RI-STU-251B www.ti.com SCBS852 – MARCH 2001 SERIES 2000 READER S251B FEATURES APPLICATIONS • • • • • • • • • • Best in Class Performance Through Patented HDX Technology Automatic Antenna Tuning High Power Output Proven in Harsh Industrial Environments Easy to Install and Use Access Control Vehicle Identification Container Tracking Asset Management Waste Management DESCRIPTION The Texas Instruments’ low-frequency (LF) reader provides all the functionality required to communicate with Texas Instruments 134.2 kHz LF transponders which are available in a variety of form factors. The RI-STU-251B Reader/Writer is capable driving a variety of antennas with inductance ranges from 26.0µH to 27.9µH including TI standard antennas RI-ANT-G01E, RI-ANT-G02E, RI-ANT-G04E gate antennas as well as RI-ANT-S01C and RI-ANT-S02C stick antennas. The RI-STU-251B includes an automatic antenna resonance tuning feature which further reduces the need for maintenance and simplifies installation. It also supports both RS232 and RS422/485 interface standards. The RI-STU-251B is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. The Series 2000 Reader S251B provides all RF and Control Functions to communicate with 134.2 kHz HDX/FSK transponders. It sends an energizing signal to the transponder, modulates the RF signal to send data to the transponder, decodes and checks the received transponder data and transmits it via a standard serial interface (RS232, RS422/485). The reader includes a Dynamic Auto Tuning (DAT) function that automatically tunes a standard antenna to resonance and keeps it tuned during operation. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) Operating Temperature Storage Temperature (1) RI-STU-251B UNIT –20 to +70 (depending on power consumption) °C –40 to +85 °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TIRIS is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001, Texas Instruments Incorporated RI-STU-251B www.ti.com SCBS852 – MARCH 2001 RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) RI-STU-251B Power Supply 10 to 24 Vdc, regulated OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PART NUMBER PARAMETER 2 RI-STU-251B Relative Humidity <97% non-condensing, IEC 68-2-30 Test Db, 21 cycles RF Transmit Frequency 134.2 Memory 64 kByte EPROM for Firmware 1kBit EEPROM for Configuration 32 kByte RAM for Data Data Storage 909 ID Codes (each 64bit) Communications Interface RS232, RS422/485 System Architecture Point-to-point and point-to-multipoint Communications Parameters 600 - 57600 baud, 7/8 data bits, even/odd parity Communications Protocol ASCII with Xon/Xoff handshake, TIRIS™ Bus Protocol Inputs/Outputs 8 configurable digital I/Os, 2 open collector outputs Antenna Tuning Range 26 to 27.9 µH (Dynamic Auto Tuning) Antenna Resonance Voltage Max. 380 Vpeak Transponder Types 134.2 kHz HDX/FSK Dimensions (L × W × H) (200 mm × 120mm × 120 mm) ± 1.5 mm Weight 900 Mounting DIN rail TS35 Submit Documentation Feedback UNIT kHz g PACKAGE OPTION ADDENDUM www.ti.com 30-Jan-2007 PACKAGING INFORMATION Orderable Device Status (1) RI-STU-251B-01 ACTIVE Package Type Package Drawing Pins Package Eco Plan (2) Qty 1 1 TBD Lead/Ball Finish Call TI MSL Peak Temp (3) Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. 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