TELCOM TC70EPA

1
TC70/71
MICROMASTER™ – SYSTEM SUPERVISOR WITH POWER SUPPLY
MONITOR, WATCHDOG AND BATTERY BACKUP
2
FEATURES
GENERAL DESCRIPTION
■
The TC70/71 is a fully-integrated power supply monitor,
watchdog and battery backup circuit in a space-saving
8-pin package.
When power is initially applied, the TC70/71 holds the
processor in its reset state for a minimum of 500msec after
VCC is in tolerance to ensure stable system start-up. After
start-up, processor sanity is monitored by the on-board
watchdog circuit. The processor must provide periodic highto-low level transitions to the TC70/71 to verify proper
execution. Should the processor fail to supply this signal
within the specified timeout period, an out-of-control processor is indicated and the TC70/71 issues a momentary
processor reset as a result. The TC70 also features a
watchdog disable pin to facilitate system test and debug.
The output of the TC70/71 can be wire-ORed to a pushbutton switch (or electronic signal) to reset the processor.
When connected to a push-button switch, the TC70/71
provides contact debounce.
The integrated battery backup circuit on-board the TC70/
71 converts CMOS RAM into nonvolatile memory by first
write-protecting, then switching the VCC line of the RAM over
to an external battery.
The TC71 incorporates an additional 1.3V threshold
detector for power fail warning, low battery detection or to
monitor power supply voltages other than +5V.
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■
■
■
■
Maximum Functional Integration: Precision Power
Supply Monitor, Watchdog Timer, External RESET
Override, Threshold Detector and Battery Backup
Controller in an 8-Pin Package
Generates Power-on RESET and Guards Against
Unstable Processor Operation Resulting from
Power "Brown-out"
Automatically Halts and Restarts an Out-ofControl Microprocessor
Output Can be Wire-ORed, or Hooked to Manual
RESET Pushbutton Switch
Watchdog Disable Pin for Easier Prototyping
(TC70)
Voltage Monitor for Power Fail or Low Battery
Warning (TC71)
Available in 8-Pin Plastic DIP or 8-Pin SOIC
Packages
Cost Effective
TYPICAL APPLICATIONS
■
■
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■
All Microprocessor-based Systems
Test Equipment
Instrumentation
Set-Top Boxes
3
4
5
FUNCTIONAL BLOCK DIAGRAM
ORDERING INFORMATION
VCC
VCCO
BATTERY
BACK-UP
CONTROL
CEI
(TC70)
CEO
(TC70)
PF
(TC71)
VBATT
VREF1
WDD
(TC70)
WATCHDOG
TIMER
∆V
DETECTOR
Part No.
Package
Temp. Range
TC70COA
TC70CPA
TC70EOA
TC70EPA
TC71COA
TC71CPA
TC71EOA
TC71EPA
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
8-Pin Plastic DIP
8-Pin SOIC
8-Pin Plastic DIP
0°C to +70°C
0°C to +70°C
– 40°C to +85°C
– 40°C to +85°C
0°C to +70°C
0°C to +70°C
– 40°C to +85°C
– 40°C to +85°C
RS
VREF2
GND
VREF3
TDO
(TC71)
VCCO
1
8
VBATT
VCC
2
7
RS
GND
CEI
3
4
TC70
6
5
WDD
CEO
VCCO
1
8
VBATT
VCC
2
7
RS
GND
3
6
PF
5
TDO
TDI
4
TC71
TC70/71
TC70/71-1 11/18/96
TELCOM SEMICONDUCTOR, INC.
7
PIN CONFIGURATIONS (DIP and SOIC)
DELAY
TIMER
TDI
(TC71)
6
5-7
8
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
TC70/71
ABSOLUTE MAXIMUM RATINGS*
Voltage (Any Pin) with Respect to
Ground ................................ GND – 0.3 to VCC + 0.3V
Operating Temperature Range ............... – 40°C to +85°C
Storage Temperature Range ................ – 65°C to +150°C
Lead Temperature (Soldering, 10 sec) ................. +300°C
*This is a stress rating only and functional operation of the device at these
or any other conditions above those indicated in the operational sections of
the specifications is not implied. Exposure to Absolute Maximum Rating
Conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS:
Recommended DC Operations: TA = TMIN to TMAX, unless otherwise specified.
Symbol
Parameter
Test Conditions
Min
Typ
Max
Unit
VCC
VIH
VIH
VIL
Supply Voltage
Input HIGH Level
Input HIGH Level
Input LOW Level
Note 1
CEI, WDD (Note 1)
RS (Note 1)
CEI, WDD, RS (Note 1)
4.5
2.5
2.2
—
5.0
—
—
—
5.5
—
—
0.8
V
V
V
V
Min
Typ
Max
Unit
—
—
5
0.01
6.5
0.20
mA
µA
—
—
—
– 1.0
– 0.1
4
1
1
—
—
7
—
—
0.02
0.02
µA
µA
µA
µA
µA
ELECTRICAL CHARACTERISTICS:
DC: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
ICC1
ICC2
Operating Current
Operating Current in
Battery Backup Mode
Input Leakage
Input Leakage
Input Leakage
Battery Standby Current
Battery Standby Current
Notes 2, 3
VCC = 0; VBATT = 2.8V; (Note 3)
IIH
IIL
IIH
ISTBY
ISTBY
CEI
CEI
RS
5.5V > VCC > VBATT + 0.2V
5.5V > VCC > VBATT + 0.2V
TA = 25°C
ELECTRICAL CHARACTERISTICS:
DC: Power Supply Monitor, EXT. RESET and Watchdog: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
IOL
WDDI
Output Current 0.4V
(RS, TDO, CEO, PF Pins)
Output Current 2.4V
(TDO, CEO, PF Pins)
WDD Input Current
VSTH
VSTL
VCCTRIP
RS Strobe (HIGH) Level
RS Strobe (LOW) Level
VCC Trip Point
IOH
Min
Typ
Max
Unit
VOL = 0.4V
2
5
—
mA
VOH = 2.4V
2
3
—
mA
– 120
—
VDD – 0.5
2.2
4.25
4.20
—
—
—
—
—
—
25
—
VDD – 1.8
4.49
4.49
µA
WDD = GND
WDD = VCC
Figure 3 (Note 1)
Figure 3 (Note 1)
(Note 1) 0°C ≤ TA ≤ 70°C
– 40°C ≤ TA ≤ 85°C
V
V
ELECTRICAL CHARACTERISTICS:
DC: Battery Backup and Threshold Detector: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
VOUT1
VCCO Output Voltage
VOUT2
VOUT in Battery Backup Mode
IOUT = 1mA
VCC – 0.3 VCC – 0.1
IOUT = 50mA
VCC – 0.5 VCC – 0.20
IOUT = 250µA, VCC < VBATT – 0.2, VBATT = 2.8V VBATT – 0.1 VBATT – 0.02
5-8
Min
Typ
Max
Unit
—
—
—
V
V
TELCOM SEMICONDUCTOR, INC.
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
1
TC70/71
ELECTRICAL CHARACTERISTICS: (Cont.)
DC: Battery Backup and Threshold Detector: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
IOUT1
IOUT2
VCCO Output Current
VCCO Output Current in
Battery Backup Mode
Battery Switchover Threshold
(VCC Falling)
Battery Switchover Hysteresis
CEO Output Voltage in
Battery Backup Mode
VSW
VHYST
VOHCEO
VTDI
Threshold Detector Trip Voltage
ITDI
Threshold Detector Input Current
VTDI (HYST)
Threshold Detector Hysteresis
Test Conditions
VCC = 4.5V, VCCO = 3.5V
VCCO = VBATT – 0.3V
VBATT = 2.8V
VCC < VBATT – 0.2, VBATT = 2.8V
IOH = 10µA
TA = 25°C
Min
50
500
Typ
100
—
Max
Unit
—
—
mA
µA
—
VBATT – 0.01
—
V
—
VBATT – 0.2
20
—
—
—
mV
V
1.2
—
1.4
V
–25
—
+25
nA
—
10
—
mV
3
4
ELECTRICAL CHARACTERISTICS:
AC: Power Supply Monitor, EXT. RESET and Watchdog: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise
specified.
Symbol
Parameter
Test Conditions
Min
Typ
tPBH
PB Hold Time
tRST
tST
tTD
tRPD
Reset Active Time
RS STROBE Pulsewidth
Watchdog Timeout Period
VCC Detect to RS LOW
Figure 4 (Note 4)
20
Figure 6
Figure 3
Figure 3
Figure 6
500
500
500
—
2
Max
Unit
—
—
msec
—
—
700
—
900
—
900
100
msec
nsec
msec
nsec
5
ELECTRICAL CHARACTERISTICS:
AC: Battery Backup and Threshold Detector: TA = TMIN to TMAX, VCC = 4.5V to 5.5V, unless otherwise specified.
Symbol
Parameter
Test Conditions
tPD
CE Propagational Delay
Figure 7
Min
Typ
Max
Unit
—
—
50
nsec
Min
Typ
Max
Unit
ELECTRICAL CHARACTERISTICS:
AC: TA = TMIN to TMAX.
Symbol
Parameter
Test Conditions
tF
VCC Fall Time From
4.25V to 3.0V
VCC Rise Time From
3.0V to 4.25V
Figure 5 (Note 1)
10
—
—
µsec
Figure 5 (Note 1)
0
—
—
µsec
tR
NOTES: 1.
2.
3
4.
All voltages referenced to ground.
No output load.
Measured with VCCO and CEO open.
The RS output must be held low for a minimum of 20msec to guarantee a reset.
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7
8
TELCOM SEMICONDUCTOR, INC.
5-9
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
TC70
TC71
PIN DESCRIPTION
Pin No
(TC70)
Pin No
(TC71)
Symbol
1
1
VCCO
2
3
4
2
3
–
VCC
GND
CEI
–
4
TDI
5
–
CEO
–
5
TDO
6
–
WDD
–
6
PF
7
7
RS
8
8
VBATT
Description
VCC Output. The higher of VCC or VBATT is internally switched to this output.
Connect to VCC if VBATT and VCCO are not used.
VCC Input. +5V power supply.
GND Input. Ground.
Chip enable input. Chip enable to static RAM or other device to be battery
backed-up. Connect to ground if VCCO is not used.
Threshold detector input. When the voltage on threshold detector input (TDI) is
less than 1.3V, threshold detector output (TDO) goes low.
Chip enable output. This line goes low only when CEI is low and VCC is above
the RESET threshold.
Threshold detector output. TDO goes low when TDI is less than 1.3V and VCC is
greater than VBATT. (The threshold detector is turned off when VCC is less than
VBATT.
Watchdog disable input. Grounding this line disables the watchdog timer (no
RESET pulses are generated after the watchdog timer times out). This input is
provided to facilitate system debug. This input is internally pulled-up and can be
left open, or tied to VCC for normal watchdog operation.
Power fail output. This line goes low when VCC is below 4.5V nominal. It is used
to write-protect the external device to be battery backed.
RESET/STORE (Bidirectional). An open drain with pull-up (in output mode) that
goes active if:
1. VCC falls below 4.5V nominal
2. If pulled low by an external electronic signal or switch closure
3. If the watchdog is not strobed within the minimum watchdog timeout period
4. During power-up and power down
In the input mode, RS is a negative edge triggered input that resets the
watchdog timer when pulled to ground through a 10kΩ, 5% tolerance resistor.
Backup battery input. Connect to ground if battery backup is not used.
DETAILED DESCRIPTION
Precision Power Supply Monitor
The RS pin is immediately driven low any time VCC is
below 4.5V nominal. The processor is held in its reset state
during power-up and power-down. RS remains low for a
minimum of 500msec after VCC is within tolerance to allow
the power supply and processor to stabilize.
Watchdog Timer
The processor drives the RS pin with an input/output
(I/O) line in series with a voltage divider to VDD. Pulling the
bottom of this divider low results in an internal voltage
change (strobe) sufficient to reset the watchdog timer, but
above the VIL input threshold of the processor RESET input.
The processor must continuously apply strobes in this
manner within a set period to verify proper software execution. A momentary reset (500msec minimum) is generated
if a hardware or software failure keeps RS from being
5-10
strobed within the watchdog timeout period. This action
typically initiates the processor's power-up routine. If the
interruption persists, new reset pulses are generated each
timeout period until RS is strobed. The timeout period is
typically 700msec.
It is often difficult to debug a system while the watchdog
is continuously generating reset pulses. For example, the
watchdog must be disabled when the system is operated
with an in-circuit emulator (ICE). The watchdog disable input
(TC70) is provided for system debugging, (or if the watchdog
timer on-board the processor is to be used). Grounding
WDD disables the watchdog (all other functions remain
intact). For normal watchdog operation, WDD can be tied to
VDD.
The software routine that drives the RS strobe must be
in a section of the program that executes frequently enough
so the time between toggles is less than one watchdog
timeout period. The strobe signal can be derived from
microprocessor address, data and/or control signals. Typical circuit examples are shown in Figure 1.
TELCOM SEMICONDUCTOR, INC.
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
1
TC70
TC71
data corruption during power up and power down. The
battery switchover circuit compares VCC to the VBATT input
and connects VCCO to whichever is higher. Switchover
(VSW) occurs when VCC is 10mV below VBATT as VCC falls,
and when VCC is 10mV more than VBATT as VCC rises. The
battery switchover comparator has 20mV of hysteresis to
prevent switch chattering if VCC falls very slowly.
Resistor Value Selection
The values of R1 and R2 must be chosen to ensure a
valid low strobe level (VSTL) on RS when the processor I/O
line is low. The use of 10kΩ, ±5% tolerance resistors are
recommended. These values result in a nominal strobe level
of 2.83V on RS (min/max of 2.43V/3.24V, assuming
VDD = 5.0V ±10%). Other resistor values can be used, so
long as the additive tolerances of the power supply and
resistor values result in a strobe that falls within VSTH and
VSTL under all additive tolerance conditions.
Integrated Battery Backup (TC71)
The TC71 differs from the TC70 in that it has a Power
Fail (PF) output instead of a gated chip enable (CEI, CEO).
PF must be externally gated with the decode for the CMOS
RAM or other device to be battery-backed. (Many CMOS
RAMs have both CE and CE enables. In this case, the PF
output can be connected directly to the CE input of the RAM).
PF is high as long as VCC is greater than 4.5V nominal.
When VCC falls below 4.5V nominal, PF is driven low.
Battery switchover for the TC71 is otherwise identical to that
of the TC70.
External Override Reset Control
A built-in debounce circuit allows a pushbutton switch
(or other electronic reset signal) to be wire-ORed to RS as
an external reset override (Figure 4). The external reset
signal is required to be an active low signal of at least
20msec in duration. Internally, this input is timed to provide
a minimum reset pulse width output of 500msec.
Threshold Detector
The TC70/71 is optimized for fast response to negativegoing changes in VDD. Systems with an inordinate amount
of electrical noise on VDD (such as systems using relays),
may require a 0.1µF bypass capacitor to reduce detection
sensitivity. This capacitor should be installed as close to the
TC70/71 as possible to keep the capacitor lead length short.
Integrated Battery Backup (TC70)
TYPICAL APPLICATIONS
The CEO line (TC70) drives the CE input of a CMOS
RAM or other device to be battery-backed. CEO follows CEI
as long as VCC is greater than 4.5V nominal. If VCC falls
below 4.5V nominal, CEO is driven to the potential of VCCO
thus write protecting the RAM and preventing accidental
+5V
VCCO
VCC
CEO
TC70
CEI
VBATT
+3V LI
BATTERY
3
4
Supply Monitor Noise Sensitivity
The TC71 issues a low-true output on the TDO pin any
time the TDI pin is less than 1.3V and VCC is greater than
VBATT. The voltage to be monitored is connected to the TDI
input through a simple resistor divider. The threshold detector can be used to generate an early power fail warning if the
unregulated DC input to the +5V regulator is available for
monitoring.
WDD
2
Figure 1 shows a full feature implementation of the
TC70; Figure 2 shows the TC71. Resistors R1 and R2 of
Figure 2 set the trip point voltage for the early power fail
warning circuit using the TC71 threshold detector.
VCC
CE
+5V
R1
10K
5
6
CMOS
RAM
ADDRESS
DECODER
ADDRESS
7
R2
13K
I/O
RS
RESET
GND
PROCESSOR
RESET
8
Figure 1. TC70 Typical Application
TELCOM SEMICONDUCTOR, INC.
5-11
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
TC70
TC71
AC IN
RECTIFIER
FILTER CAP
VCC
VCCO
WDD
CMOS
RAM
CE
PF
TC55RP
REGULATOR
VCC
CE
VCC
R3
TDI
TC71
ADDRESS
DECODER
TDO
VBATT
NMI
VCC
R3
10K
R4
ADDRESS
R4
13K
I/O
RS
3V LI
RESET
GND
PROCESSOR
RESET
Figure 2. TC71 Typical Application
tST
RS
PB CLOSED
PB OPEN
VSTH (MIN)
VSTL (MAX)
tPBH
RS
VSTL (MIN)
VIH
tTD
VIL
Note: tTD is the maximum elapsed time between strobes which
will keep the watchdog timer from forcing RS LOW.
(A STROBE is defined as a high-to-low transition from VSTH to VSTL).
Figure 3. Watchdog Strobe
5-12
tRST
Figure 4. RS Override Reset
TELCOM SEMICONDUCTOR, INC.
MICROMASTER™ – SYSTEM SUPERVISOR
WITH POWER SUPPLY MONITOR, WATCHDOG
AND BATTERY BACKUP
tR
1
TC70
TC71
2
VCC
tF
VCC
4.25V
4.25V
3
tRST
tRPD
3.0V
RS
VOH
VOL
4
Figure 5. Power Up/Down Slew Rate
VIH
Figure 6. Power Up/Down Reset Timing
5
CEI
VIL
CEI
VBATT-0.2V
VBATT- 0.2V
VIH
CEO
CEO
tPD
tPD
6
4.25V
4.25V
3.0V
VCC
tR
Figure 7. Battery Backup (Power-Up)
VCC
3.0V
tF
7
Figure 8. Battery Backup (Power-Down)
8
TELCOM SEMICONDUCTOR, INC.
5-13