W24258/LL 32K × 8 CMOS STATIC RAM GENERAL DESCRIPTION The W24258/LL is a normal speed, very low power CMOS static RAM organized as 32768 × 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES • • • • • Low power consumption: − Active: 350 mW (max.) − Standby: 25 µW (max.) Access time: 55/70 nS (max.) Single 5V power supply Fully static operation All inputs and outputs directly TTL compatible • • • • Three-state outputs Battery back-up operation capability Data retention voltage: 2V (min.) Packaged in 28-pin 600 mil DIP, 330 mil SOP and standard type one TSOP (8 mm × 13.4 mm) BLOCK DIAGRAM PIN CONFIGURATIONS CLK GEN. PRECHARGE CKT. A12 A14 A2 A3 A14 1 28 VDD A12 2 27 WE A4 A7 3 26 A13 A5 A6 4 25 A8 A6 A5 5 24 A9 A7 A4 6 23 A11 A13 A3 7 22 OE A2 8 21 A10 28-pin DIP A1 9 20 CS A0 10 19 I/O8 I/O1 11 18 I/O7 I/O2 12 17 I/O6 I/O3 13 16 I/O5 V SS 14 15 I/O4 I/O1 I/O8 R O W D E C O D E R DATA CNTRL. CORE CELL ARRAY 512 ROWS 64 X 8 COLUMNS I/O CKT. COLUMN DECODER CLK GEN. A11 A10 A1 A0 A8 A9 WE CS OE PIN DESCRIPTION OE A11 A9 A8 A13 WE V DD A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-pin TSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 V SS I/O3 I/O2 I/O1 A0 A1 A2 SYMBOL A0−A14 I/O1−I/O8 CS WE OE VDD VSS -1- DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input Write Enable Input Output Enable Input Power Supply Ground Publication Release Date: November 1998 Revision A5 W24258/LL TRUTH TABLE CS H OE X WE X L H L L MODE VDD CURRENT I/O1−I/O8 Not Selected High Z ISB, ISB1 H Output Disable High Z IDD L H Read Data Out IDD X L Write Data In IDD DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential RATING UNIT -0.5 to +7.0 V -0.5 to VDD +0.5 V Allowable Power Dissipation Storage Temperature 1.0 W -65 to +150 °C 0 to 70 °C Operating Temperature Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. Operating Characteristics (VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C) PARAMETER SYM. TEST CONDITIONS MIN. TYP.* MAX. UNIT Input Low Voltage VIL - -0.5 - +0.8 V Input High Voltage VIH - +2.2 - VDD +0.5 V Input Leakage Current ILI VIN = VSS to VDD -1 - +1 µA Output Leakage Current ILO VI/O = VSS to VDD, CS = VIH (min.) or OE = VIH (min.) or WE = VIL (max.) -1 - +1 µA Output Low Voltage VOL IOL = +2.1 mA - - 0.4 V Output High Voltage VOH IOH = -1.0 mA 2.4 - - V Operating Power IDD CS = VIL (max.), I/O = 0 I/O = 0 mA, Cycle = min. Duty =100% 55 - - 70 mA 70 - - 60 mA ISB CS = VIH (min.), Cycle = min. Duty = 100% - - 3 mA ISB1 CS ≥ VDD -0.2V - 0.7 5 µA Supply Current Standby Power Supply Current Note : Typical parameter is measured under ambient temperature TA = 25° C and VDD = 5V. -2- W24258/LL CAPACITANCE (VDD = 5V, TA = 25° C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 6 pF Input/Output Capacitance CI/O VOUT = 0V 8 pF Note: These parameters are sampled but not 100% tested. AC CHARACTERISTICS AC Test Conditions PARAMETER CONDITIONS Input Pulse Levels 0V to 3.0V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load See the drawing below AC TEST LOADS AND WAVEFORM 1 TTL 1 TTL OUTPUT OUTPUT 5 pF Including Jig and Scope 100 pF Including Jig and Scope (For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW ) 3.0V 90% 10% 0V 90% 10% 5 nS 5 nS -3- Publication Release Date: November 1998 Revision A5 W24258/LL AC Characteristics, continued (VDD = 5V ±10%; VSS = 0V; TA = 0° C to 70° C) Read Cycle PARAMETER SYM. W24258-55LL W24258-70LL MIN. MAX. MIN. MAX. UNIT Read Cycle Time TRC 55 - 70 - nS Address Access Time TAA - 55 - 70 nS Chip Select Access Time TACS - 55 - 70 nS Output Enable to Output Valid TAOE - 27 - 35 nS Chip Selection to Output in Low Z TCLZ* 10 - 10 - nS Output Enable to Output in Low Z TOLZ* 5 - 5 - nS Chip Deselection to Output in High Z TCHZ* - 25 - 30 nS Output Disable to Output in High Z TOHZ* - 25 - 30 nS Output Hold from Address Change TOH 10 - 10 - nS ∗ These parameters are sampled but not 100% tested Write Cycle PARAMETER SYM. W24258-55LL W24258-70LL MIN. MAX. MIN. MAX. UNIT Write Cycle Time TWC 55 - 70 - nS Chip Selection to End of Write TCW 40 - 50 - nS Address Valid to End of Write TAW 40 - 50 - nS Address Setup Time TAS 0 - 0 - nS Write Pulse Width TWP 40 - 50 - nS TWR 0 - 0 - nS Data Valid to End of Write TDW 25 - 30 - nS Data Hold from End of Write TDH 0 - 0 - nS Write to Output in High Z TWHZ* - 20 - 25 nS Output Disable to Output in High Z TOHZ* - 20 - 25 nS Output Active from End of Write TOW 5 - 5 - nS Write Recovery Time CS, WE ∗ These parameters are sampled but not 100% tested -4- W24258/LL TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH DOUT Read Cycle 2 (Chip Select Controlled) CS TACS TCHZ TCLZ DOUT Read Cycle 3 (Output Enable Controlled) T RC Address T AA OE T OH T AOE T OLZ CS T ACS D OUT T CHZ T OHZ TCLZ -5- Publication Release Date: November 1998 Revision A5 W24258/LL Timing Waveforms, continued Write Cycle 1 TWC Address T WR OE TCW CS T AW WE T WP TAS TOHZ (1, 4) D OUT T DW TDH D IN Write Cycle 2 ( OE = VIL Fixed) T WC Address TWR TCW CS TAW WE T WP TAS TOH TWHZ (1, 4) D OUT TDW (2) (3) TOW TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -6- W24258/LL DATA RETENTION CHARACTERISTICS (TA = 0° C to 70° C) PARAMETER SYM. TEST CONDITIONS VDD for Data Retention VDR CS ≥ VDD -0.2V Data Retention Current IDDDR Chip Deselect to Data Retention Time TCDR Operation Recovery Time TR MIN. TYP. MAX. UNIT 2.0 - - V CS ≥ VDD -0.2V, VDD = 3V - - 2 µA See data retention waveform 0 - - nS TRC* - - nS * Read Cycle Time DATA RETENTION WAVEFORM VDD 0.9 VDD 0.9 V DD VDR > = 2V TCDR TR CS > = V DD - 0.2V VIH CS VIH ORDERING INFORMATION ACCESS TIME (nS) OPERATING CURRENT MAX. (mA) STANDBY CURRENT MAX. (µ A) W24258-55LL 55 70 5 600 mil DIP W24258-70LL 70 60 5 600 mil DIP W24258S-55LL 55 70 5 330 mil SOP W24258S-70LL 70 60 5 330 mil SOP W24258Q-55LL 55 70 5 Standard type one TSOP W24258Q-70LL 70 60 5 Standard type one TSOP PART NO. PACKAGE Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -7- Publication Release Date: November 1998 Revision A5 W24258/LL PACKAGE DIMENSIONS 28-pin P-DIP Dimension in Inches Symbol A A1 A2 B B1 c D E E1 e1 L D 28 15 E1 a eA S Notes: 1 14 E S c A A2 A1 Base Plane L Seating Plane B e1 eA a B1 Min. Nom. Max. Dimension in mm Min. Nom. Max. 5.33 0.210 0.010 0.25 0.150 0.155 0.160 3.81 3.94 4.06 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 1.63 0.008 0.010 0.014 0.20 0.25 0.36 1.460 1.470 37.08 37.34 0.590 0.600 0.610 14.99 15.24 15.49 0.540 0.545 0.550 13.72 13.84 13.97 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15 0 0.670 16.00 16.51 17.02 0 0.630 0.650 15 0.090 2.29 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. . 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. 28-pin SOP Wide Body Dimension in Inches Symbol 28 A A1 A2 b c D E e HE L LE S y θ 15 e1 E HE θ L Detail F 14 1 b Min. Nom. Max. Dimension in mm Min. Nom. Max. 2.85 0.112 0.004 0.10 0.093 0.098 0.103 2.36 2.49 2.62 0.014 0.016 0.020 0.36 0.41 0.51 0.008 0.010 0.014 0.20 0.25 0.36 0.713 0.733 18.11 18.62 0.326 0.331 0.336 8.28 8.41 8.53 0.044 0.050 0.056 1.12 1.27 1.42 0.453 0.465 0.477 11.51 11.81 12.12 0.028 0.036 0.044 0.71 0.91 1.12 0.075 1.50 1.70 1.91 0.059 0 0.067 0.047 1.19 0.004 0.10 10 0 10 Notes: e1 D c A2 A S e y LE A1 See Detail F Seating Plane -8- 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch . and determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec. W24258/LL Package Dimensions, continued 28-pin Standard Type One TSOP HD Dimension In Inches Dimension In mm Symbol Min. D c A A1 A2 b c D E HD e L L1 Y θ 1 e E b A2 A θ A1 L Nom. Max. Min. Nom. 0.002 0.006 Max. 1.20 0.047 0.05 0.15 0.035 0.040 0.041 0.95 1.00 0.007 0.008 0.011 0.17 0.20 0.27 0.004 0.006 0.008 0.10 0.15 0.21 11.90 1.05 0.461 0.465 0.469 11.70 11.80 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.024 0.028 0.50 0.60 0.022 0.55 0.010 0.000 0 3 0.70 0.25 0.004 0.00 5 0 0.10 3 5 Controlling dimension: Millimeters Y L1 -9- Publication Release Date: November 1998 Revision A5 W24258/LL VERSION HISTORY VERSION DATE PAGE A4 Apr. 1998 2 A5 Nov. 1998 1, 2, 7, 9 Headquarters DESCRIPTION Add standby power supply current (ISB1) typical parameter when operation temperature TA = 25° C Deduct reverse type one TSOP package Winbond Electronics (H.K.) Ltd. Rm. 803, World Trade Square, Tower II, No. 4, Creation Rd. III, 123 Hoi Bun Rd., Kwun Tong, Science-Based Industrial Park, Kowloon, Hong Kong Hsinchu, Taiwan TEL: 852-27513100 TEL: 886-3-5770066 FAX: 852-27552064 FAX: 886-3-5796096 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-27197006 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-27190505 FAX: 886-2-27197502 Note: All data and specifications are subject to change without notice. - 10 - Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2727 N. First Street, San Jose, CA 95134, U.S.A. TEL: 408-9436666 FAX: 408-5441798