ELEC-XROMC COMI’ONEXTS GROUP SW CORPORATION f \ DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. 1 LTlF67AF / 1. These specification sheetsinclude materials protected under the copyrjght of Sharp Corporation (“Sharp”). Please do not reproduce or causeanyone to reproduce them without S*.. consent 2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined in these specification sheets,as well as the precautions mentioned bei@%.Sharp assumesno responsibility for any damage resulting from use of the product which does not c&r+& tith the absolute maximum ratings and the instructions inchrded in these specification sheets,and the precautions mentioned below. .Ii:. ) (Precautions) (1) This products is designed for use in the foUowtig application areas; * OA equipment * Audio visual equipment * Home tippliance * Telecommunication equipment (Terminal) * [email protected] 3 * Tooling machines * Computers I [ If the use of the product in the above application areas is for equipment listed in paragraphs . (2) or (3), please be sure to observethe precautions given ixi those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safec design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which d&$nds high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, t@n, automobile etc.) * Traffic signals * Gas leakage sensorbreakers * R@ue and security equipment * L Other safetyequipment I (3) Please do not use this product for equipment which require extremely high reliability and safety in fnnction and precision, such as ; * Space equipment * Tekcommunication equipment (for trunk lines) + C Nuclear power control equipment * Medical equipment 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. . 3. Please contact and consult with a Sharp sales representative for any questions about this product. CUSTOMER’S APPROVAL DATE: BY: DATE: PRESENTED BY: hp. & Department General Manager of Enginewing Dept.,BI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION I t?b : This data sheet is to introduce Model No. LTlF61.G. delivered the light emitting diode device’ to l.Structure and characteristics Structure: CaP gellorgreen chip LED device Outline dimensions and pin connections: Taping specification: Packing specification: Soldering method: @ate l.)Duty ratio=l/lO, (Note 2)Tore!ance: Pulse width*. See See See See lm~ 415% 4. Luminous intensity rank . (Ta=25”C) Condition c H I J K L 19.7 22.1 24.7 27.7 31.0 34.7 Cvote 3)Measured - 24. 0 26. 9 30. I 33.7 . 37. 0 42. 4 mcd IF=201n4 t.olerance; f 15? by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem) page page page page 2 3 4 5 6 7 8 M bxq 1. Plated. j!:.; area ReqJ area 2. Pin Conection 0 Cathode @ Anode 0-0 3. Unspecified tel. to be iO.1 Outline terminal dimensions connections and 1. This &tO * dcrlcc. 2 0h~t 10 to i*troduor thr lapin* sodi,i,fi~mlioO .Of LJ!U lode1 Ho. LmwAF taping spcciflcatlaa 2. I tapiag 2.2 Shipment rptciflc2tioo . table ‘SHIPMENT TABLE /-Hodel number PA-IT NO. -Quantity QUANTITY - Lot - Luminous intensity LOT No. SHARP UADC IN of prodqcts amber* : noi3[1oaaa -m --v @ 0 ‘0 @ 8 rank JAI.4.Y . *:Lo e indication 0 Production plant code(to be indicated alphabetically) $3 Production Lot(singie or double figures) 3 Year of producrion(che last tuo figures of the year) 8 Konch of production (to be indicated alphabetically with January corresponding d Date of production(Ol-31) to A) 2.3 Rcl+tcd l ttcrs 2.3.1. Packing There 2.3.2. should not true strength 1)Cover’trpe strength Forward 2) Tape strength against against Taking radius out 11 Products 2) Products 2.3.4.. Jointing There 3: @anti of tbrte products. 0.1-O. 8N tape be 30~ or aore. cover tape may psi. should products should be easily taken out. should not be attached to the eover’taph rt txeling. of true should (I=lO* bending of bending circ!e If it .is less than 30aa.‘the 2.3.3. peel iag: F= Cdneir +-- The continuous be missing’rbova not be joint of cover tp per reel Average: 4.000 pcs. per reel tape or csrrier tape. or Ied) 4-1. Taping 4-1-I. Shape and diwnsion of tape(TYP. > . r3- \/I Parameter : P2 PI ~ysbol~imens ’ -I iod Benarks Concave square ‘fere icai A hole Horitoatal Pitch B 1 1.1)am Dimeasioq excludes cocaes R I 1.9mm at inside bottom Diameter pi Da 1 4. Omm 1. sala Pitch PO Center Co ten- Position Vert.dire E P2 AccumuLa{:ed error i0.5mm/lO pitch 1.75mm DistaaciI:becueen tape edge and hole center Ceacer Line of the concave square hole and 2.omm cer dimension Hori .dire F 3.5ms Cover Wid:h Thickness ( W, 1 t3 5.5mm Uidch 1 wo 8. Omm ) Thickness entire 1 cl 0.2mm 1 lot part iasertion Round sprocket hole _ cape Carrier kickness unit 3 i-taterial tape of the Carrier to cape . ..PET. .. 4.Omn round sprocket hole 1 0. lnm [ 1.2IIFA Cover . With cover tape...Polyescer tape and carrier tape combined 1 X--I a-l-2.Shapc Parameter Flange Hub and dimensian of reel (TYP. ) Diameter Thickness Inner space direccioa External diameter Spindle bale diameter Key slit Width Degch Notation 3 Hatcrial: for part came etc. Reel.. .Polystyrene 1 Symbol } Dimension )’ &e@rks 9178mm I A l.Smm I c 1 W Diqension 1anlm E )6Qmm C +13fUlQ 1 E 1 U 1 of shaft 2.0mm 4.5mm I Labeling on one side of f Lange. 1 (Part name.quantity,loc No.) core Packing Specification In order to avoid the absorption of humidity in transport .a& storage, the~devices are psdtcd in alusim0 skve. 4 1. Storage Conditions The storage should lx done under follaaing conditions: Temperature . 5 to 3oc less than 6OUl-l Humidity 2. Treatment after Opening 1) Please makea soldering within 2 days after opening under following conditions: .- Temperature 5 to 3OC less than 60;YRH Humidity 2) In case the devices are not used for a long time after opening, the storage in dq box is recommendable.Or it is better to repack the devices with a desiccative by the sealer and put them in the samestorage conditions as 6-I. Then they should be used rithin 2 W?XkS. 3) Please makea soldering after a following baking treatment if unused term should be over the amditions of 2). Remmendable Gmdi tions: (TJ in taping Tesprature 60t Time 90 to 100 Hours @ in individual ( on PIB or metallic tray > Temperature 11OC Time 3 to 4 Nours M aunt ing precautions 1. Soldering l-1 Xeflow soldering To be doae’undet the following conditiqa. UN. EOse c P3( ux. 5’5ec Recommendable T hermal M ode1 1-2 Reflow soldering precautions Second time soldering shoufd be done witin 8 ham after the first one is l%shcd (Storage condition:at30C,RH(60%) I 1 2. Soldering iron method At 3OOCwithln r seconds When using a soldering (Pay attion not to iran.care must be taken not to damage the package altou any undue stress or heat on package.) Z X-l LT1F67AF