CXG1012N High-Frequency SPDT Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1012N is an antenna switch MMIC. This IC is designed using the Sony’s GaAs J-FET process and operates at a single positive power supply. Features • Single positive power supply operation • Insertion loss 0.5 dB (Typ.) at 2.0 GHz • Medium power switching P1dB (Typ.) 29 dBm at 2.0 GHz VCTL (H)=3.0V 33 dBm at 2.0 GHZ VCTL (H)=4.0 V Application Antenna switch for digital cordless telephones Structure GaAs J-FET MMIC SSOP-8P-L01 (Plastic) Absolute Maximum Ratings (Ta=25 ˚C) • Control voltage Vctl 6 • Operating temperature Topr –35 to +85 • Storage temperature Tstg –65 to +150 Operating Condition Control voltage 0/3 V ˚C ˚C V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. —1— E95444A57-TE CXG1012N Electrical Characteristics VCTL (L) =0V, VCTL (H) =3V, Pin=21.5dBm Item Insertion loss Isolation Insertion loss Isolation Input VSWR Output VSWR Switching time Control pin current Symbol IL1 ISO1 IL2 ISO2 VSWRIN VSWROUT TSW ICTL (Ta=25 ˚C) Condition f=1.0 GHz Min. Typ. 0.3 35 0.5 23 1.3 1.3 100 70 30 f=2.0 GHz 20 Max. 0.6 Unit dB dB dB dB 0.8 1.5 1.5 ns µA 150 VCTL (L) =0V, f =2.0GHz (Ta=25 ˚C) 1 dB gain compression P1dB (3) point output 1 dB gain compression P1dB (4) point output VCTL (H) =3 V 26 29 dBm VCTL (H) =4 V 30 33 dBm Block Diagram Package outline/Pin Configuration 1 Port3 Port1 Port2 8 CTLB Port3 Port1 GND GND GND CTLA Port2 8-pin SSOP (plastic) VCTLA VCTLB High Low Low High Port1-Port2 ON Port1-Port3 OFF Port1-Port2 OFF Port1-Port3 ON —2— CXG1012N AAAAAAAAAA AAAAAAAAAA AAAAAAAAAA AAAAAAAAAA AAAAAAAAAA AAAAAAAAAA Recommended Circuit CTLB 1 100pF Port1 2 100pF Port3 8 100pF 7 CXG1012N CTLA 100pF 3 6 4 5 Port2 100pF Example of Representative Characteristics (Ta=25 ˚C) AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA AAAAAAAAAAA Insertion loss, isolation vs. Input power 0 0 VCTL (H) =5V VCTL (H) =4V Insertion loss –2 –6 –20 VCTL (H) =3 VCTL (H) =4V VCTL (H) =5V Isolation –30 20 24 28 32 36 40 Input power (dBm) Insertion loss, isolation vs. Frequency 0 0 –1 –10 –2 –20 –3 –30 Isolation –40 –4 –5 –50 0 1 2 Frequency (GHz) —3— 3 Isolation (dB) Insertion loss Isolation (dB) –10 Insertion loss (dB) Insertion loss (dB) VCTL (H) =3V –4 CXG1012N Package Outline Unit: mm 8PIN SSOP (PLASTIC) + 0.2 1.25 – 0.1 ∗3.0 ± 0.1 0.1 8 5 6.4 ± 0.2 ∗4.4 ± 0.1 A 4 1 0.65 + 0.08 0.24 – 0.07 0.25 0.13 M (0.5) 0° to 10° (0.15) + 0.025 0.17 – 0.015 + 0.08 0.24 – 0.07 (0.22) 0.6 ± 0.15 0.1 ± 0.05 B DETAIL A DETAIL B NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SSOP-8P-L01 LEAD TREATMENT SOLDER / PALLADIUM PLATING EIAJ CODE SSOP008-P-0044 LEAD MATERIAL COPPER ALLOY PACKAGE WEIGHT 0.04g JEDEC CODE —4—