SHARP GM5WT95200A

28-Jan-99
DATE
I. These Techincal literature include materials protected under &hecopyright of Sharp Corporation(“S’[email protected]).
PIeasedo not reproduceor causeanyoneto reproducethemwithout Sharp’sconsent.
2. Whenusingthis product,please observe the absolut: maximum ratings andthe instructionsfor useoutlined
in these specificationsheets, as well as the precautions mentioned below. Sharpassumes
noresponsibility
for anydamageresulting ficm useof the productwhich dcesnot comply with the absolutemaxirn~mratings
md the instructions included in these specification sheets, and the precautions mentionedbelow.
(Precautions)
(1) This productsis designed
for usein the foUowingapplicationareas;
7
l 0.4 equipment * Audio visualequipment * Homeappliance
+ Telecommunication
equipment(Terminal) l Measuringequipment
*
Tooling
machines
* Compulers
I
I
If the useof the productin the aboveapplicationareasis for equipmentlistedin paragraphs
(2) or (Z), pleasebesue to observetheprecautionsgiven in thoserespectiveparagraphs.
(2) Appropriatemeasures,
suchasfail-safedesignandredundantdesignconsidering
the safety design of the overall system and equipment, should be taken to ensure reliability
andsafety when&is productis usedfor equipmentwhichdemands
high reliability and
safetyin function andprecision,suchas;
r l Transportation control and safety equipment (aircraf?,aain, automobileetc.)
1 * Traffic sign& * Gasleakagesensorbreakers l Rescueandsecurityequipment
L l Other
safety equipment
_I
(3) Pleasedo not usethisproductfor equipmentwhichrequireexnemeiyhigh rehability
and safety in function and precision, such 5s ;
l Space equipment
* Telecommunication
equipment (for trunk lines)
’ Nuclear power control equipment
* hfedical equipment
r
L
(4) Please contact and consult with a Sharp sales representative if there are any questions
regardinginterpretationof the above three paragraphs.
3. Pleasecontact andconsultwith a Sharpsalesrepresentativefor any questionsaboutthis product.
** The technical literature is subject to be changed without notice **
Opto-Electronic Devices Division
Electronic
Components
Group
SH.AFW CORF’ORATION
1
DG-991015
MOD& NJ.
G?viSWT95200A
GMSIn95200A
1 Jan/T8/99
PAGE
17 l/13
technical Wrature
1. AppliCXian
Thi.~ technicat Litemure appk to the light en&kg diode device MO&I NO. GM5WT952oOA
1 Chip type white LED (GaN chip LED device)
..,.................~.RefertotheanachedsheetPage2.
2. Outline dimensionsandterminalCO~UXC~~OCS
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
. . . .. . . . ..‘..........
Refer to the attachedsheetPage3-5
3. Ratingsandcharacteristics
3-1. Absolutemaximumratings
Electra characteristics
Optical characteristics
Ltious intensity rank
Color coordinatesranks
Deratingcurve
Characteristicschart
4. Reliability ..,,...............I.........
3-2.
3-3.
3-1.
3-J.
3-6.
3-7.
--.--..-.-.-...-.-......RefertotheattachedsheetPage6.
4- 1. Test itemsandtest conditions
4-2. Failurejudgementcriteria
5. Incomin_einspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to theattachedsheetPage 7.
5-1. Inspectionmethod
5-2. Descriptionof inspectionandcriteria
Referto the attachedsheetPage8-I 1.
6. Taping specification..,........*,.................,...........*.
6-I. Taping
6-2. Label
6-3. Dampproofpackage
7. Soldc.+g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage 12.
7-1. Reflow solderins
7-2.Mylual
soldering
7-3. Dip solderingmethod
8. Precsutions for use . . . . . . . . . a. . . . . . . . . . -.......-.g...o.....,-..IRefer
8-l. Precautionsmanersfor designingcircuit
8-2. Cleaningmethod
9. Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~....................
9-I. Ozonospheredestructivechemicals.
9-2. Brornic non-burningmaterials
to &e attachedbeet Page13.
Refer to theattachedshett Page13.
1 Jan/21iii%-
DG-991015
) PAGE -
iMODEL X-a.
I
GM5WT352OOX
2J13
-
2. Outline dimensionsandterminalconnections
f-
.
~thade
I
I
!
aa
.
P
-p+- \ ’ II
6 .,-.i__-J_-_-L,-IkL -------- --------Ql
3-L
1
I.2
/I-’
0
N‘OIC.
1. It is
not
mark
Anode /
!.I
@ Cathode /
Lo
Td
includethe flash in this dimension.
2. Pin Connection
@ Cathode
0 Anode
3. Unspecifiedtoleranceto be k0.2
unit
Scale
BIB
Free
ApplicableModel
Gbt5w-r95?00A
rhwhg No.
51101014
c
_ e-1--- _,
-’ .y- ’ :
;.
.‘; _,
-; ‘L .. .
. ..
,-
.-
3. Raiogs andcharac:erktics
I
3- 1.Ahsolutemaximumratings
P3rameter
Powerdissipation
Continuousfonvard current
Peakforward current @ore1)
Dcrating factor
(Syabolt
1 P I
.-
--~
IF
hl
DC
PulseI
va
1 Topr 1
1 Tstg 1
1 Tsol 1
Reversevoltage
Operatingtempenture
Storagetemperature
[email protected])
...-..-.‘
...’..“--
30
IlLA
50
0.10
llL4
t&4x
IDA/t
0.67
5
40 to +100
40 to Cl00
295
1 v
( “C
1 oc
1 “C
(Hotel) Duty ratio=1/10,Pulsewidth+.lms
(Note’) Manual solderingMax3second
3-2. Elec&ocharacteristics
,Parameter
/Symbol1
Forwardvoltage
VF
Reversecurrent
I-
1s
conditions
I&omt\
1 MIN.
1 -
VR=4V
lYP. 1hf.4x. 1
3.8 1 4.5 1
w
1 100 I
--
Condition
PA
1
Ta=T5’C)
-
3-3. Optid characteristics
Model No.
(Ta=tS”C)
Lhit
V
Luminous
intensity‘3
luminousintensityra&
color coordinatesranks
Iv(mcd)TYP.
G(H’(I(J
IF=20mX
200
(NoteS)Ueasured by SHARPEGBGMODELS50
(RadiometerflhotonetersWem)
GMSWT%?OOA
3d.Luminous intensityrank
Rank : Luminousintensity
/Rank : Luminousintensity
b : 4.8 9.2
j E : 43 84
a : 6.9 13.2
/ F : 62 121
A : 10 19
; i 1;; - 174
8 : 14 28
i
- 250
c : 21 40
I I : 185 - 360
D : 30 ;a
1 J : 266 - 518
oiPlQ
,
1 Unit
mcd
7
olerance:
215%
Jaw28199
j P.G-
DG-991015
.UODEL No.
GiLf5W95200A
’
, -
_-
3-S.Color
coordilares
ranks
Rank
:
Rank
.;-
4/13
“- 3.
-.
. ..
.- c-.-1.
:.=
i’
.,
‘\ :
.:
.- -
Color coordinstes
I
X
Y
0
0.26
-
0.32
1
0.2
-
0. 38
P
0.3
-
0.36
i
0.22
-
0. 40
0
0.34
-
0.40
’
0.26
-
0.44
S-6. Derating curve
Peak Forward Currenr Daating Cum
Fotward Current Dcrafing Curve
60
-40
-20
0 20 40 60 80
Ambittnr Tcmpraturc T$C)
-40
100 120
-20
0
20 40 60 80
Ambitcnt Tanpraturo Tat%)
100 120
Pelk Forward Current vs.
Dub Ratiofla=2%)
- l/lW
(Note Above charxteristic
l/10
Duty Ratio DR
l/1
data are t)-pical km and not . gurvlted
-
data
-
DG-991015
MCDEI.
I
Sad2889 _
PACZ
Ya
GMSWT952OOA
5113
-
3-7. Characmisticschart
RelativeLuminous Intesity vs. Fommd Cm
FonvardCumt vs. Forward
Vduge (~~25’~
:
t.TaPt5Q
loooK
1%
0. I
0.
1
10
ForwardCurrentI&4)
too
1
. .. .‘i ..‘,I, .
; i’;
.. ‘.
I. (‘. .c .
G
i -I_...-_ - .’* -;*-.w. -
n
[Aote)Above charxteristic data aretypical dataandnot gumted dam.
5
4
2
3
ForwardVoltageV,zo
..
w-r95 _
DG-99lOU
hfODES No.
JaGG
PAGE
GSi5i-GT95200.A
4. Rcliabiliry
The rcliabtity ofptoducrs shallbesatisfiedwith itemslistedbelow.
r
Test items
S~plCS
Confidencelevel: 90%
4-1. Test itemsand:es concliricns
Testconditions
temperaturecycling
-tO~C(jOmin)~+1OOt(3Omin),lCOCy
n=22, c4
10
Hieh temp’and‘@
humidicystorage
High temperature
storage
Low temper3rure
storage
TazT6$C, NKRK, pI00Oh
n=22,c=4
10
Ta=(Tng-maximumratings),r-1030h
n=22, c-0
10
Ta=(Tstg-minimunratings),r IOCOh
n=22,C=tl
IO
ITa=25’C,Ie(IF-maximumratings),~lOOOh
~n=22,c=q
10
IOpcratig test
kfechtical shock
15 000m/s',0.5ms,3timesJ~X,iY~Zdirection
n=ll,C=o
20
Vtiabte frequency
vibration
ZOOmis', 100-2 OOO-100Wsweepfor
ZOmin.,4times/yY,Z direction
n=I 1,C-0
z”
Solderingheat
Refer to the attachedsheetgage12’13 1 time
n=ll,C=o
20
5-2. Failurejudgemeatcriteria (Sotel)
Parameter
r
Forwardvoltage
Symbol
Fail
judgementcriteria (Noted)
VF
v,>
U.S.L. x I.2
Reversecuneat
IR
I,>
U.S.L. ' 2.0
Luminousintensity
IV
Iv > The first stagevalueX 1.5 or The JirststagevalueX 0.5 > Iv
fiote I)Mcasuringconditioais in accordancewith specification.
(Note2)U.S.L.is shownby UpperSpecificationLimit.
6113
I JaanS
DG-991015
1PAGE
MODEL So.
5. hcoming insptc5on
5-I. lrq-mion method
A single sampling pla normal inspection level II based on IS0 2859-I shail be adopted
-
NO.
1
-.
“M.*y.wU
“I
yuYb”LA”Y
inspection items
Openhon
YUY
.aI..‘a”
Criteria
Radiation color
Not cmreicl
3
Taping
Product inserted in reverse direction
4
Label
Model number is not printed,or misprinted
5
Electro-opcical
characteristics
Not conforming to the specification
7
Outlinedimensions
Dust andflaw
-..-.
8
Not conformingto the specifhion
Effect to the specification
-
Resin f f ash
AQL
gg
0.1%
No light emission
2
6
Defect
0.3mm or greater&om theproduct
DG-991015
MODEL No.
GMSWI95200X
6. Taping
61 Taping
6-I-LShape and dimension of tapc(TYP.)
Parameter
1 Symbol lDimension
1 Thickness 1 t ,
0.3
2.3
Thickness of the entire tit
1 tt
1
% Mated : Carrier titpe...PS,Cover tape...Polyestcr
Remarks
I
(With cover tape andcarrier tape combined
Janf2??i99
P?rGE
a13
DG-991015
MODEL No.
I
1 9113
GMSW95200X
6-I-t.Shape and dimension of reel(lYP
Parameter
1Symbol] Dimension 1
Diameter
Frange Thickness
Inner mace direction
EXtf Emal diameter
Hub
I
A
t
d I78
1.5
w
IO
1 s
I C
t
Key slit
1
t
Width
E
I
I Depth ) u t
for part name etc.
Jotation
% Material : Reel...Polystyrene
I
rmm--.)
Soindle hole diameter
f
Remarks
q&o
d13
r-2.0
4.5
Dimensinn
-
1
t
I
I
--_---
----
of shaft core
--
I
(Labeling on one side of [email protected] name,quantity,Iot No.)
I
I
DG-991015
MODEL No.
GM5WT95200A
sanRa/99
PAGE
10113
6-I-3.Taping specification
(1) Lead tape:
~~11out I->
End
Stuffed
10
plch
or
10
(2) Cover tape stxngth against peeJing:F=O.148N(
Cover
Leading
Empty
mare
pfi;h
or
nore
' 40-50
pith
6 =lO”or less)
taue
uuuuuuuduuuu
w
Bigining
Tape speed : 5mm/s
Forward
Carrier
tape
(3) Tape strength against bending:
The rndius ofbendiug circle should be 30mm or more.
Lfit is less than 3Omm the cover may peel.
(4) Jointing of tape:
There should not be joint of cover tapeor carrier tape.
(5) Quantity per reel:
Average2,OOOpcs.
per reel
(6) Product wcighr
Approx. 0.03 g
(7) others:
0 Apparent defect of productahorrIdnot bepackedandproductshouldnot upset.
0 There shouldnot be missingabovecontinuousthree products.
@ Productsshouldbe easilytakenout.
@ Productsshouldnot be aaachedto the cover tapeat peeling.
6-2. Labelfor reel
C~lJwr9s20M
QUA.TY
Lot number *--r
- Model number
2000
LOT No. KWBHOI
-=EIAJ C-3> WE
M JAPAN
- Luminousrank anddominantwaveIengthrank
+ Productioncountry
* :Lot numberindication
0 Productionplant code(tobe indicatedalphabetically)
@ ProductionIot(singleor doublefigures)
0 Year of productioa(tbelast two figuresof theyear)
@ Month of production
(to be indicatedalphabeticaIlywith Januuy correspondingto A)
0 Dateof producdon(01- 3 1)
r
Do-9910 15
MODELNo.
JwW99
PAGZ
GWWr952OOX
6-3. Dampproof package
In other to avoid the absorption of humidir)i h tnnspo~ and storage.
the devices are packed in ahxninum sleeve.
Label
6-El.Strage conditions
Temperature : 5 to 30°C
Humidity : less than 6O%RH
6-3-2.Treatment after opening
(1) Please make a soldering within 2 days ah opening under following condition;
Tempezmre : 5 co 30°C Humidity : less than 6O%RH
(2) In case the devices are not used for a long he after opening .the storage in dry box is recommendable.
Or it is better to repackhe deviceswith a desicativeby the sealerandput themin the somestorage
conditionsas7-3-1. Then they shouldk ?sedwithin 2 days.
(3) Pleasemakea solderingafier a following h&kingtreatmeatif unusedterm shouldbe over the conditions
of (2)
Reconunenclable
conditions:
0 in taping
Temprature:6O”Cto 65”C,Time:36to AShours
Q in individual (on PWl3 or metallic tray)
Tempmture:100°C,Time:2 to 3 houn
11113
GM5%-i95200A
1
1203
7. Soldering
7-IRedow
SOldeIiq
(1) It is not rc=ornmended to exceed the soidering temperarum and time ~IOWU below.
Caused by subsnare bend or the other mechanical stress &.ng reflow soldering
may happen gold wire disconnection etc. Therefore please check and study your
solder reflow machine’s best condition.
(2) Reflow soldering temperamre prome to be done under the following condition.
to be done under the following condition.
MAX 250
Time (s)
Recommendable Thermal Model
(4) Rccommcndable Metal Mask pattern for sLxen print
Recommend O.tmm to 03mm thickness metal mask
for screenprint. Caused by solder reflow condition,
solder paste, substrate and the other martial etc.,
my change solderbility.
Please check and study actual solderbihry before
usage.
Center of the product
Recommended solder pattern
7-2.Manual soldering
(1) It ia recommended to keep the soldering iron temperature at 295x (soldering iron
power ccnsumption 2Ow> and not to solder more than once or for over 3 seconds.
(2) When using a soldering iron, care must be taken not to damage the package.
(Pay attention not to allow any under stress or heat on package.)
7-3. Dip soldering method
To be done under the following condition.
Re-heat temp. : 80 to 120 “c
time : 30 to 120 seconds
Soldering temp. : Max. 260%
time : within 5 seconds
8. Precautions for use
8-1. Precautions matters for designing circuit
(l)This product is not designed as electromagnetic and ionized-particle diari~n
resistant
UThis LED device applies blue LED & Borescent mattrial to emit white &ht. Therefore, dependhrg on the
vatue of operationcurrent, tone of the color maychannpslightly. Pleasecheck the tone underactualusage
condition in advance.
8-2. Cleaningmethod
(1) Solventcleaning
isnot morethan45 “c. @ Immersionup to 3 &mites.
Recommend
conditions: 0 Solventtemperature
(2) UltrasoniccIeaning
The affect on the devicefrom ultrasonicbath,uIbasonicoutput, duration,boardsizeanddevicemountingmethod.
Test the cleaningmethodunderactualconditionsandcheekfor abnotmahties
beforeaotualuse.
(3) SoIVenb
Useonly the folIowing typesof solvent.
water, alcoho1,chIorofluorocabon-based
solventwhenc!eaningis necessary.
Recommendconditions: RT. 40KHz, 3OW/l, 3 to 5 minutes
9. Environrnenr
9-I. Ozonospheredestructivechemicals.
(I) The devicedoesn’tcontainfollowing substance.
(2) The devicedoesn’thavea productionLinewhoseprocessrequiresfoIlowing substance.
Restrictedpart: CFCa,haIones,CCI~,TtichIoroethane.(MethychIorofotm)
9-Z. Bm& non-burningmaterials
The devicedoesn’tcontainbromicnon-burningmaterisIs(PBBOs,PBBs)