SILAN SC16312

Silan
Semiconductors SC16312
1/4 to 1/11 DUTY FIP(VFD)
CONTROLLER/DRIVER
DESCRIPTION
The SC16312 is a FIP (Fluorescent Indicator Panel, or Vacuum
Fluorescent Display) controller/driver that is driven on a 1/4 or 1/11
duty factor. It consists of 11 segment output lines, 6 grid output lines,
5 segment/grid output drive lines, a display memory, a control circuit,
and a key scan circuit. Serial data is input to the SC16312 through a
three-line serial interface. This FIP controller/driver is ideal as a
peripheral device for a single-chip microcomputer.
FEATURES
QPF-44-10x10-0.8
* Multiple display modes (11-segment & 11-dight
to 16-segment & 4-digit).
* Key scanning (6x4 matrix).
* No external resistors necessary for driver
* Dimming circuit (eight steps).
outputs (P-ch open-drain + pull-down
* High-voltage output (VDD – 35V max).
resistor output)
* LED ports (4 chs., 20 mA max).
* Serial interface (CLK, STB, DIN, DOUT)
* General-purpose input port (4 bits)
OSC
VSS
LED1
LED2
LED3
LED4
VDD
Grid1
Grid2
Grid3
Grid4
PAD CONFIGURATION
44
43
42
41
40
39
38
37
36
35
34
SW 1 1
33 Grid5
SW 2
2
32 Grid6
SW 3
3
31 Seg16/Grid7
SW 4 4
30 Seg15/Grid8
DOUT 5
29 Seg14/Grid9
SC16312
DIN 6
28 Seg13/Grid 10
VSS 7
27 VEE
CLK 8
26 Seg12/Grid11
STB 9
25 Seg11
KEY1 10
24 Seg10
KEY2 11
13
14
15
16
17
18
19
20
21
22
KEY3
KEY4
VDD
Seg1/KS1
Seg2/KS2
Seg3/KS3
Seg4/KS4
Seg5/KS5
Seg6/KS6
Seg7
Seg8
23 Seg9
12
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Semiconductors SC16312
BLOCK DIAGRAM
Dimming
circuit
Command decoder
15 Seg 1
DIN 6
DOUT 5
16-bit
output
latch
Display memeoy
16 bits x 11 words
Serial I/F
CLK 8
16
segment
driver
11
25 Seg 11
STB 9
5
26 Seg 12/Grid 11
VDD
R
OSC
44
Timing generator
key scan
Data
selector
5
Multip
lexed
driver
31 Seg 16/Grid 7
key data memory (4 x 6)
Key1
to
Key4
SW 1
to
SW 4
11-bit
shift
register
27 Grid 6
11
4
4
5
6
Grid
driver
32 Grid 6
4-bit
latch
4-bit latch
42
39
14
7
27
VDD VSS VEE
(+5V) (0V) (-30V)
LED1
LED4
Key data memory(4 x 6)
ABSOLUTE MAXIMUM RATING (Ta=25°C, Vss=0V)
Symbol
Value
Unit
Logic Supply Voltage
Characteristic
VDD
-0.5 ~ 7.0
V
Driver Supply Voltage
VEE
VDD + 0.5 ~ VDD - 40
V
Logic Input Voltage
VI1
-0.5 ~ VDD + 0.5
V
FIP Driver Output Voltage
VO2
VEE - 0.5 ~ VDD + 0.5
V
LED Driver Output Current
IO1
+25
mA
FIP Driver Output Current
IO2
-40 (grid) ; -15 (segment)
mA
Power Dissipation
PD
800 *
mW
Storage temperature
TSTG
-65 ~ +150
°C
Operating Ambient Temperature
TOPT
-40 ~ + 85
°C
* Note: Derate at –6.4 mW/°C at Ta=25°C or higher
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Semiconductors SC16312
RECOMMENDED OPERATING RANGE (Ta=-20 ~ 70 °C, Vss=0V)
Symbol
Min
Typ
Max
Unit
Logic Supply Voltage
Parameter
VDD
4.5
5
5.5
V
High-Level Input Voltage
VIH
0.7x VDD
--
VDD
V
Low-Level Input Voltage
VIL
0
--
0.3xVDD
V
Driver Supply Voltage
VEE
0
--
VDD-35
V
Maximum power consumption PMAX. = FIP driver dissipation + RL dissipation + LED driver dissipation + dynamic
power consumption
Where segment current = 3mA, grid current = 15mA, and LED current = 20mA,
FIP driver dissipation = number of segments x 6 + number of grids/(number of grids + 1) x 30(mW)
RL dissipation = (VDD-VEE) 2 /50 x (number of segments + 1)(mW)
LED driver dissipation = number of LEDs x 20(mW)
Dynamic power consumption = VDD x 5(mW)
Example
Where VEE = -25V, VDD = 5V, and in 16-segment and 6-digit modes,
FIP driver dissipation = 16 x 6 +6/7 x 30 = 122
RL dissipation = 30 2 /50 x 17 = 306
LED driver dissipation = 4 x 20 = 80
Dynamic power consumption = 5 x 5 = 25
Total 553 Mw
ELECTRICAL CHARACTERISTICS (Ta=-20 ~ 70 °C, VDD =4.5 ~ 5.5V, VEE=-30V)
Min
Typ
Max
High-Level Output Voltage
Parameter
Symbol
VOH1
LED1- LED4, IOH1=-1mA
0.9VDD
--
--
V
Low -Level Output Voltage
VOL1
LED1- LED4, IOL1 =20mA
--
--
1
V
Low -Level Output Voltage
VOL2
DOUT, IOL2=4mA
--
--
0.4
V
High-Level Output Current
IOH21
VO=VDD-2V, Seg1 to Seg11
-3
--
--
mA
-15
--
--
mA
High-Level Output Current
IOH22
Driver Leakage Current
IOLEAK
Output Pull-Down Resistor
Input Current
Test conditions
VO=VDD-2V, Grid1 to Grid6
Seg12/Grid11 to Seg16/Grid7
Unit
VO= VDD -35V,driver off
--
--
-10
µA
RL
Driver output
50
100
150
kΩ
II
VI=VDD or VSS
--
--
±1
µA
V
High-Level Input Voltage
VIH
--
0.7VDD
--
--
Low-Level Input Voltage
VIL
--
--
--
0.3VDD
V
Hysteresis voltage
VH
CLK, DIN, STB
--
0.35
--
V
Under no load, display off
--
--
5
mA
Dynamic Current Consumption
IDDdyn
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Semiconductors SC16312
SWITCHING CHARACTERISTICS(Ta=-20 ~ 70 °C, VDD =4.5 ~ 5.5V, VEE=-30V)
Parameter
Symbol
Oscillation Frequency
Propagation Delay Time
Test conditions
Min
Typ
Max
Unit
350
500
650
kHz
tOSC
R=51Ω
tPLZ
CLK DOUT
--
--
300
ns
tPZL
CL=15pF, RL=10kΩ
--
--
100
ns
--
--
2
µs
--
--
0.5
µs
tTZH1
Rise Time
Seg1 to Seg11
CL=300pF
Grid1 to Grid6,
Seg12/Grid11
tTZH2
to Seg16/Grid7
Fall Time
tTHZ
CL=300pF, Segn, Gridn
--
--
120
µs
Maximum Clock Frequency
fmax.
Duty=50%
1
--
--
MHz
--
--
--
15
pF
Input Capacitance
CI
SWITCHING CHARACTERISTIC WAVEFORMS
fOSC
OSC
50%
PW STB
STB
PW CLK
PWCLK
tCLK-STB
CLK
tSETUP
tHOLD
DIN
tPZL
tPZL
DOUT
tTHZ
Sn/Gn
tTHZ
90%
10%
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Semiconductors SC16312
TIMING CONDITIONS(Ta=-20 ~ 70 °C, VDD =4.5 ~ 5.5V)
Symbol
Test conditions
Min
Typ
Max
Unit
Clock Pulse Width
Parameter
PW CLK
--
400
--
--
ns
Strobe Pulse Width
PW STB
--
1
--
--
µs
Data Setup Time
tSETUP
--
100
--
--
ns
Data Hold Time
tHOLD
--
100
--
--
ns
tCLK-STB
CLK ↑ → STB ↑
1
--
--
µs
tWAT
CLK ↑ → CLK ↓ Note
1
--
--
µs
Clock-Strobe Time
Wait Time
Note: When data is read, a wait time tWAIT of 1 µs is necessary since the rising of the eighth clock that has set the
command, until the falling of the first clock that has read the data.
PAD DESCRIPTION
Pin No.
Symbol
Pin Name
6
DIN
Data input
5
DOUT
Data output
Description
Input serial data at rising edge of shift clock, starting from
the low order bit.
Output serial data at the falling edge of the shift clock,
starting from low order bit. This is N-ch open-drain output
pin.
Initializes serial interface at the rising or falling edge of
the SC16312. It then waits for reception of a command.
9
STB
Strobe
Data input after STB has fallen is processed as a
command. While command data is processed, current
processing is stopped, and the serial interface is
initialized. While STB is high, CLK is ignored.
8
CLK
Clock input
44
OSC
Oscillator pin
15 ~ 20
Seg1/KS1
to Seg6/KS6
21 ~ 25
Seg7 to Seg11
37 ~ 32
Grid1 to Grid6
High-voltage output
High-voltage output
(segment)
High-voltage output
(grid)
Reads serial data at the rising edge, and outputs data at
the falling edge.
Connect resistor to this pin to determine the oscillation
frequency to this pin.
Segment output pins (Dual function as key source).
Segment output pins.
Grid output pins.
(to be continued)
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Semiconductors SC16312
(continued)
Pin No.
Symbol
Pin Name
Description
Seg12/Grid11
High-voltage output
to Seg16/Grid7
(segment/grid)
42 ~ 39
LED1 to LED4
LED output
10 ~ 13
KEY1 to KEY4
Key data input
1~4
SW 1 to SW 4
Switch input
These pins constitute a 4-bit general-purpose input port.
14,38
VDD
Logic power
5V±10%
7,43
VSS
Logic ground
Connect this pin to system GND.
27
VEE
Pull-down level
VDD-35V max.
26,28 ~ 31
These pins are selectable for segment or grid driving.
CMOS output. +20mA max.
Data input to these pins is latched at the end of the
display cycle.
FUNCTIONAL DESCRIPTION
1. DISPLAY RAM ADDRESS AND DISPLAY MODE
The display RAM stores the data transmitted from an external device to the SC16312 through the serial interface,
and is assigned addresses as follows, in 8 bits unit:
Seg1
Seg4
Seg8
Seg12
Seg16
00HL
00HU
01HL
01HU
DIG1
02HL
02HU
03HL
03HU
DIG2
04HL
04HU
05HL
05HU
DIG3
06HL
06HU
07HL
07HU
DIG4
08HL
08HU
09HL
09HU
DIG5
0AHL
0AHU
0BHL
0BHU
DIG6
0CHL
0CHU
0DHL
0DHU
DIG7
0EHL
0EHU
0FHL
0FHU
DIG8
10HL
10HU
11HL
11HU
DIG9
12HL
12HU
13HL
13HU
DIG10
14HL
14HU
15HL
15HU
DIG11
b0
b3 b4
xxHL
Lower 4 bits
b7
xxHU
Higher 4 bits
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Semiconductors SC16312
2. KEY MATRIX AND KEY-INPUT DATA STORAGE RAM
The key matrix is made up of a 6 x 4 matrix, as shown below.
KEY1
KEY2
KEY3
Seg6/KS6
Seg5/KS5
Seg4/KS4
Seg3/KS3
Seg2/KS2
Seg1/KS1
KEY4
The data of each key is stored as illustrated below, and is read with the read command, starting from the least
significant bit.
KEY1 … KEY4
KEY1 … KEY4
Seg1/KS1
Seg2/KS2
Seg3/KS3
Seg4/KS4
Seg5/KS5
Seg6/KS6
b0 --------- b3
b4 --------- b7
Reading sequence
3. LED PORT
Data is written to the LED port with command, starting from the least port’s least significant bit. When a bit of this
port is 0, the corresponding LED lights; When the bit is 1, the LED turns off. The data of bits 5 through 8 are ignored.
LSB
MSB
b3
b2
b1
b0
LED1
LED2
Don't care
LED3
LED4
On power application, all LEDs are unlit.
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Semiconductors SC16312
4. SW DATA
SW data is read with the read command, starting from the least significant bit. Bits 5 through 8 of the SW data are 0.
LSB
MSB
0
0
0
0
b3
b2
b1
b0
SW1
SW2
SW3
SW4
5. COMMANDS
Commands set the display mode and status of the FIP driver.
The first 1 byte input to the SC16312 through the DIN pin after the STB pin has fallen is regarded as a command.
If STB is set high while commands/data are transmitted, serial communication is initialized, and the
commands/data being transmitted are invalid(however, the commands/data previously transmitted remain valid).
(1) Display mode setting commands
These commands initialize the SC16312 and select the number of segments and the number of grid(1/4 to
1/11 duty, 11 segments to 16 segments).
When these commands are executed, the display is forcibly turned off, and key scanning is also stopped. To
resume display, the display command “ON” must be executed. If the same mode is selected, however, nothing
happens.
MSB
0
LSB
0
b2
b1
b0
Display mode settings
Irrelevant
000: 4 digits, 16 segments
001: 5 digits, 16 segments
010: 6 digits, 16 segments
011: 7 digits, 15 segments
100: 8 digits, 14 segments
101: 9 digits, 13 segments
110: 10 digits, 12 segments
111: 11 digits, 11 segments
On power application, the 11-digit, 11-segment mode is selected.
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Semiconductors SC16312
(2) Data setting commands
These commands set data write and data read modes.
MSB
0
1
b3
b2
b1
LSB
b0
Data write and read mode settings
00: Write data to display memory
01: Write data to LED port
10: Read key data
11: Read SW data
Irrelevant
Address increment mode settings
(display memory)
0: Increments address after data
has been written
1: Fixes address
Test mode settings
0: Normal operation
1: Test mode
On power application, the normal operation and address increment modes are set.
(3) Address setting commands
These commands set an address of the display memory.
MSB
LSB
1
1
b4
b3
b2
b1
b0
Address (00H-15H)
If address 16H or higher is set, data is ignored, until a valid address is set.
On the power application, the address is set to 00H.
(4) Display control commands
MSB
1
LSB
0
b3
b2
b1
b0
Dimming quantity settings
000: Set pulse width to 1/16
001: Set pulse width to 2/16
010: Set pulse width to 4/16
011: Set pulse width to 10/16
100: Set pulse width to 11/16
101: Set pulse width to 12/16
110: Set pulse width to 13/16
111: Set pulse width to 14/16
Irrelevant
Turns on/off display
0: Display off(key scan
continues)*
1: Display on
On power application, the 1/6 pulse width is set and the display is turned off.
*Note: On power application, key scanning is stopped.
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Semiconductors SC16312
KEY SCANNING ANG DISPLAY TIMING
TDISP=500µs
Key scan data
DIG1
SEG output
DIG2
DIG3
DIGn
DIG1
1 23456
G1
G2
1/16
TDISP
G3
Gn
1 frame=TDISPx(n+1)
One cycle of key scanning consists of one frame, and data in a 6x4 matrix is stored in RAM.
SERIAL COMMUNICATION FORMAT
Reception(command/data write)
If data continues
STB
DIN
b0
b1
b2
b6
b7
CLK
1
2
3
7
8
Transmission(data read)
STB
DIN
CLK
b0
1
b1
2
b2
3
b3
4
b4
5
b5
6
b6
7
b7
8
Note
1
2
3
4
5
6
tWAIT
DOUT
b0
A dataread command is set.
b1
b2
b3
b4
b5
Data is read.
Because the DOUT pin is an N-ch, open-drain output pin, be sure to connect an external pull-up resistor to this
pin(1kΩ to 10kΩ)..
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Semiconductors SC16312
APPLICATION
Updating display memory by incrementing address
STB
CLK
DIN
Command 1
Command 2
Command 3
Data 1
Data n
Command 4
Command1: sets display mode
Command2: sets data
Command3: sets address
Data 1 to n: transfers display data(22 bytes max.)
Command4: controls display
Updating specific address
STB
CLK
DIN
Command 1
Command 2
Data
Command
Data
Command1: set data
Command2: sets address
Data: display data
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Semiconductors SC16312
PACKAGE OUTLINE
QFP-44-10x10-0.8
UNIT:mm
13.6+-0.4
2.7
10.0+-0.2
44
12
11
1.0
10.0+-0.2
23
22
13.6+-0.4
1.8+-0.2
33
34
1
0.8+-0.2
0.35+-0.10
0.8
0.15+-0.05
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