1001 1111 0011 0000
(1)
(2)
(3)
(4)
Column 3
Color Register 1100 1110 0111 0011
Column 2
Bit 15
Column 1
Bit 0
Column 0
Block write allows for the data in the color register to be written into 4 consecutive column
address locations, starting from a selected column address in a selected row.
The block write operation can be selectively controlled on an I/O basis, and a column mask
capability is also available. This function is implemented as 4 columns ¥ 4 IOs repeated in four
quadrants. During a block write cycle, the 2 least significant column address locations (A0C,
A1C) are internally controlled, and only the 7 most significant column addresses (A2C - A8C) are
latched at the falling edge of CAS.
1) No mask block write: WEL and WEU "high" at the falling edge of RAS
The data on 16 DQ pins is cleared by the data of the color register.
2) Masked block write: WEL or WEU "low" at the falling edge of RAS
The mask data is the same as that of a RAM write cycle.
Byte block write occures if one of WEL or WEU falls during the cycle.
I/O15
*
*
*
*
I/O14
*
*
*
*
I/O13
*
*
*
*
I/O12
*
*
*
*
I/O11
*
*
*
*
I/O10
*
*
1
1
I/O9
*
*
1
1
I/O8
*
*
*
*
I/O7
*
*
*
*
I/O6
1
1
1
1
I/O5
*
*
*
*
I/O4
1
1
1
1
I/O3
0
*
*
0
I/O2
0
*
*
0
I/O1
1
*
*
1
I/O0
1
*
*
1
4 Column ¥ 4 I/O (4)
4 Column ¥ 4 I/O (3)
4 Column ¥ 4 I/O (2)
4 Column ¥ 4 I/O (1)
Note : Location "*" can not be loaded.
Example of Block Write
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¡ Semiconductor
MSM5416262
SAM PORT OPERATION
Single Register Mode
High speed serial read or write operations can be performed through the SAM port independent
of the RAM port operation, except during read/write transfer cycles.
The preceding transfer operation determines the direction of data flow through the SAM port.
If the preceding transfer is a read transfer, the SAM port is in the output mode. If the preceding
transfer is write transfer, the SAM port is in the input mode.
Serial data can be read out of the SAM after a read transfer has been performed. The data is shifted
out of the SAM starting at any of the 512 bits locations.
The TAP location corresponds to the column address selected at the falling edge of CAS during
the read or write transfer cycle. The SAM registers are configured as a circular data register. The
data is shifted out sequentially. It starts from the selected TAP location at the most significant bit
(511), then wraps around to the least significant bit (0).
Split Register Mode
In split register mode data can be shifted into or out of one half of the SAM, while a split read or
split write transfer is being performed on the other half of the SAM.
Conventional (non split) read, or write transfer cycle must precede any split read or split write
transfers. The split read and write transfers will not change the SAM port mode set by the
preceding conventional transfer operation. In the split register mode, serial data can be shifted
in or out of one of the split SAM registers, starting from any at the 256 TAP locations, excluding
the last address of each split SAM the data is shifted in or out sequentially starting from the
selected TAP location at the most significant bit (255 or 511) of the first split SAM, and then the
SAM pointer moves to the TAP location selected for the second split SAM to shift data in or out
sequentially, starts from this TAP location at the most significant bit (511 or 255), and finally
wraps around to the least significant bit.
TAP
0
1
2
TAP
255
256 257
511
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¡ Semiconductor
MSM5416262
DATA TRANSFER OPERATIONS
Upper SAM
256 ¥ 16
Serial Decoder
Upper SAM
256 ¥ 16
256 ¥ 256 ¥ 16
Memory
Array
256 ¥ 256 ¥ 16
Memory
Array
Lower SAM
256 ¥ 16
256 ¥ 256 ¥ 16
Memory
Array
Lower SAM
256 ¥ 16
The MSM5416262 features two types of bidirectional data transfer capability between RAM and
SAM.
1) Conventional (non split) transfer: 512 words by 16 bits of data can be loaded from RAM to
SAM (Read transfer), or from SAM to RAM (Write transfer).
2) Split transfer: 256 words by 16 bits of data can be loaded from the lower/upper half of the
RAM to the lower/upper half of the SAM (Split read transfer), or from the lower/upper half
of SAM to the lower/upper half of RAM (Split write transfer).
The conventional transfer and split transfer modes are controlled by the DSF input signal.
Data transfer is invoked by holding the TRG signal "low" at the falling edge of RAS.
The MSM5416262 supports 4 types of transfer operations: Read transfer, Split read transfer,
Write transfer and Split write transfer as shown in the truth table. The type of transfer operation
is determined by the state of CAS, WEL, WEU and DSF latched at the falling edge of RAS. During
conventional transfer operations, the SAM port is switched from input to output mode (Read
transfer), or output to input mode (Write transfer). It remains unchanged during split transfer
operation (Split read transfer or Split write transfer).
Both RAM and SAM are divided by the most significant row address (AX8), as shown in Figure
1. Therefore, no data transfer between AX8 = 0 side RAM and AX8 = 1 side RAM can be provided
through the SAM. Care must be taken if the split read transfer on AX8 = 1 side (or AX8 = 0 side)
is provided after the read transfer or the split read transfer, is provided on AX8 = 0 side (or AX8
= 1 side).
256 ¥ 256 ¥ 16
Memory
Array
AX8 = 0
AX8 = 1
SAM I/O Buffer
SDQ0 - 15
Figure 1. RAM and SAM Configuration
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¡ Semiconductor
MSM5416262
Read Transfer: RAS falling edge --- CAS = WEL = WEU = "H", TRG = DSF = "L"
Read transfer consists of loading a selected row of data from the RAM into the SAM register. A
read transfer is invoked by holding CAS "high", TRG "low", WEL and WEU "high", and DSF "low"
at the falling edge of RAS. The row address selected at the falling edge of RAS determines the
RAM row to be transferred into the SAM. The transfer cycle is completed at the rising edge of
TRG. When the transfer is completed, the SAM port is set into the output mode. In a read/real
time read transfer cycle, the transfer of a new row of data is completed at the rising edge of TRG,
and this data becomes valid on the SDQ lines after the specified access time tSCA from the rising
edge of the subsequent SC cycles. The start address of the serial pointer of the SAM is determined
by the column address selected at the falling edge of CAS. In a read transfer cycle (which is
preceded by a write transfer cycle), SC clock must be held at a constant VIL or VIH after the SC
high time has been satisfied. A rising edge of the SC clock must not occur until after the specified
delay tTSD from the rising edge of TRG.
In a real time read transfer cycle (which is preceded by another read transfer cycle), the previous
row data appears on the SQD lines until the TRG signal goes "high", and the serial access time
tSCA for the following serial clock is satisfied. This feature allows for the first bit of the new row
of data to appear on the serial output as soon as the last bit of the previous row has been strobed
without any timing loss. To make this continuous data flow possible, the rising edge of TRG must
be synchronized with RAS, CAS, and the subsequent rising edge of SC (tRTH, tCTH and tTSL/tTSD
must be satisfied).
Masked Write Transfer: RAS falling edge --- CAS = "H", TRG = DSF = "L"
WEL or WEU = "L"
Write transfer cycle consists of loading the content of the SAM register into a selected row of the
RAM. This write transfer is the same as a mask write operation in RAM.
If the SAM data to be transferred must first be loaded through the SAM, a Masked write transfer
operation (all DQ pins "low" at falling edge of RAS) must precede the write transfer cycles. A
masked write transfer is invoked by holding CAS "high", TRG "low", WEL or WEU "low", and
DSF "low" at the falling edge of RAS. The row address selected at the falling edge of RAS
determines the RAM row address into which the data will be transferred. The column address
selected at the falling edge of CAS determines the start address of the serial pointer of the SAM.
After the write transfer is completed, the SDQ lines are set in the input mode so that serial data
synchronized with the SC clock can be loaded.
When consecutive write transfer operations are performed, new data must not be written into
the serial register until the RAS cycle of the preceding write transfer is completed. Consequently,
the SC clock must be held at a constant VIL or VIH during the RAS cycle. A rising edge of the SC
clock is only allowed after the specified delay tCSD from the falling edge of the CAS, at which time
a new row of data can be written in the serial register.
Data transferred to SAM by read transfer cycle or split read transfer cycle can be written to the
other address of RAM by write transfer cycle. However, the address to write data must be the
same as that of the read transfer cycle (row address AX8).
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¡ Semiconductor
MSM5416262
Split Data Transfer and QSF
The MSM5416262 features a bidirectional split data transfer capability between the RAM and
SAM. During split data transfer operation, the serial register is split into two halves which can
be controlled independently. Split read or split write transfer operation can be performed to or
from one half of the serial register, while serial data can be shifted into or out of the other half of
the serial register. The most significant column address location (A8C) is controlled internally to
determine which half of the serial register will be reloaded from the RAM. QSF is an output
which indicates which half of the serial register is in an active state. QSF changes state when the
last SC clock is applied to active split SAM.
Split Read Transfer: RAS falling edge --- CAS = WEL = WEU = DSF = "H", TRG = "L"
Split read transfer consists of loading 256 words by 16 bits of data from a selected row of the split
RAM into the corresponding non-active split SAM register. Serial data can be shifted out from
the other half of the split SAM register simultaneously. During split read transfer operation, the
RAM port input clocks do not have to be synchronized with the serial clock SC, thus eliminating
timing restrictions as in the case of real time read transfers. A split read transfer can be performed
after a delay of tSTS from the change of state of the QSF output is satisfied.
Conventional (non-split) read transfer operation must precede split read transfer cycles.
Masked Split Write Transfer: RAS falling edge --- CAS = DSF = "H", TRG = "L"
WEL or WEU = "L"
Split write transfer consists of loading 256 words by 16bits of data from the non-active split SAM
register into a selected row of the corresponding split RAM. Serial data can be shifted into the
other half of the split SAM register simultaneously. During split write transfer operation, the
RAM port input clocks do not have to be synchronized with the serial clock SC, thus allowing
for real time transfer. This operation is the same as a mask write operation in RAM.
A split write transfer can be performed after a delay of tSTS from the change of state of the QSF
output is satisfied.
A masked write transfer operation must precede split write transfer. The purpose is to switch the
SAM port from output mode to input mode and to set the initial TAP location prior to split write
transfer operations.
POWER UP
Power must be applied to the RAS and TRG input signals to pull them "high" before, or at the
same time as, the VCC supply is turned on. After power-up, a pause of 200 ms minimum is
required with RAS and TRG held "high". After the pause, a minimum of 8 RAS and 8 SC dummy
cycles must be performed to stabilize the internal circuitry, before valid read, write or transfer
operations can begin. During the initialization period, the TRG signal must be held "high". If the
internal refresh counter is used, a minimum 8 CAS before RAS cycles are required instead of 8
RAS cycles.
(NOTE) INITIAL STATE AFTER POWER UP
The initial state can not be guaranteed for various power up conditions and input signal levels.
Therefore, it is recommended that the initial state be set after the initialization of the device is
performed and before valid operations begin.
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¡ Semiconductor
MSM5416262
PACKAGE DIMENSIONS
(Unit : mm)
SSOP64-P-525-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.34 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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