VISHAY SI2333CDS-T1-E3

Si2333CDS
Vishay Siliconix
P-Channel 12-V (D-S) MOSFET
FEATURES
• TrenchFET® Power MOSFET
MOSFET PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)a
0.035 at VGS = - 4.5 V
- 5.1
0.045 at VGS = - 2.5 V
- 4.5
0.059 at VGS = - 1.8 V
- 3.9
VDS (V)
- 12
Qg (Typ.)
APPLICATIONS
RoHS
COMPLIANT
• Load Switch
• PA Switch
9 nC
TO-236
(SOT-23)
G
1
3
S
D
2
Top View
Si2333CDS (O3)*
* Marking Code
Ordering Information: Si2333CDS-T1-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Drain Current (TJ = 150 °C)
Limit
- 12
±8
- 7.1
- 5.7
ID
- 5.1b, c
- 4.0b, c
- 20
- 1.0
IDM
Pulsed Drain Current
TC = 25 °C
TA = 25 °C
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Continuous Source-Drain Diode Current
Maximum Power Dissipation
IS
- 0.63b, c
2.5
1.6
PD
1.25b, c
0.8b, c
- 55 to 150
TJ, Tstg
Operating Junction and Storage Temperature Range
Unit
V
A
W
°C
THERMAL RESISTANCE RATINGS
Parameter
b, d
≤5s
Steady State
Maximum Junction-to-Ambient
Maximum Junction-to-Foot (Drain)
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. Maximum under Steady State conditions is 166 °C/W.
Document Number: 68717
S-81445-Rev. A, 23-Jun-08
Symbol
RthJA
RthJF
Typical
75
40
Maximum
100
50
Unit
°C/W
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Si2333CDS
Vishay Siliconix
MOSFET SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VDS = 0 V, ID = - 250 µA
- 12
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
ΔVDS/TJ
VDS Temperature Coefficient
V
- 13
mV/°C
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
ID = - 250 µA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = - 250 µA
-1
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 8 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = - 12 V, VGS = 0 V
-1
VDS = - 12 V, VGS = 0 V, TJ = 55 °C
- 10
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS ≤ - 5 V, VGS = - 4.5 V
2.6
- 0.4
- 20
µA
A
VGS = - 4.5 V, ID = - 5.1 A
0.0285
0.035
VGS = - 2.5 V, ID = - 4.5 A
0.036
0.045
VGS = - 1.8 V, ID = - 2.0 A
0.046
0.059
VDS = - 5 V, ID = - 1.9 A
1.6
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
1225
VDS = - 6 V, VGS = 0 V, f = 1 MHz
tr
Rise Time
td(off)
Turn-Off Delay Time
15
25
9
15
VDS = - 6 V, VGS = - 2.5 V, ID = - 5.1 A
1.9
f = 1 MHz
4.0
nC
3.8
13
VDD = - 6 V, RL = 6 Ω
ID = - 1 A, VGEN = - 4.5 V, RG = 1 Ω
tf
Fall Time
pF
260
VDS = - 6 V, VGS = - 4.5 V, ID = - 5.1 A
td(on)
Turn-On Delay Time
315
Ω
20
35
60
45
70
12
20
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
IS
TC = 25 °C
- 1.0
ISM
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
- 20
IS = - 1.0 A
IF = - 1.0 A, dI/dt = 100 A/µs, TJ = 25 °C
A
- 0.7
- 1.2
V
32
50
ns
20
40
nC
16
16
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68717
S-81445-Rev. A, 23-Jun-08
Si2333CDS
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
2.0
VGS = 5 thru 2.5 V
15
I D - Drain Current (A)
I D - Drain Current (A)
VGS = 2 V
10
VGS = 1.5 V
5
1.5
TC = 25 °C
1.0
0.5
TC = 125 °C
VGS = 1 V
0
0.0
0.5
1.0
1.5
TC = - 55 °C
0.0
0.0
2.0
0.3
VDS - Drain-to-Source Voltage (V)
1.2
1.5
Transfer Characteristics
2400
0.10
0.08
C - Capacitance (pF)
1800
0.06
VGS = 1.8 V
VGS = 2.5 V
0.04
Ciss
1200
600
VGS = 4.5 V
0.02
Coss
Crss
0.00
0
0
5
10
15
0
20
3
ID - Drain Current (A)
6
9
12
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
8
1.6
ID = 5.1 A
ID = 5.1 A
VDS = 3 V
VDS = 6 V
4
VDS = 9 V
2
(Normalized)
1.4
6
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
0.9
VGS - Gate-to-Source Voltage (V)
Output Characteristics
R DS(on) - On-Resistance (Ω)
0.6
VGS = 2.5 V
1.2
VGS = 4.5 V
1.0
0.8
0
0
5
10
15
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 68717
S-81445-Rev. A, 23-Jun-08
20
25
0.6
- 50
- 25
0
25
50
75
100
125
150
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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Si2333CDS
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.14
100
ID = 5.1 A
0.12
I S - Source Current (A)
1
R DS(on) - On-Resistance (Ω)
TJ = 150 °C
10
TJ = 25 °C
0.1
TJ = - 55 °C
0.01
0.10
0.08
0.06
TJ = 125 °C
0.04
0.02
0.001
0.0
TJ = 25 °C
0.00
0.2
0.4
0.6
0.8
1.0
1.2
0
1
VSD - Source-to-Drain Voltage (V)
3
4
5
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
10
0.4
0.3
8
ID = 250 µA
0.2
Power (W)
VGS(th) Variance (V)
2
ID = 1 mA
0.1
6
4
0.0
2
- 0.1
- 0.2
- 50
- 25
0
25
50
75
100
125
0
0.01
150
TA = 25 °C
0.1
TJ - Temperature (°C)
1
10
100
1000
Time (s)
Single Pulse Power
Threshold Voltage
100
Limited by RDS(on)*
100 µs
I D - Drain Current (A)
10
1 ms
1
10 ms
100 ms
0.1
TA = 25 °C
Single Pulse
0.01
0.1
1 s, 10 s
100 s, DC
BVDSS
Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area
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Document Number: 68717
S-81445-Rev. A, 23-Jun-08
Si2333CDS
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJF = 50 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?68717.
Document Number: 68717
S-81445-Rev. A, 23-Jun-08
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Vishay
Disclaimer
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
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document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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