SEME-LAB SML20T75

SML20T75
T247clip Package Outline.
Dimensions in mm (inches)
4.69 (0.185)
5.31 (0.209)
1.49 (0.059)
2.49 (0.098)
N–CHANNEL
ENHANCEMENT MODE
HIGH VOLTAGE
POWER MOSFETS
15.49 (0.610)
16.26 (0.640)
20.80 (0.819)
21.46 (0.845)
5.38 (0.212)
6.20 (0.244)
4.50
(0.177)
MAX
2
2
VDSS
200V
100A
ID(cont)
RDS(on) 0.022W
3
19.81 (0.780)
20.32 (0.800)
0.40 (0.016)
0.79 (0.031)
1
2.87 (0.113)
3.12 (0.123)
1.65 (0.065)
2.13 (0.084)
1.01 (0.040)
1.40 (0.055)
5.45 (0.215)
BSC
2plcs
2.21 (0.087)
2.59 (0.102)
Pin 1 – Gate
Pin 2 – Drain
Pin 3 – Source
D
•
•
•
•
Faster Switching
Lower Leakage
100% Avalanche Tested
New T247clip Package
(Clip–mounted TO–247 Package)
StarMOS is a new generation of high voltage
N–Channel enhancement mode power MOSFETs.
This new technology minimises the JFET effect,
increases packing density and reduces the
on-resistance. StarMOS also achieves faster
switching speeds through optimised gate layout.
G
S
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
VDSS
Drain – Source Voltage
200
V
ID
Continuous Drain Current
100
A
IDM
Pulsed Drain Current 1
400
A
VGS
Gate – Source Voltage
±30
VGSM
Gate – Source Voltage Transient
±40
Total Power Dissipation @ Tcase = 25°C
520
W
Derate Linearly
4.16
W/°C
PD
–55 to 150
TJ , TSTG
Operating and Storage Junction Temperature Range
TL
Lead Temperature : 0.063” from Case for 10 Sec.
300
IAR
Avalanche Current1 (Repetitive and Non-Repetitive)
100
EAR
Repetitive Avalanche Energy 1
50
EAS
Single Pulse Avalanche Energy
2
2500
V
°C
A
mJ
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Starting TJ = 25°C, L = 500µH, RG = 25W, Peak IL = 100A
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
Website: http://www.semelab.co.uk
E-mail: [email protected]
6/99
SML20T75
STATIC ELECTRICAL RATINGS (Tcase = 25°C unless otherwise stated)
Characteristic
Drain – Source Breakdown Voltage
Test Conditions
VGS = 0V , ID = 250mA
Zero Gate Voltage Drain Current
VDS = VDSS
25
(VGS = 0V)
VDS = 0.8VDSS , TC = 125°C
250
IGSS
Gate – Source Leakage Current
VGS = ±30V , VDS = 0V
±100
nA
VGS(TH)
Gate Threshold Voltage
VDS = VGS , ID = 2.5mA
4
V
ID(ON)
On State Drain Current 2
RDS(ON)
Drain – Source On State Resistance 2
BVDSS
IDSS
VDS > ID(ON) x RDS(ON) Max
VGS = 10V
Min.
200
Typ.
2
Max. Unit
V
100
mA
A
VGS = 10V , ID = 0.5 ID [Cont.]
0.022
W
DYNAMIC CHARACTERISTICS
Ciss
Characteristic
Input Capacitance
Test Conditions
VGS = 0V
Min.
Coss
Output Capacitance
VDS = 25V
1950
Crss
Reverse Transfer Capacitance
f = 1MHz
560
Qg
Total Gate Charge3
VGS = 10V
290
Qgs
Gate – Source Charge
VDD = 0.5 VDSS
66
Qgd
Gate – Drain (“Miller”) Charge
ID = ID [Cont.] @ 25°C
120
td(on)
Turn–on Delay Time
VGS = 15V
16
tr
Rise Time
VDD = 0.5 VDSS
25
td(off)
Turn-off Delay Time
ID = ID [Cont.] @ 25°C
48
tf
Fall Time
RG = 0.6W
Typ.
8500
Max. Unit
pF
nC
ns
5
SOURCE – DRAIN DIODE RATINGS AND CHARACTERISTICS
IS
Characteristic
Continuous Source Current
Test Conditions
(Body Diode)
ISM
Pulsed Source Current1
(Body Diode)
VSD
Diode Forward Voltage2
VGS = 0V , IS = – ID [Cont.]
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Min.
Typ.
Max. Unit
100
A
400
1.3
IS = – ID [Cont.] , dls / dt = 100A/ms
IS = – ID [Cont.] , dls / dt = 100A/ms
V
330
ns
5.8
mC
THERMAL CHARACTERISTICS
RqJC
RqJA
Characteristic
Junction to Case
Min.
Junction to Ambient
Typ.
Max. Unit
0.24
°C/W
40
1) Repetitive Rating: Pulse Width limited by maximum junction temperature.
2) Pulse Test: Pulse Width < 380mS , Duty Cycle < 2%
3) See MIL–STD–750 Method 3471
CAUTION — Electrostatic Sensitive Devices. Anti-Static Procedures Must Be Followed.
Semelab plc.
Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
Website: http://www.semelab.co.uk
E-mail: [email protected]
6/99