TI TPS767D325-Q1

SGLS231 − FEBRUARY 2004
D Qualification in Accordance With
D
D
D
D
D
D
D
D
D
D
D
D
D
PWP PACKAGE
(TOP VIEW)
AEC-Q100†
Qualified for Automotive Applications
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
Dual Output Voltages for Split-Supply
Applications
Output Current Range of 0 mA to 1.0 A Per
Regulator
3.3-V/2.5-V, 3.3-V/1.8-V, and 3.3-V/Adjustable
Output
Fast-Transient Response
2% Tolerance Over Load and Temperature
Dropout Voltage Typically 350 mV at 1 A
Ultra Low 85 µA Typical Quiescent Current
1 µA Quiescent Current During Shutdown
Dual Open Drain Power-On Reset With
200-ms Delay for Each Regulator
28-Pin PowerPAD TSSOP Package
Thermal Shutdown Protection for Each
Regulator
1
2
3
4
5
6
7
8
9
10
11
12
13
14
NC
NC
1GND
1EN
1IN
1IN
NC
NC
2GND
2EN
2IN
2IN
NC
NC
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1RESET
NC
NC
1FB/NC
1OUT
1OUT
2RESET
NC
NC
NC
2OUT
2OUT
NC
NC
NC − No internal connection
† Contact factory for details. Q100 qualification data available on
request.
description
The TPS767D3xx family of dual voltage regulators offers fast transient response, low dropout voltages and dual
outputs in a compact package and incorporating stability with 10-µF low ESR output capacitors.
The TPS767D3xx family of dual voltage regulators is designed primarily for DSP applications. These devices
can be used in any mixed-output voltage application, with each regulator supporting up to 1 A. Dual active-low
reset signals allow resetting of core-logic and I/O separately.
AVAILABLE OPTIONS
REGULATOR 1
VO (V)
REGULATOR 2
VO (V)
TSSOP
(PWP)
Adj (1.5 − 5.5 V)
3.3 V
TPS767D301QPWPRQ1
1.8 V
3.3 V
TPS767D318QPWPRQ1
2.5 V
3.3 V
TPS767D325QPWPRQ1
TJ
−40°C
−40
C to 125
125°C
C
The TPS767D301 is adjustable using an external resistor divider (see application information).
The PWP packages are taped and reeled as indicated by the R suffix on the device type (e.g.,
TPS767D301QPWPRQ1).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
Copyright  2004 Texas Instruments Incorporated
!"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($%
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DROPOUT VOLTAGE
vs
FREE-AIR TEMPERATURE
LOAD TRANSIENT RESPONSE
103
VO = 3.3 V
CL =100 µF
TA = 25°C
50
IO = 1 A
VDO − Dropout Voltage − mV
I O − Output Current − A
∆ VO − Change in
Output Voltage − mV
100
0
−50
−100
1
0.5
0
102
101
IO = 10 mA
100
10−1
VO = 3.3 V
CO = 10 µF
0
20
40
60
80 100 120 140 160 180 200
t − Time − µs
10−2
−60 −40 −20
IO = 0
0
20
40
60
80 100 120 140
TA − Free-Air Temperature − °C
description (continued)
Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 350 mV
at an output current of 1 A for the TPS767D325) and is directly proportional to the output current. Additionally,
since the PMOS pass element is a voltage-driven device, the quiescent current is very low and independent
of output loading (typically 85 µA over the full range of output current, 0 mA to 1 A). These two key specifications
yield a significant improvement in operating life for battery-powered systems. This LDO family also features a
sleep mode; applying a TTL high signal to EN (enable) shuts down the regulator, reducing the quiescent current
to 1 µA at TJ = 25°C.
The RESET output of the TPS767D3xx initiates a reset in microcomputer and microprocessor systems in the
event of an undervoltage condition. An internal comparator in the TPS767D3xx monitors the output voltage of
the regulator to detect an undervoltage condition on the regulated output voltage.
The TPS767D3xx is offered in 1.8-V, 2.5-V, and 3.3-V fixed-voltage versions and in an adjustable version
(programmable over the range of 1.5 V to 5.5 V). Output voltage tolerance is specified as a maximum of 2%
over line, load, and temperature ranges. The TPS767D3xx family is available in 28 pin PWP TSSOP package.
They operate over a junction temperature range of −40°C to 125°C.
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TPS767D3xx
VI
5
6
C1
0.1 µF
50 V
IN
RESET
RESET
250 kΩ
IN
OUT
4
28
EN
OUT
GND
24
VO
23
+
CO
10 µF
3
Figure 1. Typical Application Circuit (Fixed Versions) for Single Channel
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functional block diagram—adjustable version (for each LDO)
IN
EN
RESET
_
+
OUT
+
_
200 ms Delay
R1
Vref = 1.1834 V
R2
GND
functional block diagram—fixed-voltage version (for each LDO)
IN
EN
RESET
_
+
OUT
+
_
200 ms Delay
Vref = 1.1834 V
R1
FB/NC
R2
GND
External to the device
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Terminal Functions
TERMINAL
NAME
1GND
I/O
NO.
3
DESCRIPTION
Regulator #1 ground
1EN
4
I
Regulator #1 enable
1IN
5, 6
I
Regulator #1 input supply voltage
2GND
9
2EN
10
I
Regulator #2 enable
2IN
11, 12
I
Regulator #2 input supply voltage
2OUT
17, 18
O
Regulator #2 output voltage
22
O
Regulator #2 reset signal
2RESET
1OUT
Regulator #2 ground
23, 24
O
Regulator #1 output voltage
1FB/NC
25
I
Regulator #1 output voltage feedback for adjustable and no connect for fixed output
1RESET
28
O
Regulator #1 reset signal
NC
1, 2, 7, 8,
13−16, 19, 20,
21, 26, 27
No connection
timing diagram
VI
Vres†
Vres
t
VO
VIT +‡
VIT +‡
Threshold
Voltage
VIT −
Less than 5% of the
output voltage
VIT −
t
RESET
Output
ÎÎ
ÎÎ
ÎÎ
ÎÎ
200 ms
Delay
200 ms
Delay
Output
Undefined
ÎÎ
ÎÎ
ÎÎ
ÎÎ
Output
Undefined
t
† Vres is the minimum input voltage for a valid RESET. The symbol Vres is not currently listed within EIA or JEDEC standards
for semiconductor symbology.
‡ VIT −Trip voltage is typically 5% lower than the output voltage (95%VO)
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absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Input voltage range‡, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 13.5 V
Input voltage range, VI (1IN, 2IN, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VI + 0.3 V
Output voltage, VO (1OUT, 2OUT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Output voltage, VO (RESET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V
Peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally limited
ESD rating, HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See dissipation rating tables
Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
‡ All voltage values are with respect to network terminal ground.
ÁÁÁÁÁÁ
ÁÁÁÁÁÁ
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ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ
ÁÁÁÁÁ
ÁÁÁÁÁÁ
DISSIPATION RATING TABLE
PACKAGE
PWP§
AIR FLOW
(CFM)
TA ≤ 25°C
POWER RATING
DERATING FACTOR
ABOVE TA = 25°C
TA = 70°C
POWER RATING
TA = 85°C
POWER RATING
0
3.58 W
35.8 mW/°C
1.97 W
1.43 W
250
5.07 W
50.7 mW/°C
2.79 W
2.03 W
§ This parameter is measured with the recommended copper heat sink pattern on a 4−layer PCB, 1 oz. copper on 4−in x 4−in
ground layer. For more information, refer to TI technical brief literature number SLMA002.
recommended operating conditions
Input voltage, VI¶ (1IN, 2IN)
Output current for each LDO, IO (Note 1)
Output voltage range, VO (1OUT, 2OUT)
MIN
MAX
2.7
10
UNIT
V
0
1.0
A
1.5
5.5
V
Operating virtual junction temperature, TJ
−40
125
°C
¶ To calculate the minimum input voltage for your maximum output current, use the following equation: VI(min) = VO(max) + VDO(max load).
NOTE 1: Continuous current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that the
device operate under conditions beyond those specified in this table for extended periods of time.
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electrical characteristics, Vi = VO(nom) + 1 V, IO = 1 mA, EN = 0, CO = 10 µF (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
1.5 V ≤ VO ≤ 5.5 V,
10 µA < IO < 1 A
TJ = 25°C
TJ = −40°C to 125°C
1.8 V Ouput
2.8 V < VI < 10 V,
10 µA < IO < 1 A
TJ = 25°C
TJ = −40°C to 125°C
1.764
2.5 V Output
3.5 V < VI < 10 V,
10 µA < IO < 1 A
TJ = 25°C
TJ = −40°C to 125°C
2.45
3.3 V Output
4.3 V < VI < 10 V,
10 µA < IO < 1 A
TJ = 25°C
TJ = −40°C to 125°C
3.234
10 µA < IO < 1 A,
TJ = 25°C
IO = 1 A,
TJ = −40°C to 125°C
Output voltage line regulation for each LDO
(∆VO/VO) (see Notes 2 and 3)
VO + 1 V < VI ≤ 10 V,
TJ = 25°C
Output noise voltage
BW = 200 Hz to 100 kHz, VO = 1.8 V,
IC = 1 A, CO = 10 µF, TJ = 25°C
55
Output current limit for each LDO
VO = 0 V
1.7
Adjustable
Output voltage (VO) (see Note 2)
Quiescent current (GND current) for each LDO
(see Note 2)
Standby current for each LDO
FB input current
Adjustable
EN = VI,
2.7 < VI < 10V,
TJ = −40°C to 125°C
EN = VI,
1.02VO
1.8
1.836
2.55
3.3
3.366
125
0.01
2
°C
1
µA
10
Hysteresis voltage
Measured at VO
Output low voltage
VI = 2.7 V,
V
Leakage current
V(RESET) = 7 V
CO = 10 µF
dB
1.1
V
98
0.5
0.15
200
%VO
%VO
0.4
1
RESET time-out delay
V
60
92
IO(RESET) = 1 mA
µA
nA
0.8
VO decreasing
A
150
Low level enable input voltage
Reset
µVrms
2
Trip threshold voltage
µA
A
%/V
2.0
Minimum input voltage for valid RESET
V
85
FB = 1.5 V
f = 1 KHz, TJ = 25°C,
IO(RESET) = 300 µA
V
2.5
High level enable input voltage
Power supply ripple rejection (see Note 2)
UNIT
VO
0.98VO
Thermal shutdown juction temperature
2.7 < VI < 10V,
TJ = 25°C,
MAX
V
µA
mA
NOTES: 2. Minimum IN operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. maximum IN voltage 10V.
3. If VO ≤ 1.8 V, VImin = 2.7 V, and VImax = 10 V:
Line Reg. (mV) + ǒ%ńVǓ
V
O
ǒVImax * 2.7 VǓ
100
1000
If VO ≥ 2.5 V, VImin = Vo + 1 V, and VImax = 10 V:
Line Reg. (mV) + ǒ%ńVǓ
V
O
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ǒVImax * ǒVO ) 1 VǓǓ
100
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1000
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electrical characteristics, Vi = VO(nom) + 1 V, IO = 1 mA, EN = 0, CO = 10 µF (unless otherwise noted)
(continued)
PARAMETER
Input current (EN)
MIN
TYP
MAX
EN = 0 V
TEST CONDITIONS
−1
0
1
EN = VI
−1
Load regulation
Dropout voltage (see Note 4)
UNIT
µA
A
1
3
VO = 3.3 V, IO = 1 A
TJ = 25°C
TJ = −40°C to 125°C
mV
350
mV
575
NOTE 4: IN voltage equals Vo(Typ) − 100mV; Adjustable output voltage set to 3.3V nominal with external resistor divider. 1.8V, and 2.5V dropout
voltage is limited by input voltage range limitations.
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
vs Output current
2, 3, 4
vs Free-air temperature
5, 6, 7
Ground current
vs Free-air temperature
8, 9
Power supply ripple rejection
vs Frequency
10
Output spectral noise density
vs Frequency
11
Output impedance
vs Frequency
12
Dropout voltage
vs Free-air temperature
13
Output voltage
Line transient response
14, 16
Load transient response
15, 17
Output voltage
vs Time
18
Dropout voltage
vs Input voltage
19
vs Output current, TA = 25°C
21
vs Output current, TJ = 125°C
22
vs Output Current, TA = 25°C
23
vs Output current, TJ = 125°C
24
Equivalent series resistance (ESR)
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TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
1.7965
3.2835
VO = 1.8 V
VI = 2.8V
TA = 25°C
VO = 3.3 V
VI = 4.3 V
TA = 25°C
1.7960
VO − Output Voltage − V
3.2830
VO − Output Voltage − V
3.2825
3.2820
3.2815
3.2810
1.7955
1.7950
1.7945
3.2805
1.7940
3.2800
0
0.1
0.2 0.3 0.4 0.5 0.6 0.7 0.8
IO − Output Current − A
0.9
1
0
0.1
0.2 0.3
Figure 2
0.5
0.6 0.7
0.8
0.9
1
Figure 3
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
2.4960
3.32
VO = 2.5 V
VI = 3.5 V
TA = 25°C
2.4955
3.31
VO − Output Voltage − V
2.4950
VO − Output Voltage − V
0.4
IO − Output Current − A
2.4945
2.4940
2.4935
2.4930
VO = 3.3 V
VI = 4.3 V
3.30
3.29
IO = 1 A
IO = 1 mA
3.28
3.27
3.26
2.4925
2.4920
0
0.1 0.2 0.3
0.4 0.5
0.6 0.7
0.8 0.9
1
3.25
−60 −40 −20
0
20
40
60
80
100 120 140
TA − Free-Air Temperature − °C
IO − Output Current − A
Figure 4
Figure 5
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TYPICAL CHARACTERISTICS
OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
OUTPUT VOLTAGE
vs
FREE-AIR TEMPERATURE
2.515
1.815
VO = 1.8 V
VI = 2.8 V
2.510
1.805
IO = 1 A
1.800
IO = 1 mA
1.795
1.790
VO − Output Voltage − V
VO − Output Voltage − V
1.810
VO = 2.5 V
VI = 3.5 V
2.505
2.500
IO = 1 A
2.495
IO = 1 mA
2.490
2.485
1.785
−60 −40 −20
0
20
40
60
80
100 120 140
2.480
−60 −40
TA − Free-Air Temperature − °C
−20
0
Figure 6
80
100 120
96
VO = 3.3 V
VI = 4.3 V
94
VO = 1.8 V
VI = 2.8 V
92
88
IO = 1 mA
90
86
84
82
IO = 1 mA
80
IO = 1 A
78
IO = 500 mA
76
Ground Current − µ A
Ground Current − µ A
60
GROUND CURRENT
vs
FREE-AIR TEMPERATURE
92
88
86
IO = 500 mA
84
82
80
78
74
76
72
−60 −40 −20
0
20
40
60
80
100 120 140
IO = 1 A
74
−60 −40 −20
TA − Free-Air Temperature − °C
0
20
40
Figure 9
POST OFFICE BOX 655303
60
80
100 120 140
TA − Free-Air Temperature − °C
Figure 8
10
40
Figure 7
GROUND CURRENT
vs
FREE-AIR TEMPERATURE
90
20
TA − Free-Air Temperature − °C
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TYPICAL CHARACTERISTICS
OUTPUT SPECTRAL NOISE DENSITY
vs
FREQUENCY
POWER SUPPLY RIPPLE REJECTION
vs
FREQUENCY
10−5
Vn − Output Spectral Noise Density − V/ Hz
PSRR − Power Supply Ripple Rejection − dB
90
VO = 3.3 V
VI = 4.3 V
CO = 10 µF
IO = 1 A
TA = 25°C
80
70
60
50
40
30
20
10
0
−10
10
100
1k
10k
100k
VI = 4.3 V
CO = 10 µF
TA = 25°C
IO = 7 mA
10−6
IO = 1 A
10−7
10−8
102
1M
103
f − Frequency − Hz
Figure 10
DROPOUT VOLTAGE
vs
FREE-AIR TEMPERATURE
103
0
VI = 4.3 V
CO = 10 µF
TA = 25°C
IO = 1 A
VDO − Dropout Voltage − mV
Zo − Output Impedance − Ω
105
Figure 11
OUTPUT IMPEDANCE
vs
FREQUENCY
IO = 1 mA
10−1
IO = 1 A
10−2
101
104
f − Frequency − Hz
102
101
IO = 10 mA
100
10−1
VO = 3.3 V
CO = 10 µF
102
103
104
f − Frequency − kHz
105
106
10−2
−60 −40 −20
IO = 0
0
20
40
60
80 100 120 140
TA − Free-Air Temperature − °C
Figure 12
Figure 13
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TYPICAL CHARACTERISTICS
LINE TRANSIENT RESPONSE
LOAD TRANSIENT RESPONSE
∆ VO − Change in
Output Voltage − mV
3.8
2.8
VO = 1.8 V
IL = 10 mA
CL = 10 µF
TA = 25°C
20
0
−20
0
20
40
VO = 1.8 V
VI = 2.8 V
CL = 100 µF
TA = 25°C
50
0
−50
−100
I O − Output Current − A
∆ VO − Change in
Output Voltage − mV
VI − Input Voltage − V
100
60
1
0.5
0
0
80 100 120 140 160 180 200
t − Time − µs
20
40
60
Figure 15
Figure 14
LOAD TRANSIENT RESPONSE
100
∆ VO − Change in
Output Voltage − mV
VI − Input Voltage − V
LINE TRANSIENT RESPONSE
VO = 3.3 V
CL = 10 µF
TA = 25°C
5.3
I O − Output Current − A
∆ VO − Change in
Output Voltage − mV
4.3
10
0
−10
0
20
40
60
80 100 120 140 160 180 200
t − Time − µs
VO = 3.3 V
CL =100 µF
TA = 25°C
50
0
−50
−100
1
0.5
0
0
20
40
60
80 100 120 140 160 180 200
t − Time − µs
Figure 17
Figure 16
12
80 100 120 140 160 180 200
t − Time − µs
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TYPICAL CHARACTERISTICS
DROPOUT VOLTAGE
vs
INPUT VOLTAGE
4
900
3
800
IO = 1A
VDO − Dropout Voltage − mV
VO− Output Voltage − V
OUTPUT VOLTAGE
vs
TIME (AT STARTUP)
2
1
Enable Pulse − V
0
0
700
600
500
TA = 25°C
400
TA = 125°C
300
200
TA = −40°C
100
0
0
20
40
60
80 100 120 140 160 180 200
t − Time − µs
2.5
Figure 18
VI
3
3.5
4
VI − Input Voltage − V
4.5
5
Figure 19
To Load
IN
OUT
+
EN
CO
GND
RL
ESR
Figure 20. Test Circuit for Typical Regions of Stability (Figures 21 through 24) (fixed output options)
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TYPICAL CHARACTERISTICS
TYPICAL REGION OF STABILITY
TYPICAL REGION OF STABILITY
EQUIVALENT SERIES RESISTANCE†
vs
OUTPUT CURRENT
EQUIVALENT SERIES RESISTANCE†
vs
OUTPUT CURRENT
10
ESR − Equivalent Series Resistance − Ω
ESR − Equivalent Series Resistance − Ω
10
Region of Instability
1
VO = 3.3 V
Co = 4.7 µF
VI = 4.3 V
TA = 25°C
Region of Stability
0.1
Region of Instability
1
VO = 3.3 V
Co = 4.7 µF
VI = 4.3 V
TJ = 125°C
0.1
Region of Instability
Region of Instability
0.01
0.01
0
200
400
600
800
1000
0
200
IO − Output Current − mA
400
600
800
1000
IO − Output Current − mA
Figure 21
Figure 22
TYPICAL REGION OF STABILITY
TYPICAL REGION OF STABILITY
EQUIVALENT SERIES RESISTANCE†
vs
OUTPUT CURRENT
EQUIVALENT SERIES RESISTANCE†
vs
OUTPUT CURRENT
10
10
ESR − Equivalent Series Resistance − Ω
ESR − Equivalent Series Resistance − Ω
Region of Stability
Region of Instability
1
VO = 3.3 V
Co = 22 µF
VI = 4.3 V
TA = 25°C
Region of Stability
0.1
Region of Instability
0.01
Region of Instability
1
VO = 3.3 V
Co = 22 µF
VI = 4.3 V
TJ = 125°C
Region of Stability
0.1
Region of Instability
0.01
0
200
400
600
800
1000
0
IO − Output Current − mA
200
400
600
800
1000
IO − Output Current − mA
Figure 23
Figure 24
† Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any series resistance added
externally, and PWB trace resistance to CO.
14
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS231 − FEBRUARY 2004
APPLICATION INFORMATION
The features of the TPS767D3xx family (low-dropout voltage, ultra low quiescent current, power-saving shutdown
mode, and a supply-voltage supervisor) and the power-dissipation properties of the TSSOP PowerPAD package
have enabled the integration of the dual LDO regulator with high output current for use in DSP and other multiple
voltage applications. Figure 25 shows a typical dual-voltage DSP application.
R1
100 kΩ
R2
100 kΩ
U1
TPS767D325
2
3
4
5
5V
6
C0
1 µF
7
8
9
10
11
12
13
14
PG
NC
1RESET
NC
NC
1GND
1EN
NC
1FB/NC
1IN
1OUT
1IN
1OUT
NC
2RESET
NC
NC
2GND
NC
2EN
2IN
NC
2OUT
2IN
2OUT
NC
NC
NC
NC
28
27
RESET to DSP
26
VC549
DSP
25
24
23
2.5 V
22
D1
21
20
C3
33 µF
19
+
18
17
DL4148
1
CVDD
(Core
Supply)
D3
DL5817
16
D2
15
3.3 V
C1
1 µF
DVDD
(I/O Supply)
C2
33 µF
GND
GND
Figure 25. Dual-Voltage DSP Application
DSP power requirements include very high transient currents that must be considered in the initial design. This design
uses higher-valued output capacitors to handle the large transient currents.
device operation
The TPS767D3xx features very low quiescent current, which remain virtually constant even with varying loads.
Conventional LDO regulators use a pnp pass element, the base current of which is directly proportional to the
load current through the regulator (IB = IC/β). Close examination of the data sheets reveals that these devices
are typically specified under near no-load conditions; actual operating currents are much higher as evidenced
by typical quiescent current versus load current curves. The TPS767D3xx uses a PMOS transistor to pass
current; because the gate of the PMOS is voltage driven, operating current is low and invariable over the full
load range. The TPS767D3xx specifications reflect actual performance under load condition.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
15
SGLS231 − FEBRUARY 2004
device operation (continued)
Another pitfall associated with the pnp-pass element is its tendency to saturate when the device goes into
dropout. The resulting drop in β forces an increase in IB to maintain the load. During power up, this translates
to large start-up currents. Systems with limited supply current may fail to start up. In battery-powered systems,
it means rapid battery discharge when the voltage decays below the minimum required for regulation. The
TPS767D3xx quiescent current remains low even when the regulator drops out, eliminating both problems.
The TPS767D3xx family also features a shutdown mode that places the output in the high-impedance state
(essentially equal to the feedback-divider resistance) and reduces quiescent current to under 2 µA. If the
shutdown feature is not used, EN should be tied to ground. Response to an enable transition is quick; regulated
output voltage is typically reestablished in 120 µs.
minimum load requirements
The TPS767D3xx family is stable even at zero load; no minimum load is required for operation.
FB - pin connection (adjustable version only)
The FB pin is an input pin to sense the output voltage and close the loop for the adjustable option. The output
voltage is sensed through a resistor divider network as is shown in Figure 27 to close the loop. Normally, this
connection should be as short as possible; however, the connection can be made near a critical circuit to
improve performance at that point. Internally, FB connects to a high-impedance wide-bandwidth amplifier and
noise pickup feeds through to the regulator output. Routing the FB connection to minimize/avoid noise pickup
is essential. In fixed output options this pin is a no connect.
external capacitor requirements
An input capacitor is not required; however, a ceramic bypass capacitor (0.047 pF to 0.1 µF) improves load
transient response and noise rejection when the TPS767D3xx is located more than a few inches from the power
supply. A higher-capacitance electrolytic capacitor may be necessary if large (hundreds of milliamps) load
transients with fast rise times are anticipated.
Like all low dropout regulators, the TPS767D3xx requires an output capacitor connected between OUT and
GND to stabilize the internal control loop. The minimum recommended capacitance value is 10 µF and the ESR
(equivalent series resistance) must be between 60 mΩ and 1.5 Ω. Capacitor values 10 µF or larger are
acceptable, provided the ESR is less than 1.5 Ω. Solid tantalum electrolytic, aluminum electrolytic, and
multilayer ceramic capacitors are all suitable, provided they meet the requirements described previously.
16
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SGLS231 − FEBRUARY 2004
external capacitor requirements (continued)
When necessary to achieve low height requirements along with high output current and/or high ceramic load
capacitance, several higher ESR capacitors can be used in parallel to meet the previous guidelines.
TPS767D3xx
5
VI
6
IN
28
RESET
250 kΩ
IN
24
OUT
C1
0.1 µF
50 V
4
RESET
EN
VO
23
OUT
+
GND
CO
10 µF
3
Figure 26. Typical Application Circuit (Fixed Versions) for Single Channel
programming the TPS767D301 adjustable LDO regulator
The output voltage of the TPS767D301 adjustable regulator is programmed using an external resistor divider
as shown in Figure 27. The output voltage is calculated using:
V
O
+V
ǒ1 ) R1
Ǔ
R2
ref
(1)
where:
Vref = 1.1834 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be
used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage
currents at FB increase the output voltage error. The recommended design procedure is to choose
R2 = 30.1 kΩ to set the divider current at 50 µA and then calculate R1 using:
R1 +
ǒ
V
V
Ǔ
O *1
ref
R2
(2)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
TPS767D301
VI
0.1 µF
IN
RESET
RESET Output
250 kΩ
>2.7 V
EN
OUT
<0.5V
R1
FB / NC
GND
+
OUTPUT
VOLTAGE
R1
R2
UNIT
2.5 V
33.2
30.1
kΩ
3.3 V
53.6
30.1
kΩ
VO
3.6 V
61.9
30.1
kΩ
CO
4 75V
90.8
30.1
kΩ
10 µF
R2
Figure 27. TPS767D301 Adjustable LDO Regulator Programming
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
17
SGLS231 − FEBRUARY 2004
Reset indicator
The TPS767D3xx features a RESET output that can be used to monitor the status of the regulator. The internal
comparator monitors the output voltage: when the output drops to 95% (typical) of its regulated value, the
RESET output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If not
used, it can be left floating. RESET can be used to drive power-on reset circuitry or as a low-battery indicator.
regulator protection
The TPS767D3xx PMOS-pass transistor has a built-in back-gate diode that safely conducts reverse currents
when the input voltage drops below the output voltage (e.g., during power down). Current is conducted from
the output to the input and is not internally limited. When extended reverse voltage is anticipated, external
limiting may be appropriate.
The TPS767D3xx also features internal current limiting and thermal protection. During normal operation, the
TPS767D3xx limits output current to approximately 1.7 A. When current limiting engages, the output voltage
scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross
device failure, care should be taken not to exceed the power dissipation ratings of the package. If the
temperature of the device exceeds 150°C(typ), thermal-protection circuitry shuts it down. Once the device has
cooled below 130°C(typ), regulator operation resumes.
power dissipation and junction temperature
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation
the regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than
or equal to PD(max).
The maximum-power-dissipation limit is determined using the following equation:
P
D(max)
T max * T
A
+ J
R
qJA
where:
TJmax is the maximum allowable junction temperature
RθJA is the thermal resistance junction-to-ambient for the package, i.e., 27.9°C/W for the 28-terminal
PWP with no airflow.
TA is the ambient temperature.
The regulator dissipation is calculated using:
P
D
ǒ
Ǔ
+ V *V
I
O
I
O
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger the
thermal protection circuit.
18
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TPS767D301QPWPRQ1
ACTIVE
HTSSOP
PWP
28
2000
None
Call TI
Level-3-220C-168 HR
TPS767D318QPWPRQ1
ACTIVE
HTSSOP
PWP
28
2000
None
Call TI
Level-3-220C-168 HR
TPS767D325QPWPRQ1
ACTIVE
HTSSOP
PWP
28
2000
None
Call TI
Level-3-220C-168 HR
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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