PREPARED BY: Lvl -7’- . tieda APPROVED BY: Jk 3-F SPECNo. DATE: DC396029 J&16/99 -WI DATE: / ,t/97 ELECTRONIC COMPONENTS GROUP SHARP CORPOFNI’ION SPlkIFICATION “LAS DEVICE SPECIFICATION ::: REPRESENTATIVE 10 Pages DIVISION: Opto-Electronic Devices Division FOR Light Emitting Diode MODEL No. GL5ZS302BOS 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas: * OA equipment * Audio visual equipment * Home appliance * Measuring equipment * Telecommunication equipment (Terminal) * Tooling machines * Computers r If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. 1 (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Gas leakage sensor breakers * Rescue and security equipment * Traffic signals * Other safety equipment [ (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) * Medical equipment i * Nuclear power control equipment I 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER’S DATE: BY: APPROVAL &,i //c$ DATE: PRESENTED BY: 9-i , ./kzzzq2 M.Katoh, Department General Manager of Engineering Dept.m Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION /99)’ x996029 MODEL No. Junl16l99 PAGE GL5ZS302BOS GL5ZS302BOS Snecifkation 1. Application This specificationappliesto the light emitting diode deviceModel No. GL5ZS302BOS. [AlGaInF (dicing or scribebake type) Sunset-orange LED device] 2. Outline dimensionsandpin connections. . . . . ..*...................a Refer to the attachedsheetPage2. 3. Ratingsandcharacteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage3-4. 3- 1. Absolute maximumratings 3-2. Electra-opticalcharacteristics 3-3. DeratingCurve 3-4. CharacteristicsDiagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage5. 4-l. Test itemsandtest conditions 4-2. MeasurementitemsandFailurejudgement criteria .. 5. Incoming inspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage6. 5-1. Applied standard 5-2. Samplingmethodand level 5-3. Test items,judgementcriteria and classificaof defect 5-4. Test itemsthe surfaceis be applied for flat type, judgementcriteria andclassificaof defect 6. Supplement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to the attachedsheetPage7-8. 6-1. Packing 6-2. Luminousintensity rank 6-3. Dominantwavelengthrank 6-4. Environment 7. Precautionsfor usq . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage9+ 10. 7-l. Leadforming method 7-2. Notice of installation 7-3. SolderingConditions .7-4. For cleaning l/10 Jun/16/9!3 DC3996029 MODEL PAGE No. 2110 GL5ZS302BOS 2. Outline dimensions and pin comectiolls Colorless transparency- 94. 0 co. 15 I i I I i i 0 i r-’ C O a i I A.’ j i i t i t ’ I j i i i i.i A’ CD 0 i o iii I + 2 * 2 0 I 5 I ’ 0. 5 20. j i LL G I i i i i 1 ; i . ; G i T pin coIlnections 0. Anode 0. cathode Vote) Umpecified tol. to be +0.2mm L---J 2. 4 qote) Cold klled steelleadsare platedwith but ti ie tie-bar cut portionshave no plating do not solderthis part of the product. Unit mm Material Lead : (Fe) Cold rolled steel Package: Epoxy resin Fish Lead : Sn platedor wave soldering Drawing No. 51106010 Julll16/99 DG9@329 MODEL. No. I I PAGE GL5ZS302BOS I 3110 3. Ratingsandcharacteristics I (Note 1) Duty ratio=l/lOJUse width=O.lms (Note 2) At the positionof 1.6~ from the bottom resinpackage 3-2. Electra-opticalcharacteristics I Parameter i Svmbol 1 (Ta=25”C) 7ia. Conditions KTYP. IMAx.l Unity I Spectrumradiationbandwidth A 1 15 run Reversecurrent VR=W 100 /.JA 1, Terminal capacitance ct V=OV,f=MHz 60 pF IViewing Angle 1 2eii2 1 lF=2omA 1 30 1 1 deg. 1 (Note 3) Refer to the suplementitem 6. regardingthe standardof rank classification. I 3-3. Derating Curve Peak Forward Current Derating Curve Forward Current Derating Curve 60 50 80 40 60 30 20 10 0 -25 0 Ambient 25 50 Temperature 75°J100 Ta(“CI 125 -25 0 Ambient 25 50 Temperature 75a5 100 Ta (“C) 125 DG996029 MODEL No. Jun/16/99 PAGE GL5ZS302BOS Peak Forward Current vs. 4110 Duty Ratio (Ta=25%) 10 l/100 1 l/10 Duty 3-4. Characteristics Raito 10 DR Diagram(typ) (Note 1) Forward Current vs.Forward Relative Luminous Intensity vs. Ambient Temperature Voltage (Ta=25”C) 100 I ( I F=2OmA) 1000 1 .-$ c* sc 10 ii liiiiiiii j 1 j j / / / // iiiiiiil 100 .-ea v 5 -I I i i i .-z %I 0. 1 -E 1 1.2 1.4 1.6 Forward Relative Ominous 1.8 2 Vo I tage Intensity vs. 2.2 VF (VI Froward Voltaca (Ta=ZS’C) 1000 .-5 Ln 10 -60-40-20 Ambient 2.42.6 100 2 : 10 2 O- .r 5 E 1 3 ,” .z 0. 1 0. 1 10 1 Forward Current 100 IFGnAI (Note 1) Above characteristic data are typical data and not a guarantteed data. 0 20 40 Temprature 60 80 100 120 Ta (“C). DG996029 1 .Junl16/9!3 ) PAGE MODEL No. GL5ZS302BOS 5110 4. Reliability The reliability of products shall be satisfied with items listed below. 4-l. Test itemsandtest conditions I Test items I Solderability Test conditions 23025°C. 5s IPrior disnosition : Div in rosin flux soldering temoerature~ Confidencelevel: 90% I 260”5z, 5s 15 OOOm/s2. 0.5ms. 3times/S&Y&Z direction n=ll, C=O 200m/s2,100to 2 Oooto lOOBz/sweepfor 4min. ,4tirnes/iX&Y &Z direction n=ll, C=O 20 Weight:lON, Ss/each terminal n=ll, C=O 20 n=ll. 60 20 Temperaturecycling ~-4O~(3Omin)~+lOO”c(30min),3Ocycles n=22, C=O 10 Hi@’temP*md Qh n=22, C=O 10 Iigh temperaturestorageTa=lOO”c, t=lOOOh n=22, C=O 10 ow temperaturestorageITa=-40%. t=lOOOh n=22, Go 10 Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) humidity storage Operationlie WeightH,O” --f 90” +OO+-90” /each terminal + 0” Ta=+&)~, gO%m, t=l@)oh Ta=‘Z”C. IrMAX, t=lOOOh*3 n=22, C=O I I 20 10 4-2. MeasurementitemsandFailurejudgementcriteria * 1 Measurement Symbol Failurejudgementcriteria *2 Forward voltage VF VF > u.s.,a. x 1.2 Reversecurrent IR IR > U.S.L. x 2.0 Luminousintensity IV Iv > The first stagevalue X 2.0 or The first stage value X 0.5 > IV s Solderability : Sol&r shallbe adhereat the areaof 95% or moreof dippedportion. z Terminal strength: Packageis not destroyed,and terminal is not slack. * 1: Measuringcondition is in accordancewith specification. *2: U.S.L. is shownby Upper SpecificationLimit. *3: IF M.AX.is shownby forward current of absolutemaximumratings. I I Jud16/99 DG996029 PAGE MODEL No. GL5ZS302BOS 5. Incoming inspection 5-l. Applied standard: IS0 2859-l 5-2. Samplingmethodand level : A single samplingplannormalinspectionlevel II : AQL Major defect : 0.065% Minor defect : 0.4% cJ-J. 1 1No. e 1 Tan, IGJL :*a-, ILGulJ, :..A,.P....s.., &*a;a C.IWIAQ ,“u~~rnGur sna au&a r.l.x.;ficn bALwaA4I-Y nf “I f4‘af.w.t -I”-* Test items judgementcriteria Disconnection Not emit light 2 Positionof Cutting off rim Different from dimension 3 Reverseterminal Different from dimension 4 Outline dimensions Not satisfy outline specification 5 Characteristics 6 Cut off the rim Exceed -0.2mm 7 Foreign substance White point : Exceed o 0.3mm (on top view) Black point : Exceed 4 0.3mm (on top view) String form: Exceed 3.Omm(ontopview) 8 Scratch Exceed 9 0.3mmor O.lmm x l.Omm(on top view) 9 Void Exceed 9 0.3mm (on top view) 10 Uneven densityof materialfor scattering Extremely unevendensity 11 Unbalancedcenter Exceed M.25mm from packagecenter 12 Burr Exceed +0.2mmagainstprovideddimension 13 Insertion positionof terminal Insertion positionof terminal classiiicaof defec Major defect Over the limit value of specificationat Vr, Is, and Iv Minor defect 5-4. Test itemsthe surfaceis be appliedfor flat type, judgumentcriteria and classificaof defect judgementcriteria classiticaof defec Chappedthe surface The surfacechappedis striking for seethe lamp top Minor defect Hollow the surface The surfacehollow is striking for seethe lamp top No. Test items 14 15 I 6ilO DG996029 MODEL No. I GL5ZS302BOS Jun/16/99 PAGE I 7110 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 028g (One ProducfTyp.) (Indication label sample) SIiIPbtENT TABLE PART No. ~~52~302~0s + Model number *clcl cloclclcl 250 - Quantily of pm4iucts QUANTITY OT No. KA99B19 +LOtllUUlber* O-0 tSHARP’ MADE INJAPAN @ @ Q) @ @ 0 O-FiG 0 Luminousintensity rank dominantwavelengthrank + Production country Productionplant code(to be indicatedalphabetically) Supportcode Year of prcduction(thelast two figures of the year) (to be indicatedalphabeticallywith Januarycorrespondingto A) Month of production Date of production(Ol-31) 6-l-2. Outer package Put 8 packs (the sameluminousintensity rank) into outerpackage. (approximately670gper oneouter package) 6-l-3. Outer packageout line dimension Width: 14Omm,Depth: 225mm, Hight: 9Omm 6-2.Luminc)usintensity rank (Note 1) Luminousintensity Rank L 552 1075 M 795 1548 N 1144 2229 0 1 1648 (3210) I(Note 1)Tolerance:fl5% 1 unit (Ta=25”c) Condition mcd 1~2OmA I I In regardto luminousintensity, the following rankingshallbe carriedout. However the quantity of eachrank shallnot be pre scriid. In caseof the distributionof the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Dominantwavelength Rank I 0 602.0 1 598.5 a- (Ta=25”c ) Condition (Note 2) The condition of measurement : The measurementof the light emissionfrom the front sideof lamp. This rank value is the settingvalue of when that classifiesit the rank and be not a guaranteevalue. Also I shallnot askthe delivery ratio of eachrank. DG996029 MODEL No. GL5ZS302BOS I 64. Environment 641. Ozonosphere destructive chemicals. (1) The device doesn’t contain following substance. (2) The &vice doesn’t have a production line whose process requires following substance. Restricted part: CFCs,halones,CCh.Trichloroethane(Methych) 642. Brornic non-burning materials The device doesn’t contain bromic non-burning materiaW’BBOs,PBBs) Jun/16/99 PAGE 8110 DG996029 MODEL No. GL5ZS302BOS Juni16/99 PAGE g/10 7. Precautions for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-Z-l installation on a PWB Whenmounting an LED lamp on a PWBdo not apply physical stress to the lead pins. The lead pin pitch should match the PWBpin-hole pitch:absolutely avoid widening or narrowing the lead pins. Whenpositioning an LED lamp,basically employ an LEDwith tie-bar cut or use a spacer. 7-Z-Z Whenan LED1 is mounted directly on a P W B If the bottom face of an LED lamp is mounted directly on single-sided PWBthe base of the lead pins may be subjected to physical stress due to PWBwarp,cutting or clinching of lead pins. Prior to use, be sure to check that no disconnection inside of the resin or damage to resin etc., is found. Whenan LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that 1.60~1afloat above the PWB. 7-Z-3 Installation using a holder During an LEDlamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder e.xpandsand contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the ins to any undue stress. l l Gooc DG996029 MODEL No. GL5ZS302BOS 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of S oldering I 1. Manual soldering 295”C*S”C, within 3 seconds 2. Wave soldering 260°C+S”C, within 5 seconds P reheating 70°C to 8O”c, within 30 seconds 3. Auto soldering S oldering 245°C25°C. within 5 seconds (Note) Avoid dipping resin into soldering bath Avoid applying stress to lead pins while they are heated.For example , when the LED lamp is moved with the heat applied to the lead pins during manual soldering or solder repair, disconnection may occur. 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less (2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size.ultrasonic power output, cleaning time, PYBsize or device mounting condition etc. Please test it in actual using condition and confirm that doesn’t occur any defect before starting the ultrasonic cleaning. <3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded Please use the other solvent after thorough confirmation is performed in actual using condition. I Jun/16/99 ( PAGE lo/lo