.
I-), Ti&Grr~A
APPROVED
c-’
?.
.r
SPEC No.
DATE
PREPARED BY:
SHARI=
_
qp-; I 9 1993
BY:
DATE
/:
it!..
,., f ,I..
-
--
ELECTRONIC
s,I
! ,;
FILE No.
--
~~
COMPONENTS CROUP
ISSUE
April
PAGE
12 Pages
REPRESENTATIVE
SHARP CORPORATION
I
ED-93033
9, 1993
DIVISION
q PHOTOVOLTAICS DIV.
q OPTO-ELECTRONIC
DEVICES
n ELECTRONIC
1
SPECIFICATION
DJV
COMPONENTS DIV.
10
w
’
DEVICE
SPECIFICATION
FOR
PHOTOCOUPLER
hiODEL
1.
No.
This specification
sheets include
the contents
under the copyright
of
Please keep them with reasonable
care as
sharp Corporation
(“Sharp”).
important information.
Please don’t reproduce
or cause anyone reproduce
:hem \;i’thout
2.
Dlease
(1)
This
Main
Sharp’s
consent.
obey the instructions
mentioned
below
for
device is designed
for general
electronic
uses of this device are as follows;
.
actual
use of this
equipment.
- Computer
* OA equipment
-Telecommunication
equipment
* AV equipment
- Measuring
equipment
-Tooling
machine
etc.
C- Home appliance,
(Zj
Please take proper
steps in order to maintain
reliability
in case this device is used for the uses mentioned
below
high reliability.
-Unit concerning
control
and safety of a vehicle
automobile
etc.)
* Gas leak detection
breaker
*Other safety
i -Fire
box and burglar
alarm box
(2)
Please don’t use for the uses mentioned
extremely
high reliability
Telecommunication
Medical
element),
0 CLJSTG:6RR’S
DATE
BY
etc.
below
equipment
equipment
device.
(Terminal)
and safety,
which require
(air plane,
train,
- Traffic
signal
equipment,
etc..
which
1
I
require
(Trunk)
(relating
to any fatal
1
APPROVAL
T. Matsumura,
Department General Manager of
Engineering
Dept.,
TI
Opto-Electronic
Devices Div.
ELECOMGroup
SHARP CORPORATION
MODEL
No.
PACE
PC3Q67
i.
Application
This specification
photocoupler
Model
2.
applies
to the outline
No. PC3Q67.
and characteristics
of
Outline
Refer
3.
1
to the attached
Ratings
3.1
drawing
No. CY5890K02.
and characteristics
Absolute
maximum
ratings
Ta=25"C
iInput
*1
Parameter
--------_
Forward current
*2
Peak forward
Symbol
IF
current
/
Im
/
!
Reverse
voltage
"R
; *1
Power dissipation
P
/
I
ioutput
!
!
1
*l
*3
*4
50
1
1
/
A
6
I
f
,
1
V
"CEO
Emitter-collector
voltage
VECO
)
6
Ic
i
50
current
Collector
power dissipation
Total
power dissipation
Operating
temperature
___Storage temperature
-__-_-_--______
Isolation
voltage
-_~.--Soldering
temperature
--___. --__
I
Ptot
i'
Topr
i
Tstg
*1
The derating
temperature
factors
of absolute
maximum
are shown in Fig. 1 'L 4.
*2
Pulse
< lOOus,
*3
AC for
*4
For 10 s
width
lmin.,
Duty ratio
40 ,-I, 60%RH, f=60Hz
: 0.001
mW
35
j
!
!
1
I
1
rating
(Refer
"
i
(
"1
1
I *
1
mW
j
I
i LUW '
150
170
-30 % +lOO
-40 'L +125
due to ambient
to Fig.
,
mA
70
voltage
Collector
Unit
j
Collector-emitter
/2..-*l
Rating
5)
!
OC
MODEL
2
PC3Q67
3.2
Electra-optical
l
PACE
hb.
characteristics
Ta=25"C
----T----Symbol
MIN.
Parameter
----.---+--Forward voltage
-1
Input
I
VF
-
,
I TYP.
MAX.
i 1.2
1
!
1.4
Reverse current
Terminal
output
capacitance
/
Collector-emitter
breakdown voltage
1
ICE0
/
10
I 250
f
Dark current
'
-
/
-
100
Unit
Conditions
v ?F=20mA
I
1 pA ‘VR=4V
i
I
I
I
'V=O, f=lkHz
i
pF I
I
ti /vCE=20v, IF'0 1
!
I
i
I Emitter-collector
brakdown voltage
Collector
current
Collector-emitter
saturation
voltage
------Isolation
resistance
Transfer
characterostocs
Response time (Rise)
/
r
L
tr
Response time (Fall)
I
j-
14
18
I
1 US jVCE=2V
,
tf
/
-
3
18
ps
'Ic=2mA
RL=lOOQ
j
4.
Reliability
Refer
5.
to the attached
Incoming
Refer
6.
sheet,
Page 7.
sheet,
Page 8.
inspection
to the
attached
Supplements
6.1
shall
be measured
in the
following
Short between anode and cathode on the primary
between collector
and Emitter
on the secondary
(2)
The dielectric
be used.
(3)
The waveform of applied
(It is recommended
that
in insulation
oil)
withstand
tester
with
voltage
shall
the isolation
zero-cross
This
product
is not designed
(2)
This
product
is assembled
with
(3)
This
product
incorporates
non coherent
Package
as radiation
uL : Under
attached
preparation
sheet,
side and
side.
circuit
shall
hardened.
electrical
specifications
to the
method.
be a sine wave.
voltage
be measured
(1)
Refer
6.4
voltape
( 1)
6.2
6.3
Isolation
Page 9 to 11.
input
light
and output.
emitting
diode.
PAGE
4
MODEL No.
PC3Q67
7.
Notes
7.1
For cleaning
* Cleaning
conditions:
(1)
Solvent
cleaning:
Solvent
temperature
45°C or less
Immersion
3 min. or less
(2)
Ultrason
ic
Affection
to device by ultrasonic
cleaning
has
different
affection
by cleaning
bath size,
ultrasonic
power output,
cleaning
time,
PWB size
If user
or device mounting
condition
etc.
carries
out ultrasonic
cleaning,
user should
select
fit condition
that doesn't
occur defect.
* The cleaning
Solvent:
c 1 eaning:
shall
be Carrie
Ethyl
Freon
out with
solvent
below.
alcohol,
Methyl
alcohol,
TE.TF, Daiflon-solvent
Isopropyl
S3-E
alcohol
Please refrain
from using Chloro Fluoro Carbon type solvent
to clean
devices as much as possible
since it is restricted
to protert
the
ozonosphere.
Before you use alternative
solvent
you are requested
to confirm
that it does not damage package resin.
7.2
On mounting
In mounting
this device,
please perform
soldering
reflow
satisfied
with the conditions
indicated
in page 12. And please pay attention
not to occur the temperature
rising
of the package sectionally.
8.
Others
Any doubt as to this specification
shall
be determined
upon mutual consultation
of the both parties.
in good faith
pC3Q67
Date
code
Page 5
*1
.2
Pin Nos.
connection
and internal
diagram
Pti3Q67
m
d
ti
c 0.4
Epoxy'-
resin
W
&
\,f
*I)
i
Date code is composed of 2-digit
number marked according
to
DIN standard
and t'lie following
weekly-code
.
First week : 1
Second week : 2
Third week : 3
Fouth week : 4
UNIT
:1/l
mm
Fifth,
Sixth week : 5
Name P-Q67
Outline
Dimensions
Drawin
CY589OKO2
No.
.;
Page 6
pc3Q67
Fig.
1
Forward
ambient
current
vs.
temperature
Fig.
2
I
I
40
/
Y
30-20 -
-
-
i-
10
-‘JO- 0
Ambient
3
25
-
~t-b
55 75 100
temperature
Ta ("C)
Collector
power dissipation
vs. ambient
temperature
r\
I
I
I
80.
70
60 -
I
\
Ambi!nt
fzmper?tur!
--t-I
\
40 20 -030
Fig.
4
Ty"(OC)
Total
power dissipation
vs. ambient
temperature
200 -.
170
150 100
..-\
.
50--.
-30
0
Ambient
Pig.
i
5
I
1
looI-i--l-l--t-1-1
SO
Fig.
Diode power dissipation
temperature
vs. ambient
25
50
temperature
75
100
Ta ("C)
Peak forward current
vs. duty ratio
Pulse width 5 100~s
Ta - 25C
Duty ratio
01111111
-30
Ambi!ent
~?rnpe?!atu~~
?!'("C)
PAGE
4.
Reliability
The reliability
Test
I
!
shall
Test
heat
be satisfied
with
Confidence
level
23O"C,
5 s
*2
260°C
10 s
below.
: 90%, LTPD : 10X/20%
2
IR>uX
ICE0
15000m/sZ~1500G~,
0.5ms
3 times/s,
?Y, +Z direction
100 'L 2000 Q 100 Hz/4
4 times/X,Y
Z direction
/ 200m/sZ{20G]
j Temperature
1 cycling
listed
VF > u X 1.2
Weight
: lNiO.lkgf}
1 time/each
termianl
frequency
items
Conditions
*l
.:! Terminal
strength
: (Bending)
*3
/
! Mechanical
shock
/ .
I Variable
! vibration
products
Items
; Solderability
i Soldering
of
Ic
> u
X
n=ll,
C=O
n=ll,
C=O
2
< L x 0.7
min.
> u x 1.2
' 1 cycle
-40°C --I, +125"C
(30min.)
(30min.)
20 cycle
test
,
*l
Solder
shall
lead and pin
--adhere
at the area of 95% or more of immersed
hole or other
holes
shall
not be concentrated
*2
The lead pin
root
of lead
depth
pins.
*3
Terminal
bending
dipped
(Refer
direction
into solder
shall
to the below)
is
shown
be away
0.2mm from
below.
0.211~s or more
:.-i...<.;x-.. .+Soldering
area
Weight
t
: lNfO.lkgf]
portion
of
on one portion.
the
1PAGE
IMODEL No.
I
5.
Incoming
5.1
8
I
inspection
Inspection
(1)
items
Electrical
VF, IR,
(2)
5.2
PC3Q67
characteristics
1~~0% VCE(sat),
method
and Inspection
A single
sampling
plan,
MIL-STD-105D
is applied.
items are shown below.
Major
defect
I
II
I
i
i
/
I
' Minor
defect
Rise,
vim
Appearance
Sampling
Defect
Ic,
/
;
Inspection
Electrical
Unreadable
level
normal inspection
level
II
The AQL according
to the
item
characteristics
marking
_---
Appearance
defect except
the above mensioned.
I
I Inspection
I
I
/ Normal
I inspection
I
based on
inspection
level
AQL(%)
II
0.1
I
!
,
i
t
Normal
inspection
II
0.4
I
6.2
Package
6.3.1
ill
PC3Q67
specifications
Taping
conditions
Tape structure
(Refer
to the attached
sheet,
Page 10)
and Dimensions
tape is sealed heatto protect
against
The tape shall have a structure
in which a cover
pressed on the carrier
tape of hard vinylchloride
static
electricity.
(2)
Reel structure
and Dimensions
(Refer
to the attached
The taping reel shall be of corrugated
as shown in the attached
drawing.
(3)
Direction
of product
insertion
(Refer
Product direction
in carrier
the hole side on the tape.
(4)
Joint
cardboard
with
to the attached
tape shall
direct
sheet,
its
Page 11)
dimensions
sheet,
Page 11)
to the anode mark at
of tape
The cover
iS>
I
tape and carrier
The way to repair
tape in one reel
taped failure
shall
be jointless.
devices
The way to repair
taped failure
devices cut a bottom of carrier
and after
replacing
to good devices,
the cutting
with a cutter,
shall be sealed with adhesive
tape.
6.2.2
Adhesiveness
of cover
tape
The exfoliation
force between carrier
tape and cover tape
0.2N{20gf)s
lN{lOOgf]for
the angle from 160" to 180".
6.2.3
Rolling
tape
portion
shall
be
method and quanfity
Wind the tape back on the reel so that the cover tape will
be outside
Attach more than 20cm of blank tape to the trailer
and the
the tape.
leader of the tape and fix the both ends with adhesive
tape.
One reel shall contain
1000 PCS.
6.2.4
Marking
The outer
packaging
* Model No.
6.2.5
Storage
case
shall
be marked
* Number of pieces
with
Safety
information.
* Production
delivered
date
condition
Taped procuts
shall be stored at the temperature
5 Q 30°C and the humidities
lower than 7O%RH.
6.2.6
following
protection
during
lower
than
shipping
There shall be no deformation
of component
characteristecs
due to shipping.
or degradation
of electrical
g
PC3Q67
TapL
structure
Page
and Dimensions
K
-
J
-
-z
I
-_
A
I
I
L
i
I
L
Somax
, ..,
Dimension
A
21. oto. 3
J
list
C
-(Unit
:’ mm)
D
11.5&O. 1 1.75to.i
K
0. 410. 05 3. oio. 1
L
7.420. 1
E
F
G
H
12.0~0. 1 2. o-co. 1 4. wo. 1 41. 5 fb’
I
10. 8+-O. 1
10
PC3Q67
Ret1
structure
and Dimensions
a
,' t
Dimension
-4
list
a
b
330 25.51-1.5
Direction
(Unit
c
1rjtEl.O
of product
: mm)
d
13io.5
insertion
e
23kl.O
f
2.OkO.5
g
2.oa5
L
Page 11
MODEL
PAGE
No.
PC3Q67
Precautions
1.
If
solder
for
Soldering
Photocouplers
reflow:
It is recommended that only one soldering
be done at the
temperature
and the time within
the temperature
profile
as
shown in the figure.
23O'C
2ooc
180':
23:
L
i- ---
2 min. _
pp
i
,&-1_min.
-----+
minY /
;
/ *l
+-----q
1.5 min.
2.
Other
precautions
infrared
lamp used to heat up for soldering
may cause a
localized
temperature
rise in the resin.
So keep the package
temperature
within
that specified
in Item 1. Also avoid immersing
the resin part in the solder.
An
12