POINN TIC108M

TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
Copyright © 1997, Power Innovations Limited, UK
●
5 A Continuous On-State Current
●
20 A Surge-Current
●
Glass Passivated Wafer
●
400 V to 800 V Off-State Voltage
●
Max IGT of 1 mA
APRIL 1971 - REVISED MARCH 1997
TO-220 PACKAGE
(TOP VIEW)
K
1
A
2
G
3
Pin 2 is in electrical contact with the mounting base.
MDC1ACA
absolute maximum ratings over operating case temperature (unless otherwise noted)
RATING
SYMBOL
TIC108D
Repetitive peak off-state voltage (see Note 1)
Repetitive peak reverse voltage
TIC108M
TIC108S
VALUE
VDRM
600
700
TIC108N
800
TIC108D
400
TIC108M
TIC108S
VRRM
Average on-state current (180° conduction angle) at (or below) 80°C case temperature
(see Note 3)
600
700
V
V
800
TIC108N
Continuous on-state current at (or below) 80°C case temperature (see Note 2)
UNIT
400
IT(RMS)
5
A
IT(AV)
3.2
A
A
Surge on-state current (see Note 4)
ITM
20
Peak positive gate current (pulse width ≤ 300 µs)
IGM
0.2
A
Peak gate power dissipation (pulse width ≤ 300 µs)
PGM
1.3
W
PG(AV)
0.3
W
Operating case temperature range
TC
-40 to +110
°C
Storage temperature range
Tstg
-40 to +125
°C
TL
230
°C
Average gate power dissipation (see Note 5)
Lead temperature 1.6 mm from case for 10 seconds
NOTES: 1. These values apply when the gate-cathode resistance RGK = 1 kΩ.
2. These values apply for continuous dc operation with resistive load. Above 80°C derate linearly to zero at 110°C.
3. This value may be applied continuously under single phase 50 Hz half-sine-wave operation with resistive load. Above 80°C derate
linearly to zero at 110°C.
4. This value applies for one 50 Hz half-sine-wave when the device is operating at (or below) the rated value of peak reverse voltage
and on-state current. Surge may be repeated after the device has returned to original thermal equilibrium.
5. This value applies for a maximum averaging time of 20 ms.
.
PRODUCT
INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
electrical characteristics at 25°C case temperature (unless otherwise noted)
PARAMETER
IDRM
IRRM
IGT
VGT
IH
TEST CONDITIONS
Repetitive peak
off-state current
Repetitive peak
reverse current
Gate trigger current
Gate trigger voltage
MIN
TYP
RGK = 1 kΩ
TC = 110°C
400
µA
VR = rated VRRM
IG = 0
TC = 110°C
1
mA
1
mA
VAA = 6 V
RL = 100 Ω
tp(g) ≥ 20 µs
VAA = 6 V
RL = 100 Ω
TC = - 40°C
tp(g) ≥ 20 µs
RGK = 1 kΩ
VAA = 6 V
RL = 100 Ω
tp(g) ≥ 20 µs
RGK = 1 kΩ
VAA = 6 V
RL = 100 Ω
tp(g) ≥ 20 µs
RGK = 1 kΩ
VAA = 6 V
RGK = 1 kΩ
0.2
1.2
0.4
TC = 110°C
0.6
TC = - 40°C
dv/dt
NOTE
voltage
Critical rate of rise of
off-state voltage
ITM = 5 A
(see Note 6)
VD = rated VD
RGK = 1 kΩ
V
15
mA
10
Initiating IT = 20 mA
V TM
1
0.2
RGK = 1 kΩ
VAA = 6 V
Peak on-state
UNIT
VD = rated VDRM
Initiating IT = 20 mA
Holding current
MAX
1.7
TC = 110°C
80
V
V/µs
6: This parameter must be measured using pulse techniques, tp = 300 µs, duty cycle ≤ 2 %. Voltage sensing-contacts, separate from
the current carrying contacts, are located within 3.2 mm from the device body.
thermal characteristics
MAX
UNIT
RθJC
Junction to case thermal resistance
PARAMETER
MIN
TYP
3.5
°C/W
RθJA
Junction to free air thermal resistance
62.5
°C/W
MAX
UNIT
resistive-load-switching characteristics at 25°C case temperature
PARAMETER
tgt
tq
Gate-controlled
turn-on time
Circuit-commutated
turn-off time
PRODUCT
2
TEST CONDITIONS
MIN
TYP
IT = 5 A
IG = 10 mA
See Figure 1
2.9
µs
IT = 5 A
IRM = 8 A
See Figure 2
13.3
µs
INFORMATION
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
PARAMETER MEASUREMENT INFORMATION
30 V
6Ω
IT
VG
VA
10%
t gt
DUT
RG
G
VG
VA
IG
90%
PMC1AA
Figure 1. Gate-controlled turn-on time
30 V
6Ω
0.1 µ F
to 0.5 µ F
R2
IA
R1
VA
DUT
TH1
RG
RG
G1
V G1
VK
(IRM Monitor)
IG
IG
0.1 Ω
V G2
NOTES: A. Resistor R1 is adjusted for the specified value
of I RM .
B. Resistor R2 value is 30/IH , where I H is the
holding current value of thyristor TH1.
C. Thyristor TH1 is the same device type as the
DUT.
D. Pulse Generators, G1 and G2, are
synchronised to produce an on-state anode
current waveform with the following
characteristics:
tP = 50 µs to 300 µs
G2
duty cycle = 1%
E. Pulse Generators, G1 and G2, have output
pulse amplitude, V G , of ≥ 20 V and duration of
10 µs to 20 µs.
G2 t P Synchronisation
V G1
V G2
IT
IA
tP
0
IRM
VA
VT
0
tq
PMC1AB
Figure 2. Circuit-commutated turn-off time
PRODUCT
INFORMATION
3
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
AVERAGE ANODE ON-STATE CURRENT
TI23AA
6
PA - Max Continuous Anode Power Dissipated - W
IT(AV) - Maximum Average Anode Forward Current - A
DERATING CURVE
Continuous DC
5
4
Φ = 180°
3
2
0°
180°
Φ
Conduction
1
Angle
0
30
40
50
60
70
80
90
100
TJ = 110 °C
10
1
110
1
10
100
IT - Continuous Anode Forward Current - A
Figure 3.
Figure 4.
SURGE ON-STATE CURRENT
vs
CYCLES OF CURRENT DURATION
TRANSIENT THERMAL RESISTANCE
vs
CYCLES OF CURRENT DURATION
TI23AC
No Prior Device Conduction
Gate Control Guaranteed
10
1
TI23AD
10
RθJC(t) - Transient Thermal Resistance - °C/W
TC ≤ 80°C
ITM - Peak Half-Sine-Wave Current - A
TI23AB
100
TC - Case Temperature - °C
100
1
0·1
1
10
100
1
10
Consecutive 50 Hz Half-Sine-Wave Cycles
Consecutive 50 Hz Half-Sine-Wave Cycles
Figure 5.
Figure 6.
PRODUCT
4
MAX CONTINUOUS ANODE POWER DISSIPATED
vs
CONTINUOUS ANODE ON-STATE CURRENT
INFORMATION
100
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
GATE TRIGGER CURRENT
vs
GATE TRIGGER VOLTAGE
vs
CASE TEMPERATURE
CASE TEMPERATURE
TC23AA
10
VAA = 6 V
VAA = 6 V
RL = 100 Ω
RL = 100 Ω
VGT - Gate Trigger Voltage - V
IGT - Gate Trigger Current - mA
TC23AB
0·9
tp(g) ≥ 20 µs
1
0·8
RGK = 1 kΩ
Ω
tp(g) ≥ 20 µs
0·7
0·6
0·5
0·1
-60
-40
-20
0
20
40
60
80
-25
0
25
50
75
TC - Case Temperature - °C
Figure 7.
Figure 8.
GATE FORWARD VOLTAGE
vs
GATE FORWARD CURRENT
HOLDING CURRENT
vs
CASE TEMPERATURE
TC23AC
10
IA = 0
VAA = 6 V
TC = 25 °C
tp = 300 µs
Initiating IT = 20 mA
10
100
1000
1
-50
-25
0
25
50
75
IGF - Gate Forward Current - mA
TC - Case Temperature - °C
Figure 9.
Figure 10.
PRODUCT
125
TC23AD
IH - Holding Current - mA
10
1
100
RGK = 1 kΩ
Ω
Duty Cycle ≤ 2 %
1
0·1
0·4
-50
120
TC - Case Temperature - °C
100
VGF - Gate Forward Voltage - V
100
100
125
INFORMATION
5
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
GATE-CONTROLLED TURN-ON TIME
vs
GATE CURRENT
PEAK ON-STATE VOLTAGE
vs
PEAK ON-STATE CURRENT
TC23AE
2.6
TC23AF
3.1
VTM - Peak On-State Voltage - V
2.2
t gt - Gate Controlled Turn-On Time - µs
TC = 25 °C
2.4
tp = 300 µs
Duty Cycle ≤ 2 %
2.0
1.8
1.6
1.4
1.2
3.0
2.9
2.8
2.7
VAA = 30 V
RL = 6 Ω
2.6
TC = 25 °C
See Test Circuit and Waveforms
1.0
2.5
0.8
0·1
1
1
10
10
IG - Gate Current - mA
ITM - Peak On-State Current - A
Figure 11.
Figure 12.
CIRCUIT-COMMUTATED TURN-OFF TIME
vs
CASE TEMPERATURE
t q - Circuit-Commutated Turn-Off Time - µs
21
20
19
VAA = 30 V
RL = 6 Ω
IRM = 8 A
tp = 300 µs
18
Duty Cycle ≤ 2 %
17
16
15
14
13
12
20
30
40
50
60
70
80
90
TC - Case Temperature - °C
Figure 13.
PRODUCT
6
TC23AG
INFORMATION
100 110 120
100
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
MECHANICAL DATA
TO-220
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
TO220
4,70
4,20
ø
10,4
10,0
3,96
3,71
1,32
1,23
2,95
2,54
see Note B
6,6
6,0
15,90
14,55
see Note C
6,1
3,5
1,70
1,07
0,97
0,61
1
2
14,1
12,7
3
2,74
2,34
5,28
4,88
VERSION 1
0,64
0,41
2,90
2,40
VERSION 2
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTES: A. The centre pin is in electrical contact with the mounting tab.
B. Mounting tab corner profile according to package version.
C. Typical fixing hole centre stand off height according to package version.
Version 1, 18.0 mm. Version 2, 17.6 mm.
PRODUCT
MDXXBE
INFORMATION
7
TIC108 SERIES
SILICON CONTROLLED RECTIFIERS
APRIL 1971 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE
SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS.
Copyright © 1997, Power Innovations Limited
PRODUCT
8
INFORMATION