TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com 1.2A High Efficient Step Down Converter in 2x2mm SON Package Check for Samples: TLV62080 FEATURES DESCRIPTION 1 • • • • • • • • • The TLV62080 device is a synchronous step down converter with an input voltage range of 2.5V to 5.5V. The TLV62080 focuses on high efficient step down conversion over a wide output current range. At medium to heavy loads, the converter operates in PWM mode and automatically enters Power Save Mode operation at light load currents to maintain high efficiency over the entire load current range. TM DCS-Control Architecture for Fast Transient Regulation 2.5V to 5.5V Input Voltage Range 100% Duty Cycle for Lowest Dropout Power Save Mode for Light Load Efficiency Output Discharge Function Power Good Output Thermal Shutdown Available in 2x2mm 8-Pin SON Package For Improved Features Set, See TPS62080 To address the requirements of system power rails, the internal compensation circuit allows a large selection of external output capacitor values ranging from 10µF up to 100uF effective capacitance. With its DCS-ControlTM architecture excellent load transient performance and output voltage regulation accuracy is achieved. The device is available in 2mm x 2mm SON package with Thermal PAD. APPLICATIONS • • • Battery Powered Portable Devices Point of Load Regulators System Power Rail Voltage Conversion TLV62080 VIN POWER GOOD 2.5V...5.5V 180k VIN PG EN SW VOUT GND VOS 22µF GND FB 1mH 10µF R1 R2 Figure 1. Typical Application of TLV62080 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011, Texas Instruments Incorporated TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com Table 1. ORDERING INFORMATION (1) TA PACKAGE MARKING PACKAGE PART NUMBER (1) –40°C to 85°C RAU 8-Pin QFN TLV62080DSG For detailed ordering information please check the PACKAGE OPTION ADDENDUM section at the end of this datasheet. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) Voltage range at VIN, PG, VOS (2) (2) (3) VALUE UNIT –0.3 to 7 V –0.3 to (VIN + 0.3V) V Voltage range at FB (2) –0.3 to 3.6 V Voltage range at EN (2) –0.3 to (VIN + 0.3V) V 2 kV 500 V Voltage range at SW ESD rating, Human Body Model ESD rating, Charged Device Model Continuous total power dissipation See Dissipation Rating Table –40 to 125 °C Operating ambient temperature range, TA –40 to 85 °C Storage temperature range, Tstg –65 to 150 °C Operating junction temperature range, TJ (1) (2) (3) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. All voltage values are with respect to network ground terminal. During operation, device switching THERMAL INFORMATION THERMAL METRIC (1) TLV62080 DSG (8 PINS) θJA Junction-to-ambient thermal resistance 65.1 θJCtop Junction-to-case (top) thermal resistance 100.7 θJB Junction-to-board thermal resistance 135.7 ψJT Junction-to-top characterization parameter 2.3 ψJB Junction-to-board characterization parameter 45.1 θJCbot Junction-to-case (bottom) thermal resistance 8.6 (1) UNITS °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. RECOMMENDED OPERATING CONDITIONS (1) MIN TYP MAX UNIT VIN Input voltage range 2.5 5.5 VOUT Output voltage range 0.5 4.0 V TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C (1) 2 V Refer to the APPLICATION INFORMATION section for further information. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com ELECTRICAL CHARACTERISTICS Over recommended free-air temperature range, TA = -40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted), VIN=3.6V. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VIN Input voltage range IQ Quiescent current into VIN IOUT = 0mA, Device not switching ISD Shutdown current into VIN EN = LOW Under voltage lock out Input voltage falling 1.8 Under voltage lock out hysteresis Rising above VUVLO 120 mV Thermal shut down Temperature rising 150 °C Thermal shutdown hysteresis Temperature falling below TJSD 20 °C VUVLO TJSD 2.5 5.5 30 V uA 1 µA 2.0 V LOGIC INTERFACE (EN) VIH High level input voltage 2.5V ≤ VIN ≤ 5.5V VIL Low level input voltage 2.5V ≤ VIN ≤ 5.5V ILKG Input leakage current 1 V 0.4 V 0.01 0.5 µA –10 –5 % POWER GOOD VPG Power good threshold VOUT falling referenced to VOUT nominal –15 Power good hysteresis 5 VIL Low level voltage Isink = 500 µA IPG,LKG PG Leakage current VPG = 5.0 V % 0.3 V 0.01 0.1 µA 4.0 V 0.45 0.462 V 10 100 nA OUTPUT VOUT Output voltage range TLV62080 VFB Feedback regulation voltage VIN ≥ 2.5V and VIN ≥ VOUT + 1V IFB Feedback input bias current VFB = 0.45 V RDIS Output discharge resistor EN = LOW, VOUT = 1.8 V High side FET on-resistance ISW = 500 mA Low side FET on-resistance ISW = 500 mA High side FET switch current limit Rising inductor current RDS(on) ILIM 0.5 0.438 1 kΩ 120 mΩ 90 1.6 2.8 mΩ 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 A 3 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com DEVICE INFORMATION 2 GND 3 FB 4 MA GND ER 1 TH EN LP AD QFN 8 PIN 2X2 mm 8 VIN 7 SW 6 PG 5 VOS PIN FUNCTIONS PIN NAME NO. I/O VIN 8 PWR EN 1 IN GND 2,3 PWR VOS 5 IN SW 7 PWR FB 4 IN PG 6 OUT Thermal Pad DESCRIPTION Power Supply Voltage Input. Device Enable Logic Input. Logic HIGH enables the device, logic LOW disables the device and turns it into shutdown. Power and Signal Ground. Output Voltage Sense Pin for the internal control loop. Must be connected to output. Switch Pin connected to the internal MOSFET switches and inductor terminal. Connect the inductor of the output filter here. Feedback Pin for the internal control loop. Connect this pin to the external feedback divider to program the output voltage. Power Good open drain output. This pin is pulled to low if the output voltage is below regulation limits. Can be left floating if not used. Connect it to GND. FUNCTIONAL BLOCK DIAGRAMS PG VIN High Side N-MOS Power Good Control Logic Gate Driver Low Side N-MOS Thermal Shutdown SW Active Output Discharge GND EN ramp Softstart comparator direct control & compensation Under Voltage Shutdown error amplifier minimum on-timer DSC-CONTROL TM VOS FB REF Figure 2. Functional Block Diagram 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com TYPICAL CHARACTERISTICS PARAMETER MEASUREMENT INFORMATION TLV62080 VIN POWER GOOD VIN PG EN SW R3 L1 C3 C1 GND VOUT C2 VOS R1 GND FB R2 Table 2. List of Components REFERENCE DESCRIPTION MANUFACTURER C1 10uF, Ceramic Capacitor, 6.3V, X5R, size 0603 Std C2 22uF, Ceramic Capacitor, 6.3V, X5R, size 0805, GRM21BR60J226ME39L Murata C3 47uF, Tantalum Capacitor, 8V, 35mΩ, size 3528, T520B476M008ATE035 Kemet L1 1.0µH, Power Inductor, 2.2A, size 3x3x1.2mm, XFL3012-102MEB R1 Depending on the output voltage of TLV62080, 1%; R2 39.2k, Chip Resistor, 1/16W, 1%, size 0603 Std R3 178k, Chip Resistor, 1/16W, 1%, size 0603 Std Coilcraft TABLE OF GRAPHS Figure Load Current, VOUT = 0.9V Figure 3 Load Current, VOUT = 1.2V Figure 4 Load Current, VOUT = 2.5V Figure 5 Input Voltage, VOUT = 0.9V Figure 6 Input Voltage, VOUT = 2.5V Figure 7 Load Current, VOUT = 0.9V Figure 8 Load Current, VOUT = 2.5V Figure 9 Switching Frequency Load Current, VOUT = 2.5V, Figure 10 Efficiency Output Voltage Accuracy VIN = 3.3V, VOUT = 1.2V, Load Current = 500mA, PWM Mode Figure 11 VIN = 3.3V, VOUT = 1.2V, Load Current = 10mA, PFM Mode Figure 12 Load Transient VIN = 3.3V, VOUT = 1.2V, Load Current = 50mA to 1A Figure 13 Line Transient VIN = 3.3V to 4.2V, VOUT = 1.2V, Load = 2.2Ω Figure 14 VIN = 3.3V, VOUT = 1.2V, Load = 2.2Ω Figure 15 VIN = 3.3V, VOUT = 1.2V, No Load Figure 16 Typical Operation Startup Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 5 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com EFFICIENCY vs LOAD CURRENT EFFICIENCY vs LOAD CURRENT 100 100 VOUT = 0.9 V 90 80 80 70 70 Efficiency (%) Efficiency (%) 90 60 50 40 30 10 100u 1m 10m 100m Output Current (A) 1 Figure 4. EFFICIENCY vs LOAD CURRENT OUTPUT VOLTAGE vs INPUT VOLTAGE 1 3 G002 0.910 VOUT = 2.5 V VOUT = 0.9 V 0.905 60 50 40 VIN = 3.6 V VIN = 4.2 V VIN = 5.0 V 20 10 100u 1m 10m 100m Output Current (A) 1 0.900 0.895 IOUT = 1A, TA = 25°C IOUT = 1A, TA = −40°C IOUT = 1A, TA = 85°C IOUT = 10mA, TA = 25°C IOUT = 10mA, TA = −40°C IOUT = 10mA, TA = 85°C 0.890 0.885 0.880 2.5 3 3 G003 3.5 4 4.5 Input Voltage (V) Figure 5. Figure 6. OUTPUT VOLTAGE vs INPUT VOLTAGE OUTPUT VOLTAGE vs LOAD CURRENT 2.54 5 5.5 G004 0.910 VOUT = 2.5 V VIN = 3.6 V 2.52 Output Voltage (V) 0.906 2.50 2.48 IOUT = 1A, TA = 25°C IOUT = 1A, TA = −40°C IOUT = 1A, TA = 85°C IOUT = 10mA, TA = 25°C IOUT = 10mA, TA = −40°C IOUT = 10mA, TA = 85°C 2.46 2.44 3 3.5 4 4.5 Input Voltage (V) 5 0.902 0.898 TA = 25°C TA = −40°C TA = 85°C 0.894 5.5 0.890 10u G005 Figure 7. 6 1m 10m 100m Output Current (A) Figure 3. 30 Output Voltage (V) 100u G001 70 2.42 2.5 VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V 0 10u 3 Output Voltage (V) Efficiency (%) 40 10 80 0 10u 50 20 100 90 60 30 VIN = 2.8 V VIN = 3.6 V VIN = 4.2 V 20 0 10u VOUT = 1.2 V 100u 1m 10m 100m Output Current (A) 1 3 G006 Figure 8. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com OUTPUT VOLTAGE vs LOAD CURRENT SWITCHING FREQUENCY vs LOAD CURRENT 5M 2.54 VOUT = 2.5V Switching Frequency (Hz) Output Voltage (V) VIN = 3.6 V 2.52 2.50 2.48 2.46 10u TA = 25°C TA = −40°C TA = 85°C 100u 1m 10m 100m Output Current (A) 1 VIN = 2.5V VIN = 3.3V VIN = 4.2V VIN = 5.0V 4M 3M 2M 1M 0 3 0 G007 200m 400m 600m 800m Output Current (A) 1 1.2 Figure 9. Figure 10. TYPICAL APPLICATION (PWM MODE) TYPICAL APPLICATION (PFM MODE) SW 2V/div SW 2V/div VOUT 20mV/div VOUT 20mV/div L COIL 0.5A/div L COIL 0.2A/div t - 200ns/div t - 2µs/div Figure 11. Figure 12. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 1.4 G008 7 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com LOAD TRANSIENT LINE TRANSIENT 1A LOAD 1A/div 4.2V VIN 1V/div 50mA 3.3V VOUT 20mV/div VOUT 50mV/div L COIL 1A/div t - 100µs/div t - 50µs/div 8 Figure 13. Figure 14. START UP START UP (WITHOUT LOAD) EN 5V/div EN 5V/div PG 1V/div PG 1V/div VOUT 1V/div VOUT 1V/div L COIL 0.5A/div L COIL 0.2A/div t - 20µs/div t - 20µs/div Figure 15. Figure 16. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com DETAILED DESCRIPTION DEVICE OPERATION The TLV62080 synchronous switched mode converter is based on DCS™ Control (Direct Control with Seamless transition into Power Save Mode). This is an advanced regulation topology that combines the advantages of hysteretic and voltage mode control. The DCS™ Control topology operates in PWM (Pulse Width Modulation) mode for medium to heavy load conditions and in Power Save Mode at light load currents. In PWM the converter operates with its nominal switching frequency of 2MHz having a controlled frequency variation over the input voltage range. As the load current decreases the converter enters Power Save Mode, reducing the switching frequency and minimizing the IC quiescent current to achieve high efficiency over the entire load current range. DCS™ Control supports both operation modes (PWM and PFM) using a single building block having a seamless transition from PWM to Power Save Mode without effects on the output voltage. The TLV62080 offers both excellent DC voltage and superior load transient regulation, combined with very low output voltage ripple, minimizing interference with RF circuits. POWER SAVE MODE As the load current decreases the TLV62080 enters the Power Save Mode operation. During Power Save Mode the converter operates with reduced switching frequency in PFM mode and with a minimum quiescent current maintaining high efficiency. The power save mode occurs when the inductor current becomes discontinuous. It is based on a fixed on time architecture. The typical on time is given by ton=210ns·(VIN / VOUT). The switching frequency over the whole load current range is shown in Figure 10. 100% DUTY CYCLE LOW DROPOUT OPERATION The device offers low input to output voltage difference by entering 100% duty cycle mode. In this mode the high side MOSFET switch is constantly turned on and the low side MOSFET is switched off. This is particularly useful in battery powered applications to achieve longest operation time by taking full advantage of the whole battery voltage range. The minimum input voltage to maintain switching regulation, depending on the load current and output voltage can be calculated as: VIN,MIN = VOUT + IOUT,MAX ´ (RDS(on) + RL ) (1) With: VIN,MIN = Minimum input voltage IOUT,MAX = Maximum output current RDS(on) = High side FET on-resistance RL = Inductor ohmic resistance ENABLING / DISABLING THE DEVICE The device is enabled by setting the EN input to a logic HIGH. Accordingly, a logic LOW disables the device. If the device is enabled, the internal power stage will start switching and regulate the output voltage to the programmed threshold. The EN input must be terminated with a resistance less than 1MΩ pulled to VIN or GND. OUTPUT DISCHARGE The output gets discharged by the SW pin with a typical discharge resistor of RDIS whenever the device shuts down. This is the case when the device gets disabled by enable, thermal shutdown trigger, and undervoltage lockout trigger. SOFT START After enabling the device, an internal soft-start circuitry monotonically ramps up the output voltage and reaches the nominal output voltage during a soft start time (100µs, typical). This avoids excessive inrush current and creates a smooth output voltage rise slope. It also prevents excessive voltage drops of primary cells and rechargeable batteries with high internal impedance. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 9 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com If the output voltage is not reached within the soft start time, such as in the case of heavy load, the converter will enter regular operation. Consequently, the inductor current limit will operate as described below. The TLV62080 is able to start into a pre-biased output capacitor. The converter starts with the applied bias voltage and ramps the output voltage to its nominal value. POWER GOOD The TLV62080 has a power good output going low when the output voltage is below its nominal value. The power good keeps high impedance once the output is above 95% of the regulated voltage, and is driven to low once the output voltage falls below typically 90% of the regulated voltage. The PG pin is a open drain output and is specified to sink typically up to 0.5mA. The power good output requires a pull up resistor that is recommended connecting to the device output. When the device is off due to disable, UVLO or thermal shutdown, the PG pin is at high impedance. The PG signal can be used for sequencing of multiple rails by connecting to the EN pin of other converters. Leave the PG pin unconnected when not used. UNDER VOLTAGE LOCKOUT To avoid mis-operation of the device at low input voltages, an under voltage lockout is implemented, that shuts down the device at voltages lower than VUVLO with a VHYS_UVLO hysteresis. THERMAL SHUTDOWN The device goes into thermal shutdown once the junction temperature exceeds typically TJSD. Once the device temperature falls below the threshold the device returns to normal operation automatically. INDUCTOR CURRENT LIMIT The Inductor Current Limit prevents the device from high inductor current and drawing excessive current from the battery or input voltage rail. Excessive current might occur with a shorted/saturated inductor or a heavy load/shorted output circuit condition. The incorporated inductor peak current limit measures the current during the high side and low side power MOSFET on-phase in PWM mode. Once the high side switch current limit is tripped, the high side MOSFET is turned off and the low side MOSFET is turned on to reduce the inductor current. Until the inductor current drops down to low side switch current limit, the low side MOSFET is turned off and the high side switch is turned on again. This operation repeats until the inductor current does not reach the high side switch current limit. Due to the internal propagation delay, the real current limit value can exceed the static current limit in the electrical characteristics table. 10 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com APPLICATION INFORMATION Output Filter Design The inductor and the output capacitor together provide a low pass frequency filter. To simplify this process Table 3 outlines possible inductor and capacitor value combinations for the most application. Table 3. Matrix of Output Capacitor / Inductor Combinations COUT [µF] (1) L [µH] (1) 10 22 47 100 1 + + (2) (3) + + 2.2 + + + + 150 0.47 4.7 (1) (2) (3) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by+20% and -50%. Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by +20% and -30%. Plus mark indicates recommended filter combinations. Filter combination in typical application. Inductor Selection Main parameter for the inductor selection is the inductor value and then the saturation current of the inductor. To calculate the maximum inductor current under static load conditions, Equation 2 is given. DI IL,MAX = IOUT,MAX + L 2 VOUT VIN DIL = VOUT ´ L ´ fSW 1- (2) Where IOUT,MAX = Maximum output current ΔIL = Inductor current ripple fSW = Switching frequency L = Inductor value It's recommended to choose the saturation current for the inductor 20%~30% higher than the IL,MAX, out of Equation 2. A higher inductor value is also useful to lower ripple current, but will increase the transient response time as well. The following inductors are recommended to be used in designs. Table 4. List of Recommended Inductors INDUCTANCE [µH] CURRENT RATING [mA] DIMENSIONS L x W x H [mm3] DC RESISTANCE [mΩ typ] 1.0 2500 3 x 3 x 1.2 1.0 1650 3 x 3 x 1.2 2.2 2500 2.2 1600 TYPE MANUFACTURER 35 XFL3012-102ME Coilcraft 40 LQH3NPN1R0NJ0 Murata 4 x 3.7 x 1.65 49 LQH44PN2R2MP0 Murata 3 x 3 x 1.2 81 XFL3012-222ME Coilcraft Capacitor Selection The input capacitor is the low impedance energy source for the converter which helps to provide stable operation. A low ESR multilayer ceramic capacitor is recommended for best filtering and should be placed between VIN and GND as close as possible to that pins. For most applications 10μF will be sufficient, a larger value reduces input current ripple. Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 11 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com The architecture of the TLV62080 allows to use tiny ceramic-type output capacitors with low equivalent series resistance (ESR). These capacitors provide low output voltage ripple and are recommended. To keep its resistance up to high frequencies and to get narrow capacitance variation with temperature, it's recommended to use X7R or X5R dielectric. The TLV62080 is designed to operate with an output capacitance of 10µF to 100µF, as outlined in Table 3. Table 5. List of Recommended Capacitors CAPACITANCE [µF] TYPE DIMENSIONS L x W x H [mm3] MANUFACTURER 10 GRM188R60J106M 0603: 1.6 x 0.8 x 0.8 Murata 22 GRM188R60G226M 0603: 1.6 x 0.8 x 0.8 Murata 22 GRM21BR60J226M 0805: 2.0 x 1.2 x 1.25 Murata Setting the Output Voltage By selecting R1 and R2, the output voltage is programmed to the desired value. The following equation can be used to calculate R1 and R2. TLV62080 VIN POWER GOOD 2.5V...5.5V 180k VIN PG EN SW VOUT GND VOS 22µF GND FB 1mH 10µF R1 R2 Figure 17. Typical Application Circuit R1 ö R1 ö æ æ VOUT = VFB ´ ç1 + ÷ = 0.45 V ´ ç1 + ÷ R 2 R 2ø è ø è (3) For best accuracy, R2 should be kept smaller than 40kΩ to ensure that the current flowing through R2 is at least 100 times larger than IFB. Changing the sum towards a lower value increases the robustness against noise injection. Changing the sum towards higher values reduces the quiescent current. PCB Layout The PCB layout is an important step to maintain the high performance of the TLV62080 device. The input/output capacitors and the inductor should be placed as close as possible to the IC. This keeps the traces short. Routing these traces direct and wide results in low trace resistance and low parasitic inductance. A common power GND should be used. The low side of the input and output capacitors must be connected properly to the power GND to avoid a GND potential shift. The sense traces connected to FB and VOS pins are signal traces. Special care should be taken to avoid noise being induced. By a direct routing, parasitic inductance can be kept small. GND layers might be used for shielding. Keep these traces away from SW nodes. 12 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com Figure 18. PCB Layout Suggestion THERMAL INFORMATION Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. Three basic approaches for enhancing thermal performance are listed below: • Improving the power dissipation capability of the PCB design • Improving the thermal coupling of the component to the PCB by soldering the ThermalPAD™ • Introducing airflow in the system For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics Application Notes SZZA017 and SPRA953. APPLICATION EXAMPLES TLV62080 VIN POWER GOOD 2.5V .. 5.5V VIN PG EN SW 180k 1mH 10µF GND VOS GND FB 1.2V VOUT 22µF 65.3k 39.2k Figure 19. 1.2V Output Voltage Application Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 13 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com TLV62080 VIN POWER GOOD 3.0V .. 5.5V VIN PG EN SW 180k 1mH 10µF GND VOS GND FB 2.5V VOUT 22µF 178.6k 39.2k Figure 20. 2.5V Output Voltage Application 14 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 TLV62080 SLVSAK9A – OCTOBER 2011 – REVISED NOVEMBER 2011 www.ti.com Changes from Original (October 2011) to Revision A Page • Changed pin VSNS to VOS in Figure 1 ................................................................................................................................ 1 • Changed pin VSNS to VOS in Figure 17 ............................................................................................................................ 12 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Link(s): TLV62080 15 PACKAGE OPTION ADDENDUM www.ti.com 9-Mar-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) TLV62080DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TLV62080DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV62080DSGR WSON DSG 8 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TLV62080DSGT WSON DSG 8 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 8-Mar-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV62080DSGR WSON DSG 8 3000 195.0 200.0 45.0 TLV62080DSGT WSON DSG 8 250 195.0 200.0 45.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated