PREPARED BY: DATE: JJ&,~ -2 ; 97 -y--------. 3 _._ 1‘I&j&.:,,_ :-:fi-.-: ii -I s-a :,.-a ;:,+;SPEC.No. -_ ti~~~t34-. PALa APPROVED BY: DATE: / / ELECTROMC COMPONENTS GROUP SHARP CORPORATION DMSION: Opto-Electronic Devices Division SPECIFICATION DEVICE SPECIFICATION REPRESENTATIVE FOR Light Emitting Diode MODEL No. LTlED9OA 1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”). Please do not reproduce or cause anyone to reproduce them without Sharp’s consent. 2. When using this produ& please observe the absolute maximm ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damageresuking from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; r * OA equipment * Audio visual equipment * Home appliance * Measuring equipment * Telecommunication equipment (Terminal) * Computers * Tooling machines If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. 1 L (2) Appropriate measures, such as W-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in fimction and precision, such as ; r * Transportation control and safety equipment (aircra& train, automobile etc.) * Rescue and security equipment * Tra& signals * Gas leakage sensor breakers 1 * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in fLnction and precision, such as ; r * Space equipment * Telecommunication equipment (for trunk lines) l Medical equipment L * Nuclear power control equipment 1 I (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult ,tith a Sharp sales representative for any questions about this product. CUSTOMER’S APPROVAL DATE: BY: DATE: PRESENTED BY. 4 AC. Al . / J &,I M.Katoh, Department General iManager of Engineering Dept.,111 Opto-Electronic Devices Division Electronic Components Group SHARP CORPORXTION / f7yy LTlEDSOA Srxcifmtion 1. Application This specification applies to the light emitting diode device Model No. LTlEDSOA. [GaPCienow-green)tG~/G~~ed)chip LED device] 2. Outline dimensions and terminal connections . . . . . . . . . . . ..-.........Refertothe attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3 -6. 3-1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Yellow-green Characteristics Diagram 3-5. Red Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7. 4- 1. Test items and test conditions 4-2. Failure judgement criteria -, ,-. 1. . \ ,.: ,:‘..; 5. lncoeg inspection . . . . . . . . . . . . . . . . . . . . ..*....................... Refer to the attached sheet Page 8. 5- 1. Inspection method 5-2. Des-cription of inspection and criteria 6. Taping specikation . . . . . . . . . . . . . . . . . . . . . . ..*....................* 6-1. Taping 6-2. Packing specification 6-3. Label 6-4. Luminous intensity rank 7. Soldering.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*................ Refer to the attached sheet Page 9- 11. >Refer to the attached sheet Page 12. 7-1. Reflow soldering * precautions foruse............................................... Refer to the attached sheet Page 13. S- 1. Precautions matters for designing circuit 8-2, Cleaning method 9. Enhamenp.. . . . . . . . . *......................................... 9- 1. Ozonosphere destructive chemicals. 9-2. Bromic non-burning materials Refer to thy attached sheet Page 13. 2. outline dimensions and terminal c~~ecfio~ Torminrl connoctlon 4 Material Glass-Epoxy PWB: Resin: Epoxy Finish DrawingNo. Au Plated 51112009 3. Ratings aad characteristics (Notel) Duty ratio=I/1O,Pulse width=O.Ims , (Note2) &lamal soldering Max& (Note3) Each dissipation value of diode(Yellow-green,Red) is their own ratings ar generatings independently and the dissipation at the time when both diodes simultaneously generating should be within the half. Red unit MIN. 1I-YIP. IMAX. - I 2.0 I 2.8 I v (Note 3)Measure.d by SHARP EG&G MODEL550(Radiometer/Photometersyste (Tolerance : t 15%) i ---.- -.__ DG-992004 D&3/99 *--._____ 3-3. D&g Curve(Yellow-greenandRed) FotwardCurrentDentingCurve -25 0 25 50 7585100 PeakForward CurentDemtingCurve 125 AmbientTemperature Ta(“c) 0 25 50 75g5100 AmbientTemperature Tfl) PeakForwardCurrentvs. Duty Ratio (Ta=25”C) DuryRAo . 125 -- -.-____ ‘y--. -. r -.-_-_ _ _ D6- Deem99 992004 .LTlEDSOA %- . ---- -- *- *> - ’ 34. Yellow-greenChamcteristi~~Diagram(typ)(Note 1) Fomard Current vs.Fomard Volee Relative Luminous Intensity vs. Ambient Tapm=2omw (Ta=25"C) 1000 g 2 z 2 2 100 .-B E 3 .-: 9 d 0. 1 1 1.2 1.4 1.6 1.8 2 2.2 -60 2.4 Forward Voltage VF(v) I / iii/iii/ 0. 1 10 -40 -20 20 40 60 80 Ambient Temprat~~~~ Ta(“C) i 1 0 10 100 Forward Current IF(mA) tteed data. (Note 1) Above characteristicdataaretypical dataandnot a ,guaran 100 120 . D&/99 DG-992004 3-5. Red Chamctetistics Diagam(typ) (Note 1) Forward Current vnForward Voltage Relative Luminous Intensity vs. Ambient Temperature aF=2omA~ 1000 100 c b z B Y 5 100 a .B E 3 0 .z P 2 10 0. 1 1 1.2 1.4 1.6 1.8 2 2.2 -60 2.4 Forward Voltage VF(v) -40 -20 Forward (Note 10 1 20 40 60 80 l Ambient 0. 1 0 100 CummtE=(mA) 1) Above characteristic data are typical data and not a gmantteed dam Tmpraxure Ta(“cI 100 120 r 4. Reliability The reliability of productsshallbe satisfiedwith itemslistedbelow. Cotidence level: 90% Samples(Il) LTPD Defective (C) (%) 4-l. Test itemsandtestconditions Test conditions Testitems n=32, c=o 10 n-22, c=o 10 Ta= 1OO”C,t+OOh n=22, c=o 10 storageTa=25”C,t=SOOh n=“, c=o 10 n=22, Go 10 15 ooom/s’,osms, 3times/ kX$Y,*Z direction n=ll, C=O 20 2OOm/s*,100-2 OOO-lOOHz/sweepfor 4min. ,4timeaYz direction Referto the attachedsheq Page1l/12 ltimes n=ll, C=O 20 n=ll, c=O 20 temperaturecycling -25”c(3Omin)-+lOO”c(3Omin),3Otimes High temp.andhigh Ta=+60”C,9O%RH,HOOh humidity storage Efigh mpe&ure storage I .ow temperature Operatingtest Mechanicalshock Variable titquency ViilY3tiOil Solderingheat Ta=25”C,1,=30mA,r500h , 4-2. Failureju&ement criteria * 1 Parameter Symbol Failurejudgementcriteria *2 Forward voltage vF v, Reversecurrent IR Ia > U.S.L. x 2.0 Luminousintensity IV > U.S.L. x 1.2 Iv > The first stagevalueX 2.0 or The tit stagevalueX 0.5 > Iv * 1: Measuringconditionis in accordancewith specification. *2: U.S.L. is shownby Upper SpecificationLimit. 5. Incoming inspection .5- 1. Inspection method A single sampling plan, normal inspection level S-4 based on IS0 2859-l shah be adopted J-L. u~b,Ipu”l.l “I uqJ’.*LA”Y LIYY VA-.-- FIO. Inspection items Criteria 1 Electra-optical . . Not radiation 2 Radiation color Not correct 3 Taping Product inserted in reverse direction 4 Label Model number is not printed,or misprinted 5 Solderbility 1 Plating abnormality observed over 50% or greater percentage * 1 Electra-optical Not conforming to the specification 6 7 Defect A@ Major defect 0.1% Charactenstlcs Characteristics Outline dimensions 8 Not conforming to the specification Dust : @0.8nun or more Thread dust : 2.5mm or more in length and 0.25mm or more in width I’ Air bubbles : 4 0.8mm or more Scratch : 2.5n.u.nor more in length and 025mm or more in width However&e product is qualified as a good unit if the -scrach does not touch the Auwire.when seen from the front. Resin batr : Effect to the specification Resin flash:Over the unspecified tolerance Resin ond plated crack :0.3mm or more 9 could solder 50% or greater and less than 90% out of judgement area * 1 Judgement area The plated area of the product bottom Solderbility 2 Minor defect 0.4% _. __ _ DG- 992004 : I-MODELNo. i :‘-: .a LTlEDSOA -------Ad 6.Taping specificarion 6-l.Taping 6-1-l.Shape and dime&on of tape(lYF’.) 6-l-2.Shape and dimension of reel(TYP.) De&/99 P&G< - 5 &I? ‘:-.a _ 2’ .& & Deem99 DG-992004 PAGE ’ -IQ8443 MbDEL No. z LTlEDSOA j 3 4 --- 6-l-3 .Tapingspecification (1) Leadtape: Pull . ‘. ,,,I--> __ 0000000000 000000 End .I q ICIU~ Empty -I- Begirming q mnn Stuffed A’ 10 170 I-Leading Empty pitch or ‘more 40-50 pitch (2) Cover tapestrengthagainstpeeling:P=O.l-O8N( 0 =lO’or less) Cover tape c <- ’ Forward Carrier ‘yape speed : Smm/s tape (3) Tapestrengthagainstbending: The radiusof bendingcircle shouldbe 3Ommor more. Ifit is lessthan 3Omm,the cover may peel. There shouldnot bejoint of covertape or carrier tape. (4) Jointingof tape: Average 3,OOOpcs. per reel (5) Quantity per reel: Average 0.02g 1product (6) Massper products: Average 150gI packing (7)Massper packing: @ Thereshouldnot be missingabovecontinuousthree products. (8) Others: @ Productsshouldbe easilytakenout @ Productsshouldnot be attachedto the cover tapeat peeling. 6-2. Packingspecification 6-2-1. Dampproofpackage In otherto avoid the absorptionof humidity in transportandstorage,the devices arepacked in aluminumsleeve. Lab.31 6-2-2.Strage conditions Temperature: 5 to 30°C Humidity : lessthan 6O%RH 6-2-3.Trement after opening (1) Pleasemakea solderingwithin 15days after openingunderfollowing condition; Temperature: 5 to 30°C Humidity : lessthan6O%RH (2) In casethe devicesare not usedfor a long tune after opening,the storagein dry box is recommendable. Or it is better to repackthe deviceswith a desiccativeby the sealerand put them in the somestorage conditions as6-2-2. Then they shouldbe usedwithin 2 weeks. (3) Pleasemakea solderingafter a follewing bakingtreatmentif unusedterm shouldbe over the conditionsof (2) *Recommendable conditions: 0 in taping Temprature:6O’C to 6Y’C,Time:j6 to 38 hours 0 in individual (on PWB or metallic tray) Tempnture: IOO’C to 13Oc .Time:Z to 3 hours 6-3. Label _ I LOT No.KA99B19 <EIAJ C-3> . RANK O-0 WE IN JAPAN + Model number - Qmtity of products +-EIkTG3Barcode + EL4J C-3 Bar code + Lot numberl and Luminousrank, dominantwavelengthrank + Reduction country @ Prodwtion plant code@0be indicatedalphabetically) @ Roduetionlot(singleor doublefigures) @ Year of production(tbelasttwo figuresof theyear) @ Month of production (to be indicatedalphabeticallywith Januarycorresponding to A) @ Date of production(0l-3 1) 1 6-4.Luninous intensity rank(Note 1) (Yeiiow-green) . Luminousintensity 33.8 B 173 C D 25.0 36.0 - 48.8 (70.2) CRe4 Dominantwavelength . A B 6.0 - 8.8 - C D 12.7 18.3 - unit (Ta=25”C) condition mcd I&!OmA (Tolerance : + 15%) (Ta=25”C) Unit Condition 11.8 17.0 24.6 (35.5) Ml IpZOmA (Tolerance: F 15%) Also I shaIlnot askthe delivery ratio of eachrank. (Note 1) (Note 2) This rank value is the setting value of whenthat classifiesit the rank and be not a guaranteevalue. DG - 992004 No. :.-- -- MODEL -my i ;-.. .,--. -LTIEDSOA z-*, a_ *> *,-.> i’.7; . J J -‘Q ,y * I ----__c:. - . -.- -. .___ 7. Soldering 7; 1.Reflow soldering (1) It is not recommendedto exceedthe solderingtemperatureandtime shownbelow. Causedby substratebend or the othermechanical stressduringreflow soldering may happengold wire disconnectionetc. Thereforepleasecheckandstudyyour solderreflow machine’sbestcondition. (2) Reflow solderingtemperatureprofile to be doneunderthe following condition. 140-160 g Time(s) Recommendable ThermalModel (3) Recommendable Metal ~Maskpatternfor screenprint Recommend0.3m.mto 0.5~1 thicknessmetalmask for screenprint Causedby solderreflow $ondition, solderpaste, substrateand the othermaterialetc., may changesolderbility. Pleasecheck andstudy actual solderbilitybefore usage. *Center 1 1.2 1 llO/ r- Recommended 1.24 -r- soldar pattern (Unir:mxn) of the moduct 1 DedY99 PAGE _ l2/13 --.-. .,-> ‘2X4 : i--.._ i J.= ‘.--.’ J i i ,v+““-4 y= i _ DGi-,J 1 Dee/3/99 992004 T;TlEDgOi L L:i ~ - . . _. : . 8. Recautions for use 8- 1. &cautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant 8-2. Cleaning method Use only the following types of solvent.%ater” Recommend conditions: RT. 4OkHz, 3OW/l, time is more than 3 minutes The alkt on the device f?om ultrasonic bath, ultrasonic output, duration, board size and device mounting method. Test the cleaning method under actual conditions and check for abnormalities before actual use. 9. Environment 9- 1. Ozonosphere destructive chemicals. (1) The device doesn’t contain following substance. (2) The device doesn’t have a production line whose process requires following substance. Restricted part: CFCs,halones,CC~,Trichloroetbane(Methychloroform) I 9-2. Bromic non-bum& materials The device doesn’t contain bromic non-burning materials(PBBOs,PBBs) . LT1ED90A