OKI MSM7575

E2U0025-29-82
¡ Semiconductor
MSM7575
¡ Semiconductor
This version: Aug.
1999
MSM7575
Previous version: Jan. 1998
Multi-Function PCM CODEC
GENERAL DESCRIPTION
The MSM7575, developed for advanced digital cordless telephone systems, is a single channel
full duplex CODEC which performs mutual transcoding between the analog voice band signal
and the 64 kbps PCM serial data.
This device performs DTMF tone and several kinds of tone generation, transmit/receive data
mute and gain control, side-tone pass and its gain control, and VOX function.
Using advanced circuit technology, this device operates from a single 3 V power supply and
provides low power consumption.
FEATURES
• Single 3 V Power Supply Operation
VDD: 2.7 V to ␣ 3.6 V
• Transmit/Receive Full-Duplex Single Channel Operation
• Transmit/Receive Synchronous Mode Only
• PCM Interface Data Format :
A-law/µ-law/linear (2's complement) Selectable
• Serial PCM Transmission Data Rate :
64 kbps to 2048 kbps
• Low Power Consumption
Operating Mode :
24 mW Typ. (VDD = 3.0 V)
Power-Down Mode :
0.03 mW Typ. (VDD = 3.0 V)
• Two Analog Input Amplifier Stages:
Externally Gain Adjustable
• Analog Output Stage
Push-pull Drive (direct drive of 350 W␣ + 120 nF)
• Master Clock Frequency :
9.600/19.200 MHz Selectable
• Transmit/Receive Mute, Transmit/Receive Programmable Gain Control
• Side Tone Path with Programmable Attenuation
(8-step Level Adjustment)
• Built-in DTMF Tone Generator
• Built-in Various Ringing Tones Generator
• Built-in Various Ring Back Tone Generator
• Control by Serial MCU Interface
• Built-in VOX Control
Transmit side
:
Voice/Silence Signal Detect
Receive side
:
Background Noise Generation
• Built-in Op-amps and Analog Switches for Various Analog Interfaces.
• Package:
64-pin plastic QFP
(QFP64-P-1414-0.80-BK)(Product name : 7575GS-BK)
1/25
VOXO
VOXI
Prefilter
BPF
A/D
P
/
S
Compand
PCMSO
ATT
GSX2
XSYNC
ATT
-1
AOUT+
¡ Semiconductor
+
-
Voice Signal
Detect
BLOCK DIAGRAM
AIN2
V DD
DG
AG
+
-
SG
SGB
AIN1+
AIN1GSX1
Tone GEN.
VREF
BCLK
+
-
AOUT-
Back ground
Noise Gen.
ATT
PWI
VFRO
-1
SAO
Postfilter
+
S
/
P
Expand
ATT
PCMRI
TOUT1
TOUT2
TOUT3
+
REF1
AVIN
+
-
REF2
To each circuit
DIN
DOUT
DEN
EXCK
MCU Interface
V DD
+
V DD
V DD
Clock/
Timing
+
SW1
SW2
SW3
SW4
SW5
SW6
SW7
SW8
SW9
X2
X1
MCK
PDN/
RESET
IO14
IO13
IO12
IO11
IO10
IO9
IO8
IO7
IO6
IO5
IO4
IO3
IO2
IO1
+
-
2/25
MSM7575
AIN4+
AIN4GSX4
+
-1
RINGC
AIN3+
AIN3GSX3
LPF
D/A
RSYNC
MSM7575
¡ Semiconductor
,
VOXI
VOXO
DOUT
DIN
EXCK
DEN
PCMRI
MCK
X2
NC
NC
X1
PDN/RESET
NC
TOUT3
TOUT2
TOUT1
RINGC
VDD
REF2
REF1
AVIN
NC
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
PIN CONFIGURATION (TOP VIEW)
1
48
AOUT+
2
47
AOUT-
3
46
PWI
4
45
VFRO
5
44
SAO
6
43
GSX2
7
42
AIN2
32
AIN3+
AG
33
31
16
SG
IO4
30
AIN3-
SGB
34
29
15
NC
IO3
28
GSX3
NC
35
27
14
NC
IO2
26
AIN4+
IO14
36
25
13
IO13
IO1
24
AIN4-
IO12
37
23
12
IO11
DG
22
GSX4
21
38
IO9
11
IO10
BCLK
20
AIN1+
IO8
39
19
10
IO7
XSYNC
18
AIN1-
IO6
GSX1
40
17
41
9
IO5
8
RSYNC
PCMSO
64-Pin Plastic QFP
NC : No connect pin
3/25
MSM7575
¡ Semiconductor
PIN AND FUNCTIONAL DESCRIPTIONS
AIN1+, AIN1–, AIN2, GSX1, GSX2
Transmit analog input and the output for transmit gain adjustment. The pin AIN1– (AIN2)
connects to the inverting input of the internal transmit amplifier, and the pin AIN1+ connects to
the non-inverting input of the internal transmit amplifier. The pin GSX1 (GSX2) connects to
output of the internal transmit amplifier. Gain adjustment should be referred to Fig. 1.
VFRO, AOUT+, AOUT–, PWI, SAO, RINGC
Used for the receive analog output and the output for receive gain adjustment. VFRO is an
output of the receive filter. AOUT+ and AOUT– are differential analog signal outputs which can
directly drive ZL = 350 W + 120 nF or the 1.2 kW load. Gain adjustment should be referred to Fig.
1.
The ORed signal with the control register data CR4-B5 and the external pin RINGC determines
the output pins (AOUT+ and AOUT- /SAO+ and SAO-) for the speech signal and an acoustic
component of the sounder tone, DTMF tone, R tone, F tone, various kinds of tones at either the
VFRO pin or the SAO pin.
AIN1–
Differential
Analog Input
C1
Vi
R1
–
V REF
+
AIN1+
C1
0.1 mF
R2
R1
R2
10 mF
+
–
GSX1
SG
AIN2
C2
R3
to ENCODER
+
R4
GSX2
Transmit Gain: V GSX2 /Vi
= (R2/R1) ¥ (R4/R3)
Receive Gain: Vo/V VFRO
= 2 ¥ (R6/R5)
–
VFRO
from
DECODER
R5
PWI
SELECT
R6
AOUT–
Z L = 120 nF
+ 350 W
VO
Differential
Analog
Output
–
+
AOUT+
from MCU INT.
TOUT1
–1
TOUT2
SAO
Sounder Output
Signal
+1
RINGC
+
TOUT3
–
from MCU INT.
Figure 1 Analog Input/Output Interface
4/25
MSM7575
¡ Semiconductor
TOUT1, TOUT2, TOUT3
These are pins for outputs of the NOR gates whose inputs are the comparator output signal
between the SAO output level and the SG level, and each register signal stored by the MCU
interface.
The each output is NOR-gated with the comparator output and the invented signal of CR1-B7 at
TOUT3, the inverted signal of CR1-B6 at TOUT2, and the inverted signal of CR1-B5 at TOUT1.
AVIN, REF1, REF2
These pins are for inputs of two comparators internal to the device. AVIN is connected to each
non-inverting input of comparator1 and comparator2. REF1 is connected to an inverting input
of comparator1 and REF2 is connected to an inverting input of comparator2. The output of each
comparator is connected to the input of ENOR. The interval analog switch SW1 is ON/OFF
controlled by the output which is the logical OR of the ENOR and the CR5-B7 signal. When CR5B7 is at "0", the SW1 is turned to OFF if AVIN is within the voltage range of REF1 and REF2 and
the SW1 is turned to ON if AVIN is out of the voltage range of REF1 and REF2.
AIN3+, AIN3-, GSX3, AIN4+, AIN4-, GSX4
These pins are for inputs and outputs of the internal op-amps. Refer to BLOCK DIAGRAM for
the connection.
IO1 to IO14
These pins are for inputs and outputs of the internal analog switch. Refer to BLOCK DIAGRAM
and FUNCTIONAL DESCRIPTION for the connection and the control method.
X1, X2
Crystal oscillator connection pins. X2 is for the clock output pin. When a conventional external
clock is used, X1 should be connected to the ground, X2 should be left open, and the clock should
be input to the MCK pin.
For the use of a self-oscilation circut
For the use of an external clock
MSM7575
MSM7575
X1
X2
9.6 MHz or
19.2 MHz
MCK
X1
X2
MCK
9.6 MHz or
19.2 MHz
Figure 2 Connection to a Crystal Oscillator or an External Clock
5/25
¡ Semiconductor
MSM7575
SG, SGB
Analog signal ground output.
The output voltage is about 1.4 V. The bypass capacitors (10 µF in parallel with 0.1 µF ceramic
type) should be put between this pin and AG to get the specified noise characteristics. This
output voltage is 0 V during power-down.
AG
Analog ground.
DG
Digital ground.
This ground is separated from the analog signal ground(AG) in this device. The DG pin must be
kept as close to the AG pin possible on the PCB.
VDD
+3 V power supply.
PDN/RESET
Power down and reset control input.
“L” level makes the whole chip enter to power down state, and, at the same time, all of control
register data are reset to the initial state. Set this pin to “H” level during normal operating mode.
The power down state is controlled by a logical OR with CR0-B5 of the control register. When
using the pin PDN/RESET for the power down and reset control, CR0-B5 should be set to digital
“0”.
MCK
Master clock input.
The frequency must be 9.6 MHz or 19.2 MHz. The applied clock frequency is selected by the
control register data CR0-B6. The master clock signal is allowed to be asynchronous with BCLK,
XSYNC, and RSYNC.
PCMSO
Transmit PCM data output.
This PCM output signal is output from MSB in synchronization with the rising edge of BCLK or
XSYNC. A pull-up resistor must be connected to this pin, because this output is configuared as
an open drain.
During power down, this output is at high impedance state.
6/25
MSM7575
¡ Semiconductor
PCMRI
Receive PCM data input.
This PCM input signal is shifted on the falling edge of BCLK and input from MSB.
BCLK
Shift clock input for the PCM data (PCMSO, PCMRI).
The frequency is set in the range of 64 kHz to 2048 kHz.
XSYNC
8 kHz synchronous signal input for Transmit PCM data.
This signal should be synchronized with BCLK. XSYNC is used for indicating MSB of the
transmit serial PCM.
Be sure to input the XSYNC signal because it is also used as the input of the timing circuit and
the clock source of the tone generator.
RSYNC
8 kHz synchronous signal input for Receive PCM data.
This signal should be synchronized with BCLK signal. RSYNC is used for indicating the MSB
of the receive serial PCM.
BCLK
XSYNC
PCMSO
MSB
LSB
RSYNC
PCMRI
MSB
LSB
8kHz
(125ms)
Figure 3 PCM Interface Basic Timing Diagram
7/25
MSM7575
¡ Semiconductor
VOXO
Transmit VOX function signal output.
VOX function is to recognize the presence or absence of the transmit voice signal by detecting the
signal energy. “H” and “L” levels set to this pin correspond to the presence and the absence,
respectively. This result appears also at the register data CR7-B7. The signal energy detect
threshold is set by the control register data CR6-B6, B5.
VOXI
Signal input for receive VOX function.
The “H” level at VOXI indicates the presence of voice signal, the decoder block processes normal
receive signal, and the voice signal appears at analog output pins . The “L” level indicates the
absence of voice signal, the background noise generated in this device is transferred to the analog
output pins. The background noise amplitude is set by the control register CR6. Because this
signal is ORed with the register data CR6-B3, the control register data CR6-B3 should be set to
digital “0”.
Voice Input
GSX2
(Absence)
VOXO
(Presence)
(Presence)
TVXOFF
Absence
Detect (Hang-over time)
TVXON
Presence
Detect
(a) Transmit VOX Function Timing Diagram
(Absence)
VOXI
(Presence)
(Presence)
Voice Output
VFRO
Normal Voice Signal
Decoded Time period
Background
Noise
(b) Receive VOX Function (CR6-B3: digital "0") Timing Diagram
Note: VOXO, VOXI function become valid when setting CR6-B7 to digital “1”.
Figure 4 VOX Function
8/25
MSM7575
¡ Semiconductor
DEN , EXCK, DIN, DOUT
, ,
Serial control ports for MCU interface. Reading and writing data is performed by an external
MCU through these pins. Total 8 registers with 8 bits are provided on the devices.
DEN is the “Enable” control signal input, EXCK is the data shift clock input, DIN is the address
and data input, and DOUT is the data output from which inverted data of the contents of the
register is output.
Fig.5 shows the input or output timing diagram.
DEN
EXCK
W
DIN
A2
A1
A0
DOUT
B7
B6
B5
B4
B3
B2
B1
B0
B2
B1
B0
High Impedance
(a) Write Data Timing Diagram
DEN
EXCK
DIN
R
DOUT
A2
A1
A0
B7
High Impedance
B6
B5
B4
B3
(b) Read Data Timing Diagram
Figure 5 MCU Interface Input/Output Timing
Register map is shown below.
Table-1
Name
Address
Control and Detect Data
A2
A1
A0
CR0
0
0
0
CR1
0
0
1
CR2
0
1
0
CR3
0
1
1
CR4
1
0
0
CR5
1
0
1
CR6
1
1
0
CR7
1
1
1
B7
B6
B5
B4
B3
B2
B1
—
LNR
B0
A/m
MCK
PDN
PDN
PDN
SEL
SEL
ALL
TX
RX
TOUT3
TOUT2
TOUT1
-CONT
-CONT
-CONT
—
—
—
—
TX
TX
TX
TX
RX
RX
RX
RX
ON/OFF
GAIN2
GAIN1
GAIN0
ON/OFF
GAIN2
GAIN1
GAIN0
TONE
TONE
TONE
TONE
TONE
ON/OFF
GAIN3
GAIN2
GAIN1
GAIN0
TONE4
TONE3
TONE2
TONE1
TONE0
Side Tone Side Tone Side Tone
PDN
SAO/AOUT
GAIN1
GAIN0
TONE
SAO/
SEND
VFRO
SW8-
SW9-
SW5&
SW4-
SW3-
SW2-
SW1-
CONT
CONT
CONT
SW6-CONT
CONT
CONT
CONT
CONT
VOX
ON
ON
OUT
LVL1
LVL0
R/W : Enable to read/write
R/W
RX PAD R/W
GAIN2
DTMF/
OTHERS
SEL
SW7-
ON/OFF
LVL1
LVL0
VOX TX NOISE TX NOISE
R/W
RX NOISE RX NOISE RX NOISE
OFF
VOX
TIME
IN
LEVEL SEL
LVL1
LVL0
—
—
—
—
—
R/W
R/W
R/W
R/W
R/W
R
R : Read only register.
9/25
MSM7575
¡ Semiconductor
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Power Supply Voltage
VDD
Analog Input Voltage
VAIN
Digital Input Voltage
Rating
Unit
—
–0.3 to +5
V
—
– 0.3 to VDD + 0.3
V
VDIN
—
–0.3 to VDD + 0.3
V
Operating Temperature
Top
—
–30 to +85
°C
Storage Temperature
TSTG
—
–55 to +150
°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Condition
Min.
Typ.
Max.
Unit
Power Supply Voltage
Parameter
VDD
—
+2.7
—
+3.6
V
Operating Temperature Range
Ta
—
–25
+25
+70
°C
0.45 ¥ VDD
—
VDD
V
0
—
0.16 ¥ VDD
V
MCK, XSYNC, RSYNC, PCMRI,
Input High Voltage
VIH
RINGC, BCLK, VOXI,
PDN/RESET, DEN, EXCK, DIN
MCK, XSYNC, RSYNC, PCMRI,
Input Low Voltage
VIL
RINGC, BCLK, VOXI,
PDN/RESET, DEN, EXCK, DIN
fMCK1
MCK (CR0–B6 = "0")
–0.01%
9.600
+0.01%
MHz
fMCK2
MCK (CR0–B6 = "0")
–0.01%
19.200
+0.01%
MHz
Bit Clock Freqency
fBCK
BCLK
64
—
2048
kHz
Synchronous Signal Frequncy
fSYNC
XSYNC, RSYNC
—
8.0
—
kHz
MCK, BCLK, EXCK
30
50
70
%
—
—
50
ns
—
—
50
ns
Master Clock Frequency
Clock Duty Ratio
DC
MCK, XSYNC, RSYNC, PCMRI,
Digital Input Rise Time
tIr
RINGC, BCLK, VOXI,
PDN/RESET, DEN, EXCK, DIN
MCK, XSYNC, RSYNC, PCMRI,
Digital Input Fall Time
tIf
RINGC, BCLK, VOXI,
PDN/RESET, DEN, EXCK, DIN
tXS
BCLK to XSYNC
100
—
—
ns
tSX
XSYNC to BCLK
100
—
—
ns
tRS
BCLK to RSYNC
100
—
—
ns
tSR
RSYNC to BCLK
100
—
—
ns
Synchronous Signal Width
tWS
XSYNC, RSYNC
1 BCLK
—
100
ms
PCM Set-up Time
tDS
—
100
—
—
ns
—
100
—
—
ns
500
—
—
W
—
—
100
pF
10 + 0.1
—
—
mF
Transmit Sync Signal Setting Time
Receive Sync Signal Setting Time
PCM Hold Time
tDH
RDL
Digital Output Load
Bypass Capacitors for SG
CDL
CSG
PCMSO (Pull-up Resistor)
TOUT1, TOUT2, TOUT3,
PCMSO, VOXO, DOUT
SG to AG
10/25
MSM7575
¡ Semiconductor
ELECTRICAL CHARACTERISTICS
DC and Digital Interface Characteristics
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Parameter
Symbol
Condition
Min.
IDD1
Operating Mode, (VDD = 3.0 V)
—
IDD2
Power Down Mode, (VDD = 3.0 V)
—
Input High Voltage
VIH
—
0.45¥VDD
Input Low Voltage
VIL
—
0.0
Power Supply Current
Input Leakage Current
Typ.
Max.
Unit
8
6
mA
0.01
0.1
mA
—
VDD
V
—
0.16¥VDD
V
IIH
VI = VDD
—
—
2.0
mA
IIL
VI = 0 V
—
—
0.5
mA
IOH = 0.4 mA
0.5 ¥ VDD
—
VDD
V
IOH = 1 mA
0.8 ¥ VDD
—
VDD
V
1 LSTTL, Pull-up: 500 W
0.0
0.2
0.4
V
PCMSO
—
—
10
mA
—
5
—
pF
—
25
50
kW
Output High Voltage
VOH
Output Low Voltage
VOL
Output Leakage Current
IO
Input Capacitance
CIN
Output Resistance
ROSG
—
SG
Transmit Analog Interface Characteristics
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Min.
Typ.
Max.
Unit
Input Resistance
Parameter
Symbol
RINX
AIN1+ , AIN1– , AIN2
Condition
10
—
—
MW
Output Load Resistance
RLGX
GSX1, GSX2
20
—
—
kW
Output Load Capacitance
CLGX
GSX1, GSX2
—
—
100
pF
Output Amplitude
VOGX
GSX1, GSX2, RL = 20 kW
—
—
1.30 (*1)
VPP
Input Offset Voltage
VOFGX
Pre–OPAMPs
–20
—
20
mV
*1 –7.7 dBm (600 W) = 0 dBm0, + 3.17 dBm0 = 1.30 VPP (m-law Selected)
11/25
MSM7575
¡ Semiconductor
Receive Analog Interface Characteristics
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Parameter
Input Resistance
Output Load Resistance
Output Load Capacitance
Output Voltage Level
Symbol
RINPW
Comparator Input Voltage Range
PWI, AIN3+/–, AIN4+/–, REF1,
REF2, AVIN
Min.
Typ.
Max.
Unit
10
—
—
MW
RLVF
VFRO, SAO
20
—
—
kW
RLAO
AOUT+, AOUT–, GSX3, GSX4
1.2
—
—
kW
CLVF
VFRO, SAO
—
—
100
pF
CLAO
AOUT+, AOUT–, GSX3, GSX4
—
—
100
pF
VOVF
VFRO, SAO RL = 20 kW
AOUT+,
RL = 1.2 kW
AOUT–,
ZL = 350 kW
GSX3,
+ 120 nF(See Fig.1)
GSX4
—
—
1.30 (*1)
VPP
—
—
1.30 (*1)
VPP
—
—
1.30 (*1)
VPP
–100
—
100
mV
–20
—
20
mV
0.85
—
VDD–0.75
—
100
—
400
W
VOAO
VOFVF
Offset Voltage
Condition
VOFAO
GDB
VFRO, SAO
AOUT+, AOUT– (Gain = 0 dB,
Power amp only) GSX3, GSX4
AVIN, REF1, REF2
IO1-IO2, IO3-IO4, IO5-IO6,
Analog Switch "ON" Resistance
RSW
IO7-IO8, IO9-IO10, IO10-IO11,
IO12-VDD, IO13-VDD, IO14-VDD
*1 –7.7 dBm (600 W) = 0 dBm0, + 3.17 dBm0 = 1.30 VPP (m-law Selected)
12/25
MSM7575
¡ Semiconductor
AC Chracteristics
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Condition
Parameter
Symbol
Freq.
Level
(Hz)
(dBm0)
LOSS T1
0 to 60
Others
LOSS T2 300 to 3000
Min.
Typ.
Max.
Unit
25
—
—
dB
—
0.20
dB
–0.15
Transmit Frequency
LOSS T3
1020
Response
LOSS T4
3300
–0.15
—
0.80
dB
LOSS T5
3400
0
—
0.80
dB
LOSS T6
3968.75
13
—
—
dB
–0.15
—
0.20
dB
Receive Frequency
Responce
LOSS R1
0 to 3000
LOSS R2
1020
LOSS R3
3300
LOSS R4
3400
LOSS R5
3968.75
SD T1
Transmit Signal
to Distortion Ratio
Receive Signal
to Distortion Ratio
Transmit Gain
Tracking
Receive Gain
Tracking
0
–30
(*2)
dB
–0.15
—
0.80
dB
0
—
0.80
dB
13
—
—
dB
35
—
—
dB
35
—
—
dB
35
—
—
dB
SD T4
–40
28
—
—
dB
SD T5
–45
23
—
—
dB
SD R1
3
35
—
—
dB
35
—
—
dB
35
—
—
dB
SD R2
SD R3
0
1020
–30
(*2)
SD R4
–40
28
—
—
dB
SD R5
–45
23
—
—
dB
GT T1
3
–0.2
—
0.2
dB
GT T2
–10
GT T3
1020
dB
–0.2
—
0.2
dB
–50
–0.5
—
0.5
dB
GT T5
–55
–1.2
—
1.2
dB
GT R1
3
–0.2
—
0.2
dB
—
–10
GT R2
GT R3
–40
Reference
GT T4
1020
–40
Reference
—
GT R4
–50
–0.5
—
0.5
dB
GT R5
–55
–1.2
—
1.2
dB
—
AIN = SG
NIDLR
—
—
AVT
1020
AVR
—
(*2)
(*2)
(*3)
–0.2
dB
0.2
NIDLT
Amplitude
—
0
1020
dB
Reference
Idle Channel Noise
Absolute Signal
—
3
SD T2
SD T3
0
Reference
—
—
—
—
GSX2
0.285
VFRO
0.285
0
0.320
(*4)
0.320
(*4)
dB
–68
(–75.7) dBmOp
–72
(dBmp)
(–79.7)
0.359
Vrms
0.359
Vrms
13/25
MSM7575
¡ Semiconductor
AC Characteristics (Continued)
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Condition
Parameter
Symbol
Freq.
Level
(Hz)
(dBm0)
Power Supply Noise
PSRRT
Noise Freq.
Noise Level
Rejection Ratio
PSRRR : 0 to 50 kHz
: 50 mVPP
Others
Setting Time
Typ.
Max.
Unit
30
—
—
dB
30
—
—
dB
0
—
0
—
0
—
tXD3
0
—
tM1
50
—
—
ns
tM2
50
—
—
ns
tM3
50
—
—
ns
—
tSDX
Digital Input/Output
Min.
tXD1
—
tXD2
1LSTTL + 100 pF
See
pull-up: 500 W
Fig.4
200
*5(100)
200
*5(100)
200
*5(100)
200
*5(100)
ns
ns
ns
ns
tM4
50
—
—
ns
Serial Port Digital
tM5
100
—
—
ns
Input/Output Setting
tM6
50
—
—
ns
Time
tM7
50
—
—
ns
tM8
0
—
50
ns
tM9
50
—
—
ns
tM10
50
—
—
ns
0
—
50
ns
—
—
10
MHz
—
CLoad = 100 pF
See
Fig.7
tM11
Shift Clock Frequency
FEXCK
—
—
EXCK
*2 Use the P-message weighted filter
*3 PCMRI input code "11010101"(A-law)
"11111111"(m-law)
*4 0.320 Vrms = 0 dBm0 = –7.7 dBm
*5 Value in ( ) is for CLoad = 10 pF Pull-up £ 20 kW
Note: All ADPCM coder and decoder characteristics comply with ITU-T Recommendation
G.721.
14/25
MSM7575
¡ Semiconductor
AC Characteristics (DTMF and Other Tones)
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Parameter
Frequency Difference
Condition
Symbol
DFT1
DTMF Tones
DFT2
Other Tones
VTL
Original (reference)
Tone Signal Level
*6
VTH
VRL
VRH
Relative Level of
DTMF Tones
RDTMF
Transmit
Tones
DTMF (Low)
DTMF (High)
and Other Tones
DTMF (Low)
Receive
Tones
DTMF (High)
and Other Tones
VTH/VTL, VRH/VRL
Min.
Typ.
Max.
Unit
–7
—
+7
Hz
–7
—
+7
Hz
–18
–16
–14
dBm0
–16
–14
–12
dBm0
–4
–2
0
dBm0
–2
0
+2
dBm0
+1
+2
+3
dBm0
*6 Not contain the setting value of the programmable gain
AC Characteristics (Programmable Gain Stages)
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Parameter
Gain Accuracy
Symbol
Condition
Min.
Typ.
Max.
Unit
DG
All gain stages, to programmed value
–1
0
+1
dB
AC Characteristics (VOX Function)
(VDD = 2.7 V to 3.6 V, Ta = –25°C to +70°C)
Parameter
Symbol
Condition
Transmit VOX Detect Time
tVXON
OFF Æ ON
VOXO,
(Voice signal ON/OFF detect time)
tVXOF
ON Æ OFF
Fig.4
Transmit VOX Detect Level
Accuracy
(Threshold Level)
DVX
To the setting of detect level
by CR6-B6, B5.
Min.
Typ.
Max.
Unit
—
5
—
ms
150/310 160/320 170/330
ms
0
dB
–2.5
+2.5
15/25
MSM7575
¡ Semiconductor
TIMING DIAGRAM
Transmit Side PCM Data Interface
BCLK
0
tXS
XSYNC
1
tSX
2
tWS
tXD1
tXD2
3
4
5
6
7
8
10
tXD3
LSB
MSB
PCMSO
9
tSDX
Receive Side PCM Data Interface
BCLK
0
tRS
1
tSR
2
RSYNC
tDS
PCMRI
3
4
5
6
7
8
9
10
tWS
tDH
MSB
LSB
Figure 6 PCM Data Interface
16/25
MSM7575
¡ Semiconductor
Serial Port Data Transfer for MCU Interface
DEN
tM1
DIN
tM3
2
3
4
tM6
tM4
W/R
tM10
tM5
tM2
1
EXCK
A2
5
6
11
12
tM9
tM7
A1
A0
B7
B1
B0
tM11
tM8
DOUT
B7
B1
B0
Figure 7 MCU Interface
17/25
MSM7575
¡ Semiconductor
FUNCTIONAL DESCRIPTION
Control Registers
(1) CR0 (Basic operating mode)
B7
CR0
Initial Value
B6
B5
B4
B3
B2
B1
A/m SEL
MCK SEL
PDN ALL
PDN TX
PDN RX
—
LNR
0
0
0
0
0
0
0
B0
PDN
SAO/AOUT
0
Note) "Initial": Reset state by PDN/RESET
B7 ...PCM Companding law select:
0/µ-law, 1/A-law
B6 ...Master clock frequency select:
0/9.600 MHz, 1/19.200 MHz
B5 ...Power down (whole system):
0/Power on, 1/Power down
When using this data for power down control, pin PDN/RESET should be set at
“H”level. The control registers are not reset by this signal.
B4 ...Power down (Transmit only):
0/Power on, 1/Power down
B3 ...Power down (Receive only including the op-amps of GSX3, GSX4 and comparator): 0/
Power on, 1/Power down
B2 ...Not used
B1 ...PCM interface linear code select:
0/Companding law selected by CR0-B7
1/14-bit Linear code (2's complement) in spite of the value of CR0-B7
B0 ...Power Down for Sounder output amps: (SAO), or Receiver output amp (AOUT, VFRO ):
When this data is set to digital “1”, the circut which is not selected by CR4-B5 are at the
power down state.
When this data is set to digital "0", sounder amplifiers and receiver amplifiers are in the
power-on state.
18/25
MSM7575
¡ Semiconductor
(2) CR1
B7
CR1
Initial Value
B6
B5
TOUT3
TOUT2
TOUT1
–CONT
–CONT
–CONT
0
0
0
B4
B3
B2
B1
B0
—
—
—
—
RX PAD
0
0
0
0
0
B7 ... TOUT3 control bit :
0/TOUT3 = "0", 1/Enable TOUT3
B6 ... TOUT2 control bit :
0/TOUT2 = "0", 1/Enable TOUT2
B5 ... TOUT1 control bit :
0/TOUT1 = "0", 1/Enable TOUT1
B4 ... Not used
B3 ... Not used
B2 ... Not used
B1 ... Not used
B0 ... Receive side PAD : 1/inserted,12 dB loss
0/no PAD
19/25
MSM7575
¡ Semiconductor
(3)CR2 (PCM CODEC operational mode setting and transmit/receive gain adjustment)
B7
CR2
B6
B5
B4
B3
B2
B1
B0
TX ON/OFF TX GAIN2 TX GAIN1 TX GAIN0 RX ON/OFF RX GAIN2 RX GAIN1 RX GAIN0
Initial Value
0
0
1
1
0
0
1
1
B7 ... PCM Coder disable :
0/Enable, 1/Disable (transmit PCM idle pattern)
B6, B5, B4 ... Transmit gain adjustment, refer to Table-2.
B3 ... PCM Decoder disable :
0/Enable, 1/Disable (receive PCM idle pattern)
B2, B1, B0 ... Receive gain setting, refer to Table-2.
Table-2 Transmit/Receive Gain Setting table
B6
B5
B4
Transmit Gain
B2
B1
B0
Receive Gain
0
0
0
–6 dB
0
0
0
–6 dB
0
0
1
–4 dB
0
0
1
–4 dB
0
1
0
–2 dB
0
1
0
–2 dB
0
1
1
0 dB
0
1
1
0 dB
1
0
0
+2 dB
1
0
0
+2 dB
1
0
1
+4 dB
1
0
1
+4 dB
1
1
0
+6 dB
1
1
0
+6 dB
1
1
1
+8 dB
1
1
1
+8 dB
This programmable gain table should be assigned, not only for transmit/receive voice signal, but
also for the transmitted DTMF and other tones. The transmission of these tone signals are
enabled, by the CR4-B6 data described later, The original (reference) signal amplitude of these
tones are analogically defined as follows.
DTMF low-group-tones .................................... –16 dBm0/Tone
DTMF high-group-tones and others............... –14 dBm0/Tone
For example, when selecting +8 dB (B6, B5, B4) = (1,1,1) as a transmit gain, each tone signal
amplitude with analogical expression on the pin PCMSO becomes as follows .
DTMF low-group tones .................................... –8 dBm0
DTMF high-group tones and other tones ...... –6 dBm0
Gain setting of side tone (path to receive side from transmit side) and receive side tone is
performed by register CR3.
20/25
MSM7575
¡ Semiconductor
(4) CR3 (Side tone and other tone generator gain setting)
B7
B6
B5
Side. Tone Side. Tone Side. Tone
CR3
Initial Value
B4
B3
B2
B1
B0
TONE
TONE
TONE
TONE
TONE
GAIN2
GAIN1
GAIN0
ON/OFF
GAIN3
GAIN2
GAIN1
GAIN0
0
0
0
0
0
0
0
0
B7, B6, B5 ... Side tone path gain setting, refer to Table-3.
B4 ... Tone generator enable :
0/Disable, 1/Enable
B3, B2, B1, B0 ... Tone generator gain adjustment for receive side, refer to Table-4
Table-3 Side Tone Gain Setting Table
B7
B6
B5
0
0
0
OFF
0
0
1
–21 dB
0
1
0
–19 dB
0
1
1
–17 dB
1
0
0
–15 dB
1
0
1
–13 dB
1
1
0
–11 dB
1
1
1
–9 dB
Side Tone Path Gain
Table-4 Receive Tone Generator Gain Setting Table
B3
B2
B1
B0
Tone Generator Gain
B3
B2
B1
B0
Tone Generator Gain
0
0
0
0
–36 dB
1
0
0
0
–20 dB
0
0
0
1
–34 dB
1
0
0
1
–18 dB
0
0
1
0
–32 dB
1
0
1
0
–16 dB
0
0
1
1
–30 dB
1
0
1
1
–14 dB
0
1
0
0
–28 dB
1
1
0
0
–12 dB
0
1
0
1
–26 dB
1
1
0
1
–10 dB
0
1
1
0
–24 dB
1
1
1
0
–8 dB
0
1
1
1
–22 dB
1
1
1
1
–6 dB
The tone generator gain setting table for receive side, shown by Table-4, depends upon the
following reference level.
DTMF low-group tones ................................ –2 dBm0
DTMF high-group tones and others ............ 0 dBm0
For example, when selecting –6 dB (B3, B2, B1, B0) = (1, 1, 1, 1) as a tone generator gain, each DTMF
tone signal amplitude on SAO or VFRO is as follows.
DTMF low-group tone .................................. –8 dBm0
DTMF high-group tone or other tones ....... –6 dBm0
21/25
MSM7575
¡ Semiconductor
(5) CR4 (Tone genereator operating mode and frequency setting)
B7
CR4
B6
B5
B4
B3
B2
B1
B0
TONE4
TONE3
TONE2
TONE1
TONE0
0
0
0
0
0
DTMF/OTHERS
TONE
SAO/
SEL
SEND
VFRO
0
0
0
Initial Value
B7 ... DTMF or Other tones select : 0/Others, 1/DTMF
B6 ... Tone transmit enable (Transmit side) : 0/Voice signal (transmit), 1/Tone transmit
B5 ... Tone output pin select (Receive side) : 0/VFRO, 1/SAO
B4, B3, B2, B1, B0 ... Tone frequency setting, referred to Table-5-1, -2.
(a) B7 = 1 (DTMF tone)
Table-5-1
B4
B3
B2
B1
B0
Frequency
B4
B3
B2
B1
B0
Frequency
*
0
0
0
0
697 Hz + 1209 Hz
*
1
0
0
0
852 Hz + 1209 Hz
*
0
0
0
1
697 Hz + 1336 Hz
*
1
0
0
1
852 Hz + 1336 Hz
*
0
0
1
0
697 Hz + 1477 Hz
*
1
0
1
0
852 Hz + 1477 Hz
*
0
0
1
1
697 Hz + 1633 Hz
*
1
0
1
1
852 Hz + 1633 Hz
*
0
1
0
0
770 Hz + 1209 Hz
*
1
1
0
0
941 Hz + 1209 Hz
*
0
1
0
1
770 Hz + 1336 Hz
*
1
1
0
1
941 Hz + 1336 Hz
*
0
1
1
0
770 Hz + 1477 Hz
*
1
1
1
0
941 Hz + 1477 Hz
*
0
1
1
1
770 Hz + 1633 Hz
*
1
1
1
1
941 Hz + 1633 Hz
*Unrelated
(b) B7 = 0 (Other tones)
Table-5-2 Tone Generator Frequency Setting
B4
B3
B2
B1
B0
Frequency
B4
B3
B2
B1
B0
Frequency
0
0
0
0
0
2 k/2.48 kHz, 8 Hz wamble
1
0
0
0
0
2000 Hz
0
0
0
0
1
2 k/2.2 kHz, 8 Hz wamble
1
0
0
0
1
2042 Hz
0
0
0
1
0
2 k/2.48 kHz, 4 Hz wamble
1
0
0
1
0
2514 Hz
0
0
0
1
1
2 k/2.2 kHz, 4 Hz wamble
1
0
0
1
1
500 Hz
0
0
1
0
0
1 k/1.333 kHz, 8 Hz wamble
1
0
1
0
0
667 Hz
0
0
1
0
1
2.73 k/2.5 kHz, 8 Hz wamble
1
0
1
0
1
1333 Hz
0
0
1
1
0
1.8 k/2 kHz, 8 Hz wamble
1
0
1
1
0
2100 Hz
0
0
1
1
1
400 Hz,16 Hz wamble
1
0
1
1
1
—
0
1
0
0
0
400 Hz,20 Hz wamble
1
1
0
0
0
—
0
1
0
0
1
400 Hz
1
1
0
0
1
—
0
1
0
1
0
350 Hz + 440 Hz Mix
1
1
0
1
0
—
0
1
0
1
1
1.5kHz
1
1
0
1
1
—
0
1
1
0
0
1.8kHz
1
1
1
0
0
—
0
1
1
0
1
800 Hz
1
1
1
0
1
—
0
1
1
1
0
1000 Hz
1
1
1
1
0
—
0
1
1
1
1
1300 Hz
1
1
1
1
1
—
22/25
MSM7575
¡ Semiconductor
Wamble Tone Wave
t
Repeatative waveform
Tf1
Tf2
4Hz wamble... Tf1 = Tf2 = 125 ms
8Hz wamble... Tf1 = Tf2 = 62.5 ms
16Hz wamble...Tf1 = Tf2 = 31.25 ms
20Hz wamble...Tf1 = Tf2 = 25 ms
(6) CR5 (Analog switch control)
CR5
Initial Value
B7
B6
B5
B4
B3
B2
B1
B0
SW7_
SW8_
SW9_
SW5&SW6_
SW4_
SW3_
SW2_
SW1_
CONT
CONT
CONT
CONT
CONT
CONT
CONT
CONT
0
0
0
0
0
0
0
0
B7 ... Control Analog switch SW7 between IO12 and VDD :
0/SW7 OFF, 1/SW7 ON
B6 ... Control Analog switch SW8 between IO13 and VDD :
0/SW8 OFF, 1/SW8 ON
B5 ... Control Analog switch SW9 between IO14 and VDD :
0/SW9 OFF, 1/SW9 ON
B4 ... Control Analog switch SW5 between IO9 and IO10, and Analog switch SW6 between IO10
and IO11 :
0/SW5 OFF, SW6 ON, 1/SW5 ON, SW6 OFF
B3 ... Control Analog switch SW4 between IO7 and IO8 :
0/SW4 OFF, 1/SW4 ON
B2 ... Control Analog switch SW3 between IO5 and IO6 :
0/SW3 OFF, 1/SW3 ON
B1 ... Control Analog switch SW2 between IO3 and IO4 :
0/SW2 OFF, 1/SW2 ON
B0 ... Control Analog switch SW1 between IO1 and IO2 :
0/SW1 OFF, 1/SW1 ON
23/25
MSM7575
¡ Semiconductor
(7) CR6 (VOX function control)
CR6
Initial Value
B7
B6
B5
B4
B3
VOX
ON
ON
OFF
VOX IN
ON/OFF
LVL1
LVL0
TIME
0
0
0
0
0
B2
B1
B0
RX NOISE RX NOISE RX NOISE
LEVEL SEL
LVL1
LVL0
0
0
0
B7 ... VOX function enable :
0/Disable, 1/Enable
B6, B5 ... Transmit signal energy detect (Transmit VOX) threshold
(0, 0): –30 dBm0
(0, 1): –35 dBm0
(1, 0): –40 dBm0
(1, 1): –45 dBm0
B4 ... Hang-over time (Fig. 2, TVXOFF) : 0/160 ms, 1/320 ms
B3 ... Receive VOX function setting :
0/Background noise transmit, 1/Voice signal detect
When using this data for control, the pin VOXI should be set at a “L” level.
B2 ... Background noise amplitude setting :
0/Automatic, 1/Programmable by B1 and B0
Automatic : The noise is set at the voice signal amplitude at the time when B3
(or VOXI) changes from “1” to digital “0”.
B1, B0 ... (0, 0):
No noise
(0, 1):
–55 dBm0
(1, 0):
–45 dBm0
(1, 1):
–35 dBm0
(8) CR7 (Detect register, read only)
B7
CR7
Initial
VOX
B6
B5
TX NOISE TX NOISE
OUT
LVL1
LVL0
0
0
0
B4
B3
B2
B1
B0
—
—
—
—
—
*
*
*
*
*
* For IC test
B7 ... Transmit VOX function result :
0/Absence, 1/Presence
B6, B5 ... Transmit voiceless level (indicator) :
(0, 0) : below –60 dBm0
Note) These outputs are valid only when VOX
(0, 1) : –50 to –60 dBm0
function is enabled by CR6-B7.
(1, 0) : –40 to –50 dBm0
(1, 1) : over –40 dBm0
B4 ... Not used
B3 ... Not used
B2 ... Not used
B1 ... Not used
B0 ... Not used
24/25
MSM7575
¡ Semiconductor
PACKAGE DIMENSIONS
(Unit : mm)
QFP64-P-1414-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.87 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
25/25
E2Y0002-29-62
NOTICE
1.
The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.
2.
The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or
unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.
5.
Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.
6.
The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.
7.
Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior
permission.
9.
MS-DOS is a registered trademark of Microsoft Corporation.
Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan