E2D0034-39-21 ¡ Semiconductor MSM63V89C ¡ Semiconductor This version: Feb. 1999 MSM63V89C Previous version: May. 1997 1,048,576-Word x 1-Bit Solid-State Recorder Data Register GENERAL DESCRIPTION The MSM63V89C is a solid-state recorder data register in 1,048,576 words x 1 bit configuration. The MSM63V89C has a built-in internal address generator circuit allowing continuous serial read/ write operation by single external clock input. The internal address is automatically incremented by one by read/write operation. Address designation in units of 1024 words in the direction of words is possible by an external serial address input. The built-in refresh timer and refresh counter have eliminated the need of an external refresh circuit and realized a low power consumption. 26/20-pin plastic TSOP is used as the package and the operating temperature range is between 0°C and 70°C. The MSM63V89C is suitable for storing large capacity data with battery backup. A solid state recording and playback system can easily be constructed in combination with OKI’s voice synthesizer ICs. FEATURES • Configuration: 1,048,576 x 1 bit • Serial access operation: Serial access time 1.5 ms (3.0 ms) Serial read/write cycle time 2.0 ms (4.0 ms) Fast mode read/write cycle time 0.4 ms (0.4 ms) Times in parentheses indicate ones in self-refresh mode. • Low current consumption: 50 mA max. (for data holding, VCC=3.0 V) • Wide operating supply voltage range: Single 2.7 to 3.6V • Auto-refresh/self-refresh changeable • Package: 26/20-pin plastic TSOP (TSOPII26/20-P-300-1.27-K) (Product name: MSM63V89CTS-K) 1/10 ¡ Semiconductor MSM63V89C BLOCK DIAGRAM TEST VCC SAD X-address Counter Load Clock Clock SAS FAM RWCK Refresh Counter Timing Generator 1,048,576 Data Register DIN I/O Controller DOUT Y-decoder/sense Amp Y-address Counter Reset Clock RFSH RS/A VSS X-decoder/ Driver Sin Address Register Pout Address Multiplexer CS VBB Generator Write Clock Generator WE Clock Refresh Timer TEST TAS PIN CONFIGURATION (TOP VIEW) DIN 1 26 VSS WE 2 25 DOUT TEST 3 24 TEST NC 4 23 NC CS 5 22 NC 18 RWCK SAD 9 17 NC NC 10 SAS 11 16 FAM TAS 12 15 RFSH VCC 13 14 RS/A NC : No connection 26/20-pin plastic TSOP 2/10 ¡ Semiconductor MSM63V89C PIN DESCRIPTIONS Pin Symbol 1 DIN Data input 2 WE Write enable 3, 24 TEST Test input 5 CS Chip select 9 SAD Serial address data 11 SAS TAS Serial address strobe 13 VCC Power supply (3.3 V) 14 RS/A Auto-Refresh/Self-Refresh Select 15 RFSH Refresh Clock Input 16 FAM Fast Access Mode Select 18 25 RWCK DOUT Read/write clock Data output 26 VSS Ground (0 V) 12 Description Transfer address strobe 3/10 ¡ Semiconductor MSM63V89C ABSOLUTE MAXIMUM RATINGS Symbol Condition Rating Unit Terminal Voltage Parameter VT Ta = 25°C, relative to VSS –1.0 to +7.0 V Output Short-Circuit Current IOS Ta = 25°C 50 mA Power Dissipation PD Ta = 25°C 1 W Operating Temperature Top — 0 to 70 °C Storage Temperature TSTG — –55 to +150 °C RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Parameter Symbol Min. Typ. Max. Unit Supply Voltage VCC 2.7 3.3 3.6 V Supply Voltage VSS 0 0 0 V "H" Input Voltage VIH VCC – 0.5 VCC VCC + 0.5 V "L" Input Voltage VIL –0.5 0 +0.5 V ELECTRICAL CHARACTERISTICS DC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit "H" Output Voltage VOH IOH = –0.5 mA VCC – 0.5 — V "L" Output Voltage VOL IOL = 0.5 mA — 0.4 V Input Leakage Current ILI VI = 0 V to VCC –1 +1 mA Output Leakage Current ILO VO = 0 V to VCC –1 +1 mA Supply Current (in operating state) ICC1 VCC = 3 V, tRWC = 2 µs — 3 mA Supply Current (in standby state) ICC2 VCC = 3 V — 50 mA Supply Current (FAM) ICC3 VCC = 3 V, tRWC = 0.4 ms — 10 mA 4/10 ¡ Semiconductor MSM63V89C AC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol MSM63V89C-SELF MSM63V89C-AUTO Min. Max. Min. Max. Unit Refresh Cycle tREF — — — 100 ms Read/Write Cycle Time tRWC 4,000 — 2,000 — ns Access Time tACC — 3,000 — 1,500 ns Output Turn-off Delay Time tOFF 0 50 0 50 ns Input Signal Rise/Fall Time tT 3 50 3 50 ns RWCK Precharge Time tRWP 1,000 — 500 — ns RWCK Pulse Width tRW 3,000 10,000 1,500 10,000 ns SAS Cycle Time tSSC 100 — 100 — ns SAS Pulse Width tSAS 50 — 50 — ns SAS Precharge Time tSAP 50 — 50 — ns Address Setup Time tAS 0 — 0 — ns Address Hold Time tAH 50 — 50 — ns TAS Setup Time tATS 50 — 50 — ns TAS to RWCK Setup Time tTRS 50 — 50 — ns TAS Pulse Width tTAS 50 — 50 — ns Read Command Setup Time tRRS 0 — 0 — ns Read Command Hold Time tRRH 50 — 50 — ns Write Command Setup Time tWRS 0 — 0 — ns Write Command Hold Time tWRH 50 — 50 — ns Write Command Pulse Width tWP 50 — 50 — ns WE to RWCK Lead Time tRWL 50 — 50 — ns tDS 0 — 0 — ns Data Setup Time tDH 50 — 50 — ns tRWD 100 — 100 — ns RFSH Setup Time tRFS — — 500 — ns RFSH Precharge Time tRFP — — 500 — ns RFSH Pulse Width tRF — — 1,500 10,000 ns RFSH RWCK Precharge Time tRRP — — 500 — ns Fast Mode Cycle Time tFC 400 — 400 — ns Fast RWCK Mode Access Time tFAC — 300 — 300 ns Fast RWCK Precharge Time tFCP 100 — 100 — ns Fast Mode RWCK Pulse Width tFR 300 — 300 — ns Fast Mode Setup Time tFS 0 — 0 — ns Data Hold Time RWCK to WE Delay Time Fast Mode Hold Time tFH 50 — 50 — ns Fast Mode Width tFCC 4,000 100,000 2,000 100,000 ns Slow Mode Setup Time tSS 0 — 0 — ns Slow Mode Hold Time tSH 50 — 50 — ns Note: Switching to the fast mode should be made satisfying the timings of tFS and tSS at the "L" level of RWCK. 5/10 ¡ Semiconductor MSM63V89C TIMING DIAGRAMS , , ,,, Read/Write/Read Modify Write Cycle CS tRWC tRW RWCK tRWF tRW tSSC tSAP tSAS tTRS SAS tAH tAS SAD A0 A1 A2 A9 tATS tTAS TAS tRWL tRRS tRRH tWRS tWP WE tDS tDH DIN tDH tDS DY1 tACC DOUT tWRH tRWD DY2 tOFF XnY0 XnY1 High-Z 6/10 ¡ Semiconductor MSM63V89C Auto-Refresh Mode , , , , CS TAS RS/A RWCK tRRP tRFS WE DIN DOUT XnY0 XnY1 XnY2 XnY4 XnY5 XnY6 XnY7 RFSH tRF tRFP Fast Access Mode CS SAS SAD TAS tFR tFCP RWCK tFS tFCC tSS tSH FAM tFAC DOUT XnY0 Yn+1 Yn+3 Ym+1 Ym+3 Ym+4 – Y1021 Y1023 Y0Y2 Y3Y4 Xn+1Y5 XnYn Yn+2 Ym+2 Ym+5 Y1022 Xn+1 Y1 Xn+1Y6 7/10 ¡ Semiconductor MSM63V89C FUNCTIONAL DESCRIPTION Serial Address Input (SAD) Pin for inputting the start address for read/write. Address data can be input in units of 1024 words. The 1,024 address data can be input as 10-bit (A0-A9) serial from the SAD pin. Serial Address Strobe (SAS) Pin for the clock used to store the serial address data into the internal register. Address Transfer Strobe (TAS) Input pin for setting the serial address data stored in the address register to the internal address counter. When the TAS falls, the Y address is set to address 0. Read/Write Clock (RWCK) Input pin for the data register information read/write clock. Internal operation starts at the falling edge of RWCK. The information in the data register is output to the DOUT pin in the read mode, and the information at the DIN pin is written into the data register in the write mode. The internal address counter is automatically incremented when RWCK falls. Write Enable (WE) Input pin for selecting the read mode, write mode or read modify write mode. The read mode is set when WE is "H", and the write mode is set when WE is "L". When WE falls from "H" to "L" while RWCK is active, the read modify write mode is set. Data Input (DIN) Input pin for write data. The information at the data input pin is stored at the falling edge of RWCK in the write mode, and at the falling edge of WE in the read modify write mode. Data Output (DOUT) The data output pin is always kept in the high impedance state when RWCK or CS is kept at "H". When "H" or "L" information is read in the read operation, the output pin is set to "H" to "L" and holds the read information until RWCK is again set to "H". In the early write mode the output pin maintains the high impedance state, so I/O common operation by connecting DIN and DOUT is possible. Self/Auto Refresh Select (RS/A) Pin for selecting a refresh mode in order to retain memory cell data. If the RS/A pin is set to "L" level, the self-refresh mode is selected and no external refresh control is required. If the RS/A pin is set to "H" level, the auto-refresh mode is selected and refresh operation is required to retain memory cell data. Refresh Clock Input (RFSH) Input pin for controlling the external refresh when the auto refresh mode is selected. When the autorefresh mode is selected, 1024 refresh operations are required within 100ms via the RFSH pin while the RWCK is at "H" level. 8/10 ¡ Semiconductor MSM63V89C Fast Access Mode Select (FAM) Pin for fast read/write operations. Fast read/write is possible by keeping the FAM pin at "L" level. The fast access mode is set or released by inputting "L" level or "H" level to the FAM pin when the RWCK pin is at "L" level, and when tFS and tSS are satisfied. When 1024-word data access is complete, be sure to insert a normal cycle in order to increment the X address. Chip Select (CS) Input pin for disabling all input and output pins. This pin enables parallel use of multiple MSM63V89Cs by connecting the data input and output pins. Test (TEST) The TEST pin is fixed to "H" level. Turning the power ON To stabilize the device, it is required to pause for over 100ms after the VCC reaches the specified voltage. Then it is needed to add eight or more RWCK cycles (read cycles or pseudo data write cycles). 9/10 ¡ Semiconductor MSM63V89C PACKAGE DIMENSIONS (Unit : mm) TSOPII26/20-P-300-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.38 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/10 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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