E2D0097-19-94 ¡ Semiconductor MSM9831-xxx ¡ Semiconductor This version: Sep. 1999 MSM9831-xxx VOICE SYNTHESIS LSI with on-chip 384Kbit MASK ROM GENERAL DESCRIPTION MSM9831 is a PCM-based Voice Synthesis LSI (Playback only) with on-chip 384Kbit Mask ROM, D/A Converter and Low-Pass Filter. Serial input interface for an external MCU makes MSM9831 a better choice for size-critical applications with less wiring pin-count in small foot-print packaging. FEATURES • 8-bit OKI Non-Linear PCM Algorithm • Sampling Frequency (Selectable on each phrase) 4.0/5.3/6.4/8.0/10.6/12.8/16.0 kHz • On-chip Mask ROM Capacity : 384 Kbits • Maximum Playback Time Length 12.0 sec. at fsam = 4.0 kHz 6.0 sec. at fsam = 8.0 kHz 3.0 sec. at fsam = 16.0 kHz • Clock Oscillation 3.5 to 4.5 MHz (Ceramic Oscillation) 3.5 to 17 MHz (External Clock) • User definable Phrase Control Table function • Maximum number of Phrases : 31 phrases • 10-bit current-output-type D/A Converter • A built-in LPF • Power Supply Voltage : +2.0 to +5.5 V (External Clock) +2.5 to +5.5V (Ceramic Oscillation) • Package: 8-Pin SOP Package (SOP8-P-250-1.27-K) (Product name: MSM9831-xxx MA) COMPARISON TABLE WITH MSM9802 MSM9831 Mask ROM Capacity Interface Oscillation Max. Phrase Number Status Signal Output D/A Converter Current Flowing MSM9802 384K Bit 512K Bit MCU (Serial) MCU (Parallel)/Stand-alone Ceramic/External Clock Ceramic/CR 31 63 None NAR/BUSY Forced into the circuit Forced out of the circuit 1/22 ¡ Semiconductor MSM9831-xxx PIN CONFIGURATION (TOP VIEW) ST 1 8 PDWN PI 2 7 XT GND 3 6 XT AOUT 4 5 VDD 8-pin Plastic SOP BLOCK DIAGRAM 16 384-Kbit ROM 8 ST PI Serial Interface 5 2-Kbit ROM Phrase Control Table 16-bit Address controller 8 PDWN 2-Kbit ROM Phrase Addres Table Test ROM 2-Kbit Reset, Power Down Timing 8 Controller XT OSC XT Circuit PCM data Area PCM Synthesizer 378-Kbit 10 10-bit DAC LPF VDD GND AOUT 2/22 ¡ Semiconductor MSM9831-xxx PIN DESCRIPTIONS Pin Symbol I/O 1 ST I Description Playback starter pin. Phrase Address (number) is determined by the number of times of input to PI pin while ST being held "L". Playback starts on ST's rising edge with phrase address data loaded into the LSI. When no pulse input to PImade while ST being held "L", the LSI recognizes it as "Stop Code" to stop playback. 2 PI I Address input pin. The phrase number to playback is determined by the times of pulse pulse input to PI pin while ST being held "L". 32-time pulse input has the internal counter initialized. 3 GND — GND pin. 4 AOUT O Analog output pin. Built with N-MOS open-drain type, wave-form output is made in the form of changing output current. While PDWN being held "H", AOUT maintains 1/2 level output, thus the current keeps on flowing. The Pop-Noise Canceller is put into works when standby is reset to return to be active, and when entering into standby mode. 5 VDD — 6 XT I Power supply pin. Insert a 0.1mF or larger by-pass capacitor in-between GND pin and this pin. Wired to the ceramic oscillator when a ceramic oscillator is in use. Input the clock signal to this pin when the external clock is selected as the timing source. Using a ceramic oscillator or an external clock can be selected with OKI's Analizing and Editing Tool. 7 XT O 8 PDWN I Wired to the ceramic oscillator when a ceramic oscillator is in use. When the external clock is in use, keep this pin open. The LSI remains in standby mode while this pin is being held "L". 3/22 ¡ Semiconductor MSM9831-xxx ABSOLUTE MAXIMUM RATINGS (GND=0V) Parameter Power Supply Voltage Input Voltage Storage Temperature Symbol VDD VIN TSTG Condition Ta = 25°C Rating –0.3 to +7.0 Unit V –0.3 to VDD+0.3 V –55 to +150 °C — RECOMMENDED OPERATING CONDITIONS (GND=0V) Parameter Power Supply Voltage Symbol VDD Condition Range Unit With a Ceramic Osc. (Note) 2.5 to 5.5 V With the external clock fOSC=3.5 MHz to 4.5 MHz 2.0 to 5.5 V With the external clock fOSC=3.5 MHz to 14.5 MHz 2.7 to 5.5 V With the external clock fOSC=3.5 MHz to 17 MHz 3.0 to 5.5 V Min. Typ. Max. 3.5 4.096 4.5 MHz With the external clock VDD=2.0 V to 5.5 V 3.5 4.096 4.5 MHz With the external clock VDD=2.7 V to 5.5 V 3.5 — 14.5 MHz With the external clock VDD=3.0 V to 5.5 V 3.5 — 17 MHz With a Ceramic Osc. VDD=2.5 V to 5.5 V (Note) Master Clock Frequency Operating Temperature fOSC Top — –40 to +85 °C Note: A crystal that is usable in this LSI is described in "Functional Description" of this document. If you want to use a different crystal, it is recommended to evaluate the crystal before using it. 4/22 ¡ Semiconductor MSM9831-xxx ELECTRICAL CHARACTERISTICS DC Characteristics (VDD=2.0 to 5.0 V, GND=0 V, fOSC=4.096 MHz, Ta=–40 to +85°C, unless otherwise specified) Parameter "H" Input Voltage Symbol VIH Condition VDD fOSC=4.5 MHz or less (VDD=2.0 V to 5.5 V) ¥ 0.8 fOSC>14.5 MHz (VDD=3.0 V to 5.5 V) fOSC=14.5 MHz or less (VDD=2.7 V to 5.5 V) "L" Input Voltage VIL Min. fOSC=14.5 MHz or less (VDD=2.7 V to 5.5 V) fOSC=4.5 MHz or less (VDD=2.0 V to 5.5 V) fOSC>14.5 MHz (VDD=3.0 V to 5.5 V) VDD ¥ 0.85 Typ. Max. Unit — — V — — V — — — — VDD ¥ 0.2 VDD ¥ 0.15 V V "H" Input Current IIH VIH=VDD — — 10 mA "L" Input Current IIL VIL=GND –10 — — mA Dynamic Supply Current Standby Supply Current AOUT Output Current AOUT output IDD current is excluded fOSC=4.096 MHz — 1.2 3.0 mA VDD=3.0 V fOSC=4.096 MHz — 0.4 1.0 mA VDD=2.0 V fOSC=4.096 MHz — 0.2 0.7 mA VDD=5.5 V fOSC=16 MHz — — 12.0 mA VDD=3.0 V fOSC=16 MHz — — 4.0 mA VDD=2.0 V fOSC=16 MHz — — 2.8 mA — — 10 mA Ta=–40°C to +70°C IDS IAOUT VDD=5.5 V — — 50 mA VDD=2.0 V to 5.5 V 0.4 — 8.9 mA VDD=5.5 V 3.8 6.0 8.9 mA VDD=2.0 V 0.4 1.0 1.9 mA Ta=–40°C to +85°C At maximum output current 5/22 ¡ Semiconductor MSM9831-xxx AC Characteristics (Oscillation Frequency at fOSC=4.096 MHz, VDD=2.0 to 5.0 V, GND=0 V, Ta=–40 to +85°C) Parameter Symbol Condition Min. Typ. Max. Unit Master Clock duty cycle fduty — 40 50 60 % Time before RESET input after Power On tRST — 10 — — ms PDWN hold time after RESET input tPDH — 10 — — ms tDAR, tDAF — 60 64 68 ms PDWN-ST setup time tPDSS — 1 — — ms ST-PI setup time tSPS — 1 — — ms PI pulse width tPW — 0.35 — 2000 ms PI cycle time tPC — 0.7 — 4000 ms DA Converter shifting time (Pop-Noise Canceller working time) *1 ST-PI hold time tSPH — 1 — — ms ST-AOUT setup time *2 tSAS fSAM=8.0 kHz — — 1050 ms Phrase stop time *2 tDPS fSAM=8.0 kHz — — 700 ms Silence in-between phrases *2 tBLN fSAM=8.0 kHz — — 700 ms tSSW — 0.35 — 2000 ms Stop ST pulse width Phrase ST-Phrase ST pulse interval *2 tPP fSAM=8.0 kHz 1050 — — ms Phrase ST-Stop ST pulse interval *2 tPS fSAM=8.0 kHz 1050 — — ms Stop ST-Phrase ST pulse interval *2 tSP fSAM=8.0 kHz 500 — — ms Sampling Freqnency *3 fSAM — 3.9 — 28.0 kHz *1 Proportional to the period of oscillation frequency (fOSC). *2 Proportional to the period of sampling frequency (fSAM). *3 The sampling frequency (fSAM) is determined by the oscillation frequency (fOSC) and the frequency dividing ratio selected for each phrase. 6/22 ¡ Semiconductor MSM9831-xxx TIMING DIAGRAMS 1. Power-On VDD PDWN (I) tRST ST (I) PI (I) tPDH Reset Power Down Note: A level input in combination of PDWN="L", ST="L" and PI="H" resets the LSI. After Power-On, you need to do an initial reset as shown in the above chart. 2. Activating the LSI and Standby Mode PDWN (I) AOUT (O) 1 2 IAOUT tDAR tDAF 7/22 ¡ Semiconductor MSM9831-xxx 3. Playback PDWN (I) ST (I) PI (I) tSPH tSPS tPW AOUT (O) tPC tPDSS tSAS 4. Re-inputting the address while playback is going on ST (I) PI (I) AOUT (O) tDPS tBLN tPP Current phrase stops Next phrase starts 8/22 ¡ Semiconductor MSM9831-xxx 5. Stop Code Input ST (I) PI (I) tSSW AOUT (O) tDPS tPS tSP Current phrase stops 9/22 ¡ Semiconductor MSM9831-xxx FUNCTIONAL DESCRIPTION 1. Sampling Frequency Sampling Frequency can be selected and setup on each phrase address. 7 sampling frequencies are available for user's choice in preparing Voice Data File at the pre-production stage. Select sampling frequencies to satisfy fSAM=3.9 to 28.0 kHz obtained by frequency dividing ratios in Table 1.1. Table 1.1 Sampling Frequency Sampling Frequency (fOSC=4.096MHz) Frequency diving ratio 4.0kHz fOSC/1024 5.3kHz fOSC/768 6.4kHz fOSC/640 8.0kHz fOSC/512 10.6kHz fOSC/384 12.8kHz fOSC/320 16.0kHz fOSC/256 2. Recording/Playback Time Figure 2.1 below shows memory allocation of on-chip 384K bit Mask ROM. The Mask ROM is partitioned into 4 data areas: user's Area, Phrase Control Table Area, Phrase Control Area and Test Data Area. Actual memory space is the total Mask ROM capacity (384K bit) indicated in this document minus 6K bit. Phrase Control Table Area 2K bit Phrase Data Control Area 2K bit Test Data Area 2K bit User's Area 378K bit Figure 2.1 Memory Allocation of on-chip Mask ROM (384K bit) 10/22 ¡ Semiconductor MSM9831-xxx The playback time is obtained by dividing the memory capacity by the bit rate. The playback time for 8-bit PCM algorithm is obrained by using the following equation. Playback time [sec] = Memory capacity [bit] Bit rate [bps] = Memory capacity [bit] Sampling frequency [Hz] ¥ 8 [bit] For example, if all phrases are stored in the MSM9802 at 8 kHz sampling frequency, the maximum playback time is as follows. Playback time = (384–6) ¥ 1024 [bit] 8000 [Hz] ¥ 8 [bit] = 6.0 [sec] 3. Playback Method The MSM9831 uses OKI non-linear PCM algorithm. In the mid-range of waveform, OKI 8-bit non-linear PCM has precision equivalent to that of 10bit straight PCM. 4. Inserting Silence In addition to normal recorded sound phrases, the MSM9831 allows a user to play back or insert silence (silent phrase). User can set up time length of silence from a minimum of 32ms to a maximum of 996ms in 32ms step when fOSC=4.096 MHz. These time lengths are directly proportioned to the clock (fOSC) period. 11/22 ¡ Semiconductor MSM9831-xxx 5. Phrase Control Table Because the LSI contains the Phrase Control Table, it is possible to play back multiple phrases in succession by a single easy control operation like controlling a single regular phrase playback. Up to 8 combined phrases including a silence can be registered in a single address in the Phrase Control Table. Further, you can use the maximum memory space for data storage because it is not required to have the same phrase data. To show an example, let's assume that your application needs to speak two similar sentences, "It is fine today" and "It is rainy today." The two sentences have the common words "it", "is" and "today". What you have to do is to prepare these common sound data, not in sentences but in words, and to store each combined phrase data in Phrase Control Table as shown in Table 4.1 and Figure 4.1 Multiple phrases can be played continuously merely by specifying a desired phrase using an X address. For an example from Table 4.1, when address "01" is specified, "It is fine today" is played, and when address"02" is specified, "It is rainy" is played. Phrase Control Table, a silence can be inserted without using the User's Area. Minimum time for silence Maximum time for silence Time unit for setting up silence 32 ms 992 ms 32 ms Table 4.1 Matrix of the Phrase Control Table No. X-Address Y-Address (HEX) (Up to 8 phrases) Sound Data It is (silence) fine today. [01] [02] Silence [05] [03] It is (silence) rainy today. 3 03 [01] [02] [04] [09] [06] [05] [0A] [03] It is fine becoming cloudy, rainy in some areas today. 30 1E 31 1F ··· [01] [02] Silence [04] [03] 02 ··· 01 2 ··· 1 12/22 ¡ Semiconductor MSM9831-xxx Figure 4.1 Phrase Combination Matrix for Phrase Control Table Phrase Control Table Area No. X-Address Phrase Data Registration Area Phrase Addigned No. Y-Address Phrase 1 01 2 02 2 [02] is 2 02 is 3 03 3 Silence (64ms) 3 03 today 4 04 4 [05] rainy 4 04 fine 5 05 5 [03] today 5 05 rainy 6 06 6 — 6 06 cloudy 7 07 7 — 7 07 snowy 8 08 8 — 8 08 occasionally 9 09 09 becoming 10 0A in some areas length (32ms¥n) 31 1F — n Silence time length 1 32 ms 2 64 ms ··· 1F 9 Setting of silence time ··· 31 it ············· it ············· [01] ············· 1 ······· 01 ······· 1 31 992 ms The silence time lengths are directly proportional to the clock (fOSC) period. 13/22 ¡ Semiconductor VDD PDWN (I) Phrase 01 Selected Phrase 02 Selected Phrase 03 Selected Phrase 01 Selected Stop Code ST (I) PI (I) AOUT (O) Reset Power Down It is fine today It is rainy today It is fine becoming cloudy, rainy in some areas today. It is fine today Playback Phrase 01 Playback Phrase 02 Playback Phrase 03 Playback Phrase 01 Power Down Enter into Stand-by mode Enter into Stand-by mode Current phrase stops Playback stops Figure 5.2 Playback timing when using phrase control data MSM9831-xxx 14/22 ¡ Semiconductor MSM9831-xxx 6. Oscillation, Clock Signal Input 6-1 Using a Ceramic Oscillator Figure 6.1 shows an oscillation circuit diagram using a Ceramic Oscillator. (Select Use a Ceramic Oscillator option on selecting options) MSM9831 MSM9831 XT XT C1 XT XT C2 External capacitor type Internal capacitor type Figure 6.1 Oscillation Circuit with an external ceramic oscillator The optimal load capacities when connecting ceramic oscillators from MURATA MFG., KYOCERA CORPORATION, and TDK CORPORATION are shown below for reference. Optimal load Ceramic oscillator Maker MURATA MFG. Type CSA4.00MG capacity Freq (MHz) C1 (pF) C2 (pF) 4.0 CSA4.00MGW TDK CORPORATION 30 30 Built in Built in CSAC4.00MGC 30 30 CSTCC4.00MG Built in Built in CSA4.00MGU 30 30 CST4.00MGWU Built in Built in Supply Voltage Range (V) 3.0 to 5.5 30 30 CSTCC4.00MGU Built in Built in 2.6 to 5.5 33 33 2.5 to 5.5 Built in Built in 2.5 to 5.5 33 33 2.5 to 5.5 Built in Built in 4.0 FCR4.0MC5 Temperature Rnage (°C) –40 to +85 2.7 to 5.5 CSAC4.00MGCU FCR4.0M5 Operating –40 to +85 CCR4.0MC3 KYOCERA KBR-4.0MSA CORPORATION KBR-4.0MSB KBR-4.0MKC 4.0 –20 to +80 KBR-4.0MKD KBR-4.0MKS 33 33 PBRC4.00A Built in Built in PBRC4.00B 33 33 15/22 ¡ Semiconductor MSM9831-xxx 6-2 Using External Clock Input Figure 6.2 shows an oscillation circuit diagram using an external clock input. XT XT Open External Clock, etc. as the timing source Figure 6.2 Oscillation Circuit using an external clock input 16/22 ¡ Semiconductor MSM9831-xxx 7. Low-Pass Filter In this IC, all voice outputs are through the built-in low-pass filter (LPF). Figure 7.1 and Table 7.1 show the LPF frequency characteristics and LPF cutoff frequency respectively. The frequency characteristics and cutoff frequencies are directly proportional to sampling frequencies. Only the voice output through LPF in this IC is enabled. [dB] 20 10 0 –10 –20 –30 –40 –50 –60 –70 –80 100 10 1k 10k [Hz] Figure 7.1 LPF Frequency Characteristics (fSAM=8 kHz) Table 7.1 LPF Cutoff Frequency Sampling Frequency (kHz) (fSAM) Cutoff Frequency (kHz) (fCUT) 4.0 5.3 1.2 1.6 6.4 2.0 8.0 2.5 10.6 3.2 12.8 4.0 16.0 5.0 17/22 ¡ Semiconductor MSM9831-xxx Connecting the MSM9831 to Speaker Driving Amplifier The MSM9831 uses a current output type D/A converter. When the MSM9831 is connected to a voltage input type amplifier, it is required to convert the voice signal that is output as "change of current" into the voice signal that is output as "change of voltage". The connection between the MSM9831 and MSC1157 (OKI speaker driving amplifier) when a resistor is used for the above conversion is described below. Circuit connection example 1: When VDD=5.0V and the amplitude of Ain of the MSC1157 is 2.5VP-P + SP SP XT – 4.096MHz STBY VR + – XT SEL GND GND 4.7mF PDWN Ain MSC1157 PI P1.0 VCC 47nF AOUT MSM9831 P1.1 MCU ST + – 10mF 500W VDD P1.2 0.1mF +5V 0.1mF +5V (Ceramic oscillation is selected) Circuit connection example 2: When VDD=3.0V and the amplitude of Ain of the MSC1157 is 1.5VP-P P1.0 PDWN CLK XT SP SP XT 10mF 620W Ain + – MSC1157 PI VCC 47nF AOUT MSM9831 P1.1 MCU ST + – STBY VR + – GND SEL GND 4.7mF VDD P1.2 0.1mF +3V 0.1mF +3V (External clock input is selected) 18/22 ¡ Semiconductor MSM9831-xxx Use a resistor with an appropriate value (RL) considering the output voltage (reference the drawing below). Relationship between AOUT pin voltage and AOUT output current at VDD=5V RL=500W 6 RL=200W Maximum output current 4 3 Output current at waveform center 2 RL=5kW 1 0 2 3 4 5 * When RL is too high when RL=200W are generated when RL=5kW Shift to standby (1) Normal voice waveform is obtained Shift to standby (2) Voice waveform is distorted and pop noises Playback Standby Power down Power down Playback Standby Power down VAOUT (V) Power down 1 Time 0 Time IAOUT (mA) 5 19/22 ¡ Semiconductor MSM9831-xxx D/A CONVERTER OUTPUT CURRENT Relationship between supply voltage and AOUT output current (Ta=25°C, VAOUT=VDD, PCM at maximum) AOUT outptu current (mA) 6 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Supply voltege (V) Relationship between ambient temperature and AOUT output current (VAOUT=VDD, PCM at maximum) AOUT outptu current (mA) 6 5 VDD=5V 4 3 VDD=3V 2 1 0 –40 –20 0 20 40 60 80 100 Ambient temperature (°C) Relationship between AOUT pin voltage and AOUT output current (Ta=25°C, VDD=5.0V, PCM at maximum) AOUT outptu current (mA) 6 5 4 3 2 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 AOUT pin voltage (V) 20/22 ¡ Semiconductor MSM9831-xxx NOTES 1. Internal converter circuit The MSM9831 has not employed a voltage output type D/A converter but a current output type D/A converter. Therefore, the voice output circuit of the MSM9831 is different from that of the MSM6650 family product which has employed a voltage output type D/A converter. The voice output circuit of the MSM9831 also is different from that of the MSM9800 family product because the MSM9831 has employed a current flowing-in type D/A converter and the MSM9800 family product has employed a current flowing-out type D/A converter. (See the table below) D/A converter circuit type D/A converter output circuit MSM6650 family Voltage output type — MSM9800 family Current output (flowing-out) type P-MOS open drain MSM9831 Current output (flowing-in) type N-MOS open drain Product name Circuit connection between the MSM9831 and amplifier IC Resistor for conversion from current to voltage VDD MSM9831 AOUT D/A converter GND AMP Current flowing direction Circuit connection between the MSM9800 family product and amplifier IC Current flowing direction VDD D/A converter AOUT AMP MSM9800 family GND Resistor for conversion from current to voltage 2. Ceramic oscillator A crystal that is usable in this LSI is described in "Functional Description" of this document. If you want to use another crystal, it is recommended to evaluate the crystal before using it. 21/22 ¡ Semiconductor MSM9831-xxx PACKAGE DIMENSIONS (Unit : mm) SOP8-P-250-1.27-K Mirror finish Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5 mm or more 0.10 TYP. Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 22/22 E2Y0002-29-62 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. 9. MS-DOS is a registered trademark of Microsoft Corporation. Copyright 1999 Oki Electric Industry Co., Ltd. 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