SONY CXA1726AM

CXA1726AM/AS
Multiplier IC for Displays
Description
The CXA1726AM/AS is a multiplier IC which is
used for dynamic convergence, dynamic focus and
others in CRT display monitors and projectors. It is
used in conjunction with an IC (CXA1470AM/AS)
which generates waveforms for deflection
compensation.
Features
Analog multiplier
• Maximum input voltage
• Maximum output voltage
• Frequency response
• 4 inputs, 1 output
• 2 inputs, 1 output
Operational amplifier
• Maximum output voltage
• Frequency response
Analog switch
• Maximum output voltage
• Frequency response
4ch
±1.3V
±2.7V (RL = 3.9kΩ)
1.0MHz (–3dB)
2ch
2ch
2ch
±3.65V (RL = 1kΩ)
1MHz (–3dB)
1ch
Absolute Maximum Ratings
• Supply voltage
Applications
• CRT display monitors
• Projectors
Structure
Bipolar silicon monolithic IC
Operating Condition
Supply voltage
VCC
7
VEE
–7
Topr
–20 to +75
Tstg
–65 to +150
PD (CXA1726AM) 625
(CXA1726AS) 1350
• Operating temperature
• Storage temperature
• Allowable power dissipation
30 pin SDIP (Plastic)
30 pin SOP (Plastic)
VCC
VEE
5 ± 0.25
–5 ± 0.25
V
V
V
V
°C
°C
mW
mW
16 VEE
IN7Yb
mul.
mul.
L
H
mul.
GND 15
IN4Y 14
IN4X 13
OUT4 12
IN2Y 7
L
H
IN2X 6
4
OUT1a
OUT1b 5
3
IN1
L
H
2
SW1
VCC 1
17
20 IN7Xa
OUT3 11
18 IN7Ya
21 OUT7
IN3+ 10
mul.
L
H
22 OUT6
IN3– 9
19 IN7Xb
23 IN6+
OUT2 8
24 IN6–
25 OUT5
26 IN5Yb
27 IN5Ya
L
H
28 IN5Xb
IN5Xa
29
L
H
30 SW2
Block Diagram and Pin Configuration (Top View)
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94607B7X
CXA1726AM/AS
Pin Description
Pin No.
1
Symbol
VCC
Pin voltage
Description
Equivalent circuit
Positive supply voltage pin.
5V
50µA
500
2
2
2.3V
SW1
Control pin of switch unit.
The signal input from IN1 is
selected for "a" side or "b" side
by the SW1 applied voltage.
When SW1 is 2V or less, low
turns to "a" side; it is 2.6V or
more, high turns to "b" side.
50µA
500
3
3
IN1
Input pin of switch unit.
0V
100µA
4
5
Output pins of switch unit.
The pin which is not selected is
GND.
OUT1 a
OUT1 b
4
2mA
5
500
6
13
IN2 X
IN4 X
0V
0V
6
Multiplier IN X input pins.
13
100µA
–2–
100µA
CXA1726AM/AS
Pin No.
Symbol
Pin voltage
100µA
100µA
7
14
IN2 Y
IN4 Y
Description
Equivalent circuit
0V
0V
Multiplier IN Y input pins.
500
7
14
8
12
21
25
OUT2
OUT4
OUT7
OUT5
0V
0V
0V
0V
56k
8
Multiplier output pins.
12
50µA
21
25
9
24
10
23
IN3–
IN6–
IN3+
IN6+
1k
9
10
24
23
Operational amplifier input pins.
50µA
100µA
11
22
OUT3
OUT6
Operational amplifier output pins.
11
22
15
GND
16
VEE
GND
0V
Negative supply voltage pin.
–5V
–3–
CXA1726AM/AS
Pin No.
18
20
27
29
Symbol
Pin voltage
IN7 Ya
IN7 Xa
IN5 Ya
IN5 Xa
50µA
500
0V
17
19
26
28
Description
Equivalent circuit
IN7 Yb
IN7 Xb
IN5 Yb
IN5 Xb
Input pins of multiplier with
switch.
17 18
19 20
26 27
28 29
50µA
500
30
50µA
30
Switch pin to select "a" side or
"b" side of multiplier with switch.
SW2
"a" side ≤ 2.0V
"b" side ≥ 2.6V
50µA
50µA
Electrical Characteristics
Multiplier
No.
Item
Symbol
Conditions
1
Output offset voltage
VO
X = Y = 0V
2
Scale factor
SF
X = Y = 1V → V1
X = –Y = 1V → V2
(| V1 | + | V2 |)/2 = SF
3
Frequency response
GT
X = 1V, Y = SG1
4
Input dynamic range
VIN
5
Output dynamic range VOUT
6
Input bias current
IIB
X = Y = 1V
Measurement
point
Min.
Typ.
Max.
Unit
OUT
–110
16
110
mV
0.95
1
1.05
—
–3
–0.5
1
dB
±2.3
V
±2.7
V
3
µA
200
ns
X, Y
–3
Y, OUT
50
X = 1V, Y = SG2
7
Delay time
Output
DT
t
Input
100%
50%
0%
Measure "t".
–4–
125
CXA1726AM/AS
Operational Amplifier
Item
No.
Symbol
Conditions
Measurement
point
Min.
Typ.
Max.
Unit
IN
–1
0.35
1
µA
OUT
50
80
8
Input bias current
IIB
9
Voltage gain
AV
10
Output dynamic range VOUT
11
Frequency response
GT
Inversed input pin = SG1
Non-inversed input pin = GND
–3
12
Input offset voltage
VI
IN = 0V
IN = 0V
dB
±3.65
V
–0.15
1.4
dB
–6
–2
+6
mV
Measurement
point
Min.
Typ.
Max.
Unit
OUT
–3
–0.15
1
dB
2.5
Switch
No.
Item
13
Frequency response
14
Switch threshold high VSH
SW
15
Switch threshold low
VSL
SW
2.0
V
16
Output dynamic range
VOUT
OUT
±3.1
V
17
Input bias current
IIB
IN = 0V
IN
–1
–0.4
1
µA
18
Output offset voltage
VO
IN = 0V
OUT
–15
–3
15
mV
IN, OUT
50
113
200
ns
Measurement
point
Min.
Typ.
Max.
Unit
Symbol
GT
Conditions
IN = SG1
V
X = 1V, Y = SG2
19
Delay time
Output
DT
50%
t
Input
100%
0%
Measure "t".
No.
Item
20
Current consumption 1
ICC
A1
21
26
33
mA
21
Current consumption 2
IEE
A16
–33
–26
–21
mA
Symbol
Conditions
–5–
SG2
SG2
–6–
1V
1V
3.9k
3.9k
S14B
1V
3.9k
1k
5p
S9
3.9k
S7B
1V
SG1
10k
10µ 10k
S7C
1V S14C
SG1
1V
5V
A1
10k
S14A
S13
S7A
S6
S3
S2
GND
IN4Y
IN4X
OUT4
OUT3
IN3+
IN3–
OUT2
IN2Y
IN2X
OUT1b
OUT1a
IN1
SW1
VCC
Electrical Characteristics Measurement Circuit
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
H
H
L
L
mul.
mul.
mul.
mul.
H
L
H
L
H
L
H
L
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
VEE
IN7Yb
IN7Ya
IN7Xb
IN7Xa
OUT7
OUT6
IN6+
IN6–
OUT5
IN5Yb
IN5Ya
IN5Xb
IN5Xa
SW2
10k
A1G
S17A
S18A
S19
S20
S26A
S27A
S28
S29
S30
5V
S17B
S18B
1V
1V
S17C
S18C
1V
1V
1V
1V
1V
1V
SG1
S26C 1V
S27C
10k 10µ
1V
3.9k
1k
5p
S24
3.9k
S26B
S27B
1V
1V
10k
SG2
SG2
SG2
SG2
CXA1726AM/AS
CXA1726AM/AS
Application Circuit
V.SIN 2
C2
0.001µ
C1
22µ
R3
3.3k
R1
22k
C3
22µ
R2
10k
V1
5V
4
GND GND
1
2
3
VCC
5
SW1
OUT3
6
7
IN1
OUT4
8
OUT1a
IN4 X
9
OUT1b
IN4 Y
GND
10
IN2 X
GND
11
IN2 Y
12
OUT2
13
IN3–
14
GND GND
IN3+
15
GND
R4
5.6k
C4
22µ
VEE
IN7 Yb
IN7 Ya
IN7 Xb
IN7 Xa
OUT7
OUT6
IN6+
IN6–
OUT5
IN5 Yb
IN5 Ya
IN5 Xb
IN5 Xa
SW2
A1726AM/AS
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
R5
10k
V2
5V
GND
C5
5p
R7
5.6k
GND
GND
R6
5.6k
GND
R9
33k
R8
5.6k
GND
VSAW–
VSAW+
5
GND GND
4
3
GND GND
1
2
VCC
VPARA+
6
HDIN
VPARA–
GND
7
HSQ
VSIN
8
V3
5V
HDIN
VSQ
9
VDIN
10
VAGC
11
VGEN
12
V4
GND
13
VDIN
VGND
0.1µ
14
C7
47µ
C6
0.047µ
VCLP
HCLP
HPARA–
HPARA+
HSAW–
HSAW+
HAGC
HGND
HDLY
HBIAS
VREF
VBIAS
IREF
VEE
A1470AM/AS
15
16
17
18
19
20
21
22
23
24
25
26
27
28
R18
51k
GND
C8
1µ
C9
0.047µ
GND
GND
C10
1µ
GND
R11
2.2k
R13
8.2k
V4
5V
R12
1.5k
GND
GND
C11
0.1µ
GND
GND GND
R14
1k
GND
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
–7–
C12
47µ
CXA1726AM/AS
Input Signals
GND
SG1
5Vp-p
f = 1MHz
3Vp-p
SG2
GND
f = 200kHz
Description of Operation
• Multiplier
The input X and Y signals of the multiplier are multiplied and output to the OUT pins.
• Operational amplifier
This inputs the signals which have been output from the multiplier.
∗ Care is required with ringing in the operational amplifier. Placing a 5p capacitor in parallel with the feedback
resistor is recommended as a preventive measure.
• Switch
The signal input from IN1 is selected for "a" side or "b" side by the SW1 applied voltage.
When SW1 is 2V or less, low turns to "a" side; it is 2.6V or more, high turns to "b" side.
The unselected output pin is connected to GND.
∗ For the multipliers with a switch, "a" side or "b" side is selected under the same conditions.
–8–
CXA1726AM/AS
Multiplier frequency response
[dB]
0
Input X = DC 1V
Y = 5Vp-p Sine wave
–4
X
Y
–8
mul.
OUT
–12
–14
10k
100k
1M
10M
[Hz]
Operational amplifier frequency response
[dB]
Input 5Vp-p Sine wave
0
10k
–4
10k
IN
–8
–12
10k
100k
1M
10M
[Hz]
Multiplier gain characteristics
2
Input X = 1V
Y = –2 to +2V
OUT
[V]
1
–2
–1
0
1
2
–1
–2
Y [V]
–9–
OUT
CXA1726AM/AS
Package Outline
Unit: mm
CXA1726AM
30PIN SOP(PLASTIC)
+ 0.4
2.3 – 0.15
+ 0.4
18.8 – 0.1
0.1
30
+ 0.2
0.1 – 0.05
(9.3)
A
0.5 ± 0.2
10.3 ± 0.4
+ 0.3
7.6 – 0.1
16
15
1
0.45 ± 0.1
+ 0.1
0.2 – 0.05
1.27
0.2
M
0° to 10°
DETAIL A
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
SOP-30P-L03
LEAD TREATMENT
SOLDER PLATING
EIAJ CODE
SOP030-P-0375
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.7g
JEDEC CODE
CXA1726AS
+ 0.1
05
0.25 – 0.
30PIN SDIP (PLASTIC)
+ 0.4
26.9 – 0.1
30
+ 0.3
8.5 – 0.1
10.16
16
0° to 15°
15
1
+ 0.4
3.7 – 0.1
0.5 MIN
1.778
0.5 ± 0.1
3.0 MIN
Two kinds of package surface:
1.All mat surface type.
2.All mirror surface type.
0.9 ± 0.15
PACKAGE STRUCTURE
MOLDING COMPOUND
EPOXY RESIN
SONY CODE
SDIP-30P-01
LEAD TREATMENT
SOLDER/PALLADIUM
PLATING
EIAJ CODE
SDIP030-P-0400
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
1.8g
JEDEC CODE
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
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