VLMC310. Vishay Semiconductors Low Current SMD LED PLCC-2 FEATURES • SMD LED with exceptional brightness • Compatible with automatic placement equipment e3 • EIA and ICE standard package • Compatible with infrared, vapor phase and wave solder processes according to CECC 00802 and J-STD-020C • Available in 8 mm tape • Low profile package • Non-diffused lens: excellent for coupling to light pipes and backlighting • Very low power consumption • Luminous intensity ratio in one packaging unit IVmax/IVmin ≤ 2.0 • Lead (Pb)-free device • Preconditioning: according to Jedec level 2a • Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC 19225 DESCRIPTION These new devices have been designed to meet the increasing demand for low current SMD LEDs. The package of the VLMC310. is the PLCC-2 (equivalent to a size B tantalum capacitor). It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA • Product group: LED • Package: SMD PLCC-2 • Product series: low current • Angle of half intensity: ± 60° APPLICATIONS • Automotive: backlighting in dashboards and switches • Telecommunication: indicator and backlighting in telephone and fax • Indicator and backlight for audio and video equipment • Indicator and backlight for battery driven equipment • Small indicator for outdoor applications • Indicator and backlight in office equipment • Flat backlight for LCDs, switches and symbols • General use PARTS TABLE PART COLOR, LUMINOUS INTENSITY TECHNOLOGY VLMC3100 Green, IV > 0.71 mcd GaP on GaP VLMC3101 Green, IV > 1.12 mcd GaP on GaP Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 1 VLMC310. Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS1) VLMC310. PARAMETER TEST CONDITION SYMBOL VALUE Reverse voltage VR 6 V DC Forward current IF 7 mA IFSM 2) tp ≤ 10 µs Surge forward current UNIT 0.5 A Power dissipation PV 20 mW Junction temperature Tj 100 °C Tamb - 40 to + 100 °C Operating temperature range Tstg - 40 to + 100 °C t≤5s Tsd 260 °C mounted on PC board (pad size > 16 mm2) RthJA 500 K/W Storage temperature range Soldering temperature Thermal resistance junction/ ambient Note: 1) Tamb = 25 °C unless otherwise specified 2) Driving the LED in reverse direction is suitable for a short term application OPTICAL AND ELECTRICAL CHARACTERISTICS1) VLMC310., GREEN PARAMETER TEST CONDITION PART SYMBOL MIN TYP. VLMC3100 IV 0.71 1.6 VLMC3101 IV 1.12 1.6 562 Luminous intensity 2) IF = 2 mA Dominant wavelength IF = 2 mA λd Peak wavelength IF = 2 mA λp 565 Angle of half intensity IF = 2 mA ϕ ± 60 Forward voltage IF = 2 mA VF 1.9 Reverse voltage IR = 10 µA VR VR = 0, f = 1 MHz Cj Junction capacitance MAX mcd mcd 575 6 UNIT nm nm deg 2.4 V 15 V 50 pF Note: 1) T amb = 25 °C unless otherwise specified 2) in one Packing Unit IVmax/IVmin ≤ 2.0 LUMINOUS INTENSITY CLASSIFICATION COLOR CLASSIFICATION GROUP GREEN GROUP DOM. WAVELENGTH (NM) STANDARD OPTIONAL MIN MAX E1 E2 F1 1 2 1 0.71 0.90 1.12 0.90 1.12 1.40 MIN. MAX. 3 562 565 4 564 567 5 566 569 6 568 571 7 570 573 8 572 575 Note: Wavelengths are tested at a current pulse duration of 25 ms and an accuracy of ± 1 nm. LIGHT INTENSITY (MCD) Note: Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± 11 %. The above Type Numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable. www.vishay.com 2 Document Number 81649 Rev. 1.1, 18-Sep-07 VLMC310. Vishay Semiconductors TYPICAL CHARACTERISTICS Tamb = 25 °C, unless otherwise specified I v rel - Relative Luminous Intensity IF - Forward Current (mA) 10 8 6 4 2 0 Green 1.2 0.8 0.4 I F = 2 mA 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) 95 10842 Figure 1. Forward Current vs. Ambient Temperature 0° 10° 0 20 40° 1.0 0.9 50° 0.8 60° 70° 0.7 80° 60 80 100 Figure 4. Rel. Luminous Intensity vs. Ambient Temperature 20° 30° 40 Tamb - Ambient Temperature (°C) 95 10057 2.4 I v rel - Specific Luminous Intensity 0 IV rel - Relative Luminous Intensity 1.6 green 2.0 1.6 1.2 0.8 0.4 0 0.6 95 10319 0.4 0.2 0 0.2 0.4 16486 Figure 2. Rel. Luminous Intensity vs. Angular Displacement 50 0.2 100 0.1 200 0.05 500 I F/mA 0.02 tp/T 100 I v rel - Relative Luminous Intensity I F - Forward Current (mA) 20 0.5 Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle 100 Green 10 1 tp/T= 0.001 tp = 10 µs 0.1 0 95 10056 10 1 0.6 1 2 3 4 5 VF - Forward Voltage (V) Figure 3. Forward Current vs. Forward Voltage Document Number 81649 Rev. 1.1, 18-Sep-07 Green 10 1 0.1 0.01 0.1 95 10059 1 10 100 I F - Forward Current (mA) Figure 6. Relative Luminous Intensity vs. Forward Current www.vishay.com 3 VLMC310. Vishay Semiconductors IVrel - Relative Luminous Intensity 1.2 green 1.0 0.8 0.6 0.4 0.2 0 520 540 560 580 600 620 λ - Wavelength (nm) 95 10038 Figure 7. Relative Intensity vs. Wavelength PACKAGE DIMENSIONS in millimeters Mounting Pad Layout 1.2 4 2.6 (2.8) area covered with solder resist 4 1.6 (1.9) 20541 www.vishay.com 4 Document Number 81649 Rev. 1.1, 18-Sep-07 VLMC310. Vishay Semiconductors METHOD OF TAPING/POLARITY AND TAPE AND REEL REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS18 (= 8000 PCS.) PREFERRED SMD LED (VLM3 - SERIES) Vishay’s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 40 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. 10.4 8.4 120° 4.5 3.5 13.00 12.75 2.5 1.5 62.5 60.0 Identification Label: Vishay Type Group Tape Code Production Code Quantity Adhesive Tape Blister Tape 14.4 max. 321 329 18857 Figure 10. Reel Dimensions - GS18 Component Cavity SOLDERING PROFILE 94 8670 IR Reflow Soldering Profile for Lead (Pb)-free Soldering TAPING OF VLM.3.. Preconditioning acc. to JEDEC Level 2a 300 3.5 3.1 2.2 2.0 3.6 3.4 4.0 3.6 8.3 7.7 Temperature (°C) 5.75 5.25 1.85 1.65 1.6 1.4 4.1 3.9 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp down 6 °C/s max. ramp up 3 °C/s 50 0.25 4.1 3.9 max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 0 2.05 1.95 0 94 8668 50 100 150 Time (s) 200 Figure 8. Tape Dimensions in mm for PLCC-2 250 300 max. 2 cycles allowed 19885 Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile (acc. to J-STD-020C) REEL PACKAGE DIMENSION IN MM FOR SMD LEDS, TAPE OPTION GS08 (= 1500 PCS.) TTW Soldering 300 948626-1 (acc. to CECC00802) 5s Lead Temperature 250 4.5 3.5 2.5 1.5 Temperature (°C) 10.0 9.0 120° 13.00 12.75 63.5 60.5 Identification 200 second wave 235 °C...260 °C first wave full line: typical dotted line: process limits ca. 2 K/s ca. 200 K/s 150 100 °C...130 °C 100 ca. 5 K/s 2 K/s 50 forced cooling Label: Vishay Type Group Tape Code Production Code Quantity 0 0 50 100 150 200 250 Time (s) 180 178 Figure 12. Double Wave Soldering of Opto Devices (all Packages) 14.4 max. 94 8665 Figure 9. Reel Dimensions - GS08 Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 5 VLMC310. Vishay Semiconductors BAR CODE PRODUCT LABEL EXAMPLE: 106 A H VISHAY 37 B C D E F G 20127 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: J1 = code for luminous intensity group D) Date code year/week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminium bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: • Storage temperature 10 °C to 30 °C • Storage humidity ≤ 60 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 192 h at 40 °C + 5 °C/ - 0 °C and < 5 % RH (dry air/ nitrogen) or 96 h at 60 °C + 5 °C and < 5 % RH for all device containers or 24 h at 100 °C + 5 °C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A112 level 2a label is included on all dry bags. L E V E L CAUTION This bag contains MOISTURE –SENSITIVE DEVICES 2a 1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 260°C) must be: a) Mounted within 672 hours at factory condition of < 30°C/60%RH or b) Stored at <10% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >10% when read at 23°C + 5°C or b) 2a or 2b is not met. Aluminum bag Label 4. If baking is required, devices may be baked for: 192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen) or o or 96 hours at 60±5 Cand <5%RH For all device containers 24 hours at 100±5°C Not suitable for reels or tubes Bag Seal Date: ______________________________ (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A113 Reel 15973 FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. 19786 Example of JESD22-A112 level 2a label ESD PRECAUTION Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the Antistatic Shielding Bag. Electro-Static Sensitive Devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The Vishay Semiconductors standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain Vishay Semiconductors specific data. www.vishay.com 6 Document Number 81649 Rev. 1.1, 18-Sep-07 VLMC310. Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Document Number 81649 Rev. 1.1, 18-Sep-07 www.vishay.com 7 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1