TI TMS28F010A-12

TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
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Organization . . . 128K × 8-Bit Flash Memory
Pin Compatible With Existing 1-Megabit
EPROMs
VCC Tolerance ±10%
All Inputs/Outputs TTL Compatible
Maximum Access/Minimum Cycle Time
’28F010A-10
100 ns
’28F010A-12
120 ns
’28F010A-15
150 ns
’28F010A-17
170 ns
Industry-Standard Programming Algorithm
PEP4 Version Available With 168-Hour
Burn-In and Choice of Operating
Temperature Ranges
Chip Erase Before Reprogramming
10 000 and 1 000 Program/Erase-Cycle
Versions Available
Low Power Dissipation ( VCC = 5.5 V )
– Active Write . . . 55 mW
– Active Read . . . 165 mW
– Electrical Erase . . . 82.5 mW
– Standby . . . 0.55 mW
(CMOS-Input Levels)
Automotive Temperature Range
– 40°C to 125°C
N PACKAGE
( TOP VIEW )
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
VCC
W
NC
A14
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
FM PACKAGE
( TOP VIEW )
A12
A15
A16
VPP
VCC
W
NC
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4
description
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
The TMS28F010A is a 1048 576-bit, programmable read-only memory that can be electrically
bulk-erased and reprogrammed. It is available in
10 000 and 1 000 program/erase-endurancecycle versions.
3 2 1 32 31 30
29
6
28
7
27
8
26
9
25
10
24
11
23
12
22
13
21
14 15 16 17 18 19 20
A14
A13
A8
A9
A11
G
A10
E
DQ7
DQ1
DQ2
VSS
DQ3
DQ4
DQ5
DQ6
The TMS28F010A Flash EEPROM is offered in a
dual in-line plastic package (N suffix) designed for
insertion in mounting-hole rows on 15,2-mm
(600-mil) centers, a 32-lead plastic leaded
chip-carrier package using 1,25-mm (50-mil) lead
spacing (FM suffix), a 32-lead thin small-outline
package (DD suffix), and a reverse pinout TSOP
package (DU suffix).
5
The TMS28F010A is characterized for operation
in temperature ranges of 0°C to 70°C (NL, FML,
DDL, and DUL suffixes), – 40°C to 85°C (NE, FME,
DDE, and DUE suffixes), and – 40°C to 125°C
(NQ, FMQ, DDQ, and DUQ suffixes). All package
types are offered with 168-hour burn-in (4 suffix).
PIN NOMENCLATURE
A0 – A16
DQ0 – DQ7
E
G
NC
VCC
VPP
VSS
W
Address Inputs
Data In/Data Out
Chip Enable
Output Enable
No Internal Connection
5-V Power Supply
12-V Power Supply
Ground
Write Enable
Copyright  1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
• DALLAS, TEXAS 75265
• HOUSTON, TEXAS 77251–1443
POST OFFICE BOX 655303
POST OFFICE BOX 1443
1
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
DD PACKAGE
( TOP VIEW )
A11
A9
A8
A13
A14
NC
W
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
DU PACKAGE
REVERSE PINOUT
( TOP VIEW )
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
VSS
DQ2
DQ1
DQ0
A0
A1
A2
A3
2
1
32
2
31
3
30
4
29
5
28
6
27
7
26
8
25
9
24
10
23
11
22
12
21
13
20
14
19
15
18
16
17
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A11
A9
A8
A13
A14
NC
W
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
device symbol nomenclature
TMS28F010A
-12
C4
FM
L
4
PEP4 Burn-In
4 = 168-Hour Burn-In
(blank if no burn-in)
Temperature Range Designator
L
=
0°C to 70°C
E
= – 40°C to 85°C
Q = – 40°C to 125°C
Package Designator
N = Plastic Dual In-Line Package
FM = Plastic Leaded Chip Carrier
DD = Thin Small-Outline Package
DU = Thin Small-Outline Package,
Reverse Pinout
Program/Erase Endurance
C4 = 10 000 Cycles
C3 = 1 000 Cycles
Speed Designator
-10 = 100 ns
-12 = 120 ns
-15 = 150 ns
-17 = 170 ns
•
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
•
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TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
logic symbol†
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
E
G
W
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
12
11
10
9
8
7
6
5
27
26
23
25
4
28
29
3
2
22
24
31
13
FLASH
EEPROM
131 072 × 8
0
A
0
131 071
16
G1
[PWR DWN]
G2
1, 2 EN (READ)
1C3 (WRITE)
A, 3D
∇4
A, Z4
14
15
17
18
19
20
21
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the N package.
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
•
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
functional block diagram
DQ0 – DQ7
8
Erase-Voltage Switch
VPP
W
Input/Output Buffers
State Control
To Array
Program/Erase
Stop Timer
Command Register
Program-Voltage
Switch
STB
Data Latch
Chip-Enable and
Output-Enable
Logic
E
G
STB
A0 – A16
A
d
d
r
e
s
s
17
L
a
t
c
h
•
Column Decoder
Column Gating
Row Decoder
1 048 576-Bit
Array Matrix
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TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
Table 1. Operation Modes
FUNCTION
VPP†
(1)
E
(22)
G
(24)
A0
(12)
A9
(26)
W
(31)
DQ0 – DQ7
(13 – 15, 17 – 21)
VPPL
VPPL
VIL
VIL
X
X
VIH
VIH
Data Out
X
Standby and Write Inhibit
VPPL
VIH
VIL
VIH
X
X
Output Disable
X
X
X
HI-Z
Algorithm Selection Mode
Algorithm-Selection
VPPL
VIL
VIL
VID
VIH
Read
VPPH
VPPH
VIL
VIL
VIL
VIH
X
Data Out
VPPH
VPPH
VIH
VIL
X
HI-Z
MODE
Read
Read
Read/
Write
Output Disable
Standby and Write Inhibit
VIL
VIH
X
X
X
VIH
VIH
X
X
X
HI-Z
Mfr Equivalent Code 89h
Device Equivalent Code B4h
HI-Z
Write
VIH
X
X
Data In
VIL
NOTE: X can be VIL or VIH.
† VPPL ≤ VCC + 2 V; VPPH is the programming voltage specified for the device. For more details, refer to the recommended operating conditions.
operation
read/output disable
When the outputs of two or more TMS28F010As are connected in parallel on the same bus, the output of any
particular device in the circuit can be read with no interference from the competing outputs of other devices. To
read the output of the TMS28F010A, a low-level signal is applied to the E and G pins. All other devices in the
circuit should have their outputs disabled by applying a high-level signal to one of these pins.
standby and write inhibit
Active ICC current can be reduced from 30 mA to 1 mA by applying a high TTL level on E or to 100 µA with a
high CMOS level on E. In this mode, all outputs are in the high-impedance state. The TMS28F010A draws active
current when it is deselected during programming, erasure, or program/erase verification. It continues to draw
active current until the operation is terminated.
algorithm-selection mode
The algorithm-selection mode provides access to a binary code identifying the correct programming and erase
agorithms. This mode is activated when A9 (pin 26) is forced to VID. Two identifier bytes are accessed by toggling
A0. All other addresses must be held low. A0 low selects the manufacturer equivalent code 89h, and A0 high
selects the device equivalent code B4h, as shown in the algorithm-selection mode table below:
PINS
IDENTIFIER
Manufacturer Equivalent Code
Device Equivalent Code
A0
DQ7
DQ6
DQ5
DQ4
DQ3
DQ2
DQ1
DQ0
HEX
VIL
VIH
1
0
0
0
1
0
0
1
89
1
0
1
1
0
1
0
0
B4
NOTE: E = G = VIL, A1 – A8 = VIL, A9 = VID, A10 – A16 = VIL, VPP = VPPL.
programming and erasure
In the erased state, all bits are at a logic 1. Before erasing the device, all memory bits must be programmed to
a logic 0. Afterwards, the entire chip is erased. At this point, the bits, now logic 1s, can be programmed
accordingly. Refer to the Fastwrite and Fasterase algorithms for further detail.
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
•
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
command register
The command register controls the program and erase functions of the TMS28F010A. The algorithm-selection
mode can be activated using the command register in addition to the above method. When VPP is high, the
contents of the command register and the function being performed can be changed. The command register
is written to when E is low and W is pulsed low. The address is latched on the leading edge of the pulse, while
the data is latched on the trailing edge. Accidental programming or erasure is minimized because two
commands must be executed to invoke either operation.
power supply considerations
Each device should have a 0.1-µF ceramic capacitor connected between VCC and VSS to suppress circuit noise.
Changes in current drain on VPP require it to have a bypass capacitor as well. Printed-circuit traces for both
power supplies should be appropriate to handle the current demand.
Table 2. Command Definitions
COMMAND
Read
REQUIRED
BUS
CYCLES
OPERATION†
ADDRESS
DATA
OPERATION†
1
Write
X
00h
Read
RA
RD
Read
0000
0001
89h
B4h
FIRST BUS CYCLE
X
SECOND BUS CYCLE
DATA
Algorithm-Selection Mode
3
Write
Set-Up-Erase/Erase
2
Write
X
20h
Write
X
20h
Erase Verify
2
Write
EA
A0h
Read
X
EVD
Set-Up-Program/Program
2
Write
X
40h
Write
PA
PD
Program Verify
2
Write
X
C0h
Read
X
PVD
Reset
2
Write
X
FFh
Write
† Modes of operation are defined in Table 1.
Legend:
EA
Address of memory location to be read during erase verify.
RA
Address of memory location to be read.
PA
Address of memory location to be programmed. Address is latched on the falling edge of W.
RD
Data read from location RA during the read operation.
EVD
Data read from location EA during erase verify.
PD
Data to be programmed at location PA. Data is latched on the rising edge of W.
PVD
Data read from location PA during program verify.
X
FFh
•
90h
ADDRESS
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•
7
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
command definitions
read command
Memory contents can be accessed while VPP is high or low. When VPP is high, writing 00h into the command
register invokes the read operation. When the device is powered up, the default contents of the command
register are 00h and the read operation is enabled. The read operation remains enabled until a different valid
command is written to the command register.
algorithm-selection mode command
The algorithm-selection mode is activated by writing 90h into the command register. The manufacturer
equivalent code (89h) is identified by the value read from address location 0000h, and the device equivalent
code (B4h) is identified by the value read from address location 0001h.
set-up-erase/erase commands
The erase-algorithm initiates with E = VIL, W = VIL, G = VIH, VPP = VPPH, and VCC = 5 V. To enter the erase mode,
write the set-up-erase command, 20h, into the command register. After the TMS28F010A is in the erase mode,
writing a second erase command, 20h, into the command register invokes the erase operation. The erase
operation begins on the rising edge of W and ends on the rising edge of the next W. The erase operation requires
10 ms to complete before the erase-verify command, A0h, can be loaded.
Maximum erase timing is controlled by the internal stop timer. When the stop timer terminates the erase
operation, the device enters an inactive state and remains inactive until a valid erase verify, read, or reset
command is received.
erase-verify command
All bytes must be verified following an erase operation. After the erase operation is complete, an erased byte
can be verified by writing the erase-verify command, A0h, into the command register. This command causes
the device to exit the erase mode on the rising edge of W. The address of the byte to be verified is latched on
the falling edge of W. The erase-verify operation remains enabled until a valid command is written to the
command register.
To determine whether or not all the bytes have been erased, the TMS28F010A applies a margin voltage to each
byte. If FFh is read from the byte, all bits in the designated byte have been erased. The erase-verify operation
continues until all of the bytes have been verified. If FFh is not read from a byte, an additional erase operation
needs to be executed. Figure 2 shows the combination of commands and bus operations for electrically erasing
the TMS28F010A.
set-up-program/program commands
The programming algorithm initiates with E = VIL, W = VIL, G = VIH, VPP = VPPH, and VCC = 5 V. To enter the
programming mode, write the set-up-program command, 40h, into the command register. The programming
operation is invoked by the next write-enable pulse. Addresses are latched internally on the falling edge of W,
and data is latched internally on the rising edge of W. The programming operation begins on the rising edge of
W and ends on the rising edge of the next W pulse. The program operation requires 10 µs for completion before
the program-verify command, C0h, can be loaded.
Maximum program timing is controlled by the internal stop timer. When the stop timer terminates the program
operation, the device enters an inactive state and remains inactive until a valid program-verify, read, or reset
command is received.
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POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
•
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
program-verify command
The TMS28F010A can be programmed sequentially or randomly because it is programmed one byte at a time.
Each byte must be verified after it is programmed. The program-verify operation prepares the device to verify
the most recently programmed byte. To invoke the program-verify operation, C0h must be written into the
command register. The program-verify operation ends on the rising edge of W.
While verifying a byte, the TMS28F010A applies an internal margin voltage to the designated byte. If the true
data and programmed data match, programming continues to the next designated byte location; otherwise, the
byte must be reprogrammed. Figure 1 shows how commands and bus operations are combined for byte
programming.
reset command
To reset the TMS28F010A after set-up-erase command or set-up-program command operations without
changing the contents in memory, write FFh into the command register two consecutive times. After executing
the reset command, a valid command must be written into the command register to change to a new state.
Fastwrite algorithm
The TMS28F010A is programmed using the Texas Instruments Fastwrite algorithm shown in Figure 1. This
algorithm programs in a nominal time of two seconds.
Fasterase algorithm
The TMS28F010A is erased using the Texas Instruments Fasterase algorithm shown in Figure 2. The memory
array needs to be completely programmed (using the Fastwrite algorithm) before erasure begins. Erasure
typically occurs in one second.
parallel erasure
To reduce total erase time, several devices can be erased in parallel. Since each Flash EEPROM can erase
at a different rate, every device must be verified separately after each erase pulse. After a given device has been
successfully erased, the erase command should not be issued to this device again. All devices that complete
erasure should be masked until the parallel erasure process is finished (see Figure 3).
Examples of how to mask a device during parallel erase include driving the E pin high, writing the read command
(00h) to the device when the others receive a set-up-erase or erase command, or disconnecting it from all
electrical signals with relays or other types of switches.
•
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POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443
•
9
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
Bus
Operation
Start
Address = 00h
Initialize
Address
VCC = 5 V ± 10%, VPP = 12 V ± 5%
Standby
Command
Comments
Wait for VPP to ramp to
VPPH (see Note A)
Setup
X=1
Initialize pulse count
Write Set-Up-Program Command
Write
Set-UpProgram
Write
Data = 40h
Write
Write Data
Valid address/data
Write Data
Increment
Address
Wait = 10 µs
X=X+1
Write Program-Verify Command
Wait = 10 µs
Standby
Wait = 6 µs
No
Read
Fail
and Verify
Byte
Write
ProgramVerify
X = 25?
Data = C0h; ends
Program operation
Standby
Wait = 6 µs
Read
Read byte to verify
Programming; compare
output to expected output
Yes
Pass
Interactive
Mode
No
Last
Address
?
Yes
Write Read Command
Power
Down
Apply VPPL
Write
Read
Apply VPPL
Standby
Device Passed
Device Failed
NOTES: A. Refer to the recommended operating conditions for the value of VPPH.
B. Refer to the recommended operating conditions for the value of VPPL.
Figure 1. Programming Flowchart: Fastwrite Algorithm
10
Data = 00h; resets register
for read operations
•
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•
Wait for VPP to ramp to
VPPL (see Note B)
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
Bus
Operation
Start
Command
Preprogram
All Bytes = 00h
?
No
Comments
Entire memory must = 00h
before erasure
Program All
Bytes to 00h
Use Fastwrite
programming algorithm
Yes
Address = 00h
Initialize addresses
VCC = 5 V ± 10%, VPP = 12 V ± 5%
Standby
Setup
X=1
Wait for VPP to ramp to
VPPH (see Note A)
Write Set-Up-Erase Command
Initialize pulse count
Write-Erase Command
Wait = 10 ms
Write
Set-UpErase
Data = 20h
Write
Erase
Data = 20h
X=X+1
Interactive
Mode
Write Erase-Verify Command
Wait = 6 µs
Standby
Wait = 10 ms
No
Increment
Address
Read
and Verify
Byte
Pass
No
Write
Fail
X = 1000?
Erase
Verify
Addr = Byte to verify;
Data = A0h; ends the erase
operation
Yes
Standby
Wait = 6 µs
Read
Read byte to verify erasure;
compare output to FFh
Last
Address?
Yes
Write Read Command
Apply VPPL
Apply VPPL
Device Passed
Device Failed
Write
Power
Down
Standby
•
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•
Read
Data = 00h; resets register
for read operations
Wait for VPP to ramp to
VPPL (see Note B)
11
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
NOTES: A. Refer to the recommended operating conditions for the value of VPPH.
B. Refer to the recommended operating conditions for the value of VPPL.
Figure 2. Flash-Erase Flowchart: Fasterase Algorithm
Start
Program All Devices to 00h
X=1
Give Erase Command to All
Devices
D=1
Yes
Mask Device #D
Is
Device #D
Erased
?
X = X+1
No
D=n
?
Give Erase
Command to
All Unmasked
Devices
No
D = D+1
Yes
No
Are
All Devices
Erased
?
No
X = 1000
?
Yes
Yes
Give Read
Command to
All Devices
Give Read
Command to
All Devices
All Devices Pass
Finished With Errors
NOTE: n = number of devices being erased.
Figure 3. Parallel-Erase Flow Diagram
12
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•
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 7 V
Supply voltage range, VPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 14 V
Input voltage range (see Note 2): All inputs except A9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to VCC + 1 V
A9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to 13.5 V
Output voltage range (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 0.6 V to VCC + 1 V
Operating free-air temperature range during read/erase/program, TA
NL, FML, DDL, DUL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
NE, FME, DDE, DUE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40°C to 85°C
NQ, FMQ, DDQ, DUQ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 40° C to 125°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to VSS.
2. The voltage on any input pin can undershoot to – 2.0 V for periods less than 20 ns.
3. The voltage on any output pin can overshoot to 7.0 V for periods less than 20 ns.
recommended operating conditions
VCC
Supply voltage
VPP
Supply voltage
During write/read/flash erase
During read only (VPPL)
VIL
Low level dc input voltage
Low-level
VID
Voltage level on A9 for algorithm-selection mode
MAX
5
55
5.5
V
VCC + 2
12.6
V
12
11.4
TTL
High level dc input voltage
High-level
TYP
45
4.5
0
During write/read/flash erase (VPPH)
VIH
MIN
CMOS
•
VCC + 0.5
VCC + 0.5
TTL
VCC – 0.5
– 0.5
CMOS
GND – 0.2
GND + 0.2
11.5
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•
2
0.8
UNIT
V
V
V
V
13
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature
PARAMETER
TEST CONDITIONS
MIN
MAX
VOH
High level output voltage
High-level
IOH = – 2.5 mA
IOH = – 100 µA
VOL
Low level output voltage
Low-level
IOL = 5.8 mA
IOL = 100 µA
0.45
IID
A9 algorithm-selection-mode current
A9 = VID max
200
All except A9
II
Input current (leakage)
IO
Output current (leakage)
VO = 0 V to VCC
VPP = VPPH,
VPP supply current (read/standby)
IPP2
IPP3
VPP supply current (during program pulse) (see Note 4)
VPP supply current (during flash erase) (see Note 4)
IPP4
VPP supply current (during program/erase verify)
(see Note 4)
ICCS
VCC supply current (standby)
ICC1
TTL-input level
V
VCC – 0.4
0.1
±1
VI = 0 V to 5.5 V
VI = 0 V to 13 V
A9
IPP1
2.4
± 200
Read mode
UNIT
V
µA
µA
±10
µA
200
µA
VPP = VPPL
VPP = VPPH
±10
µA
30
mA
VPP = VPPH
30
mA
VPP = VPPH
5.0
mA
VCC = 5.5 V,
VCC = 5.5 V,
E = VIH
1
mA
100
µA
VCC supply current (active read)
VCC = 5.5 V
f = 6 MHz,
E = VIL,
Outputs open
30
mA
ICC2
VCC average supply current (active write) (see Note 4)
VCC = 5.5 V,
E = VIL,
Programming in progress
10
mA
ICC3
VCC average supply current (flash erase) (see Note 4)
VCC = 5.5 V,
E = VIL,
Erasure in progress
15
mA
ICC4
VCC average supply current (program/erase verify)
(see Note 4)
VCC = 5.5 V,
E = VIL,
VPP = VPPH,
Program/erase-verify in progress
15
mA
CMOS-input level
E = VCC
NOTE 4: Not 100% tested; characterization data available.
capacitance over recommended ranges of supply voltage and operating free-air temperature,
f = 1 MHz†
PARAMETER
Ci
TEST CONDITIONS
Input capacitance
VI = 0 ,
VO = 0,
Co
Output capacitance
† Capacitance measurements are made on sample basis only.
14
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•
MIN
MAX
UNIT
f = 1 MHz
6
pF
f = 1 MHz
12
pF
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature
PARAMETER
TEST
CONDITIONS
ALTERNATE
SYMBOL
’28F010A-10
MIN
MAX
’28F010A-12
MIN
MAX
’28F010A-15
MIN
MAX
’28F010A-17
MIN
MAX
UNIT
ta(A)
Access time from
address, A0 – A16
tAVQV
100
120
150
170
ns
ta(E)
Access time from
chip enable, E
tELQV
100
120
150
170
ns
ten(G)
Access time from
output enable, G
tGLQV
45
50
55
60
ns
tc(R)
Cycle time, read
tAVAV
100
120
150
170
ns
td(E)
Delay time, E low
to low-Z output
tELQX
0
0
0
0
ns
td(G)
Delay time, G low
to low-Z output
tGLQX
0
0
0
0
ns
tdis(E)
Chip disable time
to hi-Z output
tEHQZ
0
55
0
55
0
55
0
55
ns
tdis(G)
Output disable
time to hi-Z
output
tGHQZ
0
30
0
30
0
35
0
35
ns
th(D)
Hold time, data
valid from
address, E, or G†
tAXQX
0
0
0
0
ns
trec(W)
Write recovery
time before read
tWHGL
6
6
6
6
µs
CL = 100 pF,
1 Series 74
TTL load,
Input tr ≤ 20 ns
ns,
Input tf ≤ 20 ns
† Whichever occurs first.
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•
15
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
timing requirements–write/erase/program operations
ALTERNATE
SYMBOL
PARAMETER
tc(W)
tc(W)PR
Cycle time, write using W
tc(W)ER
th(A)
Cycle time, erase operation
th(E)
th(WHD)
Hold time, E
tsu(A)
tsu(D)
Setup time, address
tsu(E)
tsu(EHVPP)
Setup time, E before W
tsu(VPPEL)
trec(W)
Setup time, VPP to E low
trec(R)
tw(W)
Recovery time, read before W
tw(WH)
tr(VPP)
Pulse duration, W high
tf(VPP)
Fall time, VPP
Cycle time, programming operation
Hold time, address
Hold time, data valid after W high
Setup time, data
Cycle time, write using W
tc(W)ER
th(A)
Cycle time, erase operation
th(E)
th(WHD)
Hold time, E
tsu(A)
tsu(D)
Setup time, address
tsu(E)
tsu(EHVPP)
Setup time, E before W
tsu(VPPEL)
trec(W)
Setup time, VPP to E low
trec(R)
tw(W)
Recovery time, read before W
tw(WH)
tr(VPP)
Pulse duration, W high
Hold time, address
Hold time, data valid after W high
Setup time, data
16
UNIT
ns
µs
tWLAX
tWHEH
55
tWHDX
tAVWL
9.5
10
9.5
10
ms
60
ns
0
0
ns
10
10
ns
0
0
ns
tDVWH
tELWL
50
50
ns
20
20
ns
tEHVP
tVPEL
100
100
ns
1.0
1.0
µs
tWHGL
tGHWL
6
6
µs
0
0
µs
tWLWH
tWHWL
60
60
ns
20
20
ns
tVPPR
tVPPF
1
1
µs
1
1
µs
’28F010A 15
’28F010A-15
MIN
NOM
MAX
’28F010A 17
’28F010A-17
MIN
NOM
MAX
UNIT
tAVAV
tWHWH1
tWHWH2
150
170
ns
10
10
µs
tWLAX
tWHEH
60
70
ns
0
0
ns
tWHDX
tAVWL
10
10
ns
0
0
ns
tDVWH
tELWL
50
50
ns
20
20
ns
tEHVP
tVPEL
100
100
ns
1.0
1.0
µs
tWHGL
tGHWL
6
6
µs
0
0
µs
tWLWH
tWHWL
tVPPR
60
60
ns
20
20
ns
1
1
µs
tVPPF
1
1
µs
Recovery time, W before read
Rise time, VPP
tf(VPP)
Fall time, VPP
NOTE 5: Rise/fall time ≤ 10 ns.
MAX
10
Setup time, E high to VPP ramp
Pulse duration, W (see Note 5)
NOM
120
ALTERNATE
SYMBOL
Cycle time, programming operation
’28F010A 12
’28F010A-12
MIN
10
Rise time, VPP
tc(W)
tc(W)PR
MAX
100
Recovery time, W before read
PARAMETER
NOM
tAVAV
tWHWH1
tWHWH2
Setup time, E high to VPP ramp
Pulse duration, W (see Note 5)
’28F010A 10
’28F010A-10
MIN
•
9.5
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•
10
9.5
10
ms
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
timing requirements — alternative E-controlled writes
ALTERNATE
SYMBOL
PARAMETER
’28F010A 10
’28F010A-10
MIN
’28F010A 12
’28F010A-12
MAX
MIN
MAX
’28F010A 15
’28F010A-15
MIN
MAX
’28F010A 17
’28F010A-17
MIN
MAX
UNIT
tc(W)
Cycle time, write using E
tAVAV
100
120
150
170
ns
tc(E)PR
Cycle time, programming operation
tEHEH
10
10
10
10
µs
tELAX
tEHDX
75
80
80
90
ns
10
10
10
10
ns
tEHWH
tAVEL
0
0
0
0
ns
0
0
0
0
ns
50
50
50
50
ns
0
0
0
0
ns
th(EA)
th(ED)
Hold time, address
th(W)
tsu(A)
Hold time, W
tsu(D)
tsu(W)
Setup time, data
Setup time, W before E
tDVEH
tWLEL
tsu(VPPEL)
Setup time, VPP to E low
tVPEL
1.0
1.0
1.0
1.0
µs
trec(E)R
Recovery time, write using E
before read
tEHGL
6
6
6
6
µs
trec(E)W
Recovery time, read before
write using E
tGHEL
0
0
0
0
µs
tELEH
tEHEL
70
70
70
80
ns
20
20
20
20
ns
tw(E)
tw(EH)
Hold time, data
Setup time, address
Pulse duration, write using E
Pulse duration, write, E high
PARAMETER MEASUREMENT INFORMATION
2.08 V
RL = 800 Ω
Output
Under Test
CL = 100 pF
Figure 4. AC Test Output Load Circuit
AC testing input/output waveforms
2.4 V
0.45 V
2V
0.8 V
2V
0.8 V
AC testing inputs are driven at 2.4 V for logic high and 0.45 V for logic low. Timing measurements are made at
2 V for logic high and 0.8 V for logic low on both inputs and outputs. Each device should have a 0.1-µF ceramic
capacitor connected between VCC and VSS as close as possible to the device pins.
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•
17
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
PARAMETER MEASUREMENT INFORMATION
tc(R)
Address Valid
A0 – A16
ta(A)
E
ta(E)
tdis(E)
G
trec(W)
ten(G)
W
td(E)
DQ0 – DQ7
td(G)
tdis(G)
th(D)
HI-Z
Ouput Valid
Figure 5. Read Cycle Timing
18
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•
HI-Z
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
PARAMETER MEASUREMENT INFORMATION
Program
Command
Program
Latch
Verify
Address
and Data Programming Command
Power Up Set-UpProgram
and
Standby Command
Program
Verification
Standby/
Power Down
A0 – A16
tc(W)
tc(W)
tc(W)
tsu(A)
tc(R)
th(A)
th(A)
tsu(A)
E
tsu(E)
tsu(E)
tdis(E)
tsu(E)
th(E)
th(E)
G
th(E)
tc(W)PR
trec(R)
tw(WH)
tdis(G)
trec(W)
W
tw(W)
tw(W)
th(WHD)
tsu(D)
HI-Z
Data In
Data In = 40h
VCC
Data In = C0h
td(E)
ta(E)
Valid Data Out
5V
0V
VPP
ten(G)
td(G)
tw(W)
tsu(D)
tsu(D)
DQ0 – DQ7
th(D)
th(WHD)
th(WHD)
tsu(VPPEL)
VPPH
VPPL
tf(VPP)
tr(VPP)
tsu(EHVPP)
Figure 6. Write Cycle Timing
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•
19
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
PARAMETER MEASUREMENT INFORMATION
Program
Command
Program
Latch
Verify
Address
and Data Programming Command
Power Up Set-UpProgram
and
Standby Command
Program
Verification
Standby/
Power Down
A0 – A16
tc(W)
tc(W)
tc(W)
tsu(A)
th(EA)
tc(R)
th(EA)
tsu(A)
W
tsu(W)
tsu(W)
tdis(G)
tsu(W)
th(W)
th(W)
th(W)
G
tc(w)B
trec(E)W
tdis(E)
trec(E)R
tw(EH)
E
tw(E)
tsu(D)
DQ0 – DQ7
th(D)
th(ED)
th(ED)
tw(E)
th(ED)
tw(E)
tsu(D)
tsu(D)
HI-Z
Data In
Data In = 40h
VCC
ten(G)
td(G)
Data In = C0h
td(E)
ta(E)
Valid Data Out
5V
0V
tsu(VPPEL)
VPPH
VPP
VPPL
tr(VPP)
tf(VPP)
tsu(EHVPP)
Figure 7. Write Cycle (Alternative E-Controlled Writes) Timing
20
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•
TMS28F010A
1048576-BIT FLASH
ELECTRICALLY ERASABLE PROGRAMMABLE READ-ONLY MEMORY
SMJS012 – DECEMBER 1992 – REVISED NOVEMBER 1993
PARAMETER MEASUREMENT INFORMATION
Power Up Set-UpErase
and
Standby Command
Erase
Command
EraseVerify
Command
Erasing
Erase
Standby/
Verification Power Down
A0 – A16
tc(W)
tc(W)
tc(W)
tc(R)
th(A)
tsu(A)
E
tsu(E)
tsu(E)
tsu(E)
th(E)
th(E)
G
tdis(E)
th(E)
tw(WH)
trec(R)
tc(E)B
trec(W)
tdis(G)
W
th(D)
th(WHD)
th(WHD)
tw(W)
tw(W)
DQ0 – DQ7
tsu(D)
Data In = 20h
Data In = 20h
ten(G)
td(G)
tw(W)
tsu(D)
tsu(D)
HI-Z
th(WHD)
Data In = A0h
td(E)
ta(E)
Valid Data Out
5V
VCC
0V
tsu(VPPEL)
VPPH
VPP
VPPL
tf(VPP)
tr(VPP)
tsu(EHVPP)
Figure 8. Flash-Erase Cycle Timing
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•
21
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