E2D0036-39-21 ¡ Semiconductor MSM66V84B ¡ Semiconductor This version: Feb. 1999 MSM66V84B Previous version: May. 1997 4,194,304-word x 1-bit Serial Register GENERAL DESCRIPTION MSM66V84B is a serial register organized as 4,194,304 words x one bit, characterized by mediumspeed, low power consumption operation. This device has a built-in internal address generation circuit allowing continuous serial read/write operation by external clock input. Read/write operation causes the internal address to be incremented automatically by +1. External address input enables addressing in units of 1024 words. Furthermore, a refresh timer and a refresh address counter are installed, which makes an external refresh circuit unnecessary. In addition, this configuration allows lower power consumption. The device is packaged in 26/20-pin SOJ or 26/20 TSOP having a width of 300 mil. It is well adapted for storing much data by means of a battery backup. Its combination with our recording and playback LSI enables the easy implementation of a solid recording and playback system. FEATURES • Configuration 4,194,304 x 1 bit • Serial access operation Serial access time : 1.5 ms Serial read/write time : 2.5 ms • Low current drain 100 mA max. (VCC = 3.6 V with data stored and under standard conditions) • Refresh operation A self-refresh function is supported. • Wide operation voltage range Single 2.7 to 3.6 V • Addressing Units of 1024 words • Process 0.45 mm double well CMOS process • Package options : 26/20-pin plastic SOJ (SOJ26/20-P-300-1.27) (Product name : MSM66V84BJS) 26/20-pin plastic TSOP (TSOPII26/20-P-300-1.27-K) (Product name : MSM66V84BTS-K) 1/10 ¡ Semiconductor MSM66V84B BLOCK DIAGRAM TAS Row Address Counter Row Decoder Refresh Address Counter Address Multiplexer Refresh Timer 4,194,304 Data Register Column Decoder SAS RWCK Row Address Register Column Address Counter DIN I/O Control SAD DOUT Timing Generator Write Clock Generator WE 2/10 ¡ Semiconductor MSM66V84B PIN CONFIGURATION (TOP VIEW) TEST 1 TEST 1 26 VCC 26 VCC RWCK 2 25 TEST RWCK 2 25 TEST NC 3 24 TEST NC 3 24 TEST TEST 4 23 SAD TEST 4 23 SAD TEST 5 22 SAS TEST 5 22 SAS TEST 9 18 TAS TEST 9 18 TAS TEST 10 17 CS TEST 10 17 CS DIN 11 16 WE DIN 11 16 WE NC 12 15 DOUT NC 12 15 DOUT VSS 13 14 NC VSS 13 14 NC NC : No connection NC : No connection 26/20-pin plastic SOJ 26/20-pin plastic TSOP (K type) PIN DESCRIPTION Pin Symbol 25 TEST Test input TEST Test input 2 RWCK Read/write clock 11 DIN Data input 13 VSS Ground (0 V) 15 DOUT WE Data output 17 CS Chip select 18 TAS Transfer address strobe 22 SAS Serial address strobe 23 SAD Serial address data 26 VCC Power supply (2.7 V to 3.6 V) 1, 4, 5 9, 10, 24 16 Description Write enable Note : All TEST pins are to be connected to the power supply. The TEST pin is to be referenced to the ground level. 3/10 ¡ Semiconductor MSM66V84B ABSOLUTE MAXIMUM RATINGS Symbol Condition Rating Unit Pin Voltage Parameter VT Against VSS at Ta = 25 °C –0.5 to +4.6 V Output Short-Circuit Current IOS Ta = 25 °C 50 mA Power Dissipation PD Ta = 25 °C 1 W Operating Temperature Top — 0 to 70 °C Storage Temperature TSTG — –55 to +150 °C RECOMMENDED OPERATING CONDITIONS (Ta = 0 to 70°C) Symbol Min. Typ. Max. Unit Supply Voltage Parameter VCC 2.7 3.0 3.6 V Supply Voltage VSS 0 0 0 V "H" Input Voltage VIH VCC – 0.3 VCC VCC + 0.2 V "L" Input Voltage VIL –0.2 0 +0.5 V ELECTRICAL CHARACTERISTICS DC characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Parameter Symbol Condition Min. Max. Unit "H" Output Voltage VOH IOH = –0.1 mA VCC – 0.5 — V "L" Output Voltage VOL IOL = 0.1 mA — 0.4 V Input Leakage Current IIL VI = 0 V to VCC –1 +1 mA Output Leakage Current IOL VO = 0 V to VCC –1 +1 mA Supply Current (Operation) ICC1 VCC = 3.6 V, tRWC = 2.5 ms — 10 mA Supply Current (Standby) ICC2 VCC = 3.6 V — 100 mA 4/10 ¡ Semiconductor MSM66V84B AC Characteristics (VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C) Symbol Min. Max. Units Read/Write Cycle Time Parameter tRWC 2,500 — ns Access Time tACC — 1,500 ns Output Turn-off Delay Time tOFF 0 50 ns I/O Signal Rise Time tT 3 50 ns RWCK Pre-charge Time tRWP 1,000 — ns RWCK Pulse Time tRW 1,500 10,000 ns SAS Cycle Time tSSC 100 — ns SAS Pre-charge Time tSAP 50 — ns SAS Pulse Width tSAS 50 — ns Address Setup Time tAS 0 — ns Adress Hold Time tAH 50 — ns TAS Setup Time tATS 50 — ns TAS . RWCK Setup Time tTRS 50 — ns TAS Pulse Width tTAS 50 — ns Read Instruction Setup Time tRRS 0 — ns Read Instruction Hold Time tRRH 250 — ns Write Instruction Setup Time tWRS 0 — ns Write Instruction Hold Time tWRH 50 — ns Write Instruction Pulse Width tWP 50 — ns WE. RWCK Read Time tRWL 50 — ns tDS 0 — ns tDH 50 — ns tRWD 50 — ns Data Setup Time Data Hold Time RWCK. WE Delay Time 5/10 tRW tRWP RWCK tSAS tSSC tSAP SAS tAS SAD tAH A0 A1 A12 tATS ¡ Semiconductor tRWC tTRS TIMING DIAGRAM Read/write and read/modify/write cycles CS tTAS TAS tRWL tRRS tRRH tRWD tWP tWRS tWRH WE tDS n+1 DIN tOFF n n+1 tDS tDH n+2 6/10 MSM66V84B tACC DOUT tDH ¡ Semiconductor MSM66V84B PIN FUNCTIONS AND OPERATING MODES • Serial address input (SAD) Pin used to enter start address for reading/writing. An address can be specified in units of 1024 words. 1024 words of address data can be entered through the pin as 13 bits (A0 to A12) of serial data. The 13th bit must be A12 as a dummy address, however. The A12 input level must be either "H" or "L". • Serial address strobe (SAS) This is a clock pin for latching serial address data into an internal register. • Address transfer strobe (TAS) This is an input pin for loading the internal address counter with serial address data latched in the address register. • Read/write clock (RWCK) This is a clock input pin for reading and writing information in the data register. The trailing edge of RWCK triggers off internal operation. In the reading mode, information in the data register is output to the DOUT pin. In the writing mode, the data register is loaded with DIN information. At the leading edge of RWCK, the internal address counter is incremented automatically by +1. • Write enable (WE) This is an input pin for selecting the read mode, the write mode, or the read-modify-write mode. When WE is "H", the read mode is set up and, when WE is "L", the write mode is set up. When the level is lowered from "H" to "L" with RWCK active, the read-modify-write mode is set up. • Data input (DIN) This is a pin for entering write data. Information on the data input pin is latched when the trailing edge of RWCK is encountered in the write mode and that of WE is encountered in the read/modify mode. • Data output (DOUT) The data output pin always provides high impedance as long as RWCK or CS is kept at "H". When "H" or "L" information is read, the output pin set at "H" or "L", and information read until RWCK returns to "H" is held. In the early write mode, the output pin is maintained at high impedance, so that, connect of DIN and DOUT enables "I/O common operation". • Chip selection (CS) This is an input pin for disabling all input pins. This pin allows the use of two or more MSM66V84B devices with data input and output pins connected in parallel. • Test (TEST, TEST) The TEST pin must always be fixed at "L" and the TEST pin at "H". 7/10 ¡ Semiconductor MSM66V84B NOTES ON ENERGIZATION MSM66V84B has built-in board bias generation and inner power supply circuits. Thus, energization must be followed by a pause period of 1 ms or more for internal circuit stabilization. Furthermore, the TEST pin must be brought "L" concurrently with or prior to VCC, and all clock input pins and TEST pins must be brought "H" concurrently with or prior to VCC. To achieve proper operation of internal circuits, the initial pause above must be followed by minimum ten dummy read cycles with RWCK. NOTES ON SUPPLY VOLTAGE VARIATION When using MSM66V84B, take precautions so that the supply voltage does not vary over one volt within a period of 1,000ms or less in the active state. 8/10 ¡ Semiconductor MSM66V84B PACKAGE DIMENSIONS (Unit : mm) SOJ26/20-P-300-1.27 Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.80 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 9/10 ¡ Semiconductor MSM66V84B (Unit : mm) TSOPII26/20-P-300-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.38 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 10/10 E2Y0002-29-11 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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