TI TAS5132_0702

TM
TAS5132
www.ti.com
SLES190 – DECEMBER 2006
STEREO DIGITAL AMPLIFIER POWER STAGE
FEATURES
•
•
•
•
•
•
•
•
•
•
•
•
•
2×20 W at 10% THD+N Into 8-Ω BTL
2×25 W at 10% THD+N Into 6-Ω BTL
>100-dB SNR (A-Weighted)
<0.1% THD+N at 1 W
Thermally Enhanced Package:
– DDV (44-pin HTSSOP)
High-Efficiency Power Stage (>90%) With
140-mΩ Output MOSFETs
Power-On Reset for Protection on Power Up
Without Any Power-Supply Sequencing
Integrated Self-Protection Circuits Including
Undervoltage, Overtemperature, Overload,
Short Circuit
PWM Activity Detector to detect stopped PWM
inputs and protect the system
Error Reporting
EMI Compliant When Used With
Recommended System Design
Intelligent Gate Drive
Pin Compatible With the TAS5142DDV
A low-cost, high-fidelity audio system can be built
using a TI chipset, comprising a modulator (e.g.,
TAS5086) and the TAS5132. This system only
requires a simple passive LC demodulation filter to
deliver
high-quality,
high-efficiency
audio
amplification with proven EMI compliance. This
device requires two power supplies, at 12 V for
GVDD and VDD, and at 18 V for PVDD. The
TAS5132 does not require power-up sequencing due
to internal power-on reset. The efficiency of this
digital amplifier is greater than 90% into 8 Ω, which
enables the use of smaller power supplies and
heatsinks.
The TAS5132 has an innovative protection system
integrated on chip, safeguarding the device against a
wide range of fault conditions that could damage the
system. These safeguards are short-circuit
protection, overcurrent protection, undervoltage
protection, and overtemperature protection. The
TAS5132 has a new proprietary current-limiting
circuit that reduces the possibility of device shutdown
during high-level music transients.
BTL OUTPUT POWER vs SUPPLY VOLTAGE
30
TC = 75°C
THD+N @ 10%
25
•
•
•
•
Televisions
Mini/Micro Audio Systems
DVD Receivers
Home Theaters
DESCRIPTION
The TAS5132 is an integrated stereo digital amplifier
power stage with an advanced protection system.
The TAS5132 is capable of driving a 6-Ω bridge-tied
load (BTL) at up to 25 W per channel with low
integrated noise at the output, low THD+N
performance, and low idle power dissipation.
PO − Output Power − W
APPLICATIONS
20
6Ω
15
10
8Ω
5
0
0
5
10
15
20
PVDD − Supply Voltage − V
G002
PurePath Digital™
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath Digital, PowerPAD are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TAS5132
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SLES190 – DECEMBER 2006
GENERAL INFORMATION
Terminal Assignment
The TAS5132 is available in a thermally enhanced package:
• 44-pin HTSSOP PowerPAD™ package (DDV)
This package type contains a heat slug that is located on the top side of the device for convenient thermal
coupling to the heatsink.
DDV PACKAGE
(TOP VIEW)
GVDD_B
OTW
NC
NC
SD
PWM_A
RESET_AB
PWM_B
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_C
RESET_CD
PWM_D
NC
NC
VDD
GVDD_C
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
GVDD_A
BST_A
NC
PVDD_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
PVDD_D
NC
BST_D
GVDD_D
P0016-02
2
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SLES190 – DECEMBER 2006
GENERAL INFORMATION (continued)
MODE Selection Pins
MODE PINS
PWM INPUT
M3
M2
M1
0
0
0
2N
0
0
1
Reserved
0
1
0
1N
(1)
0
1
1
1N
(1)
1N
(1)
1
0
0
1
0
1
2N
(1)
(2)
1
1
0
1
1
1
(1)
(1)
OUTPUT CONFIGURATION
PROTECTION SCHEME
2 channels BTL output
BTL mode
(2)
AD modulation
2 channels BTL output
BTL mode
(2)
AD modulation
1 channel PBTL output
PBTL mode. Only PWM_A input is used.
4 channels SE output
Protection works similarly to BTL mode (2). Only
difference in SE mode is that OUT_X is Hi-Z
instead of a pulldown through internal pulldown
resistor.
AD/BD modulation
AD modulation
AD/BD modulation
2 channels BTL output
Protection system work similarly to BTL mode
(2) (0, 0, 0); however the PWM input protection
is disabled. Also, overcurrent detection will be
more sensitive and will latch if an error occurs.
Reserved
The 1N and 2N naming convention is used to indicate the required number of PWM lines to the power stage per channel in a specific
mode.
An overload protection (OLP) occurring on A or B causes both channels to shut down. An OLP on C or D works similarly. Global errors
like overtemperature error (OTE), undervoltage protection (UVP), and power-on reset (POR) affect all channels.
Package Heat Dissipation Ratings (1)
(1)
(2)
PARAMETER
TAS5132DDV
RθJC (°C/W)—2 BTL or 4 SE channels (8 transistors)
1.4
RθJC (°C/W)—1 BTL or 2 SE channel(s) (4 transistors)
2.6
RθJC (°C/W)—(1 transistor)
8.7
Pad area (2)
15 mm2
JC is junction-to-case, CH is case-to-heatsink.
RθCH is an important consideration. Assume a 2-mil thickness of typical thermal grease between the pad area and the heatsink. The
RθCH with this condition is 2.5°C/W for the DDV package.
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ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VDD to AGND
–0.3 V to 13.2 V
GVDD_X to AGND
–0.3 V to 13.2 V
PVDD_X to GND_X
(2)
–0.3 V to 30 V
OUT_X to GND_X
(2)
–0.3 V to 30 V
BST_X to GND_X
(2)
–0.3 V to 43.2 V
VREG to AGND
–0.3 V to 4.2 V
GND_X to GND
–0.3 V to 0.3 V
GND_X to AGND
–0.3 V to 0.3 V
GND to AGND
–0.3 V to 0.3 V
PWM_X, OC_ADJ, M1, M2, M3 to AGND
–0.3 V to 4.2 V
RESET_X, SD, OTW to AGND
–0.3 V to 7 V
Maximum continuous sink current (SD, OTW)
9 mA
Maximum operating junction temperature range, TJ
0°C to 150°C
Storage temperature range
–40°C to 125°C
Lead temperature, 1,6 mm (1/16 inch) from case for 10 seconds
260°C
Minimum pulse duration, low
50 ns
(1)
(2)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
These voltages represent the dc voltage + peak ac waveform measured at the terminal of the device in all conditions.
ORDERING INFORMATION
TA
PACKAGE
DESCRIPTION
0°C to 70°C
TAS5132DDV
44-pin HTSSOP
For the most current specification and package information, see the TI Web site at www.ti.com.
4
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Terminal Functions
TERMINAL
NAME
NO.
FUNCTION
(1)
DESCRIPTION
AGND
11
P
Analog ground
BST_A
43
P
HS bootstrap supply (BST). External capacitor to OUT_A required.
BST_B
34
P
HS bootstrap supply (BST). External capacitor to OUT_B required.
BST_C
33
P
HS bootstrap supply (BST). External capacitor to OUT_C required.
BST_D
24
P
HS bootstrap supply (BST). External capacitor to OUT_D required.
GND
10
P
Ground
GND_A
38
P
Power ground for half-bridge A
GND_B
37
P
Power ground for half-bridge B
GND_C
30
P
Power ground for half-bridge C
GND_D
29
P
Power ground for half-bridge D
GVDD_A
44
P
Gate-drive voltage supply. Requires 0.1-µF capacitor to GND.
GVDD_B
1
P
Gate-drive voltage supply. Requires 0.1-µF capacitor to GND.
GVDD_C
22
P
Gate-drive voltage supply. Requires 0.1-µF capacitor to GND.
GVDD_D
23
P
Gate-drive voltage supply. Requires 0.1-µF capacitor to GND.
M1
15
I
Mode selection 1
M2
14
I
Mode selection 2
M3
13
I
Mode selection 3
NC
3, 4, 19, 20,
25, 42
–
No connect. Pins may be grounded.
OC_ADJ
9
O
Analog overcurrent programming. Requires resistor to ground.
OTW
2
O
Overtemperature warning signal, open drain, active low
OUT_A
39
O
Output, half-bridge A
OUT_B
36
O
Output, half-bridge B
OUT_C
31
O
Output, half-bridge C
OUT_D
28
O
Output, half-bridge D
PVDD_A
40, 41
P
Power supply input for half-bridge A. Requires close decoupling of 0.1-µF capacitor
to GND_A.
PVDD_B
35
P
Power supply input for half-bridge B. Requires close decoupling of 0.1-µF capacitor
to GND_B.
PVDD_C
32
P
Power supply input for half-bridge C. Requires close decoupling of 0.1-µF capacitor
to GND_C.
PVDD_D
26, 27
P
Power supply input for half-bridge D. Requires close decoupling of 0.1-µF capacitor
to GND_D.
PWM_A
6
I
Input signal for half-bridge A
PWM_B
8
I
Input signal for half-bridge B
PWM_C
16
I
Input signal for half-bridge C
PWM_D
18
I
Input signal for half-bridge D
RESET_AB
7
I
Reset signal for half-bridge A and half-bridge B, active low
RESET_CD
17
I
Reset signal for half-bridge C and half-bridge D, active low
SD
5
O
Shutdown signal, open-drain, active-low
VDD
21
P
Power supply for digital voltage regulator. Requires 0.1-µF capacitor in parallel with a
10-µF capacitor to GND.
VREG
12
P
Digital regulator supply filter. Requires 0.1-µF capacitor to AGND.
(1)
I = input, O = output, P = power
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SLES190 – DECEMBER 2006
SYSTEM BLOCK DIAGRAM
OTW
System
Microcontroller
SD
TAS5508
OTW
SD
BST_A
BST_B
RESET_AB
RESET_CD
VALID
PWM_A
LeftChannel
Output
OUT_A
Output
H-Bridge 1
Input
H-Bridge 1
PWM_B
OUT_B
Bootstrap
Capacitors
2nd-Order L-C
Output Filter
for Each
Half-Bridge
2-Channel
H-Bridge
BTL Mode
OUT_C
PWM_C
4
18 V
PVDD
System
Power
Supply
GND
12 V
4
PVDD
Power
Supply
Decoupling
BST_D
Bootstrap
Capacitors
4
GVDD
VDD
VREG
Power Supply
Decoupling
Hardwire
OC Limit
GND
GVDD (12 V)/VDD (12 V)
VAC
6
OC_ADJ
AGND
VDD
M3
OUT_D
2nd-Order L-C
Output Filter
for Each
Half-Bridge
BST_C
VREG
M2
GND
PVDD_A, B, C, D
M1
GVDD_A, B, C, D
Input
H-Bridge 2
PWM_D
Hardwire
Mode
Control
Output
H-Bridge 2
GND_A, B, C, D
RightChannel
Output
B0047-01
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SLES190 – DECEMBER 2006
FUNCTIONAL BLOCK DIAGRAM
VDD
Undervoltage
Protection
OTW
Internal Pullup
Resistors to VREG
SD
M1
Protection
and
I/O Logic
M2
M3
4
4
VREG
VREG
Power
On
Reset
AGND
Temp.
Sense
GND
RESET_AB
Overload
Protection
RESET_CD
Isense
OC_ADJ
GVDD_D
BST_D
PVDD_D
PWM_D
PWM
Rcv.
Ctrl.
Timing
Gate
Drive
OUT_D
BTL/PBTL−Configuration
Pulldown Resistor
GND_D
GVDD_C
BST_C
PVDD_C
PWM_C
PWM
Rcv
.
Ctrl.
Timing
Gate
Drive
OUT_C
BTL/PBTL−Configuration
Pulldown Resistor
GND_C
GVDD_B
BST_B
PVDD_B
PWM_B
PWM
Rcv
.
Ctrl.
Timing
Gate
Drive
OUT_B
BTL/PBTL−Configuration
Pulldown Resistor
GND_B
GVDD_A
BST_A
PVDD_A
PWM_A
PWM
Rcv
.
Ctrl.
Timing
Gate
Drive
OUT_A
BTL/PBTL−Configuration
Pulldown Resistor
GND_A
B0034-02
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SLES190 – DECEMBER 2006
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX
UNIT
PVDD_X
Half-bridge supply
DC supply voltage
0
18
19
V
GVDD_X
Supply for logic regulators and gate-drive
circuitry
DC supply voltage
10.8
12
13.2
V
VDD
Digital regulator input
DC supply voltage
10.8
12
13.2
V
RL (BTL)
RL (SE)
Output filter: L = 10 µH, C = 470 nF.
Output AD modulation, switching
frequency > 350 kHz
Load impedance
RL (PBTL)
LOutput (BTL)
LOutput (SE)
6-8
Ω
3-4
3-4
10
Minimum output inductance under
short-circuit condition
Output-filter inductance
µH
10
LOutput (PBTL)
10
FPWM
PWM frame rate
TJ
Junction temperature
192
384
0
432
kHz
125
°C
AUDIO SPECIFICATIONS (BTL)
PVDD_X = 18 V, GVDD = VDD = 12 V, BTL mode, RL = 8 Ω, ROC = 22 KΩ, CBST = 33-nF, audio frequency = 1 kHz, AES17
filter, FPWM = 384 kHz, case temperature = 75°C (unless otherwise noted). Audio performance is recorded as a chipset, using
TAS5086 PWM processor with an effective modulation index limit of 96.1%. All performance is in accordance with
recommended operating conditions, unless otherwise specified.
PARAMETER
PO
Power output per channel, DDV package
MIN
TYP
26
RL = 8 Ω, 10% THD, clipped input signal
20
RL = 6 Ω, 0 dBFS, unclipped input signal
20
RL = 8 Ω, 0 dBFS, unclipped input signal
16
0 dBFS
MAX
UNIT
W
<0.1%
THD+N
Total harmonic distortion + noise
Vn
Output integrated noise
A-weighted
(1)
A-weighted
94
105
dB
94
105
dB
.6
W
SNR
Signal-to-noise ratio
1W
DNR
Dynamic range
A-weighted, input level = –60 dBFS using
TAS5086 modulator
Pidle
Power dissipation due to idle losses
(IPVDD_X)
PO = 0 W, 4 channels switching (2)
(1)
(2)
8
TEST CONDITIONS
RL = 6 Ω, 10% THD, clipped input signal
SNR is calculated relative to 0-dBFS input level.
Actual system idle losses are affected by core losses of output inductors.
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<0.06%
50
200
µV
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SLES190 – DECEMBER 2006
AUDIO SPECIFICATIONS (Single-Ended Output)
PVDD_X = 18 V, GVDD = VDD = 12 V, SE mode, RL = 3 Ω, ROC = 22 KΩ, CBST = 33-nF, audio frequency = 1 kHz, AES17
filter, FPWM = 384 kHz, case temperature = 75°C (unless otherwise noted). Audio performance is recorded as a chipset, using
TAS5086 PWM processor with an effective modulation index limit of 96.1%. All performance is in accordance with
recommended operating conditions, unless otherwise specified.
PARAMETER
PO
TEST CONDITIONS
Power output per channel, DDV package
TYP
RL = 3 Ω, 10% THD, clipped input signal
12.5
RL = 4 Ω, 10% THD, clipped input signal
10.0
RL = 3 Ω, 0 dBFS, unclipped input signal
9.5
RL = 4 Ω, 0 dBFS, unclipped input signal
7.5
0 dBFS, 4 Ω
.09
1 W, 4 Ω
.05
UNIT
W
THD+N
Total harmonic distortion + noise
Vn
Output integrated noise
A-weighted
18
µV
SNR
Signal-to-noise ratio (1)
A-weighted
100
dB
DNR
Dynamic range
A-weighted, input level = –60 dBFS using
TAS5086 modulator
100
dB
Pidle
Power dissipation due to idle losses (IPVDD_X)
PO = 0 W, 4 channels switching (2)
.6
W
(1)
(2)
%
SNR is calculated relative to 0-dBFS input level.
Actual system idle losses are affected by core losses of output inductors.
AUDIO SPECIFICATIONS (PBTL)
PVDD_X = 18 V, GVDD = VDD = 12 V, PBTL mode, RL = 3 Ω, ROC = 22 KΩ, CBST = 33-nF, audio frequency = 1 kHz, AES17
filter, FPWM = 384 kHz, case temperature = 75°C (unless otherwise noted). Audio performance is recorded as a chipset, using
TAS5086 PWM processor with an effective modulation index limit of 96.1%. All performance is in accordance with
recommended operating conditions, unless otherwise specified.
PARAMETER
PO
TEST CONDITIONS
Power output per channel, DDV package
TYP
RL = 3 Ω, 10% THD, clipped input signal
50
RL = 4 Ω, 10% THD, clipped input signal
40
RL = 3 Ω, 0 dBFS, unclipped input signal
37
RL = 4 Ω, 0 dBFS, unclipped input signal
30
0 dBFS, 3 Ω
.14
1 W, 3 Ω
.02
UNIT
W
THD+N
Total harmonic distortion + noise
Vn
Output integrated noise
A-weighted
30
µV
SNR
Signal-to-noise ratio (1)
A-weighted
105
dB
DNR
Dynamic range
A-weighted, input level = –60 dBFS using TAS5086
modulator
105
dB
Pidle
Power dissipation due to idle losses (IPVDD_X)
PO = 0 W, 1 channel switching (2)
.6
W
(1)
(2)
%
SNR is calculated relative to 0-dBFS input level.
Actual system idle losses are affected by core losses of output inductors.
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ELECTRICAL CHARACTERISTICS
RL= 8 Ω, FPWM = 384 kHz (unless otherwise noted). All performance is in accordance with recommended operating
conditions, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
3
3.3
3.6
UNIT
Internal Voltage Regulator and Current Consumption
VREG
Voltage regulator, only used as a
reference node
IVDD
VDD supply current
IGVDD_X
Gate supply current per half-bridge
IPVDD_X
Half-bridge idle current
VDD = 12 V
Operating, 50% duty cycle
V
6
9
Idle, reset mode
5.5
8
50% duty cycle
3.6
5.5
Reset mode
1.0
2.0
50% duty cycle, without output filter or load
9
15
mA
Reset mode, no switching
.1
.2
mA
mA
mA
Output Stage MOSFETs
RDSon,LS
Drain-to-source resistance, LS
TJ = 25°C, includes metallization resistance,
GVDD = 12 V
140
155
mΩ
RDSon,HS
Drain-to-source resistance, HS
TJ = 25°C, includes metallization resistance,
GVDD = 12 V
140
155
mΩ
I/O Protection
Vuvp,G
Undervoltage protection limit,
GVDD_X, voltage rising
9.6
V
Vuvp,G
Undervoltage protection limit,
GVDD_X, voltage falling
9.2
V
BSTuvpF
Puts device into RESET when BST
voltage falls below limit
6.2
V
BSTuvpR
Brings device out of RESET when
BST voltage rises above limit
6.6
V
OTW (1)
Overtemperature warning
125
°C
OTWHYST (1)
Temperature drop needed below
OTW temperature for OTW to be
inactive after the OTW event
25
°C
OTE (1)
Overtemperature error
155
°C
OTEOTWdifferential (1)
OTE-OTW differential
30
°C
OTEHYST (1)
A reset event must occur for SD to
be released following an OTE
event.
30
°C
OLPC
Overload protection counter
FPWM = 384 kHz
1.25
ms
IOC
Overcurrent limit protection
Resistor—programmable, max. current,
ROCP = 22 kΩ
IOCT
Overcurrent response time
ROCP
OC programming resistor range
Internal pulldown resistor at the
output of each half-bridge
Connected when RESET is active to provide
bootstrap capacitor charge. Not used in SE
mode
PAD
PWM Activity Detector, causes
device reset when PWM input
signal is stopped.
PWM stopped and time measured for device
to go into RESET (Output switching stopped)
10
5.0
150
Resistor tolerance = 5% for typical value; the
minimum resistance should not be less than
20kΩ.
RPD
(1)
4.0
Specified by design
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6.0
A
ns
kΩ
20
10
22
3.0
kΩ
25
µS
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ELECTRICAL CHARACTERISTICS (continued)
RL= 8 Ω, FPWM = 384 kHz (unless otherwise noted). All performance is in accordance with recommended operating
conditions, unless otherwise specified.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Digital Specifications
VIH
High-level input voltage
VIL
Low-level input voltage
Ilkg
2
PWM_A, PWM_B, PWM_C, PWM_D, M1,
M2, M3, RESET_AB, RESET_CD
V
0.8
Static, High PWM_A, PWM_B, PWM_C,
PWM_D, M1, M2, M3, RESET_AB,
RESET_CD
Input leakage current
V
100
µA
Static, Low PWM_A, PWM_B, PWM_C,
PWM_D, M1, M2, M3, RESET_AB,
RESET_CD
–10
10
OTW/Shutdown (SD)
RINT_PU
Internal pullup resistance, OTW to
VREG, SD to VREG
VOH
High-level output voltage
VOL
Low-level output voltage
Internal pullup resistor
20
26
32
3
3.3
3.6
External pullup of 4.7 kΩ to 5 V
5.5
IO = 4 mA
0.25
0.5
kΩ
V
V
TYPICAL CHARACTERISTICS, BTL CONFIGURATION
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
OUTPUT POWER
vs
SUPPLY VOLTAGE
30
TC = 75°C
THD+N @ 10%
TC = 75°C
PVDD = 18 V
One Channel
25
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
10
1
6Ω
0.1
20
6Ω
15
10
8Ω
5
8Ω
0.01
0
0.1
1
0
10
PO − Output Power − W
5
10
15
20
PVDD − Supply Voltage − V
G002
G001
Figure 1.
Figure 2.
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TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
UNCLIPPED OUTPUT POWER
vs
SUPPLY VOLTAGE
SYSTEM EFFICIENCY
vs
OUTPUT POWER
100
25
TC = 75°C
95
20
Efficiency − %
PO − Output Power − W
90
15
6Ω
10
8Ω
85
6Ω
80
75
70
5
8Ω
65
TC = 25°C
60
0
0
5
10
15
0
20
10
20
30
40
50
PO − Output Power − W
PVDD − Supply Voltage − V
G003
Figure 3.
Figure 4.
SYSTEM POWER LOSS
vs
OUTPUT POWER
SYSTEM OUTPUT POWER
vs
CASE TEMPERATURE
60
G004
30
7
TC = 25°C
6
25
6Ω
PO − Output Power − W
Power Loss − W
5
6Ω
4
3
2
8Ω
20
8Ω
15
10
5
1
THD+N @ 10%
0
0
0
10
20
30
40
PO − Output Power − W
50
60
0
G005
Figure 5.
12
20
40
60
Figure 6.
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80
TC − Case Temperature − °C
100
120
G006
TAS5132
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SLES190 – DECEMBER 2006
TYPICAL CHARACTERISTICS, BTL CONFIGURATION (continued)
Noise Amplitude − dBr
NOISE AMPLITUDE
vs
FREQUENCY
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
−100
−110
−120
−130
−140
−150
−160
TC = 75°C
0
2
4
6
8
10 12 14 16 18 20 22 24
f − Frequency − kHz
G007
Figure 7.
TYPICAL CHARACTERISTICS, SE CONFIGURATION
OUTPUT POWER
vs
SUPPLY VOLTAGE
15
10
TC = 75°C
Digital Gain = 3 dB
TC = 75°C
THD+N @ 10%
12
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
1
3Ω
0.1
9
3Ω
6
3
4Ω
4Ω
0.01
0.01
0.1
1
PO − Output Power − W
0
10
0
G008
Figure 8.
5
10
15
20
PVDD − Supply Voltage − V
G009
Figure 9.
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TAS5132
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TYPICAL CHARACTERISTICS, SE CONFIGURATION (continued)
OUTPUT POWER
vs
CASE TEMPERATURE
15
12
PO − Output Power − W
3Ω
9
4Ω
6
3
THD+N @ 10%
0
0
20
40
60
80
100
120
TC − Case Temperature − °C
G010
Figure 10.
TYPICAL CHARACTERISTICS, PBTL CONFIGURATION
OUTPUT POWER
vs
SUPPLY VOLTAGE
60
10
TC = 75°C
Digital Gain = 3 dB
TC = 75°C
THD+N @ 10%
50
PO − Output Power − W
THD+N − Total Harmonic Distortion + Noise − %
TOTAL HARMONIC DISTORTION + NOISE
vs
OUTPUT POWER
1
3Ω
0.1
40
3Ω
30
20
4Ω
10
0.01
4Ω
0.1
1
10
PO − Output Power − W
60
0
0
G011
Figure 11.
14
5
10
20
G012
Figure 12.
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PVDD − Supply Voltage − V
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SLES190 – DECEMBER 2006
TYPICAL CHARACTERISTICS, PBTL CONFIGURATION (continued)
SYSTEM OUTPUT POWER
vs
CASE TEMPERATURE
60
THD+N @ 10%
PO − Output Power − W
50
3Ω
40
4Ω
30
20
10
0
0
20
40
60
80
TC − Case Temperature − °C
100
120
G013
Figure 13.
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PVDD
3.3 Ω
GVDD
10 mF
220 mF
25 V
10 nF
25 V
10 Ω(A)
10 nF
25 V
TAS5132DDV
100 nF(A)
1
2
Microcontroller
GVDD_A
4
5
Shutdown
BST_A
NC
NC
NC
PVDD_A
SD
6
PWM1_P
PWM_A
7
VALID
RESET_AB
8
PWM1_M
PWM_B
22 kΩ
9
OC_ADJ
PWM2_P
10
GND
11
PWM2_M
AGND
12
100 nF
TAS5508
VREG
13
1Ω
10 mF
10 Ω(A)
10 nF
25 V
PVDD_B 35
BST_B 34
BST_C
PVDD
33 nF
33
PWM_C
GND_D
RESET_CD
OUT_D
33 nF
100 nF
25 V
100 nF
25 V
47 mF
25 V
10 nF
25 V
100 nF
25 V
3.3 Ω
470 nF
63 V
29
28
10 mH @ 6 A
PVDD_D
100 nF
25 V
3.3 Ω
26
NC
PVDD_D
NC
NC
GVDD_C
47 mF
25 V
10 mH@ 6 A
30
27
22
3.3 Ω
OUT_B 36
GND_C
VDD
100 nF
25 V
GND_B 37
M1
21
100 nF
47 mF
25 V
GND_A 38
M2
PWM_D
GVDD
100 nF
25 V
OUT_A 39
18
20
10 mH @ 6 A
PVDD_A 40
OUT_C 31
16
470 nF
63 V
41
PVDD_C 32
15
19
3.3 Ω
10 mH @ 6 A
42
M3
14
17
33 nF
43
OTW
3
0Ω
Optional
100 nF
25 V
44
GVDD_B
BST_D
GVDD_D
100 nF
25 V
25
10 nF
25 V
47 mF
25 V
24
23
PVDD
33 nF
100 nF(A)
3.3 Ω
10 nF
25 V
220 mF
25 V
S0070-06
A.
Optional component, GVDD_A and GVDD_B can potentially share the same decoupling components. Also, GVDD_C
and GVDD_D can potentially share the same decoupling components.
Figure 14. Typical Differential (2N) BTL Application With AD Modulation Filters
16
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PVDD
3.3 Ω
GVDD
10 mF
220 mF
25 V
10 nF
25 V
10 Ω(A)
10 nF
25 V
TAS5132DDV
100 nF(A)
1
2
Microcontroller
GVDD_A
43
OTW
4
5
Shutdown
NC
NC
NC
PVDD_A
SD
6
PWM1_P
PWM_A
7
VALID
RESET_AB
8
PWM_B
22 kΩ
9
PWM2
OC_ADJ
10
GND
11
AGND
100 nF
12
VREG
13
TAS5508
17
GND_A 38
1Ω
10 mF
BST_B 34
BST_C
10 Ω(A)
33 nF
33
PWM_C
GND_D
RESET_CD
OUT_D
33 nF
100 nF
25 V
100 nF
25 V
47 mF
25 V
10 nF
25 V
100 nF
25 V
3.3 Ω
470 nF
63 V
29
28
10 mH@ 6 A
PVDD_D
100 nF
25 V
3.3 Ω
26
NC
PVDD_D
NC
NC
GVDD_C
47 mF
25 V
10 mH@ 6 A
30
27
22
10 nF
25 V
PVDD_B 35
GND_C
VDD
100 nF
3.3 Ω
OUT_B 36
M1
21
GVDD
100 nF
25 V
47 mF
25 V
GND_B 37
M2
PWM_D
20
100 nF
25 V
OUT_A 39
18
19
10 mH @ 6 A
PVDD_A 40
OUT_C 31
16
470 nF
63 V
41
PVDD_C 32
15
3.3 Ω
10 mH @ 6 A
42
M3
14
33 nF
BST_A
3
0Ω
Optional
100 nF
25 V
44
GVDD_B
BST_D
GVDD_D
100 nF
25 V
25
10 nF
25 V
47 mF
25 V
24
23
PVDD
33 nF
100 nF(A)
3.3 Ω
10 nF
25 V
220 mF
25 V
S0070-07
A.
Optional component, GVDD_A and GVDD_B can potentially share the same decoupling components. Also, GVDD_C
and GVDD_D can potentially share the same decoupling components.
Figure 15. Typical Non-Differential (1N) BTL Application With AD Modulation Filters
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THEORY OF OPERATION
POWER SUPPLIES
To facilitate system design, the TAS5132 needs only
a 12-V supply in addition to the (typical) 18-V
power-stage supply. An internal voltage regulator
provides suitable voltage levels for the digital and
low-voltage analog circuitry. Additionally, all circuitry
requiring a floating voltage supply, e.g., the high-side
gate drive, is accommodated by built-in bootstrap
circuitry requiring only a few external capacitors.
In order to provide outstanding electrical and
acoustical characteristics, the PWM signal path
including gate drive and output stage is designed as
identical, independent half-bridges. For this reason,
each half-bridge has separate gate drive supply
(GVDD_X),
bootstrap
pins
(BST_X),
and
power-stage supply pins (PVDD_X). Furthermore, an
additional pin (VDD) is provided as supply for all
common circuits. These RC filters provide the
recommended high-frequency isolation. Special
attention should be paid to placing all decoupling
capacitors as close to their associated pins as
possible. In general, inductance between the power
supply pins and decoupling capacitors must be
avoided. (See reference board documentation for
additional information.)
For a properly functioning bootstrap circuit, a small
ceramic capacitor must be connected from each
bootstrap pin (BST_X) to the power-stage output pin
(OUT_X). When the power-stage output is low, the
bootstrap capacitor is charged through an internal
diode connected between the gate-drive power-supply pin (GVDD_X) and the bootstrap pin. When
the power-stage output is high, the bootstrap
capacitor potential is shifted above the output
potential and thus provides a suitable voltage supply
for the high-side gate driver. In an application with
PWM switching frequencies in the range from 352
kHz to 384 kHz, it is recommended to use 33-nF
ceramic capacitors, size 0603 or 0805, for the
bootstrap supply. These 33-nF capacitors ensure
sufficient energy storage, even during minimal PWM
duty cycles, to keep the high-side power stage FET
(LDMOS) fully turned on during the remaining part of
the PWM cycle. In an application running at a
reduced switching frequency, generally 192 kHz, the
bootstrap capacitor might need to be increased in
value.
Special attention should be paid to the power-stage
power supply; this includes component selection,
PCB placement, and routing. As indicated, each
half-bridge has independent power-stage supply pins
(PVDD_X). For optimal electrical performance, EMI
compliance, and system reliability, it is important that
each PVDD_X pin is decoupled with a 100-nF
18
ceramic capacitor placed as close as possible to
each supply pin. It is recommended to follow the
PCB layout of the TAS5132 reference design. For
additional information on recommended power
supply and required components, see the application
diagrams given previously in this data sheet.
The 12-V supply should be from a low-noise,
low-output-impedance voltage regulator. Likewise,
the 18-V power-stage supply is assumed to have low
output impedance and low noise. The power-supply
sequence is not critical as facilitated by the internal
power-on-reset circuit. Moreover, the TAS5132 is
fully protected against erroneous power-stage turnon
due to parasitic gate charging.
SYSTEM POWER-UP/POWER-DOWN
SEQUENCE
Powering Up
The TAS5132 does not require a power-up
sequence. The outputs of the H-bridges remain in a
low-impedance state until the gate-drive supply
voltage (GVDD_X) and VDD voltage are above the
undervoltage protection (UVP) voltage threshold (see
the Electrical Characteristics section of this data
sheet). Although not specifically required, it is
recommended to hold RESET_AB and RESET_CD
in a low state while powering up the device. This
allows an internal circuit to charge the external
bootstrap capacitors by enabling a weak pulldown of
the half-bridge output. The output impedance is
approximately 3KΩ under this condition, unless
mode 1, 0, 0 (Single-ended Mode), is used. This
means that the TAS5132 should be held in reset for
at least 200 µS to ensure that the bootstrap
capacitors are charged. This also assumes that the
recommended 0.033-µF bootstrap capacitors are
used. Changes to bootstrap capacitor values will
change the bootstrap capacitor charge time.
When the TAS5132 is being used with TI PWM
modulators such as the TAS5086, no special
attention to the state of RESET_AB and RESET_CD
is required, provided that the chipset is configured as
recommended.
Powering Down
The TAS5132 does not require a power-down
sequence. The device remains fully operational as
long as the gate-drive supply voltage and VDD
voltage are above the undervoltage protection (UVP)
voltage threshold (see the Electrical Characteristics
section of this data sheet). Although not specifically
required, it is a good practice to hold RESET_AB
and RESET_CD low during power down, thus
preventing audible artifacts, including pops or clicks.
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When the TAS5132 is being used with TI PWM
modulators such as the TAS5086, no special
attention to the state of RESET_AB and RESET_CD
is required, provided that the chipset is configured as
recommended.
ERROR REPORTING
The SD and OTW pins are both active-low,
open-drain
outputs.
Their
function
is
for
protection-mode signaling to a PWM controller or
other system-control device.
Any fault resulting in device shutdown is signaled by
the SD pin going low. Likewise, OTW goes low when
the device junction temperature exceeds 125°C (see
the following table).
SD
OTW
DESCRIPTION
0
0
Overtemperature (OTE) or overload (OLP) or
undervoltage (UVP)
0
1
Overload (OLP) or undervoltage (UVP)
1
0
Junction temperature higher than 125°C
(overtemperature warning)
1
1
Junction temperature lower than 125°C and no
OLP or UVP faults (normal operation)
Note that asserting either RESET_AB or RESET_CD
low forces the SD signal high, independent of faults
being present. TI recommends monitoring the OTW
signal using the system microcontroller and
responding to an overtemperature warning signal by,
e.g., turning down the volume to prevent further
heating of the device, resulting in device shutdown
(OTE).
To reduce external component count, an internal
pullup resistor to 3.3 V is provided on both SD and
OTW outputs. Level compliance for 5-V logic can be
obtained by adding external pullup resistors to 5 V
(see the Electrical Characteristics section of this data
sheet for further specifications).
DEVICE PROTECTION SYSTEM
The TAS5132 contains advanced protection circuitry
carefully designed to facilitate system integration and
ease of use, as well as to safeguard the device from
permanent failure due to a wide range of fault
conditions such as short circuits, overload,
overtemperature, and undervoltage. The TAS5132
responds to a fault by immediately setting the power
stage in a high-impedance (Hi-Z) state and asserting
the SD pin low. In situations other than overload and
overtemperature, the device automatically recovers
when the fault condition has been removed. For
highest possible reliability, recovering from an
overload fault requires external reset of the device
(see the Device Reset section of this data sheet) no
sooner than 1 second after the shutdown.
PWM inputs that will detect the condition when a
PWM input is continuously high or low. This function
is named PWM Activity Detector (PAD). Without this
protection circuitry, if a PWM input is continuously
high or low, the PVDD power supply voltage could
appear on the associated output pin. This condition
could damage either the output load (loudspeaker) or
the device. If a PWM input remains either high or low
for over 10 µS, the device's outputs will be set into a
Hi-Z state. If this error condition occurs, SD will not
be asserted low.
Use of TAS5132
Capable Systems
in
High-Modulation-Index
This device requires at least 50 ns of low time on the
output per 384-kHz PWM frame rate in order to keep
the bootstrap capacitors charged. As an example, if
the modulation index is set to 99.2% in the TAS5086,
this setting allows PWM pulse durations down to 20
ns. This signal, which does not meet the 50-ns
requirement, is sent to the PWM_X pin, and this
low-state pulse time does not allow the bootstrap
capacitor to stay charged. In this situation, the low
voltage across the bootstrap capacitor can cause the
bootstrap UVP circuitry to avtivate and shutdown the
device. The TAS5132 device requires limiting the
TAS5086 modulation index to 96.1% to keep the
bootstrap capacitor charged under all signals and
loads.
Therefore, TI strongly recommends using a TI PWM
processor, such as TAS5508 or TAS5086, with the
modulation index set at 96.1% to interface with
TAS5132. This is done by writing 0x04 to the
Modulation Limit Register (0x10) in the TAS5086 or
0x04 to the Modulation Limit Register (0x16) in the
TAS5508.
Overcurrent (OC) Protection
Limiting and Overload Detection
With
Current
The device has independent, fast-reacting current
detectors with on all high-side and low-side
power-stage FETs. See the following table for
OC-adjust resistor values. The detector outputs are
closely monitored by two protection systems. The
first protection system controls the power stage in
order to prevent the output current from further
increasing, i.e., it performs a current-limiting function,
rather than prematurely shutting down during
combinations of high-level music transients and
extreme speaker load impedance drops. If the
high-current situation persists, i.e., the power stage
is being overloaded, a second protection system
triggers a latching shutdown, resulting in the power
stage being set in the high-impedance (Hi-Z) state.
The TAS5132 contains circuitry associated with its
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Current limiting and overload protection are
independent for half-bridges A and B and,
respectively, C and D. That is, if the bridge-tied load
between half-bridges A and B causes an overload
fault, only half-bridges A and B are shut down.
OC-Adjust Resistor Values
(kΩ)
Max. Current Before OC
Occurs (A)
22
5.2
27
4.6
30
4.2
33
3.8
DEVICE RESET
42
3.2
47
2.9
56
2.5
69.8
2.0
Two reset pins are provided for independent control
of half-bridges A/B and C/D. When RESET_AB is
asserted low, all four power-stage FETs in half-bridges A and B are forced into a high-impedance
(Hi-Z) state. Likewise, asserting RESET_CD low
forces all four power-stage FETs in half-bridges C
and D into a high-impedance state. Thus, both reset
pins are well suited for hard-muting the power stage
if needed.
Overtemperature Protection
The TAS5132 has a two-level temperature-protection
system that asserts an active-low warning signal
(OTW) when the device junction temperature
exceeds 125°C (nominal) and, if the device junction
temperature exceeds 155°C (nominal), the device is
put into thermal shutdown, resulting in all half-bridge
outputs being set in the high-impedance (Hi-Z) state
and SD being asserted low. OTE is latched in this
case. To clear the OTE latch, both RESET_AB and
RESET_CD must be asserted. Thereafter, the device
resumes normal operation.
Undervoltage Protection (UVP) and Power-On
Reset (POR)
The UVP and POR circuits of the TAS5132 fully
protect the device in any power-up/down and
brownout situation. While powering up, the POR
circuit resets the overload circuit (OLP) and ensures
20
that all circuits are fully operational when the
GVDD_X and VDD supply voltages reach 9.6 V
(typical). Although GVDD_X and VDD are
independently monitored, a supply voltage drop
below the UVP threshold on any VDD or GVDD_X
pin results in all half-bridge outputs immediately
being set in the high-impedance (Hi-Z) state and SD
being asserted low. The device automatically
resumes operation when all supply voltages have
increased above the UVP threshold.
In BTL modes, to accommodate bootstrap charging
prior to switching start, asserting the reset inputs low
enables weak pulldown of the half-bridge outputs. In
the SE mode, the weak pulldowns are not enabled,
and it is therefore recommended to ensure bootstrap
capacitor charging by providing a low pulse on the
PWM inputs when reset is asserted high.
Asserting either reset input low removes any fault
information to be signalled on the SD output, i.e., SD
is forced high.
A rising-edge transition on either reset input allows
the device to resume operation after an overload
fault.
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power
Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
8-Jan-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TAS5132DDV
ACTIVE
HTSSOP
DDV
44
35
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5132DDVG4
ACTIVE
HTSSOP
DDV
44
35
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5132DDVR
ACTIVE
HTSSOP
DDV
44
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
TAS5132DDVRG4
ACTIVE
HTSSOP
DDV
44
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
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