SONY CXB1454R

CXB1454R
VGA/SVGA/XGA 24bit Receiver
Description
CXB1454R is the 1 chip deserializer for VGA/SVGA/
XGA 24bit color digital RGB, and meet to the Gigabit
Video Interface specification.
64 pin LQFP (Plastic)
Absolute Maximum Ratings
• Supply voltage
Vcc
• Storage temperature Tstg
• Allowable power dissipation
PD
4.0
–65 to +150
1710
V
°C
REXT
PANEL0
PANEL1
LOS
TESTDT
TESTSB
SDATAP
REFRQP
V
°C
mW
Recommended Operating Condition
• Supply voltage
Vcc
3.3 ± 0.16
• Operating temperature Topr
0 to +60
SDATAN
REFRQN
VccA
VEES
VEEA
LPFA
Block Digagram & Pin out
LPFB
Structure
Bipolar silicon monolithic IC
TESTEXN
Features
• 1 chip receiver for serial transmission of 24-bit color
VGA/SVGA/XGA picture
• On chip cable equalizer circuit to compensate the
cable loss
• On chip PLL circuit for data and clock recovery
• On chip panel mode automatically selectable circuit
• TTL compatible I/O
• Support 1 pixel/shiftclock mode with 1 chip and 2
pixel/shiftclock mode with 2 chips
• +3.3V single power supply
• Low power consumption
• 64pin plastic LQFP package with body size 14mm ×
14mm
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
32 CLKPOL
CNTL 49
31 R0
DE 50
SFTCLK 51
VEET 52
30 R1
Cable
EQ
CDR
PLL
29 VEET
VccT 53
28 VccT
VEEG 54
27 VEEG
VccG 55
26 VccG
Serial
to
Parallel
Converter
HSYNC 56
VSYNC 57
B7 58
25 R2
24 R3
23 R4
B6 59
22 R5
VEEG 60
21 VEEG
20 VCCG
VccG 61
B5 62
19
Decoder
R6
18 R7
B4 63
17
VEET
VccT
G0
G1
G2
G3
9 10 11 12 13 14 15 16
G4
8
G5
7
VEET
6
VccT
B1
5
G6
4
B0
3
G7
2
B2
VEET
1
B3
VccT 64
Fig. 1. Block Diagram & Pin out
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E98X24B03
CXB1454R
Pin List
Tab. 1. Power/Ground
Pin Number
Pin Name
Descriptions
VCCT
8, 16, 28, 53, 64
TTL power surpply, should be connected to 3.3V ± 5%
VEET
1, 9, 17, 29, 52
TTL ground, connected to 0V
VCCG
20, 26, 55, 61
Logical core power surpply, connected to 3.3V ± 5%
VEEG
21, 27, 54, 60
Logical core ground, connected to 0V
VCCA
44
Analog power surpply, connected to 3.3V ± 5%
VEEA
45
Analog ground, connected to 0V
VEES
46
Analog substrate, connected to 0V
–2–
CXB1454R
Tab. 2. Digital Signals
Pin Name
SFTCLK
Pin Number
51
Type
TTL out
Descriptions
Shift clock, for the data
fetch at falling or rising
edge
RED (7 to 0) 18, 19, 22, 23,
24, 25, 30, 31,
GRN (7 to 0) 6, 7, 10, 11,
TTL out
12, 13, 14, 15,
BLU (7 to 0) 58, 59, 62, 63,
2, 3, 4, 5
Pixel data
HSYNC
56
TTL out
Hsync data
VSYNC
57
TTL out
Vsync data
CNTL
49
TTL out
Control data
DE
50
TTL out
Display enable data
LOS
36
TTL out
Los of signal
TTL in
Panel mode select switch
TTL in
Trigger edge select switch
TTL in
Reserved for TEST under
fabrication
PANEL (1, 0) 35, 34
CLKPOL
32
TESTEXN
TESTDT
TESTSB
43,
37,
38
Equivalent circuit
VCCT
TTL-OUT
VEET
6k
6k
TTL-IN
300
VEET
VCCG
SDATAP/N
40, 41
Rx
Serial input
SDATAP/N
REFRQP/N
REFRQP/N
39, 42
VCCG
VCCT
Rx
Refclk request
VEEG
–3–
VEEG
CXB1454R
Tab. 3. Special
Pin Name
Pin Number
Descriptions
Equivalent circuit
VCCG
REXT
33
External Resister
REXT
VEEG
VCCA
LPFA
LPFB
LPFA/B
47, 48
External loop filter
VEEA
–4–
CXB1454R
Electrical characteristics
Tab. 4. Absolute Maximum Rating
Description
Symbol
Min.
Typ.
Max.
Unit
Power supply voltage
VCC
–0.3
4
V
TTL DC input voltage
VI_T
–0.5
5.5
V
TTL output current (High)
IOH_T
–20
0
TTL output current (Low)
IOL_T
0
20
mA
'
mA
Serial input pin voltage
Vsdin
–0.5
VCC + 0.5
V
REFRQ output pin voltage
VRQout
0.5
VCC + 0.5
V
Storage temperature
Tstg
–65
150
°C
Comments
Tab. 5. Recommended Operating Conditions
Description
Symbol
Min.
Typ.
Max.
Unit
3.3
3.465
V
60
°C
Power supply voltage (Include VCCT5)
VCC
3.135
Operating temperature
Topr
0
Comments
Tab. 6. DC Characteristics (Under the recommended conditons. See Tab. 5)
Description
Symbol
Min.
Typ.
Max.
Unit
Conditions
Input HIGH voltage (TTL)
VIH_T
2
5.5
V
Input LOW voltage (TTL)
VIL_T
0
0.8
V
Input HIGH current (TTL)
IIH_T
20
µA
VIN = VCC
Input LOW current (TTL)
IIL_T
–400
µA
VIN = 0
Output HIGH voltage (TTL)
VOH_T
2.25
V
IOH = –0.2mA
Output LOW voltage (TTL)
VOL_T
0.5
V
IOL = 4mA
Output HIGH current (REFRQ)
IOH_RQ
–0.1
+0.1
mA
Output LOW current (REFRQ)
IOL_RQ
7.8
11
mA
Input dynamic range (SDATA)
VIM_SD
VCC – 0.4
VCC + 0.2
V
Common mode voltage
Input dynamic range (SDATA)
VID_SD
–0.5
+0.5
V
Differential voltage
440
mA
65MHz,
All low pattern,
Outputs open
mA
65MHz,
Worst case pattern
See Fig. 8
Outputs open
0
325
Supply current
ICC
350
–5–
465
See Fig. 3, 4
REXT = 1.3kΩ
CXB1454R
50Ω
VCCA/G/T
CXB1454R
37 TESTDT
REFRQP 39
VCC
A
A
150Ω
38 TESTSB
43 TESTEXN
50Ω
REFRQN 42
150Ω
VEEA/G/T
Fig. 2. IOH_RQ and IOL_RQ DC measurement
TESTDT
TESTSB
TESTEXN
Fig. 3. IOH_RQ and IOL_RQ DC measurement setting
Electrical characteristics
Tab. 7. AC Characteristics (Under the recommended conditons. See Tab. 5)
Description
Symbol
Minimum SFTCLK frequency
Maximum SFTCLK frequency
Fsftclk
SFTCLK duty factor
Dsftclk
Pixel/Sync/Cntl/DE setup to
SFTCLK
Tsetup
Min.
Typ.
Max.
Unit
25.0
MHz
MHz
60
%
Vth = 1.4V, CL = 10pF
16
10
5
ns
ns
ns
Vth = 1.4V, CL = 10pF
25MHz
40MHz
65MHz
17
11
6
ns
ns
ns
Vth = 1.4V, CL = 10pF
25MHz
40MHz
65MHz
65.0
40
Conditions
Pixel/Sync/Cntl/DE hold to
SFTCLK
Thold
SFTCLK rise time
Torc
3
ns
0.8 to 2.0V, CL = 10pF
SFTCLK fall time
Tofc
2.5
ns
2.0 to 0.8V, CL = 10pF
Pixel/Sync/Cntl/DE rise time
Tofd
4.5
ns
0.8 to 2.0V, CL = 10pF
Pixel/Sync/Cntl/DE fall time
Tord
2
ns
2.0 to 0.8V, CL = 10pF
CLOCK mode assert time
TAclk
0.9
µs
CLOCK mode deassert time
TDclk
50
µs
LOS signal assert time
TAlos
0.5
µs
LOS signal deassert time
TDlos
0.1
µs
–6–
CXB1454R
VCCA/G/T
TTLout
Cprobe
CXB1454R
VCC
CL'
oscilloscope
VEEA/G/T
CL' + Cprobe = 10pF
Fig. 4. Pixel/Sync/Cntl/DE waveform measurement
Timing Chart
1/Fsftclk
2.0V
Vth
SFTCLK
0.8V
Torc
Tofc
Dsftclk/Fsftclk
Setup/hold time is refered from
rising edge in CLKPOL = GND
falling edge in CLKPOL = Vcc or OPEN
Tsetup
Thold
Tord
REDxx
GRNxx
BLUxx
H/Vsync
CNTL
DE
2.0V
0.8V
Tofd
Fig. 5. TTL output timing
Pixel
Sync/Cntl/DE
error
Indeterminate
SftClk
TAclk
REFRQP
REFRQN
Indeterminate
TDclk
SDATAP
SDATAN
Fig. 6. Refclk request timing
–7–
CXB1454R
SDATAP
SDATAN
NRZ data
TDlos
TAlos
LOS
Fig. 7. Idle mode timing
T
T
SFTCLK
f
RGB
<7, 5, 3, 1>
f/2
RGB
<6, 4, 2, 0>
f/2
Fig. 8. Worst case test pattern
–8–
CXB1454R
CLKPOL Pin Control
The CLKPOL pin is used to select the SFTCLK trigger edge. (See Table 8.)
The CLKPOL pin is open High TTL input.
Table 8. SFTCLK Polarity
CLKPOL
Receiver operation trigger
L
Rising edge
H
Falling edge
PANEL1 and 0 Pin Control
The PANEL1 and 0 pins are used to select the panel mode. (See Table 9.)
For the normal use, the all frequencies of SFTCLK (25MHz to 65MHz) can be covered by fixing both PANEL1
and 0 to High.
The PANEL1 and 0 pins are open High TTL inputs.
Table 9. Panel Mode
PANEL1
PANEL0
L
L
L
Supporting panel size
Shift clock
Serial rate
VGA (640 × 480)
25MHz
750Mbps
H
SVGA (800 × 600)
40MHz
1200Mbps
H
L
XGA (1024 × 768)
65MHz
1950Mbps
H
H
VGA to XGA
25MHz to 65MHz
750Mbps to 1950Mbps
Test Pin Control
The TESTEXN, TESTDT and TESTSB pins are for test only. Select normal mode. (See Table 10.)
The TESTEXN, TESTDT and TESTSB pins are open High, TTL inputs.
Table 10. Test Mode
TESTEXN
TESTDT
TESTSB
Operation mode
L
X
X
Test mode
H
H
H
Normal mode
LOS Pin Output
The LOS pin shows the absence of proper level of SDATA signal. The LOS pin is High when the connector is
disconnected or the transmitter is idle.
The LOS pin is TTL output.
–9–
CXB1454R
Applications
CXB1454R GVIF receiver is applied to the digital RGB signal transmission for
P/C with LCD monitor
Video on demand system
Monitoring system
Graphical controller
Projector
Digital TV monitor
Car navigation system
with GVIF transmitter, CXB1455R.
CXB1455R GVIF Transmitter
BLU (7 to 0)
SYNC/CNTL/DE
8
8
Parallel
to
Serial
Converter
Cable
Driver
4
PLL
SHIFTCLOCK
STP or Twin axial
8
Serial
to
Parallel
Converter
Cable
Equalizer
Decoder
GRN (7 to 0)
8
Encoder
RED (7 to 0)
8
8
4
PLL
CXB1454R GVIF Receiver
Fig. 9. Block Diagram of GVIF transceiver chip set
– 10 –
RED (7 to 0)
GRN (7 to 0)
BLU (7 to 0)
SYNC/CNTL/DE
SHIFTCLOCK
CXB1454R
Application Cicuit
VCC
Differential cable
0.1 to 0.4n
(3)
(1) CHIP RESISTOR (1%)
(2) CHIP CAPACITOR
(3) FORMED BY THE PRINTED CIRCUIT PATTERN
(L = 0.5 to 1.0mm / W = 0.5 to 1.0mm)
Connector
E
0.1 to 0.4n (3)
0.1 to 0.4n (3)
100 (1)
33µ
16V
150
(1)
470 (1)
150
(1)
0.1µ
470 (1)
(2)
1.3k
(1)
47p 47p
(2) (2)
330
100p (2)
Vcc
330
R0 31
51 SFTCLK
R1 30
E
VEET 29
53 VccT
VccT 28
54 VEEG
VEEG 27
55 VccG
VccG 26
56 HSYNC
R2 25
57 VSYNC
R3 24
58 B7
R4 23
59 B6
0.1µ
(2)
E
E
R5 22
60 VEEG
VEEG 21
61 VccG
VCCG 20
E
0.1µ
(2)
R6 19
62 B5
R7 18
63 B4
VEET 17
VccT
VEET
7
8
9 10 11 12 13 14 15 16
G0
G6
6
VccT
G7
5
G1
B0
4
G2
B1
3
G3
B2
2
G4
B3
1
G5
VEET
64 VccT
Vcc
0.1µ
(2)
Vcc
52 VEET
Vcc
H: FALLING EDGE TRIGGER
L: RISING EDGE TRIGGER
CLKPOL 32
50 DE
0.1µ
(2)
SW1
330
REXT
PANEL0
LOS
PANEL1
TESTDT
TESTSB
REFRQP
SDATAP
SDATAN
REFRQN
VccA
49 CNTL
TESTEXN
VEES
VEEA
LPFA
LPFB
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
0.1µ (2)
0.1µ (2)
Vcc
Vcc
DE
VSYNC
HSYNC
CNTL
SFTCLK
0.1µ (2)
7
MSB
6
5
4
3
2
BLUE DATA
1
0
LSB
7
MSB
6
5
4
3
2
1
0
LSB
GREEN DATA
7 6
MSB
5
4
3
2
1
0
LSB
RED DATA
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
Fig. 10. Recommended application circuit
– 11 –
CXB1454R
Recommended Printed Circuit Board Structure
AAAAAAAA
AAAAAAAA
AAAAAAAA
AAAAAAAA
L1:
I1:
L2:
I2:
L3:
I3:
L4:
Cu plate (18µm) + solder coat
Fiber-glass epoxy core (0.3mm)
Cu plate (36µm)
Fiber-glass epoxy core (0.8mm)
Cu plate (36µm)
Fiber-glass epoxy core (0.3mm)
Cu plate (18µm) + solder coat
Fig. 11. Recommended Printed Circuit Board Structure
Recommended Printed Circuit Board Pattern
POWER and special signal routing example
0.5mm
G Through hole to the GND plane (L2)
Through hole to the VCCE/VCCG plane (L3)
E
AA
Through hole to the VCCT plane (L3)
T
A
FET
Chip resistor
AA AA
AA AA
L2 doesn't have plane
in this area
AA
AA
G
6mm
PANEL0
REXT
PANEL1
LOS
TESTSB
TESTDT
REFRQP
SDATAN
SDATAP
REFRQN
TESTEXN
VccA
VEEA
LPFA
33
VEES
48
LPFB
49
Chip capacitor
G
DE
R0
SFTCLK
R1
VEET
VEET
VccT
VccT
VEEG
VccG
G
G
E
E
VccG
HSYNC
R2
VSYNC
R3
B7
R4
R5
VEEG
VccG
E
64
T
T
T
T
T
T
T
T
VEEG
G
VccG
B5
R6
B4
R7
E
17
VEET
VccT
G0
G1
G2
G3
G4
G5
VEET
VccT
G6
G7
B0
B1
B2
B3
VEET
VccT
T
G
VEEG
B6
G
T
1
G
G
16
T
G
32
CLKPOL
CNTL
Fig. 12. Recommended Printed Circuit Board Pattern
– 12 –
CXB1454R
Micro Strip Line
For maximum performance, the impedance between the pins SDDATAP/N of the LSI and the footprint of the
connector should be 50Ω using a micro strip line. 50Ω impedance can be reached when using 0.5mm width
pattern lines on L1 using this circuit board structure. The length of the lines should be identical and throughhole should not be used. L2 is recommended as the large ground plane.
Terminators
Terminators (100Ω resistor) should be located as close to the LSI as possible.
Filter Devices and Reference Registors
Capacitors and resistors which are connected to LPFA/B and REXT are filters and reference resistors. The
region of Layer 2 (L2) is under the device and conductive patterns. The ground plane should be taken off in
order to reduce parasitic capacitors.
Bypass Capacitors
Bypass capacitors (0.1µF SMD type) should be located as close to the pins as possible. Refer to the
recommendation.
– 13 –
CXB1454R
Recommendation for Cable and Connector Characteristics
The GVIF system uses terminators at both ends (transmitter and receiver), a cable equalizer and a small
amplitude differential signal. In order to solve the problems of high speed data transmission such as signal
reflection, reduce the signal level and EMI. In order to achieve the best solution, note the following:
Tx
termination
50Ω
Rx
termination
100Ω
Tx
LSI
Rx
LSI
Microstrip
line
(50Ω)
Foot
print
Connector
Cable
(diff. 100Ω)
Connector
Foot
print
Microstrip
line
(50Ω)
It is important to note the following issues for a good data transmission system:
• Good impedance matching
Differential impedance should be fit to the recommended template on the next page.
• Cable loss should be small and the loss curve should be smooth.
Maximum loss should be less than 15dB at 1GHz for the CXB1454R which has a built-in cable equalizer.
See the next page.
• Skew of POS/NEG (differential signal) should be small
Less than 12% of 1-bit time or 160ps@VGA, 100ps@SVGA, 60ps@XGA.
• Good EMI performance cable and connectors.
In order to satisfy these issues, the recommendations are as follows:
• Use the differential cable which provides good controlled impedance, low loss and good skew matching.
A shielded twisted pair (STP) cable is recommended.
• Use a low reflectance connector.
• To minimize interference from other signals, high speed signal lengths should be identical.
• Use double shielded cable.
– 14 –
CXB1454R
Recommended Transmission Path : Differential impedance template
Zo
(Ω)
150
110
106
94
90
75
< 500ps
Microstrip
line
Foot
print
< 500ps
Connector
Connector
Foot
print
Microstrip
line
Recommended Transmission Path : Attennation Characteristics
Loss
< 15dB
2dB
Measured curve
Fitting curve
Frequency
1GHz
– 15 –
CXB1454R
TTL output waveform with CL = 10pF
SFTCLK
65MHz
TTL output
B0
T 65Mb/s
TTL output
1.00V/div
∗ ATTEN 40dB
1.00V/div
5ns/div
SFTCLK Power spectrum
RL 119.2dBµV
10dB/
D
R
C
CENTER 65.000MHz
RBW 100kHz ∗ VBW 100kHz
SPAN 9.900MHz
∗ SWP 50.0ms
– 16 –
CXB1454R
Package Outline
Unit: mm
64PIN LQFP (PLASTIC)
16.0 ± 0.2
∗
1.7MAX
14.0 ± 0.1
0.1
33
48
32
(15.0)
49
B
A
17
64
16
+ 0.08
0.37 – 0.07
(0.5)
1
0.8
0.13 M
0.25
0.6 ± 0.2
0° to 10°
(0.5)
(0.35)
DETAIL A
(0.125)
+ 0.08
0.37 – 0.07
0.145 ± 0.04
0.1 ± 0.1
DETAIL B
NOTE: Dimension “∗” does not include mold protrusion.
PACKAGE STRUCTURE
PACKAGE MATERIAL
EPOXY RESIN
SONY CODE
LQFP-64P-L02
LEAD TREATMENT
PALLADIUM PLATING
EIAJ CODE
LQFP064-P-1414
LEAD MATERIAL
COPPER ALLOY
PACKAGE MASS
0.7g
JEDEC CODE
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).
– 17 –
Sony Corporation