28-Jan-99 DATE I. These Techincal literature include materials protected under &hecopyright of Sharp Corporation(“S’ha@). PIeasedo not reproduceor causeanyoneto reproducethemwithout Sharp’sconsent. 2. Whenusingthis product,please observe the absolut: maximum ratings andthe instructionsfor useoutlined in these specificationsheets, as well as the precautions mentioned below. Sharpassumes noresponsibility for anydamageresulting ficm useof the productwhich dcesnot comply with the absolutemaxirn~mratings md the instructions included in these specification sheets, and the precautions mentionedbelow. (Precautions) (1) This productsis designed for usein the foUowingapplicationareas; 7 l 0.4 equipment * Audio visualequipment * Homeappliance + Telecommunication equipment(Terminal) l Measuringequipment * Tooling machines * Compulers I I If the useof the productin the aboveapplicationareasis for equipmentlistedin paragraphs (2) or (Z), pleasebesue to observetheprecautionsgiven in thoserespectiveparagraphs. (2) Appropriatemeasures, suchasfail-safedesignandredundantdesignconsidering the safety design of the overall system and equipment, should be taken to ensure reliability andsafety when&is productis usedfor equipmentwhichdemands high reliability and safetyin function andprecision,suchas; r l Transportation control and safety equipment (aircraf?,aain, automobileetc.) 1 * Traffic sign& * Gasleakagesensorbreakers l Rescueandsecurityequipment L l Other safety equipment _I (3) Pleasedo not usethisproductfor equipmentwhichrequireexnemeiyhigh rehability and safety in function and precision, such 5s ; l Space equipment * Telecommunication equipment (for trunk lines) ’ Nuclear power control equipment * hfedical equipment r L (4) Please contact and consult with a Sharp sales representative if there are any questions regardinginterpretationof the above three paragraphs. 3. Pleasecontact andconsultwith a Sharpsalesrepresentativefor any questionsaboutthis product. ** The technical literature is subject to be changed without notice ** Opto-Electronic Devices Division Electronic Components Group SH.AFW CORF’ORATION 1 DG-991015 MOD& NJ. G?viSWT95200A GMSIn95200A 1 Jan/T8/99 PAGE 17 l/13 technical Wrature 1. AppliCXian Thi.~ technicat Litemure appk to the light en&kg diode device MO&I NO. GM5WT952oOA 1 Chip type white LED (GaN chip LED device) ..,.................~.RefertotheanachedsheetPage2. 2. Outline dimensionsandterminalCO~UXC~~OCS . . . . . . . . . . . . . . . . . . . . .. . . . ..‘.......... Refer to the attachedsheetPage3-5 3. Ratingsandcharacteristics 3-1. Absolutemaximumratings Electra characteristics Optical characteristics Ltious intensity rank Color coordinatesranks Deratingcurve Characteristicschart 4. Reliability ..,,...............I......... 3-2. 3-3. 3-1. 3-J. 3-6. 3-7. --.--..-.-.-...-.-......RefertotheattachedsheetPage6. 4- 1. Test itemsandtest conditions 4-2. Failurejudgementcriteria 5. Incomin_einspection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Refer to theattachedsheetPage 7. 5-1. Inspectionmethod 5-2. Descriptionof inspectionandcriteria Referto the attachedsheetPage8-I 1. 6. Taping specification..,........*,.................,...........*. 6-I. Taping 6-2. Label 6-3. Dampproofpackage 7. Soldc.+g . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attachedsheetPage 12. 7-1. Reflow solderins 7-2.Mylual soldering 7-3. Dip solderingmethod 8. Precsutions for use . . . . . . . . . a. . . . . . . . . . -.......-.g...o.....,-..IRefer 8-l. Precautionsmanersfor designingcircuit 8-2. Cleaningmethod 9. Environment. . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~.................... 9-I. Ozonospheredestructivechemicals. 9-2. Brornic non-burningmaterials to &e attachedbeet Page13. Refer to theattachedshett Page13. 1 Jan/21iii%- DG-991015 ) PAGE - iMODEL X-a. I GM5WT352OOX 2J13 - 2. Outline dimensionsandterminalconnections f- . ~thade I I ! aa . P -p+- \ ’ II 6 .,-.i__-J_-_-L,-IkL -------- --------Ql 3-L 1 I.2 /I-’ 0 N‘OIC. 1. It is not mark Anode / !.I @ Cathode / Lo Td includethe flash in this dimension. 2. Pin Connection @ Cathode 0 Anode 3. Unspecifiedtoleranceto be k0.2 unit Scale BIB Free ApplicableModel Gbt5w-r95?00A rhwhg No. 51101014 c _ e-1--- _, -’ .y- ’ : ;. .‘; _, -; ‘L .. . . .. ,- .- 3. Raiogs andcharac:erktics I 3- 1.Ahsolutemaximumratings P3rameter Powerdissipation Continuousfonvard current Peakforward current @ore1) Dcrating factor (Syabolt 1 P I .- --~ IF hl DC PulseI va 1 Topr 1 1 Tstg 1 1 Tsol 1 Reversevoltage Operatingtempenture Storagetemperature Solderingtemperature@ate2) ...-..-.‘ ...’..“-- 30 IlLA 50 0.10 llL4 t&4x IDA/t 0.67 5 40 to +100 40 to Cl00 295 1 v ( “C 1 oc 1 “C (Hotel) Duty ratio=1/10,Pulsewidth+.lms (Note’) Manual solderingMax3second 3-2. Elec&ocharacteristics ,Parameter /Symbol1 Forwardvoltage VF Reversecurrent I- 1s conditions I&omt\ 1 MIN. 1 - VR=4V lYP. 1hf.4x. 1 3.8 1 4.5 1 w 1 100 I -- Condition PA 1 Ta=T5’C) - 3-3. Optid characteristics Model No. (Ta=tS”C) Lhit V Luminous intensity‘3 luminousintensityra& color coordinatesranks Iv(mcd)TYP. G(H’(I(J IF=20mX 200 (NoteS)Ueasured by SHARPEGBGMODELS50 (RadiometerflhotonetersWem) GMSWT%?OOA 3d.Luminous intensityrank Rank : Luminousintensity /Rank : Luminousintensity b : 4.8 9.2 j E : 43 84 a : 6.9 13.2 / F : 62 121 A : 10 19 ; i 1;; - 174 8 : 14 28 i - 250 c : 21 40 I I : 185 - 360 D : 30 ;a 1 J : 266 - 518 oiPlQ , 1 Unit mcd 7 olerance: 215% Jaw28199 j P.G- DG-991015 .UODEL No. GiLf5W95200A ’ , - _- 3-S.Color coordilares ranks Rank : Rank .;- 4/13 “- 3. -. . .. .- c-.-1. :.= i’ ., ‘\ : .: .- - Color coordinstes I X Y 0 0.26 - 0.32 1 0.2 - 0. 38 P 0.3 - 0.36 i 0.22 - 0. 40 0 0.34 - 0.40 ’ 0.26 - 0.44 S-6. Derating curve Peak Forward Currenr Daating Cum Fotward Current Dcrafing Curve 60 -40 -20 0 20 40 60 80 Ambittnr Tcmpraturc T$C) -40 100 120 -20 0 20 40 60 80 Ambitcnt Tanpraturo Tat%) 100 120 Pelk Forward Current vs. Dub Ratiofla=2%) - l/lW (Note Above charxteristic l/10 Duty Ratio DR l/1 data are t)-pical km and not . gurvlted - data - DG-991015 MCDEI. I Sad2889 _ PACZ Ya GMSWT952OOA 5113 - 3-7. Characmisticschart RelativeLuminous Intesity vs. Fommd Cm FonvardCumt vs. Forward Vduge (~~25’~ : t.TaPt5Q loooK 1% 0. I 0. 1 10 ForwardCurrentI&4) too 1 . .. .‘i ..‘,I, . ; i’; .. ‘. I. (‘. .c . G i -I_...-_ - .’* -;*-.w. - n [Aote)Above charxteristic data aretypical dataandnot gumted dam. 5 4 2 3 ForwardVoltageV,zo .. w-r95 _ DG-99lOU hfODES No. JaGG PAGE GSi5i-GT95200.A 4. Rcliabiliry The rcliabtity ofptoducrs shallbesatisfiedwith itemslistedbelow. r Test items S~plCS Confidencelevel: 90% 4-1. Test itemsand:es concliricns Testconditions temperaturecycling -tO~C(jOmin)~+1OOt(3Omin),lCOCy n=22, c4 10 Hieh temp’and‘@ humidicystorage High temperature storage Low temper3rure storage TazT6$C, NKRK, pI00Oh n=22,c=4 10 Ta=(Tng-maximumratings),r-1030h n=22, c-0 10 Ta=(Tstg-minimunratings),r IOCOh n=22,C=tl IO ITa=25’C,Ie(IF-maximumratings),~lOOOh ~n=22,c=q 10 IOpcratig test kfechtical shock 15 000m/s',0.5ms,3timesJ~X,iY~Zdirection n=ll,C=o 20 Vtiabte frequency vibration ZOOmis', 100-2 OOO-100Wsweepfor ZOmin.,4times/yY,Z direction n=I 1,C-0 z” Solderingheat Refer to the attachedsheetgage12’13 1 time n=ll,C=o 20 5-2. Failurejudgemeatcriteria (Sotel) Parameter r Forwardvoltage Symbol Fail judgementcriteria (Noted) VF v,> U.S.L. x I.2 Reversecuneat IR I,> U.S.L. ' 2.0 Luminousintensity IV Iv > The first stagevalueX 1.5 or The JirststagevalueX 0.5 > Iv fiote I)Mcasuringconditioais in accordancewith specification. (Note2)U.S.L.is shownby UpperSpecificationLimit. 6113 I JaanS DG-991015 1PAGE MODEL So. 5. hcoming insptc5on 5-I. lrq-mion method A single sampling pla normal inspection level II based on IS0 2859-I shail be adopted - NO. 1 -. “M.*y.wU “I yuYb”LA”Y inspection items Openhon YUY .aI..‘a” Criteria Radiation color Not cmreicl 3 Taping Product inserted in reverse direction 4 Label Model number is not printed,or misprinted 5 Electro-opcical characteristics Not conforming to the specification 7 Outlinedimensions Dust andflaw -..-. 8 Not conformingto the specifhion Effect to the specification - Resin f f ash AQL gg 0.1% No light emission 2 6 Defect 0.3mm or greater&om theproduct DG-991015 MODEL No. GMSWI95200X 6. Taping 61 Taping 6-I-LShape and dimension of tapc(TYP.) Parameter 1 Symbol lDimension 1 Thickness 1 t , 0.3 2.3 Thickness of the entire tit 1 tt 1 % Mated : Carrier titpe...PS,Cover tape...Polyestcr Remarks I (With cover tape andcarrier tape combined Janf2??i99 P?rGE a13 DG-991015 MODEL No. I 1 9113 GMSW95200X 6-I-t.Shape and dimension of reel(lYP Parameter 1Symbol] Dimension 1 Diameter Frange Thickness Inner mace direction EXtf Emal diameter Hub I A t d I78 1.5 w IO 1 s I C t Key slit 1 t Width E I I Depth ) u t for part name etc. Jotation % Material : Reel...Polystyrene I rmm--.) Soindle hole diameter f Remarks q&o d13 r-2.0 4.5 Dimensinn - 1 t I I --_--- ---- of shaft core -- I (Labeling on one side of flange.@art name,quantity,Iot No.) I I DG-991015 MODEL No. GM5WT95200A sanRa/99 PAGE 10113 6-I-3.Taping specification (1) Lead tape: ~~11out I-> End Stuffed 10 plch or 10 (2) Cover tape stxngth against peeJing:F=O.148N( Cover Leading Empty mare pfi;h or nore ' 40-50 pith 6 =lO”or less) taue uuuuuuuduuuu w Bigining Tape speed : 5mm/s Forward Carrier tape (3) Tape strength against bending: The rndius ofbendiug circle should be 30mm or more. Lfit is less than 3Omm the cover may peel. (4) Jointing of tape: There should not be joint of cover tapeor carrier tape. (5) Quantity per reel: Average2,OOOpcs. per reel (6) Product wcighr Approx. 0.03 g (7) others: 0 Apparent defect of productahorrIdnot bepackedandproductshouldnot upset. 0 There shouldnot be missingabovecontinuousthree products. @ Productsshouldbe easilytakenout. @ Productsshouldnot be aaachedto the cover tapeat peeling. 6-2. Labelfor reel C~lJwr9s20M QUA.TY Lot number *--r - Model number 2000 LOT No. KWBHOI -=EIAJ C-3> WE M JAPAN - Luminousrank anddominantwaveIengthrank + Productioncountry * :Lot numberindication 0 Productionplant code(tobe indicatedalphabetically) @ ProductionIot(singleor doublefigures) 0 Year of productioa(tbelast two figuresof theyear) @ Month of production (to be indicatedalphabeticaIlywith Januuy correspondingto A) 0 Dateof producdon(01- 3 1) r Do-9910 15 MODELNo. JwW99 PAGZ GWWr952OOX 6-3. Dampproof package In other to avoid the absorption of humidir)i h tnnspo~ and storage. the devices are packed in ahxninum sleeve. Label 6-El.Strage conditions Temperature : 5 to 30°C Humidity : less than 6O%RH 6-3-2.Treatment after opening (1) Please make a soldering within 2 days ah opening under following condition; Tempezmre : 5 co 30°C Humidity : less than 6O%RH (2) In case the devices are not used for a long he after opening .the storage in dry box is recommendable. Or it is better to repackhe deviceswith a desicativeby the sealerandput themin the somestorage conditionsas7-3-1. Then they shouldk ?sedwithin 2 days. (3) Pleasemakea solderingafier a following h&kingtreatmeatif unusedterm shouldbe over the conditions of (2) Reconunenclable conditions: 0 in taping Temprature:6O”Cto 65”C,Time:36to AShours Q in individual (on PWl3 or metallic tray) Tempmture:100°C,Time:2 to 3 houn 11113 GM5%-i95200A 1 1203 7. Soldering 7-IRedow SOldeIiq (1) It is not rc=ornmended to exceed the soidering temperarum and time ~IOWU below. Caused by subsnare bend or the other mechanical stress &.ng reflow soldering may happen gold wire disconnection etc. Therefore please check and study your solder reflow machine’s best condition. (2) Reflow soldering temperamre prome to be done under the following condition. to be done under the following condition. MAX 250 Time (s) Recommendable Thermal Model (4) Rccommcndable Metal Mask pattern for sLxen print Recommend O.tmm to 03mm thickness metal mask for screenprint. Caused by solder reflow condition, solder paste, substrate and the other martial etc., my change solderbility. Please check and study actual solderbihry before usage. Center of the product Recommended solder pattern 7-2.Manual soldering (1) It ia recommended to keep the soldering iron temperature at 295x (soldering iron power ccnsumption 2Ow> and not to solder more than once or for over 3 seconds. (2) When using a soldering iron, care must be taken not to damage the package. (Pay attention not to allow any under stress or heat on package.) 7-3. Dip soldering method To be done under the following condition. Re-heat temp. : 80 to 120 “c time : 30 to 120 seconds Soldering temp. : Max. 260% time : within 5 seconds 8. Precautions for use 8-1. Precautions matters for designing circuit (l)This product is not designed as electromagnetic and ionized-particle diari~n resistant UThis LED device applies blue LED & Borescent mattrial to emit white &ht. Therefore, dependhrg on the vatue of operationcurrent, tone of the color maychannpslightly. Pleasecheck the tone underactualusage condition in advance. 8-2. Cleaningmethod (1) Solventcleaning isnot morethan45 “c. @ Immersionup to 3 &mites. Recommend conditions: 0 Solventtemperature (2) UltrasoniccIeaning The affect on the devicefrom ultrasonicbath,uIbasonicoutput, duration,boardsizeanddevicemountingmethod. Test the cleaningmethodunderactualconditionsandcheekfor abnotmahties beforeaotualuse. (3) SoIVenb Useonly the folIowing typesof solvent. water, alcoho1,chIorofluorocabon-based solventwhenc!eaningis necessary. Recommendconditions: RT. 40KHz, 3OW/l, 3 to 5 minutes 9. Environrnenr 9-I. Ozonospheredestructivechemicals. (I) The devicedoesn’tcontainfollowing substance. (2) The devicedoesn’thavea productionLinewhoseprocessrequiresfoIlowing substance. Restrictedpart: CFCa,haIones,CCI~,TtichIoroethane.(MethychIorofotm) 9-Z. Bm& non-burningmaterials The devicedoesn’tcontainbromicnon-burningmaterisIs(PBBOs,PBBs)